Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of th e cir cuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check(See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exp ose d metallic par t. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conict between the
following servicing precautions and any of the safety precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug
or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate
high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specied otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a ammable mixture.
Unless specied otherwise in this service manual, lubrication
of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks
are correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test xtures specied in this
service manual.
CAUTION: Do not connect the test xture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some eld-effect transistors
and semiconductor “chip” components. The following techniques
should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent
potential shock reasons prior to applying power to the unit
under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder
ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate
electrical charges sufcient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufcient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will
be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your
foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder ows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by
gently prying up on the lead with the soldering iron tip as the
solder melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing
the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
1. Remove the defective transistor by clipping its leads as close
as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and
if necessary, apply additional solder.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the
good copper pattern. Solder the overlapped area and clip off
any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the
lead of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
This document is applied to LA40A / LD41A chassis LED TV
which is manufactu red in TV( or Mo nit or) Factory or is
produced on the basis of this data.
2. Designation
1) Th e adjust ment is a ccordin g to th e order w hich is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
2) Power adjustment : Free Voltage.
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard.
5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 110-240 V, 50/60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA-110),
DDC Adjustment Jig equipment, Service remote control.
7) Push the "IN STOP KEY" - For memory initialization.
Case1 : Software version up
1. After downloading S/W by USB , TV set will reboot
automatically.
2. Push “In-stop” key.
3. Push “Power on” key.
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push
“In-stop” key at rst.
2. Push “Power on” key for turning it on.
→ If you push “Power on” key, TV set will recover
channel information by itself.
3. After function inspection, Push “In-stop” key.
4) Click “Read” tab, and then load download file(XXXX.bin) by
clicking “Read”.
(4)
filexxx.bin
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
(5)
(7) ……….OK
3.2. USB DOWNLOAD(*.epk file download)
(1) Make New folder named “LG_DTV” and put ISP file(*.epk)
in the folder.
(2) Put the USB Stick to the USB socket.
(3) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
- Bu t your downloaded version is High, USB data is
automatically detecting
(4) Show the message "Copying files from memory"
3. Main PCB check process
* APC - After Manual-Insult, executing APC
3.1. Boot le Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message. If display “Error”, Check connect computer, jig,
and set.
(3) Click “Connect” tab. If display “Can’t”, Check connect
computer, jig, and set.
(1) (3)
Please Check the Speed :
Use the speed under
OK
Only for training and service purposes
200KHz.
- 10 -
(5) Updating is starting.
(6) Updating C om pl et ed , T he Multi-vi si on will r es ta rt
automatically.
(7) If your TV is turned on, check your updated version and
Tool option.(refer to next page tool option section)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to
channel recover. if all channel data is cleared, you didn’t
have a DTV/ATV test on production line.
* After downloading, have to adjust TOOL OPTION again.
(1) Push "ADJ" key in service remote control.
(2) Select "Tool Option 1" and Push “OK” button
(3) Punch in the number. (Each model has their number.)
(4) Completed selecting Tool option.
EZ ADJUST
0. Tool Option1 ►
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
Tool Option1
Inch
Tool
Maker
Tool Option1
16423
26
MX33
LGD_IPS
3.5. Function Check
3.5.1. Check display and sound
*Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI(PC : 1366 x 768 @ 60Hz)
* Display and Sound check is executed by Remote control
<Caution> Not to push the INSTOP key after completion if the
function inspection.
3.4. EDID Process
3.4.1. EDID download
(1) Press "Power only" key of service remote control.
(2) Press the "ADJ" key of service remote control.
(3) Enter EDID D/L mode by pushing "►" key at "12. EDID D/L".
(4) Select “Start” menu to download EDID data.
(5) Check the "OK" message.
(6) Press EXIT key on service remote control.
<Caution>
- Do not connect HDMI & D-sub Cable when download EDID.
* Edid data and Model option download (RS232)
No.ItemCMD 1 CMD 2 Data 0
Enter download
MODE
EDID data and
Model option
download
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12. EDID D/L ►
13. Sub B/C
14. Touch Sensitivity Setting
15. Ext. Input Adjust
16. SPK Lipsync Adjust
17.SPDIF Lipsync Adjust
Download
‘Mode In’
DownloadAE00 10 Automatically download
AA0 0 When transfer the ‘Mode
EDID D/L
HDMI OK
RGB OK
Reset
Start
In’, Carry the command.
(The use of a internal Data)
3.6. CI+ key writing process(Device CN)
3.6.1. Communication Port Connection
Connection : PCBA(USB Port) → USB to Serial Adapter(UC232A) → RS-232C cable → PC(RS-232C port)
3.6.2. CI+ Key Download
(1) Set CI+ Key path Directory at Start Mac & CI+ Download
Programme.
(2) Set COM 1,2,3,4 / 115200(Baudrate)
(3) Click port connection button.
(4) Start CI+ Key Download, Push the button.
(5) Check OK or NG
(6) After completing download, CI + key values are increase
by one automatically. To write CI+ key next SET, click CI+
key writing button directly.
(7) Check whether the key was downloaded or not at ‘In Start’
menu. (Refer to below).
<Caution>
* Use the proper signal cable for EDID Download
3.6.3. Check the Download to CI+ Key value in LG set.
(1) Check the method of CI+ Key value.
1) Check the method on Instart menu.
(2) Check the method of CI+ key value(RS232)
1) Into the main ass’y mode(RS232: aa 00 00)
CMD 1CMD 2Data 0
AA00
2) Check the mothed of CI+ key by command
(RS232: ci 00 20)
CMD 1CMD 2Data 0
CI20
3) Result value
i 01 OK 1d1852d21c1ed5dcx
CI+ Key Value
4. Total Assembly line process
4.1. Tool option & ADC Check
(1) Press "Power on" key of service remote control.
(2) Connect RS232 Signal Cable to RS-232 Jack.
(3) Check the 'Tool Option'(Refer to the BOM Comments or
Adjustment spec.)
(4) Check the ‘ADC’ is ok.
4.2. Model name & Serial number download
4.2.1. Model name & Serial number D/L
1) Press "Power on" key of service remote control.
2) Connect RS232 Signal Cable to RS-232 Jack.
3) Write Model Name & Serial Number by use RS-232.
4) Must check the serial number at the Diagnostics of SET UP
menu. (Refer to below.)
4.2.2. Method & notice
(1) Model Name & Serial Number D/L is using of scan
equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0.
*Manual Download (Model Name and Serial Number)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized. (Not
always) There is impossible to download by bar code scan,
so It need Manual download.
1) Press the 'Instart' key of ADJ remote control.
2) Go to the menu '6.Model Number D/L' like below photo.
3) Input the Factory model name(ex 24LB4500) or Serial
number like photo.
4) Check the model name Instart menu. → Factory name
displayed.
5) Check the Diagnostics. (DTV country only) → Buyer
■ Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART/CVBS)
3) COMPONENT (480i)
4) HDMI(PC : 1366 x 768 @ 60Hz)
* Display and Sound check is executed by Remote control
* Caution : Not to push the INSTOP KEY after completion if
the function inspection.
4.3.2. PCMCIA CARD Check
You must adjust DTV 29 Channel and insert PCMCIA CARD
to socket.
- If PCMCIA CARD works normally, video signals will appear
on screen.
appear on screen.
* Caution: Set up "RF mode" before launching products.
But it works abnormally, "No CA module" will
* Note : Manual W/B process using adjusts Remote control.
1) After enter Service Mode by pushing "ADJ" key,
2) Enter "White Balance" by pushing "►" key at "9. White
Balance".
EZ ADJUST
0. Tool Option1
1. Tool Option2
2. Tool Option3
3. Tool Option4
4. Tool Option5
5. Tool Option6
6. Country Group
7. Area Option
8. ADC Calibration
9. White Balance
10. 10 Point WB
11. Test Pattern
12 EDID D/L
13. Sub B/C
14. Touch Sensitivity Setting
15. Ext. Input Adjust
16. SPK Lipsync Adjust
17.SPDIF Lipsync Adjust
Whit Balance
Color Temp. ◄►
R-Gain
G-Gain
B-Gain
R-Cut
G-Cut
B-Cut
Test-Pattern
Backlight
Reset To Set
Cool
100
104
192
64
64
64
ON
100
4.4. White balance adjustment
(Do not adjust white balance)
(1) Equipment
1) Color Analyzer: CA-210 (LED Module : CH 14)
2) Adj. Computer(During auto adj., RS-232C protocol is
needed)
3) Adjust Remote control
RGB Gains are fixed data for each model.
Insert RS-232C Jack which is connected with PC for White
Balance or equivalent device.
→ Total Assembly line should be check whether the color
coordinate(x,y) data refer to below table were meet or not.
Color coordinate is differ from panel’s characteristics of
color temperature. Please check panel characteristics about
color temperature
- Cool Panel
X=0.276 (±0.04)
Y=0.275 (±0.04)
X=0.290 (±0.04)
Y=0.298 (±0.04)
X=0.318 (±0.04)
Y=0.334 (±0.04)
<Test Signal>
Inner pattern
(204gray,80IRE)
<Test Signal>
Inner pattern
(204gray,80IRE)
Color
Temperature
Luminance
(cd/m²)
Cool13,000K
Medium9,300K
Warm6,500K
CoolMin : 80K Typ : 110
Medium Min : 80K Typ : 110
WarmMin : 70K Typ : 110
* When doing Adjustment, Please make circumstance as
below.
4.5. DPM Operation check
■ Measurement Condition: 100~240V@ 50/60Hz
(1) Set Input to HDMI (with Input Label set to PC) and connect
HDMI cable to set - HDMI Mode
(2) Cut off H sync or V sync of signal.
(3) Check DPM operation refer to the below table.
Operating ConditionSync(H/V) Video LED(SET) Wattage(W)
Power S/W On
Sleep mode -
RGB, HDMI
Off/OffOffAmber1
* Note : x,y coordinates are drifted about 0.007 after 30 mins
heat-run. So checking color coordinate within 5-min at
total assembly line, consider x,y coordinates might be
up to 0.007 than x,y target of each color temperature.
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
If this system need 5V Power
and don’t need 12V Power,
Please need 5V_MHL_Separate Power
POWER_ON/OFF1
+3.3V_ST
R401
10K
R434
100K
B
+3.3V_ST
R440
22K
R438
100
C
Q400
MMBT3904(NXP)
E
C439
4.7uF
10V
PMV48XP
Q402
C434
1uF
10V
OPT
S
G
D
+3.3V_Normal
C438
0.1uF
16V
HD(12V Panel)
IC400
AAM
GND
IN
SW
AAM
GND
IN
SW
MP2315GJ
1
2
NEW
3
3A
4
IC401
MP2315GJ
1
2
NEW
3
3A
4
HD(12V Panel)
C406
0.1uF
50V
C407
0.1uF
50V
R402
47K
OPT
R403
47K
JP400
4
2
1
JP401
C400
47uF
25V
105C
+19V
OPT
OPT
C402
C401
10uF
10uF
25V
25V
Check the Ripple
HD(12V Panel)
C404
2.2uF
25V
C405
2.2uF
25V
MULTI_ON
LED_AMBER
C403
2.2uF
25V
D400
MMBD6100
A2
A1
C408
0.1uF
50V
19V to 1.15V (M1 Core)
OPT
R404
47K
AAM
IN
SW
GND
19V TO 5V DCDC CONVERTER
R400
10K
C
C410
0.47uF
16V
OPT
C411
C409
0.1uF
2.2uF
50V
25V
IC402
MP2315GJ
1
2
NEW
3
3A
4
OPT
R405
47K
AAM
GND
IN
SW
FB
8
VCC
7
EN/SYNC
6
BST
5
MP2315GJ
1
2
NEW
3
4
IC403
3A
C415
8
7
6
5
0.1uF
16V
FB
VCC
EN/SYNC
BST
R408
68
C414
0.1uF
50V
+3.3V_Normal
R414
10K
OPT
R413
2K
R415
68
C416
0.1uF
50V
R416
75K
1%
C419
0.1uF
16V
OPT
R417
2K
L400
4.7uH
C421
22uF
6.3V
C420
0.1uF
16V
C426
10uF
OPT
L403
10uH
+1.15V_VDDC
R42 4
4.7 K
C430
0.1uF
10V
16V
R42 5
R42 6
1%
0
10K
1%
3.3V TO 1.5V LDO(DDR Power)
+3.3V_Normal
R433
10K
+3.3V_ST
C433
10uF
10V
NC_1
EN2
VIN3
NC4
IC404
TJ4220GDP-ADJ
1
9
2
THERMAL
3
4
8
7
6
5
[EP]GND
GND
ADJ/SENSE
VOUT
NC_2
C435
0.01uF
25V
R443
R444
+1.5V_DDR
R445
10K
1%
1%
1K
1%
10K
C437
10uF
10V
OPT
PANEL POWER CONTROL
C427
10uF
+5V_Normal
R435
0
FHD(5V Panel)
+12V_Normal
HD(12V Panel)
R437
0
1K
FHD
R3471
PANEL_CTL
B
C
FHD
Q3451
MMBT3904(NXP)
R3472
0
E
FHD
R436
4.7K
10K
R439
B
R441
100K
FHD(5V Panel)
R442
10K
C
Q401
MMBT3904(NXP)
E
C440
4.7uF
16V
HD(12V Panel)
R442-*1
4.7K
Q403
AO3407A
G
C436
1uF
16V
HD(12V Panel)
+12V_PANEL_POWER
S
D
13.06.28
For Module Power Sequence
R441 : 22k --> 100k
R442 : 1k --> 10k
R43 0
R43 1
R43 2
+5V_Normal
39K
1%
15K
1%
10K
1%
R420
33K
C432
C431
10uF
10V
0.1uF
10V
16V
HD(12V Panel)
R446
0
+5V_PANEL_POWER
R447
0
FHD(5V Panel)
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
For Interlace Mode
High : Interlace Mode
Low : Normal Mode
2013.07.15
INTERLACE_CTRL
RXACK+
RXACK-
RXA2+
RXA2-
RXBCK+
RXBCK-
RXB2+
RXB2-
RXA3+
RXA3-
RXA1+
RXA1-
RXA0+
RXA0-
RXB3+
RXB3-
RXB1+
RXB1-
RXB0+
RXB0-
FHD(5V Panel)
+3.3V_Normal
OPT
R625
4.7K
FHD(5V Panel)
5.6 K
5.6 K
R61 5
OPT
R626
100
JP613
FHD(5V Panel)
P602
10031HR-30
JP614
R61 6
R627
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
IR/LED and Control
KEY_SCL
KEY_SDA
LB_joy_stick
R606-*2 150
Amber LED(Non M75):5.9mA
Amber LED(M75) : 16mA
LED_RED
R600
10K
OPT
LED_AMBER
R601
C
B
Q600
MMBT3904(NXP)
E
10K
R602
10K
OPT
(IR Port protection against ESD)
C
B
Q601
MMBT3904(NXP)
E
4.7K
R603
+3.3V_ST
IR
1/10W
1%
+3.3V_ST
MT_joy_stick
R606 150
1/10W
1%
touch_key
R606-*1 270
1/10W
1%
121018
100ohm->200ohm
KEY2
KEY1
+3.3V_ST
MT_joy_stick
R610270
LB_joy_stick
121118
R604,R610
2012->1608
R609
200
touch_key
R610-*2
R610-*1 330
680
1/10W
5%
Red LED(Non M75):4.8mA
Red LED(M75) : 5.9mA
1/10W
1%
1/10W
1%
0424
C601
50V
1000pF
Close to Wafer
TOUCH KEY
TOUCH KEY
20V
VA600
R613
3.3K
R611
100
R623
22
R624
22
R612
100
+3.3V_ST
R614
3.3K
D411
D410
30V
CDS3C30GTH
Close to Wafer
12.07.17
Change D601~3
30V
CDS3C30GTH
JP601
JP602
JP603
JP606
JP605
JP604
JP608
JP607
JP609
JP610
JP611
JP612
P601
12507WR-12L
1
2
3
4
5
6
7
8
9
10
11
12
13
IR_OUT(Ready)
+3.3V_ST
(OPT)IR_OUT
R617
IR_OUT
22
(OPT)IR_OUT
Q602
MMBT3904(NXP)
(OPT)IR_OUT
C
E
(OPT)IR_OUT
R618
10K
1000pF
OPT
R619
0
(OPT)IR_OUT
B
C603
50V
MMBT3904(NXP)
+3.3V_ST
R620
10K
Q603
(OPT)IR_OUT
R621
10K
(OPT)IR_OUT
C
E
B
(OPT)IR_OUT
R622
47K
IR
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
To Improve Ringing issue
LOW capacitance Part apply
121128
ESD improve
OPT->APPLY
DSUB
VA701
20V
DSUB
DSUB
VA703
11.10.27
Hotel_Model(RS232C apply)
NON_Hotel_Model(RS232C Bypass)
PM_TXD
PM_RXD
VA702
VA704
20V
20V
OPT
OPT
R705
10K
DSUB
121128
ESD improve
OPT->APPLY
121128
ESD improve
OPT->APPLY
DSUB
JP700
JP701
JP703
JP704
DSUB
DSUB
5.5V
5.5V
5.5V
VA706
VA705
C700
0.33uF
16V
Hotel_Model(RS232C apply)
RIN 2
DOU T2
8
7
Hotel_Model(RS232C apply)
9
10
DIN 2
ROU T2
NON_Hotel_Model(RS232C Bypass)
C701
0.33uF
16V
6V-5
IC700
MAX3232CDR
11
12
DIN 1
R703
0
R704
0
R706
100
JP702
C2-
ROU T1
Hotel_Model(RS232C apply)
C2+
4
13
RIN 1
R707
100
DSUB
D700
MMBD6100
C
R708
10K
DSUB
JP705
DSUB
GND_2
RED2GREEN3BLUE4GND_15DDC_G ND
GREEN _GND
RED_G ND
11
6
1
C1-2V+
3
14
DOU T1
JP706
A2
A1
VA707
20V
DSUB
121128
ESD improve
OPT->APPLY
JP707
JP709
DDC_C LOCK
V_SYN C
H_SYN C
NC10SYNC_ GND
DDC_D ATA
BLUE_ GND
15
14
13
12
9
8
7
JK703
SPG09-DB-010
+3.3V_ST
C702
0.33uF
16V
C703
0.1uF
16V
Hotel_Model(RS232C apply)
C1+
1
15
GND16VCC
Hotel_Model(RS232C apply)
VA708
20V
VA709
20V
JP708
VA710
20V
DSUB
DSUB
JP710
SHILE D
16
C704
0.1uF
16V
(OPT)IR_OUT
R709
0
+3.3V_ST
DSUB
R710
47K
DSUB
VA711
20V
DSUB
121128
ESD improve
OPT->APPLY
IR_OUT
R711
10K
DSUB
R713
47K
DSUB
C
B
E
DSUB opt
+3.3V_ST
+5V_Normal
Q700
MMBT3904(NXP)
DSUB
SW DEBUG Wafer
12507WS-04L
1
2
3
4
RGB_DDC_SCL
RGB_DDC_SDA
DSUB_DET
P701
5
USB(SIDE)
NC
OUT_2
VA716
OUT_1
FLG
20V
3AU04S-305-ZC-(LG)
JK701
1234
USB DOWN STR EAM
5
JP713
JP712
JP711
C705
22uF
VA712
121128
ESD improve
OPT->APPLY
20V
121128
ESD improve
OPT->APPLY
PC AUDIO(SIDE)
VA715
JP715
20V
JP718
AUDIO_IN
JP717
JP716
JP719JP721JP720JP714
OPT
VA713
20V
VA714
20V
AUDIO_IN
C707
220pF
50V
C706
220pF
50V
AUDIO_IN
AUDIO_IN
AUDIO_IN
KJA-PH-1-0177
JK702
120918
JIG GND Point addition
6 M6
1 M1
3 M3_DETECT
4 M4
5 M5_GND
Jack Shield (HDMI1, HDMI2, RGB)
IC701
AP2191DSG
8
1
7
2
6
3
5
4
111026
ESD diode deletion
EAH39491601 2EA
120103
ESD diode addition
EAF61530301 2EA
AUDIO_IN
12.08.10
47K->470K
OPT
GND
IN_1
IN_2
EN
USB_DM
USB_DP
R718
470K
OPT
R717
470K
USB_CTL
+3.3V_Normal
R721
470K
AUDIO_IN
R719
15K
AUDIO_IN
R720
15K
1:AL8
1:AL7
R722
10K
AUDIO_IN
R723
10K
AUDIO_IN
R725
AUDIO_IN
R724
1K
10K
R726
47
+5V_Normal
16V
USB_OCD
C708
0.1uF
PC_AUDIO_DET
PC_R_IN
PC_L_IN
DSUB/SCART Switch
DSUB
C711
0.01uF
25V
DSUB
C710
DSUB
6.3V
22uF
OPT
C712
6.3V
C709
22uF
470pF
50V
C713
0.01uF
25V
C714
6.3V
22uF
DSUB
C715
6.3V
OPT
22uF
C716
0.01uF
25V
DSUB
C717
DSUB
6.3V
22uF
C718
6.3V
22uF
OPT
C719
0.01uF
25V
DSUB
C720
DSUB
6.3V
22uF
OPT
C721
6.3V
22uF
C727
0.01uF
25V
DSUB
C728
6.3V
22uF
C729
6.3V
DSUB
22uF
OPT
C730
0.01uF
25V
DSUB
C731
6.3V
22uF
C732
6.3V
DSUB
22uF
OPT
DSUB_R+
DSUB_G+
DSUB_B+
SC1_R+
SC1_G+
SC1_B+
DSUB
RED_1_INPUT
HD_SYNC_SIGNAL_DETECTOR
DSUB
R727 470K
GREEN_1_INUT
GROUND1
BLUE_1_INPUT
GROUND2
RED_2_INPUT
GROUND3
GREEN_2_INPUT
GROUND4
BLUE_2_INPUT
VD_1_INPUT
DSUB
1
2
3
4
5
6
7
8
9
10
11
12
IC702
BA7657F
HD_1_INPUT
24
HD_2_INPUT
23
HD_OUTPUT
22
RED_OUTPUT
21
VCC
20
GREEN_OUTPUT
19
COMPOSITE_VIDEO_INPUT
18
COMPOSITE_SYNC_OUTPUT
17
CONTROL
16
BLUE_OUTPUT
15
VD_OUTPUT
14
VD_2_INPUT
13
DSUB/SC1_OUT_CTRL
+5V_Normal
DSUB
DSUB
R712
22
R734
0
DSUB
R714
68K
DSUB
C722
0.1uF
50V
DSUB
DSUB
R730
4.7K
R716
75
R728
2K
R715
75
DSUB
DSUB
C725
22uF
10V
R733
B
10K
R729
75
DSUB
300
+3.3V_ST
C
E
DSUB
C733
22uF
10V
OPT
300
R735
OPT
R737
SC1_FB
DSUB_VSYNC
DSUB
Q701
MMBT3904(NXP)
DSUB
DSUB_HSYNC
OPT
300
R736
DSUB/SC1_HSYNC
DSUB/SC1_R+
DSUB/SC1_G+
DSUB/SC1_B+
DSUB/SC1_VSYNC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
23 inch LGD Panel : LED_CH2, LED_CH3 SET
27 inch LGD Panel : LED_CH2 SET
29 inch CMI Panel : LED_CH1, LED_CH2 SET
23.8 inch LGD FHD : LED_CH1/CH2 NOTSET
LED_CH3 SET
ERROR_OUT
JP1007
LGD 21.6"/26" Connector
P1001
SM14B-SRSS-TB
24V
1
24V
2
24V
3
24V
4
24V
5
GND
6
GND
7
GND
8
GND
9
GND
10
11
INV_ON
12
NC
13
PWN_DIM
14
15
GND
PANEL
CSOT(27.5")
LGD(21.6/26")
CMI(23.6")
CMI(29")
Input
Voltage
24V
24V
19V
53.2V
Option
(21.6/26
/27.5
/29 Panel)
set
set
Not Set
set
Set
Set
Set
Option
(LGD FHD
/CMI 24")
Not set
Not set
Set
SetNot SetLGD(FHD)
Not Set
Option
(CMI 29")
Option
(24V Panel)
set
set
Option
(LGD FHD
/CMI)
Not set
Not set
Not set
Not setNot Set
Not Set
Not set
Not set
Not Set19V
Set
13
05002HR-H12J05
P1003
CMI_23.6" Connector
CMI_29"
P1002
SMAW200-03
3
2
1
12
11
10
9
8
7
6
5
4
3
2
1
JP1008
JP1009
LED_CH3/23.8"LGD
R1048
0
LED_CH3/23.8"LGD
R1055
0
R1063
23.6"
0
LGD FHD/23.6"
R1033
LGD FHD/23.6"
R1034
R1064
NOT23.8"LGD/ NOT 23.6"
23.6"
R1031
0
R1032
NOT23.8"LGD/ NOT 23.6"
0
0
0
0
R1067
R1066
23.6"
23.6"
0
0
0
0
0
0
LED_CH1
R1056
LED_CH2/NOT23.8"LGD
LED_CH1
R1057
R1058
R1059
LED_CH2/NOT23.8"LGD
JP1010
JP1011
JP1012
JP1014M1004
JP1013
M1002
M1000
M1001
M1003
R10290
R10270
CMI_29"
CMI_29"
R10280
R10300
CMI_29"
CMI_29"
CMI_29"
R1026
10K
CMI_29"
ZD1000
33V
+19V
+24V_BLU
0
R3423
JP1004
JP1005
0
R1010
C1011
1uF
10V
OPT
JP1006
OPT
WLED_ENABLE
WLED_DIM_ADJ
GND
REDUCE RIPPLE CURRENT
L100-*1
0
C1029
0.1uF
250V
OPT
R1065
23.6"
0
R1062
23.6"
0
OPT
C1028-*1
1uF
100V
OPT
C1029-*1
1uF
100V
M1005
M1006
M1007
M1008
C1027
33uF
100V
-55TO+105C
R1061
0
CMI_29"
CMI_29"
R1045
1M
1/8W
1%
7
6
5
4
3
2
1
12507WR-06L
P1004
LGD FHD
CMI_29"
R1046
1M
1/8W
1%
C1026
33uF
100V
-55TO+105C
LGD FHD/CMI 24"
R1046-*1
0
LGD FHD/CMI 24"
R1045-*1
0
6
5
4
3
2
1
12507WR-06L
P1005
LGD FHD
7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
LG-NonOS SB51_ExtSPI 3’b000 51 boot from SPI
LG-OS HEMCU_ExtSPI 3’b001 MIPS boot from SPI
+3.3V_ST
OPT
OPT
R119 4.7K
R116 4.7K
R123 2.7K
OPT
R120 4.7K
R117 4.7K
R124 4.7K
NAND_FLASH_1G_SS
EAN61857001
IC102-*4
K9F1G08U0D-SCB0
NC_29
48
NC_28
47
NC_27
46
NC_26
45
I/O7
44
I/O6
43
I/O5
42
I/O4
41
NC_25
40
NC_24
39
NC_23
38
VCC_2
37
VSS_2
36
NC_22
35
NC_21
34
NC_20
33
I/O3
32
I/O2
31
I/O1
30
I/O0
29
NC_19
28
NC_18
27
NC_17
26
NC_16
25
BOOT KEY OPTION
VCC
8
WP
7
SCL
6
SDA
5
OPT
R104 100
+3.3V_ST
TOUCH KEY
R114
10K
Joystic
R115
10K
AUD_MASTER_CLK
If calculate current LED_RED level = 2.469V
If R123 is 2.7K, LED_RED level = 2.75V
And LED_RED high threshold is 2.5V when boot up
Please use 2.7K for R123
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MA55
MAIN2_NON_EU
2013/05/23
52
Page 32
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