LG 24LH4530-PU Schematic

Internal Use Only

LED TV

SERVICE MANUAL

CHASSIS :

MODEL :

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LU60A

24LH4530 24LH4530-PU

P/NO :

MFL69169512 (1601-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ......................................................................... 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 8

TROUBLE SHOOTING ........................................................................... 12

BLOCK DIAGRAM .................................................................................. 16

EXPLODED VIEW .................................................................................. 17

SCHEMATIC CIRCUIT DIAGRAM ........................................... APPENDIX

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 2 -

LGE Internal Use Only

AC Volt-meter

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Good Earth Ground
such as WATER PIPE,

To Instrument's
exposed
METALLIC PARTS

When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

0.15µF

1.5 Kohm/10W

CONDUIT etc.

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 3 -

LGE Internal Use Only

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an
explosion hazard.

2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of

contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.

Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this
service manual.

CAUTION: Do not connect the test fixture ground strap to any

heat sink in this receiver.

Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the

unit under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.

4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.

CAUTION: Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the

range or 500 ˚F to 600 ˚F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.

(500 ˚F to 600 ˚F)

b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500 ˚F to 600 ˚F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 4 -

LGE Internal Use Only

IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as
possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

CAUTION: Maintain original spacing between the replaced

component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as
possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous

condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.

Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the

it does not touch components or sharp edges.

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 5 -

LGE Internal Use Only

SPECIFICATION

NOTE : Specications and others are subject to change without notice for improvement.

1. Application Range

This spec sheet is applied all of the TV used LU60A chassis.

2. Specication

Each part is tested as below without special appointment

1) Temperature : 25 ˚C ± 5 ˚C (77 ˚F ± 9 ˚F),
CST : 40 ˚C ± 5 ˚C

2) Relative Humidity : 65 % ± 10 %

3) Power Voltage : Standard input voltage
(100 V - 240 V ~, 50 / 60 Hz)

· Standard Voltage of each products is marked by mod­els

4) Specication and performance of each parts are followed

each drawing and specication by part number in accord-

ance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3.Test method

1) Performance : LGE TV test method followed

2) Demanded other specication

- Safety : UL

- EMI : FCC

4. Model general specication

No Item Specication Remarks

1 Market AMERICA, CANADA, MEXICO LH4530 series is US only

MT48x Series is Mexico only.

2 Receiving system ATSC / NTSC-M / 64 & 256 QAM

3 Available Channel VHF 2-13, UHF 14-69, CATV 1-135, DTV 2-69, CADTV 1-135

4 Interface RF / Composite(CVBS) / Component / HDMI / D-Sub / USB 22,24LH4530 serise : RF/ HDMI/

USB(SVC only)
28LH4530 : RF/ HDMI/USB
MT48x serise : RF, Component/
CVBS/ HDMI/ DSUB/ USB

5. Feature and Function

No Item Specication Remarks

1 RF Input Analog NTSC

DTV ATSC

2 HDMI Input (Rear) HDMI version 1.4/ support PC

Support HDCP

3 Component Input

(Rear, 1EA)

4 CVBS Input ATSC/NTSC-M common port with Component.

Y/Pb/Pr LH4530 not support

Rear : 1EA

5 USB (Side, 1EA) For My Media(Photo/Music List) 22,24LH4530 not support

Picture + Music

6 D-Sub RGB-PC LH4530 not support

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 6 -

LGE Internal Use Only

5. External Input Support Format

- RGB/HDMI (PC) *LH4530 doesn’t support RGB

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 720*400 31.468 70.080 28.321

2 640*480 31.469 59.940 25.175

3 640*480 37.500 75.000 31.500

4 800*600 37.879 60.317 40.000

5 800*600 46.875 75.000 49.500

6 1024*768 48.363 60.004 65.000

7 1024*768 60.023 75.029 78.750

8 1280*800 49.702 59.81 83.500

9 1366*768 47.717 59.79 85.5

- HDMI (DTV)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Remark

1 720* 480 31.469 / 31.5 59.94 / 60 27.00/ 27.03 SDTV 480P

2 720*576 31.25 50.00 27.864 SDTV 576P

3 1280*720 37.50 50.00 74.250 HDTV 720P

4 1280* 720 44.96 / 45 59.94 / 60 74.17/ 74.25 HDTV 720P

5 1920* 1080 33.72 / 33.75 59.94 / 60 74.17/ 74.25 HDTV 1080I

6 1920* 1080 28.125 50.00 74.25 HDTV 1080I

7 1920* 1080 27.00 24 74.25 HDTV 1080P

8 1920* 1080 33.75 30.00 74.25 HDTV 1080P

9 1920* 1080 56.250 50 148.5 HDTV 1080P

10 1920* 1080 67.43 / 67.5 59.94 / 60 148.35/ 148.50 HDTV 1080P

- Component *LH4530 doesn’t support RGB

No

1 720x480 15.730 59.940 720x480i

2 15.750 60.000

3 31.470 59.940 720x480p

4 31.500 60.000

5 720x576 15.625 50.000 720x576p

6 31.250 50.000

7 1280x720 44.960 59.940 1280x720p

8 37.500 50.000

9 1920x1080 33.720 59.940 1920x1080i

10 33.750 60.000

11 28.125 50.000 1920x1080p

12 56.250 50.000

13 67.432 59.940

14 67.500 60.000

- Video Color Format : YcbCr 444, 422 (xvYcc is not supported)

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

Resolution H-freq(kHz) V-freq(Hz)

Specication

45.000 60.000

Remark

- 7 -

LGE Internal Use Only

ADJUSTMENT INSTRUCTION

(2)

(6)

(5)

1. Application Range

This document is applied all of monitor TV models with LU60A
chassis..

2. Designation

1) The adjustment is according to the order which is designat-

ed and which must be followed, according to the plan which
can be changed only on agreeing.

2) Power adjustment : Free Voltage.

3) Magnetic Field Condition: Nil.

4) Input signal Unit: Product Specication Standard.

5) Reserve after operation: Above 5 Minutes (Heat Run)

Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %

Input voltage : 220 V, 60 Hz

6) Adjustment equipments : Color Analyzer (CA-210 or CA-

110), DDC Adjustment Jig equipment, SVC remote controll.

7) Push The "IN STOP KEY" – For memory initialization

Case1 : Software version up

1) After downloading S/W by USB , Multi-vision set will
reboot automatically

2) Push "In-stop" key

3) Push "Power on" key

4) Function inspection

5) After function inspection, Push "In-stop" key.

Case2 : Function check at the assembly line

1) When TV set is entering on the assembly line, Push "In-

stop" ke y at rst.

2) Push "Power on" key for turning it on.

→ If you push "Power on" key, TV set will recover channel

information by itself.

3) After function inspection, Push "In-stop" key.

4) Click “Read” tab, and then load download le(XXXX.bin) by

clicking “Read”

(4)

filexxx.bin

5) Click “Auto” tab and set as below

6) Click “Run”.

7) After downloading, check “OK” message.

(5)

(7) ……….OK

* USB DOWNLOAD

1) Make New folder named “LG_DTV” and put ISP le(*.bin)

in the folder.

2) Put the USB Stick to the USB socket.

3) 3 Automatically detecting update le in USB Stick

- If your downloaded program version in USB Stick is
Low, it didn’t work. But your downloaded version is
High, USB data is automatically detecting.

4) TV Software Upgrade feature will be displayed.

3. Main PCB check process

* APC - After Manual-Insult, executing APC

* Boot le Download

1) Execute ISP program “Mstar ISP Utility” and then click

“Cong” tab.

2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.

3) Click “Connect” tab. If display “Can’t ”, Check connect
computer, jig, and set.

(1) (3)

Please Check the Speed :

Use the speed under

OK

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

200KHz.

5) Updating is starting.

6) Updating Completed, The TV will restart automatically.

* After downloading, have to adjust TOOL OPTION again.

- 8 -

LGE Internal Use Only

3.1. EDID Process

012345678

9AB

CDE

F

0

0

FFFFFFFFFF

FF

0

1E6DC8

59

111

1101191

3

68

331D78EA62

75A355

4F

A0

2720125054

A7

6A

0

314F454F614F81

011

30

11111

1

662156AA5101E3046

8F

40

33

0

FD

1E

11

0

01E000FD0

384B1E

50

3D

9

0

0A

2020202020

20

000FC0

32

60

44204844204C472054

560A20

000

FF

70

0

0A

2020202020202020202020

200B1

012345678

9AB

CDE

F

0

0

FFFFFFFFFF

FF

0

1E

6D

CA

59

111

1101191

3

80

331D78EA62

75A355

4F

A0

27

20

125054

A7

6A

0

314F454F614F81

0113011111

1

662156AA5101E3046

8F

40

33

0

FD

1E

11

0

01E000FD0

384B1E

50

3D

9

0

0A

2020202020

20

000FC0

32

60

44204844204C472054

560A20

000

FF

70

0

0A

2020202020202020202020

20196

012345678

9AB

C

D

E

F

0

2

3

1E

F1

4E

84

5

3

2

20

221011

131214

10

1F716

23957766

30C0100801

1D

20

0

72

51D01E203888150565021

0

0

1E

30

1

1D

8018711C1620582C250565021

0

40

09E1

1D80D0721C

1620102C25

80C48E5021

0

09E2

3A80D0

72

382D40

102C45

20

60

6

44

21

0

01E2

3A

801871

382D40

582C70

450565021

0

01E0000000

F0

3.1.1. EDID download

1) Press “Power only” key of service remote controll.

2) Press the “ADJ” Key of service remote controll.

3) Enter EDID D/L mode by pushing “►” key at “EDID D/L”.

4) Select “Start” menu to download EDID data.

5) Check the “OK” message.

6) Press EXIT key on R/C.

→ Caution: Do not connect HDMI Cable when download

EDID

* Edid data and Model option download (RS232)

NO Item CMD 1CMD 2Data 0

- HDMI : Checksum : 96 F0

Enter

download

MODE

EDID data and

Model option

download

Download
‘Mode In’

Download A E 00 10 Automatically download

A A 0 0 When transfer the

→ Caution

* Use the proper signal cable for EDID Download

- Analog EDID : Pin3 exists

- Digital EDID : Pin3 exists

3.1.2. EDID Data

- a. RGB : Checksum – B1

‘Mode In’,

Carry the command.

(The use of a internal

Data)

3.2. Function Check

3.2.1. Check display and sound

*Check Input and Signal items. (cf. work instructions)

1) TV

2) AV (SCART/CVBS)

3) COMPONENT (480i)

4) HDMI
* Display and Sound check is executed by Remote controll.

→ Caution : Not to push the INSTOP KEY after completion if

the function inspection.

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 9 -

LGE Internal Use Only

4. Total Assembly line process

*Connection

4.1. Tool option & ADC Check

1) Press “Power on” key of service remote control.

2) Connect D-SUB cable D-SUB jack for RS232.

3) Check the 'Tool Option' (Refer to the BOM Comments or
Adjustment spec)

4) Check the ‘ADC’ is ok

4.2. Model name & Serial number Down­load

4.2.1. Model name & Serial number D/L

1) Press "Power on" key of service remote control.

2) Connect RS232 Signal Cable to RS-232 Jack.

3) Write Serial number by use RS-232.

4) Must check the serial number at the Diagnostics of SET UP
menu.

4.2.2. Method & notice

1) Model Name & Serial Number D/L is using of scan equip­ment.

2) Setting of scan equipment operated by Manufacturing
Technology Group.

3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0

4) Check the model name Instart menu → Factory name

displayed (ex 24LN4500)

5) Check the Diagnostics (DTV country only) → Buyer model

displayed (ex 24LN4500)

4.3. Function Check

4.3.1. Check display and sound

*Check Input and Signal items. (cf. work instructions)

1) TV

2) AV (SCART/CVBS)

3) COMPONENT (480i)

4) HDMI

* Display and Sound check is executed by Remote controll.

4.4. White balance adjustment

-Equipment

1) Color Analyzer: CA-210 (LED Module : CH 14)

2) Adj. Computer(During auto adj., RS-232C protocol is
needed)

3) Adjust Remocon

RGB_Gains are xed data for each model.

Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
* Total Assembly line should be check whether the color

coordinate(x,y) data refer to below table were meet or not.
Color coordinate is differ from panel’s characteristics of color
temperature. Please check panel characteristics about color
temperature.

- Cool Panel

Color
Temperature

Luminance
(cd/m²)

*Note : *Note : x,y coordinates are drifted about 0.005 after

▪ White Balance Default value

MT48

LH4530

Cool 13,000 °K X=0.276 (±0.04)

Medium 9,300k °K X=0.291 (±0.04)

Warm 6,500k °K X=0.318 (±0.04)

Cool Min : 80 Typ : 110 <Test Signal>

Medium Min : 80 Typ : 110

Warm Min : 70 Typ : 110

Y=0.275 (±0.04)

Y=0.294 (±0.04)

Y=0.334 (±0.04)

<Test Signal>
Inner pattern
(204gray,80IRE)

Inner pattern
(204gray,80IRE)

30 mins heat-run. So checking color coordinate within
5-min at total assembly line, consider x,y coordinates
might be up to 0.005 than x,y target of each color
temperature

Gain Cut

R G B R G B

22MT48

22LH4530

24MT48

24LH4530

28MT48

28LH4530

LGD

Cool 121 126 192 128 128 128

(AH-

Medium 165 172 210 128 128 128

IPS /
FHD)

Warm 186 185 192 128 128 128

CMI

Cool 171 172 208 128 128 128

LE2

Medium 192 192 188 128 128 128

(VA /

HD)

Warm 192 162 122 128 128 128

BOE

Cool 182 172 222 140 140 140

(VA /

Medium 192 173 192 140 140 140

HD)

Warm 192 168 130 140 140 140

→ Caution : Not to push the INSTOP KEY after completion if

the function inspection.

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 10 -

LGE Internal Use Only

*Auto-control interface and directions

Color Analyze r

Comput er

Pattern Generator

※

※If TV internal pattern is used, not needed

Signal Source

Probe

RS-232C

RS-232C

RS-232C

DFT JIG

RGB Cable

1) Adjust in the place where the inux of light like oodlight

around is blocked. (Illumination is less than 10ux).

2) Adhere closely the Color Analyzer ( CA210 ) to the module
less than 10cm distance, keep it with the surface of the
Module and Color Analyzer’s Prove vertically.(80~100°).

3) Aging time

- After aging start, keep the power on (no suspension of

power supply) and heat-run over 5 minutes.

- Using ‘no signal’ or ‘full white pattern’ or the others,

check the back light on.

* When doing Adjustment, Please make circumstance as

below.

4.5. Model Name & SW Version & Adjust
check.

* Press the ‘Instart’ key of ADJ remote controll

4.5.1. Model Name& SW Version Check

1) Check ‘Model Name’.

2) Check ‘S/W Version’ (Refer to the IC Ver. in the BOM)

* Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End

RS-232C COMMAND

[CMD ID DATA]

Cool Mid Warm Cool Mid Warm

R Gain jg Ja jd 00 172 192 192 192

G Gain jh Jb je 00 172 192 192 192

B Gain ji Jc jf 00 192 192 172 192

R Cut 64 64 64 128

G Cut 64 64 64 128

B Cut 64 64 64 128

MIN CENTER

(DEFAULT)

MAX

** Caution **
Color Temperature : COOL, Medium, Warm.
One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
(when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)

*Note : Manual W/B process using adjusts Remote control.

1) After enter Service Mode by pushing "ADJ" key,

2) Enter "White Balance" by pushing "►" key at "White Bal-

ance".

4.5.2. Adjust Check

1) Check ‘Country Group’

2) Check ‘Area Option’

3) Check ‘Tool Option’ (Refer to the BOM Comments)

4) Check ‘EDID[RGB&HDMI]’ is OK.
* After check all, Press the 'EXIT' key of ADJ remote controll

to go out SVC menu.

4.6. Outgoing condition Conguration

* After all function test., press IN-STOP Key by SVC Remote

controll. And make Outgoing Condition

4.7. Ship-out mode check (In-stop)

▪ After nal inspection, if monitor is power only mode, In-stop

process is started automatically when PC is turned off by
command.

Check that the unit goes to Stand-by mode.

▪ For manual in-stop, press In-Stop key of the Adj. R/C and

check that the unit goes to Stand-by mode.

▪ In-stop time

- total required time : around 10 second.(Maximum 12
second)

; time to display “In-stop OSD” : 8 second.
; time to turn on RED LED : 2 second.

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 11 -

LGE Internal Use Only

1. No Power

Replace X300

N

Check C500

Voltage Level (19V)

Check Power connector

OK ?

Replace Adapter

Y

N

Y

Check IC501 Output

Voltage Level (3.3V)

Replace IC501 &

Recheck

Y

N

Check X300 Clock

24MHz

Replace IC405 Flash

Memory

Y

Check IC503 Output

Voltage Level (5V)

Replace IC503 &

Recheck

Y

N

Check IC502 Output

Voltage Level (1.15V)

Replace IC502 &

Recheck

N

Y

TROUBLE SHOOTING

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 12 -

LGE Internal Use Only

2. No Picture

Replace Cable

N

Module Back Light On?

Check IC700 & Q700

Replace LED Driver IC or FET

Y

N

N

Check Panel Power 1 2V (P401 #30 )

Check IC500 Output 12V

Replace IC500 &

Recheck

Y

N

Check Panel input Clock

P401 (#9, #10 )

Check IC300

Repair Main B/D

Y

N

Check FFC Cable for Damage or

Open Conductors

Check LED Driver Output

(C706)

Replace T-Con Board or Module

Y

Check IC300

Replace Mai n SOC

N

Check WLED_ENABL E Hig h?

Y

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 13 -

LGE Internal Use Only

3. No Video - Digital TV

Check RF Cable

Y

1. Check RF IC(L200) Power (3.3V)

2. Check IC501 Output voltage(3.3V)

Replace IC501 &

Recheck

Y

N

Check SCL/SDA Line(TU200 #3, #4)

Replace TU200 or

IC300(=> Main Scaler

)

N

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 14 -

LGE Internal Use Only

4. No Video - HDMI

Replace Main

Scaler

(IC300)

Check input signal format

Is it supported?

Check JK100 for proper

connection or Damage

Replace Connector

Y

N

Check I2C Signal

(JK100)

Re Download EDID Data

Y

N

Y

Check HDMI Cable for Damage or

Open Connector

Y

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 15 -

LGE Internal Use Only

BLOCK DIAGRAM

172mV

540mV

M1L

(128 Pin)

RS-23 2C( Phone j ack)

DEMOD

X -tal

Serial Flash

8M x 8bit

DDR 2

64Mbit

HDMI 1

TMDS/ DDC

Vide o

Fro nt

End

Audio

Fro nt

End

HDMI

RX

LVD S out

FHD or HD

HD/SD

Vide o

Enco der

BM 28720MUV

( Digital AMP)

I2S

M CLK

Audio

DSP

UART

RX/ TX

A i r /Ca bl e

C an tuner

Side USB

USB2 .0

LVDS

Co n.

FHD

A nalog

De mod

E EP ROM

64K x 8bi t

XTAL : 24MHz

TMDS

22in ch :148.5MHz(FH D)

20/24/28i nch : 85.5M Hz(HD)

22in ch : L VDS 2ch, 1920x1080,60hz , 175MHz

20/24/28i nch : L VDS 1ch, 1366x768,60hz, 82MHz

DDR : 800MHz

MT48, 28LH 4530 : Fo r user

22/24LH 4530 : Ser vice o nl y

MT48, 28LH 4530 : Use(Serv ice on ly )

22/24LH 4530 : Not u se

MT48 : TDSS-H 701F(LG IT/Hal f NIM)

LH4530 : VA4S1UB1388(Shar p/Half NIM)

IF

I F (ATS C)

I F (NTSC)

S D A/SCL

(24MHz)

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 16 -

LGE Internal Use Only

400

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts
are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as recommended
in this manual to prevent Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

910

LV1

730

A2

200

540

541

831

900

120

832

300

Copyright © LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 17 -

510

LGE Internal Use Only

<HDMI>

Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

SHIELD

20

19

18

17

16

15

14

13

12

11
10

EAG59023302

9

8

7

6

5

4

3

2

1

JK100

CK+

D0-

D0_GND

D0+

D1-

D1_GND

D1+

D2-

D2_GND

D2+

JP110

JP109

JP107

5V_HDMI_1

R100

1K

OPT
VA100

18V

AR106

AR105

5.1

+3.3V_ST

AR104

OPT

VA101

5.6V

OPT

VA102

18V

5.1

47K

VA103

18V

5V_HDMI_1

Q101

2N3904S

5V_DET_HDMI_1

C

E

R110

10K

B

VA108

18V

VA109

18V

HPD1

DDC_SDA_1

DDC_SCL_1

C
R102
10K

OPT

Q100

B

2N3904S

E

CK-_HDMI1
CK+_HDMI1
D0-_HDMI1
D0+_HDMI1

D1-_HDMI1
D1+_HDMI1

D2-_HDMI1
D2+_HDMI1

R120

2.7K

+5V

R121

2.7K

A2CA1
MMBD6100
D102

DDC_SDA_1

DDC_SCL_1

Jack Shield (HDMI)

JackShield(for NonCKD)

M100

MGJ64944801

JackShield(for CKD)

M100-*1

MGJ64944802

COMPONENT

6A

[GN/YL]E-LUG

5A

[GN/YL]O-SPRING

4A

[GN/YL]CONTACT

5B

[BL]O-SPRING

7C

[RD1]E-LUG-S

5C

[RD1]O-SPRING

4C

[RD1]CONTACT

5D

[WH]O-SPRING

4E

[RD2]CONTACT

5E

[RD2]O-SPRING

6E

JK101

COMP

[RD2]E-LUG

PPJ245-31

COMP

VA113

5.6V

VA105

COMP
VA104

5.6V

COMP

VA112

5.6V

VA107

5.6V
OPT

VA122

5.6V
OPT

OPT

5.6V

COMP

R10 6
75

1%

COMP
C100
1000pF
50V

COMP

C101
1000pF
50V

COMP

R10 7

75
1%

R108
470K
OPT

R109

470K
OPT

COMP

R105
75
1%

COMP

OPT

C102

0.1uF
16V

COMP
10K

AR100

+3.3V

10K

AR107

COMP

R114

12K

COMP

R113

12K

R118

COMP

1K

VA106

5.6V

OPT

COMP
R117

COMP_Y+

AV_DET

COMP_Pb+

1K

COMP_DET

COMP_Pr+

COMP_L_IN

USB_SPG

SPG15-UCS-0203

JK103-*1

1234

USB DOWN STREAM

5

(Obsolete)USB_SPG
SPG15-UCS-0203

JK103

1234

USB DOW N ST REAM

5

<USB_SIDE>

10V->6.3V for CI
150625 YJLee

6.3V
C103

C104

VA110

ZD100

10uF

5V

6.3V
OPT

OPT

OPT

VA111

18V

18V

JP113

JP112

JP111

22uF

OPT

R104
14K

MAX 1.5A(USB 2.0)

VOUT

6

ILIM

5

OC

4

R111

2.2

R112

2.2

IC100

BD2242G

SIDE_USB_DM

SIDE_USB_DP

Add for EOS
150309 YJLee

+5V

VIN

1

GND

2

EN

3

R119

10K

R101
100

R103
100

+3.3V

C105

0.1uF

16V

4.7K
R122

USB1_OCD

USB1_CTL

<RS232C>

RS232C

6 M6

1 M1

3 M3_DETECT

4 M4

5 M5_GND

RS232C

VA123

Event only

AR103

RS232C

RS232C

VA124

18V

18V

P100

100

+3.3V_ST

1

2

3

4

5

+3.3V_ST

4.7K

AR101

RS232C

PM_TXD

PM_RXD

JK104

COMP_R_IN

JP116

JP128

JP129

JP130

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.





M1L_CI

JACK INTERFACE

2015-06-27

1

7

TUNER

Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

9

SHIELD

TU200
VA4S1UB1388

SCL

1

SDA

2

B[+3.3V]

3

NC_1

4

IF_AGC

5

NC_2

6

IF[N]

7

IF[P]

8

Close to TUNER

Ready to solve noise issue.

OPT

C200

0.1uF
16V

OPT

C201

0.1uF
16V

AR200

33

Close to the tuner

OPT

C204
18pF
50V

OPT

C206
18pF
50V

AR201

200

C208
20pF
50V

121118
SS BEAD->SUNLORD BEAD

C211
100pF
50V

close to the tuner pin, add,09029

R206 1K

C207

0.1uF

16V

+3.3V_TU

R207

1.8K

L200

C209
20pF
50V

120OHM

R208

1.8K

TU_SCL

TU_SDA

+3.3V_TU

C212

0.1uF
16V

C214
100uF
16V
105C
OPT

IF_AGC

should be guarded by ground

60mA

+3.3V_TU

C210
22uF

6.3V

0ohm(3.3_TU)

L203-*1

0

Bead(3.3_TU)

L203

UBW2012-121F

C213

0.1uF
16V

C215
22uF

6.3V

+3.3V

C217

0.1uF

16V

Apply->OPT for CI
150625 YJLee

DIF_N

DIF_P

1. should be guarded by ground

2. No via on both of them

3. Signal Width >= 12mils
Signal to Signal Width = 12mils
Ground Width >= 24mils

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TUNER





M1L_CI

Tuner block

2015-06-27

2

7

+3.3V_ST

Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

4.7K

AR309

Delete AMP_SCL/SDA Pull-up resistor for CI
150630 YJLee

<SOC_RESET>

+3.3V_ST

10V->6.3V for CI
150625 YJLee

D400

MMBD6100

OPT

A2CA1

<HW_OPT>

+3.3V_ST

PIN NAME

MODEL_OPT_1

R304

R305

C300
10uF

6.3V

1K

MO_FHD

1K

MO_HD

R307

R303

100K

MODEL_OPT

MODEL OPTION

LOW

FHD

22

C305

0.1uF
16V

HIGH

HD

I2C_SDA
I2C_SCL

SOC_RESET

DISP_EN

+3.3V_ST

1uF

C332

+1.8V_DDR

C309

10uF

6.3V

10V->6.3V for CI
150625 YJLee

+5V

10K

AR305

R301

4.7K

B

Q300

2N3904S

SOC_RESET

SIDE_USB_DM

SIDE_USB_DP

16V

C339

10V

0.1uF

+1.15V_VDDC

WLED_ENABLE

C

R347

20K

1/16W

1%

E

AV_DET

IR

INT/GPIO64/I2S_OUT_MCK

LED_AMBER

KEY1

KEY2

CEC/GPIO71

AVDD_MOD_3
SAR0/GPIO75
SAR1/GPIO74
SAR2/GPIO73

VDDIO_DATA

C311

16V

0.1uF

POWER_ON/OFF1

DISP_EN

LED_RED

AMP_RESET_N

DDC_SDA_1

DDC_SCL_1

I2C_SDA

I2C_SCL

AMP_MUTE

R316

R317

100

22

DDCDA_DAT
DDCDA_CLK

DDCDB_DAT
DDCDB_CLK
HOTPLUG_B

+1.15V_VDDC

<VDDC 1.15V>

+1.15V_VDDC

0.1uF

0.1uF

C306

0.1uF

0.1uF

16V

16V

C307

C308

16V

16V

C310

10uF

10V

C302

6.3V

10V->6.3V for CI
150625 YJLee

C304 1uF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

IRIN

RESET
DM_P0
DP_P0

VDDC_4

GPIO54
GPIO55
GPIO84
GPIO83

GPIO67
GPIO70
GPIO86

EFUSE
VDDC_5
RXCN_B
RXCP_B
RX0N_B
RX0P_B
RX1N_B
RX1P_B

[EP]

TESTPIN

96

97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128

1

RX2N_B2RX2P_B

+3.3V_ST

PWM1

PWM0

SPI_SDO

/SPI_CS

SPI_SCK

33

AR302

SPI_CZ

SPI_CK

92

93

SPI_SDI

PWM0/GPIO15

SPI_DO

SPI_DI

90

91

PWM1/GPIO14

88

89

PM_TXD

PM_RXD

DDCA_DA

DDCA_CK

94

95

[M1L] 128 PIN

129

THERMAL

3

4

RXCN_A5RXCP_A6RX0N_A7RX0P_A8RX1N_A9RX1P_A10RX2N_A11RX2P_A12HSYNC0

AVDD_MOD_1

16V

C336

0.1uF

CK-_HDMI1

CK+_HDMI1

D0+_HDMI1

D1+_HDMI1

D1-_HDMI1

D0-_HDMI1

HPD1

/FLASH_WP

PANEL_CTL

GPIO2

GPIO1

GPIO0

HOTPLUG_A

85

86

87

IC301

BIN0P14GIN0P15GIN0M16RIN0P

D2-_HDMI1

D2+_HDMI1

MULTI_ON

GPIO4

83

84

TU_SCL

GPIO5

TU_SDA

82

P_AMP_SCL

GPIO6

81

RXB0-

P_AMP_SDA

LVB0M

GPIO7

79

80

RXB0+

LVB1M

LVB0P

77

78

RXB1-

LVB1P

76

RXB1+

MSD8222LUM

13

17

18

VSYNC0

AVDD3P3_ADC

+3.3V_ST

C338

0.1uF

16V

19

20

21

BIN1P

GIN1P22GIN1M23RIN1P24CVBS0

SOGIN1

50V

1000pF

0.047uF

0.047uF

25V

COMP

COMP

COMP

C316

C318

C317

COMP

COMP

COMP

R312 33

R311 33

R309 33

COMP_Pb+

25V

COMP_Y+

+3.3V_ST

RXB2-

LVB2P

LVB2M

74

75

25V

0.047uF

0.047uF

COMP

COMP

C320

C319

COMP

R315 33

COMP

COMP_Pr+

R333 68

16V

0.1uF

C335

RXB2+

RXBCK-

LVBCLKP

LVBCLKM

AVDD_LPLL

72

73

25

VCOM

CVBS_OUT1

25V

0.047uF
25V

25V

COMP

C321 0.047uF

C322

COMP

R337 150

R338 180

COMP_Y+

RXBCK+

LVB3M

71

26

VDDC_1

+3.3V_ST

RXB3-

70

27

+1.15V_VDDC

USB1_CTL

USB1_OCD

RXB3+

LVA0M

GPIO29

GPIO28

LVB3P

67

68

69

28

29

30

AVDD_AU33

LINEIN_R0

LINEIN_L0

LINEIN_R1

C3232.2uF

C324

COMP

COMP

2.2uF

10V

10V

COMP_R_IN

COMP_L_IN

C330

0.1uF

16V

RXA0-

RXA0+

LVA0P

65

66

64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33

31

32

LINEIN_L1

LVA1M
LVA1P
LVA2M
LVA2P
LVACLKM
LVACLKP
LVA3M
LVA3P
GPIO53/I2S_OUT_SD
GPIO52/I2S_OUT_BCK
GPIO51/I2S_OUT_MCK
GPIO50/I2S_OUT_WS
GPIO49/SPDIF_OUT
GPIO47
GPIO46

R1069
0

OPT

GPIO45/I2C_SCLM/UART_RX1
GPIO44/I2C_SDAM/UART_TX1

RXA1-

RXA1+

RXA2-

RXA2+

RXACK-

RXACK+

RXA3-

RXA3+

AUD_LRCH

AUD_SCK

AUD_LRCK

COMP_DET

5V_DET_HDMI_1

MODEL_OPT

VDDC_3
VDDC_2

+1.15V_VDDC

VDDIO_CMD
AVDD_MOD_2
XTAL_OUT
XTAL_IN
AVDD3P3_DMPLL
AVDD3P3_DADC
VIFM
VIFP
IFAGC
LINEOUT_R3
LINEOUT_L3

Close to MSTAR

16V

C328

0.1uF

C327

0.1uF

16V

OPT
C333
50V
100pF

VRM_ADC
VAG

16V

C325

0.1uF

6.3V

C326

10uF

L302

BLM15PX121SN1

DIMMING

BLU_CURRENT_CTL

WLED_DIM_ADJ

1%

1M

R339

DTV_IF

OPT
C334
100pF
50V

+1.15V_VDDC

X300

24.0MHz

DIF_N

DIF_P

+3.3V

L303-*1

0

Bead(IF_AGC)

0.1uF

0ohm(IF_AGC)

C342
16V





M1L_CI

MAIN

OPT

R310

3.9K

C343 30pF

50V

C344 30pF

50V

Apply->OPT for CI
150625 YJLee

L303

BLM15PX121SN1

R340
10K

R341

10V

C341

2.2uF

1/16W

5%

14.08.21
27->30pF

C329

0.1uF

16V

NON_A_DEMODE
AGC 1.25V
100 OHM SERIAL
A_DEMODE 0ohm

100

C345

0.047uF
25V

Close to MSTAR

R313

10K

R314

100

PDIM

R300

C331

10uF

6.3V

10V->6.3V for CI
150625 YJLee

+3.3V_ST

4.7K

C340

0.1uF

IF_AGC

R302

4.7K

+3.3V_ST

16V

+3.3V_ST

C337

0.1uF

16V

2015-06-27

PWM0

PWM1

M1L Chip sel

3

+1.8V_DDR

C303

C301

10uF

6.3V

10V->6.3V for CI
150625 YJLee

7

0.1uF

16V

IR/LED and Control

Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

15Y_CONTROL

LED_RED

R400

10K

KEY2

KEY1

C

B

E

10K

OPT

R402

Q400
2N3904S

AR400

100

16Y_CONTROL

AR401

100

LED_AMBER

R404

Module(HD)

+3.3V_ST

3.3K

AR413

Apply->OPT for CI
150625 YJLee

R405

4.7K

C

B

Q401

E

2N3904S

IR

10K

R406
200

D410

30V

CDS3C30GTH

50V

C400

1000pF

D411

CDS3C30GTH

JP400

JP401

JP402

30V

JP408

JP409

JP410

VA400 18V

P400

12507WR-08L

1

2

3

4

5

6

7

8

9

PIN22(23.6")

0~0.7V

2.7~3.3V/Open

PIN22(27.5"BOE,29")

0~0.7V

2.7~3.3V/Open

PIN22(27.5"CSOT)

0~0.7V/Open

2.7~3.3V

PIN23

NC(OPEN)

GND

+12V_PANEL_POWER

27.5"

23.6",29"

VESA
JEDIA

JEDIA

VESA

VESA
JEDIA

HD(12V Panel)

C403

0.1uF
16V

25V->16V for CI
150625 YJLee

RXA3+

RXA3-

RXACK+

RXACK-

RXA2+

RXA2-

RXA1+

RXA1-

RXA0+

RXA0-

#21 23.6(LGD) Interlace Mode Selection
High : Interlace Mode
Low : Normal Mode

2015.08.18

5.6 K

5.6 K
R41 5

R41 4

HD(12V Panel)

HD(12V Panel)

Change option
150508 YJLee

JP412

R401

23.6"LGD(LVDS)
R417

23.6"CMI(LVDS)

R416 0

27.5"(LVDS)

0

0

HD(12V Panel)

P401

10031HR-30

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

Module(FHD)

+5V_PANEL_POWER

FHD(5V Panel)

C404

0.1uF
16V

For Interlace Mode
High : Interlace Mode
Low : Normal Mode

2013.07.15

RXACK+

RXACK-

RXA2+

RXA2-

RXA1-

RXBCK+

RXBCK-

RXB2+

RXB2-

RXB1+

RXA3+

RXA3-

RXA1+

RXA0+

RXA0-

RXB3+

RXB3-

RXB1-

RXB0+

RXB0-

R418

4.7K

OPT

+3.3V

5.6 K
R41 9

FHD(5V Panel)

FHD(5V Panel)

OPT
R420
100

JP413

FHD(5V Panel)

P402

10031HR-30

JP414

5.6 K
R42 1

R422

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

<SERIAL FLASH>

/SPI_CS

SPI_SDO

/FLASH_WP

SPI_FLASH_WINBOND_15Y

IC405-*1

W25Q64FVSSIG

VCC

CS

8

1

DO[IO1]

WP[IO2]

%HOLD[IO3]

7

2

CLK

6

3

GND

DI[IO0]

4

5

+3.3V_ST

R564
10K

+3.3V_ST

MX25L6433FM2I-08G

R569

4.7K
OPT

CS#

SO/SIO1

WP#/SIO2

GND

SPI_FLASH_MACRONIX_16Y

IC405

1

2

3

4

8

7

6

5

VCC

HOLD#/SIO3

SCLK

SI/SIO0

+3.3V_ST

C556

0.1uF

16V

SPI_SCK

SPI_SDI

<NVRAM>

BR24G512FJ-3

A0

A1

A2

GND

Rohm_EEPROM

IC403-*1

1

2

3

4

+3.3V_ST

C552

0.1uF

ATMEL_EEPROM

AT24C512C-SSHD-T

A0

VCC

8

WP

7

SCL

6

SDA

5

1

A1

2

IC403

A2

3

GND

4

16V

VCC

8

WP

7

SCL

6

SDA

5

R573
22

R574
22

I2C_SCL

I2C_SDA

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.





M1L_CI

MEMORY/LVDS/IR

2015-06-27

4

7

JK500

Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

KJA-DC-1-0032

19V to 12V (For HD Panel)

HD(12V Panel)

IC500

JP500

4

2

1

JP501

+19V

C500
47uF
25V
105C

Check the Ripple

OPT
C501
10uF
25V

OPT
C502
10uF
25V

C504

2.2uF
25V

HD(12V Panel)
HD(12V Panel)

C506

0.1uF
50V

OPT
R501
47K

AAM

GND

IN

SW

MP2315GJ

1

2

3

3A

4

FB

8

VCC

7

EN/SYNC

6

68->100 150322 YJLee
To reduce SW spike voltage

BST

5

HD(12V Panel)

HD(12V Panel)

R505
100

C512

0.1uF
50V

MULTI_ON

HD(12V Panel)
R508
10K

OPT
R509
2K

C517

0.1uF
16V

HD(12V Panel)

HD(12V Panel)

R517
33K

L502

HD(12V Panel)

10uH

25V->16V for CI
150625 YJLee

C528

C524

C522
10uF

16V

Change X7R(3216)->X5R(2012) for CI
150625 YJLee

0.1uF

10uF

16V

HD(12V Panel)
HD(12V Panel)
HD(12V Panel)

16V

R52 0
43K
1%

R52 1
100 K
1%

R52 2

10K
1%

HD(12V Panel)
HD(12V Panel)
HD(12V Panel)

+12V_Normal

** 3.3V_ST -> 1.15V VDDC

+3.3V_ST

R502

10K

C503
10uF

10V

X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.

2013.11.27 by BJ.KIM

V0 = 0.8*(1+(R1/R2))

AP7173-SPG-13 HF(DIODES)

IC501

[EP]

IN

1

PG

2

VCC

3

EN

4

9

THERMAL

OUT

8

FB

7

SS

6

GND

5

+3.3V_ST

C505

560pF

50V

R2

R503

6.8K

1%

R1

R506
3K

1%

X5R(EAE31360401) -> X7R(EAE52158501)
To improve CST Issue.

2013.11.27 by BJ.KIM

C507
10uF
10V

OPT
C508

10uF
10V

+1.15V_VDDC

OPT
C513

10uF
10V

OPT
ZD500

2.5V

POWER_ON/OFF1

10V->6.3V for CI
150625 YJLee

+3.3V_ST

+3.3V

C533
10uF

6.3V

R537

10K

R538
100K

AZ1117EH-ADJTRG1

1.3A

B

IC504

ADJ/GND

C

E

OUTIN

R542

100

Q500
2N3904S

R544

22K

R500
330

R1

1/10W
1%

R516
150

R2

1/16W
1%

10V->6.3V for CI
150625 YJLee

C534

4.7uF
10V

SSM3J332R

C537
10uF

6.3V

Vout=1.25*(1+R2/R1)+Iadj*R2

C536

1uF

OPT

Q502

10V

G

+1.8V_DDR

S

D

ZD300

2.5V
OPT

+3.3V

C540

0.1uF
16V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MULTI_ON

R559
1K

C510

0.47uF

PANEL POWER CONTROL

+5V

IC503

16V
OPT

C509

2.2uF
25V

C511

0.1uF
50V

R504
47K

AAM

GND

IN

SW

MP2315GJ

1

2

3

3A

4

FB

8

VCC

7

EN/SYNC

6

68->100 150322 YJLee
To reduce SW spike voltage

BST

5

R514
100

C516

0.1uF
50V

R549

R519
33K

L503
10uH

R52 9

47K

C520

0.1uF

10K

16V

C527
10uF

6.3V

10V->6.3V for CI
150625 YJLee

C531
10uF

6.3V

C532

0.1uF
16V

R53 0

7.5 K

R53 1

1%

1%

10K

1%

+5V

R530:8.2k->7.5k
150918 HJChoi

R588

1K

FHD(5V Panel)

PANEL_CTL

FHD(5V Panel)
R539
0

C

B

E

FHD(5V Panel)

+12V_Normal

FHD(5V Panel)

Q504
2N3904S

0

R567

R540

4.7K

HD(12V Panel)

R541
0

B

10K

R543

R545

100K

FHD(5V Panel)

R546
15K

C

Q501
2N3904S

E

C535

4.7uF
16V

HD(12V Panel)
R546-*1
75K

R546:10k->15k
FHD/150918 HJChoi

Q503

SSM3J332R

S

G

+12V_PANEL_POWER

D





M1L_CI

POWER

HD(12V Panel)

R550
0

+5V_PANEL_POWER

FHD(5V Panel)
R551

0

2015-06-27

6 7

AUDIO AMP

Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

AMP_MUTE

P_AMP_SDA

P_AMP_SCL

AUD_SCK

AUD_LRCK

AUD_LRCH

+3.3V

10K

AR600

C600
2700pF
50V

R601

10K

B

1.5K
R603

C601

0.027uF
50V

+3.3V_ST

R604

10K

C

Q600

2N3904S

E

C602
33pF
50V

OPT

JP600

10V
1uF

C603

3.3K

R605

R606 100

C604
33pF
50V

OPT

ADDR

BCLK

LRCK

SDATA

TEST1

REG15

DGND

JP601

PLL

C605

1uF

10V

[EP]

1

2

3

4

5

6

7

8

C606
1000pF
50V

OPT

SCL

SDA

32

THERMAL

33

9

DVDD

TEST2

+3.3V

31

10

AMP_RESET_N

OPT

1000pF

50V

C607

NC_2

RSTX

MUTEX

28

29

30

IC600

BM28720MUV

11

12

13

TEST3

ERROR

STADAO

JP602

JP603

10V

C608 10uF

REG_G

27

14

NC_1

10V

4.7uF

C610

OUT1P

BSP1P

25

26

24

23

22

21

20

19

18

17

15

BSP2N16OUT2N

10V

C609 4.7uF

VCCP1

GNDP1

BSP1N

OUT1N

OUT2P

BSP2P

GNDP2

VCCP2

+19V

+19V

C611
10uF
25V

C612
10uF
25V

C629
10uF
25V

C630
10uF
25V

OPT

C616

4.7uF

C615

C613
100uF
25V
105C

4.7uF

10V

10V

OPT

C614

100uF
25V
105C

C617
680pF
50V

R608

5.6

R609

5.6
C618

680pF
50V

R611

5.6

C619
680pF
50V

R610

5.6

C620
680pF
50V

L602

10.0uH

NRS6045T100MMGK

L603

10.0uH

NRS6045T100MMGK

L600

10.0uH

NRS6045T100MMGK

L601

10.0uH

NRS6045T100MMGK

C623

0.33uF
50V

C624

0.33uF
50V

C621

0.33uF
50V

C622

0.33uF

50V

OPT

C626

0.47uF
50V

OPT

C625

0.47uF
50V

JP604

JP606

JP605

250A1-WR-H04M

4

3

2

1

JP607

WAFER-ANGLE

P600

SPK_L+

SPK_L-

SPK_R+

SPK_R-

100K

R607

+3.3V

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.





M1L_CI

AMP_ROHM

2015-06-27

76

LED DRIVER

Copyright ⓒ 2016 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

R1041

BLU_CURRENT_CTL

2K

1%

WLED_DIM_ADJ

R1034
510K

1/8W
1%

23.6
R1022-*1

12K
1%
1/8W

PDIM
R1039
100

PDIM
R1019
100K

1%

R1042
33K
1%

100k->33k(3V->1.6V)
140323 YJLee

CH1

CH2

CH3

CH4

C1021
1000pF
50V

23.6_NOT
R1022

9.1K
1%
1/8W

+19V

OPT

C1019

100pF

50V

Apply->OPT for CI
150727 YJLee

23.6CMI

R1063

NOT23.6CMI

R1000

0

23.6CMI

R1001

0

+19V

23.6LGD
R1025-*3

2.7K

1%

0

LED_CH3

R1056 100K

Switching Freq:306KHz

R1036

R1035

20K

200K

1%

1%

27.5

22/23.6LGD/27.5

R1024

R1025

1.3K

6.2K

1%

1%

22
R1025-*1

3.3K

1%

23.6CMI
R1025-*2

3.9K

R1066

23.6CMI

100K

LED_CH2

R1058

GND->19V MPS recommend
150326 YJLee

1%

0

100K

LED_CH1

R1059

R1024-*1
270

1%

23.6CMI

+19V

R1005
100K

R1007

15K

GND1

ISET

ADIM

LED4

LED3

LED2

LED1

NC_1

NC_2

VCC2

C1011

0.1uF
16V

OSC

OVP

EN2

L1001

33uH

High : 1.5V

ADIM
R1006
0

IC1001

MP3378E

1

2

3

4

5

6

7

8

9

10

11

FB

12

13

14

THERMAL

28

29

27

26

25

24

23

22

21

20

19

18

17

16

15

R1008
51K

33K->51K

[EP]GND

PWM

EN1

COMP

C1022

VCC1

1uF
25V

VIN1

GATE

ISENSE

SYNC

BST

68->100 150322 YJLee
To reduce SW spike voltage

AGND

GND2_2

GND2_1

SW

VIN2

C1016

0.1uF
50V

OPT
C1020
100pF

50V
Apply->OPT for CI
150727 YJLee

+19V

C1031

1uF

25V

R1018
100

C1017

0.1uF
50V

+19V

C1030

2.2uF
25V

R1023

100K

1%

R1026
1K

R1027
10K

L1003

10uH

C1018

22uF

6.3V

R1045

270 1%

WLED_ENABLE

R1051

C1032

4700pF

50V

C1033

0.47uF
50V

Add sync circuit
150512 YJLee

19V to 3.3V Ground should be separated

R1028

OPT

C1029

C1028

0.1uF

10uF

6.3V

10V->6.3V for CI
150625 YJLee

16V

1.6K

R1029

1.6K

R1030

D

33

R1009

3.9K
1%

+3.3V_ST

5V

1%

ZD1000

PESD5V0S1UA

1%

1K
1%

R1010

3.9K
1%

G

S

R1044

Q1002
AOD2922

0.1

1%

D1002
BR210

100V

CMI23.6

R1068

0

M1004

M1005

M1006

M1007

M1008

CH1

CH2

CH3

CH4

Vout

R1049
0

CMI23.6_NOT

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

7

6

5

4

3

2

1

12507WR-06L

P1004

7

6

5

4

3

2

(UPSIDE WAFER)22"

1

12507WR-06L

P1005

(LEFT WAFER)22"NOT

Vout

(OPT)Bead_500ohm

R1003-*1

500

0ohm

R1003

0





M1L_CI

LED DRIVER

L1000

500

OPT
C1000
1uF

50V

OPT

C1001
1uF
50V

OPT
R1002
100K

OPT
R1004
100K

C1024
10uF
100V

33uF->10uF for CI
150704 YJLee

2015-06-27

7

C1023

33uF
100V

7