LG 22LD310 Schematic

LCD TV

SERVICE MANUAL

CAUTION

BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP92A

MODEL : 22LD310

22LD310-MA

North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

Internal Use Only

Printed in KoreaP/NO : MFL63284502 (1003-REV00)

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 2 -

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ...................................................................................... 6

ADJUSTMENT INSTRUCTION ............................................................... 8

BLOCK DIAGRAM ................................................................................. 12

EXPLODED VIEW .................................................................................. 13

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 3 -

SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.

It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1 MΩ and 5.2 MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument’s
exposed
METALLIC PARTS

Good Earth Ground
such as WATER PIPE,
CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1

*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15 uF

Ω

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 4 -

CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the

following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.

2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its
assemblies.

4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.

7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in this

service manual.

CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.

2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.

4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).

7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500

°F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.

(500

°F to 600 °F)

b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature

(500

°F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 5 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.

2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and
solder it.

3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor
Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as
possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.

Power Output, Transistor Device
Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit
board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as
possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit
board.

3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.

Fuse and Conventional Resistor
Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.

2. Securely crimp the leads of replacement component around
notch at stake top.

3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).

1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.

1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 6 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This spec. sheet is applied to LCD TV used LP92A chassis.

2. Specification

Each part is tested as below without special appointment.

1) Temperature
: 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40 ºC ± 5 ºC

2) Relative Humidity : 65 % ± 10 %

3) Power Voltage
: Standard input voltage(AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

each drawing and specification by part number in
accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety: CE, IEC specification

- EMC : CE, IEC

4. Module specification(General)

No. Item Specification Measurement Remark

1 Screen Size 55 cm(22 inch) wide Color Display Module Resolution : 1366*768
2 Aspect Ratio 16:9
3 LCD Module 55 cm(22 inch) TFT WXGA LCD
4 Operating Environment Temp.: 0 deg ~ 40 deg

Humidity : 0 % ~ 85 %

5 Storage Environment Temp.: -20 deg ~ 60 deg

Humidity : 0 % ~ 85 %
6 Input Voltage AC 100-240 V~ 50 / 60 Hz
7 Power Consumption ≤ 70 W 55 cm(22 inch) HD
8 LDC Module 55 cm(22 inch) 501(H) x 297(V) x 17.3(D) Outline Dimension, Unit : mm

(Maker : LGD) 116.5 x 349.5 x RGB Pixel Pitch, Unit : mm

2CCFL Backlight Assembly

Coating 3H

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

5. Chroma& Brightness (Optical)

(1) LCD Module

The Color Coordinates check condition

- 50 cm from the surface, Full White Pattern

- Picture mode Vivid

- 7 -

LGE Internal Use Only

No. Item Min. Typ. Max. Unit Maker Remark

1. Luminance 280 350 cd/m

2

(W/O PC mode)

2. VIew angle (R/L, U/D) 170/155 degree CR > 10

3. Color Coordinates White X Typ 0.285 Typ
Y -0.03 0.293 +0.03

RED X 0.642

Y 0.333

Green X 0.295

Y 0.608

Blue X 0.147

Y 0.063

4. Contrast ratio 700:1 1000:1

5. Luminance Variation 1.3

6. Component Video Input (Y, PB, PR)

No.

Specification

Proposed

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720*480 31.47 59.94 27.000 SDTV 480P
5 720*480 31.50 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27.000 SDTV 576P 50 Hz
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45.00 60.00 74.250 HDTV 720P
9 1280*720 37.50 50.00 74.25 HDTV 720P 50 Hz

7. HDMI Input(DTV)

No.

Specification

Proposed Remarks

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display
3 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50 Hz
4 720*480 31.47 59.94 27 SDTV 480P
5 720*480 31.5 60.00 27.027 SDTV 480P
6 720*576 31.25 50.00 27 SDTV 576P
7 1280*720 44.96 59.94 74.176 HDTV 720P
8 1280*720 45 60.00 74.25 HDTV 720P
9 1280*720 37.5 50.00 74.25 HDTV 720P

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 8 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LCD TV, LP92A
chassis.

2. Specification

(1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolation

transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relative

humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220

V~ 50 / 60 Hz.
(5) Before adjustment, execute Heat-Run for 5 minutes at RF

no signal.

3. Adjustment items

3.1. PCB assembly adjustment items

(1) Download the MSTAR main software(IC604, Mstar ISP Utility)

1) Using D/L Jig
(2) Input Tool-Option
(3) ADC Calibration - Component
(4) Check SW Version.

3.2. SET assembly adjustment items

(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Preset CH information
(5) Factoring Option Data input

4. PCB assembly adjustment method

4.1. Mstar Main S/W program download

- Using D/L Jig
(1) Preliminary steps

1) Connect the download jig to D-sub(RGB) jack

(2) Download steps

1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened

2) Click the “Connect” button and confirm “Dialog Box”

3) Click the “Config” button and Change speed

I2C Speed setting : 350Khz~400Khz

4) Read and write bin file.

Click “(1)Read” tab, and then load download file
(XXXX.bin) by clicking “Read”.

1

Filexxx.bin

5) Click “(2)Auto” tab and set as below

6) Click “(3)Run”.

7) After downloading, you can see the “(4)Pass” message.

* If TV is Turn On, Check the updated SW Version and

Tool Option.

4.2. Input tool option.

Adjust tool option refer to the BOM.

- Tool Option Input : PCBA Check Process

- Area Option Input : Set Assembly Process
After Input Tool Option and AC off

Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because being

different with some setting value depend on

module maker, inch and market
(2) Equipment : adjustment remote control.
(3) Adjustment method

- The input methods are same as other chassis.(Use IN­START Key on the Adjust Remote control.)
(If not changed the option, the input menu can differ the
model spec.)

Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value
[Caution]

- Don’t Press “IN-STOP” key after completing the function
inspection.

- Don’t connect HDMI cable when downloading the EDID.

If the cables are connected, Downloading of EDID could
be failed.

4.3. EDID Data

* 22LD310<HDMI : 256 Byte>

(1) EDID D/L method

1) Press the In-start key

2) Move to the System Control2 and Press the OK( )

3) Move to the EDID D/L and press the right direction
key(

G)

4) After about a few seconds, appear “OK’, then complete.

5) Press the OK key( ).

6) Press the EXIT key.

4.4. ADC Calibration-Component

- Using External pattern
(1) Required Equipments

- Remote control for adjustment

- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process

1) Change the Input to Component mode.

2) Input the Component 720P@60 Hz 100 % Color Bar
YPbPr signal into Component

(MSPG-925F Model: 217 / Pattern: 65)

3) Press ADJ key on R/C for adjustment.

4) Enter Password number. Password is “0 0 0 0”.

5) Select “Auto-RGB” and press OK( ) key.

6) ADC adjustment is executed automatically .

7) When ADC adjustment is finished, this OSD appear
“COMPONENT-OK”

(3) Confirmation

1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)
0x00 0x02 instruction.

2) We confirm whether “0xF3 (offset), 0xF4 (gain)” address
of EEPROM “0xBC” is “0xAA” or not.

3) If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t
“0xAA”, we adjust once more.

4) We can confirm the ADC values from “0x06~0x0B”
addresses in a page “0xBC”.

- 9 -

LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved.

Only for training and service purposes

1

Filexxx.bin

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 10 -

LGE Internal Use Only

4.5. Check SW Version

(1) Method

1) Push In-star key on Adjust remote control.

2) SW Version check
Check “Main : Vx.xx” - LD310

5. SET assembly adjustment method

5.1. Input Area-Option

(1) Profile : Must be changed the Area option value because

being different of each Country’s Language and

signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method

- The input methods are same as other chassis.(Use IN­START Key on the Adjust Remote control.)

Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value.

5.2. Adjustment of White Balance

- Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.

- Principle : To adjust the white balance without the saturation,

Fix the one of R/G/B gain to 192 (default data)
and decrease the others.

- Adjustment mode : Three modes - Cool / Medium / Warm

(Medium data is automatically calibrated by the Cool data)

- Required Equipment

1) Remote control for adjustment

2) Color Analyzer : CA100+ or CA-210 or same product ­LCD TV(ch : 9)

(should be used in the calibrated ch by CS-1000)

3) Auto W/B adjustment instrument(only for auto adjustment)

5.2.1. Connecting diagram of equipment for measuring
(For Automatic Adjustment)

* LP92A Support I2C Interface For ADC/DDC Adjustment.

(1) Enter the adjustment mode of DDC

- 22Set command delay time : 50 ms

- Enter the DDC adjustment mode at the same time heat­run mode when pushing the power on by power only key

- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat­run pattern display)

(2) Release the DDC adjustment mode

- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode

- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.

- Need to transmit the aging off command to TV set after
finishing the adjustment.

- Check DDC adjust mode release by exit key and release
DDC adjust mode)

(3) Enter the adjust mode of white balance

- Enter the white balance adjustment mode with aging
command (F3, 00, 00)

(4) Release the adjust mode of white balance

- Release the white balance adjustment mode with aging
command(F3, 00, FF)

* Luminance min value is 150cd in the Cool/Medium/Warm

mode(For LCD)

5.3. Adjustment of White Balance

(for Manual adjustment)

(1) Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000

(2) Operate the zero-calibration of the CA100+ or CA-210,

then stick sensor to the module when adjusting.

(3) For manual adjustment, it is also possible by the following

sequence.

1) Select white pattern of heat-run by pressing “POWER

ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)

2) Push “Exit” key.

3) Change to the AV mode by remote control.

4) Input external pattern (85 % white pattern)

5) Push the ADJ key -> Enter “0000” (Password)

6) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) using

D/E(CH +/-) key on R/C..

7) Adjust R/ G/ B Gain using

F/G(VOL +/-) key on R/C.

8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the

one of R/G/B gain and change the others

9) When adjustment is completed, Enter “COPY ALL”.

10) Exit adjustment mode using EXIT key on R/C.

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 11 -

LGE Internal Use Only

* CASE

First adjust the coordinate far away from the target value(x, y).

1) x, y > target
i) Decrease the R, G.

2) x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.

3) x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R

4) x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using the

CA100+ or CA210 equipment

To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)

Coordinate

Mode

x y

Temp uv∆

Cool 0.285±0.002 0.293±0.002 9,300 K 0.000

Medium 0.295±0.002 0.305±0.002 8,000 K 0.000

Warm 0.313±0.002 0.329±0.002 6,500 K 0.000

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

- 12 -

BLOCK DIAGRAM

TX

IR & LED (P201)

IC603

HDMI (JK301)

HDMI_DATA

EEPROM

24C02

TMDS

Serial Flash

(16MByte)

EEPROM

MAIN_SCL/SDA

IC301

IC602

HDMI_SCL/SDA

RGB_PC (JK102)

(SVC Only)

EEPROM

for HDCP

(8K)

MAIN_SCL/SDA

SCL/SDA

MAIN SCLAER

Mi 8 LG7871

IC601

DSUB_SCL/SDA

COMPONENT

(JK100)

MNT_OUT

COMP_Y/Pb/Pr

COMPONENT_Y/Pb/Pr : 1/0.7Vpp

E-DIM

C

TXCE0–

aria8-

(IC604)

COMPONENT_L/R : 500mVrms

COMP_LIN/RIN

AV(JK101)

connect

TXCE2–

TXCE3–

TXCLKE–

TX E1–

TXCO1–

TXCO3–

TXCO2–

TXCO0–

TXCLKO–

P202

P203

P204

AV_LIN/RIN : 500mVrms

R SPK OUT

AV_VIN: 1Vpp

PWM

AUDIO LOUT/ROUT : 500mVrms

AV_VIN

AV_LIN/RIN

AUAMP_SCL/SDA

IC502

IC501

TV

(RF)

L_SPK_OUT

__

NTP3100L

_ : m

TU_MAIN

L_CH

R_CH

IF

SIF

AUDIO_L/R OUT

AUDIO_OUT(JK103)

IIS_OUT

AMP

PANEL_STATUS

TUNER

TU401

VIF SAW

Filter

SIF SAW

Filter

RL_ON/I-DIMMING/DISP_EN

OPC_OUT

CONTROL (P200)

TUNER_SCL/SDA

AUDIO

(64K)

LIPS

orHD LVDS

Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 13 -

LGE Internal Use Only

300

200

540

530

400

800

550

900

910

120

122

500

301

LV1

510

200T

A2

A5

A10

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

INPUT

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

JK101

Component/AV In

CVBS_VIN

R110
75

[YL]O-SPRING-L

ZD101
SD05

ZD102
SD05

[YL]CONTACT-L

5F
6F

PPJ228-01

[GN]E-LUG

9A

[GN]O-SPRING-S

4A

[GN]CONTACT-S

3A

[BL]E-LUG

9B

[BL]C-LUG-S

8B

[RD]E-LUG_1

9C

[RD]C-LUG-S

8C

[WH]E-LUG

9D

ZD103
SD05

ZD104

SD05

D103
SD05

D104
SD05

R116
75

R117
75

R118
75

COMP_Y

COMP_PB

COMP_PR

AV Audio Out

PPJ200-01

JK102

1

[RD]1P-CAN

2

[RD]O-SPRING

3

[RD]CONTACT

4

[WH]1P-CAN

5

[WH]C-LUG-L

D107
30V

NON_HOTEL_OPT

D108
30V

NON_HOTEL_OPT

C102

5.6nF
50V

C103

5.6nF
50V

NON_HOTEL_OPT

R128

R125

0

C

B

E

Q103
RT1C3904-T112

NON_HOTEL_OPT

R127

R126

0

C

B

E

Q104
RT1C3904-T112

CVBS_LIN

CVBS_RIN

HOTEL_OPT

R129

0

HOTEL_OPT

1K

1K

R130

0

HOTEL_OPT

R131

0

RT1C3904-T112
Q105

C

B

E

RT1C3904-T112
Q106

C

B

E

READY
C106
560pF
50V

READY
C107
560pF
50V

C104
10uF
16V

C105
10uF
16V

R103
10K

R101

R108

12K

220K

R104

10K

R109

R102

220K

12K

SPK_R+_HOTEL
SPK_R-_HOTEL
AUDIO_R

MNT_ROUT
MUTE_LINE

POP NOISE

MNT_LOUT
MUTE_LINE

POP NOISE

[WH]C-LUG-L

D101
30V

[RD]O-SPRING-L

D102
30V

[RD]CONTACT-L

7G

5H
6H

[WH]C-LUG-S

8D

[RD]E-LUG_2

9E

[RD]O-SPRING-S

4E

[RD]CONTACT-S

3E

D105
30V

D106
30V

AV Video Out

12V_AUDIO

GAIN X 4

E
C

JP102

R119
220K

R120
220K

ISA1530AC1
Q101

B

R106

220

READY
R107

402

R121

10K

R122

10K

R105

75

R123
12K

R124
12K

JP101

R111

470

RT1C3904-T112
Q102

C

B

E

R112

68

READY
C108
560pF
50V

READY
C109
560pF
50V

R114

47

MNT_VOUT_T

COMP_L

COMP_R

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX61462901 2009/08/20

INPUT

1 7

LVDS/IR

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-

HD(26/32")

P203

FF10001-30

26_32inch

31

5V_12V_LCD

1

R210 0

2

R211 0

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

NON_LGDV5

NON_LGDV5

OPC_ENABLE

R224 0

OPC_ENABLE

R222 0

3.3V_M

JEIDA
R221

4.7K

VESA
R220

0

TXCE3+

TXCE3-

TXCLKE+

TXCLKE-

TXCE2+

TXCE2-

TXCE1+

TXCE1-

TXCE0+

TXCE0-

READY

R202

0

TXCE3+

TXCE3-

TXCLKE+

TXCLKE-

TXCE2+

TXCE2-

TXCE1+

TXCE1-

TXCE0+

TXCE0-

3.3V_M

OPC_ENABLE

R201
470

OPC_ENABLE
RT1C3904-T112

Q201

C R205

B

E

External VBR

OPC_OUTPUT

OPC_ENABLE

1K

3.3V_M

OPC_ENABLE

R213

4.7K

E_DIM
OPC_OUT

OPC_EN

5V_12V_LCD

P204

SMAW200-28C2

19_22inch

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

HD(19/22")

CONTROL

SMAW200-03

P200

KEY1

KEY2

L204
8OHM

L205
8OHM

C210
100pF
50V

C211
100pF
50V

1

2

3

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

KEY1

KEY2

IR

LED_B

LED_R

R206

4.7K
R208

4.7K

R204

4.7K

R212

10K

ST_5V

READY
C202

0.1uF
50V

3.3V_M

B
READY

R209

0

ST_3.3V

B

Q204

RT1C3904-T112

E

KST3906-MTF
Q202

C

R203

10K

C

E

L206
8OHM

L207
8OHM

MBW3216-501TF

L203

500-ohm

BG2012B080TF

L202
8OHM

C212
100pF

50V

C207

0.1uF
50V

C205
47pF
50V

READY
C203

0.1uF
50V

READY
C201

0.1uF
50V

C209
100pF
50V

C208
100pF
50V

BG2012B080TF

L200
8OHM

BG2012B080TF

L201
8OHM

C206
100pF
50V

C204
100pF
50V

IR & LED

READY
ZD205

5.6B

READY
ZD203

5.6B

ZD201

5.6B

READY
ZD202

5.6B

READY
ZD200

5.6B

KEY1

KEY2

GND

ST_5V

GND

IR

LED_B

LED_R

READY
ZD204

5.6B

12507WS-08L

P201

1

2

3

4

5

6

7

8

9

GND

GASKET for ESD Improvement

32inch_GASKET

GAS1

MDS61887706

26inch_GASKET

GAS1-*1

MDS61887701

32inch_GASKET

MDS61887706

26inch_GASKET

GAS2-*1

MDS61887701

GAS2

32inch_GASKET

GAS3

MDS61887706

26inch_GASKET

GAS3-*1

MDS61887701

32inch_GASKET

GAS4

MDS61887706

26inch_GASKET

GAS4-*1

MDS61887701

EAX61462901 2009/08/20

LVDS/IR

2 7

HDMI

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

22

19

18

17

16

15

14

13

12

11

10

9

8

7

6

5

4

3

2

1

20

21

JK301

QJ41193-CFEE1-7F

R302

1K

R320

4.7K

R321
10K

R323
10K

READY
R301
10K

HD_5V

HDMI_5V_DET

C

E

2SC3052

Q301

B

R313
10K

HPDCTL

R303

10

R304

10

R305 5.6

R306

5.6

R307 5.6

R308

5.6

R309

5.6

R310

5.6

R311

5.6

R312

5.6

HDMI_SDA
HDMI_SCL

TXCLK-

TXCLK+
B_TX0-

B_TX0+
G_TX1-

G_TX1+
R_TX2-

R_TX2+

HDMI

฀

IC301

AT24C02BN-10SU-1.8

A0

1

A1

2

A2

3

GND

4

8

7

6

5

VCC

WP

SCL

SDA

MMBD301LT1G

D301
30V

R322
100

R324
100

R325
100

R327
10K

READY

R328

0

R329

4.7K

R331

4.7K

ENKMC2838-T112

D302

A1

C

A2

C302

0.1uF
50V

5V_M

HD_5V

DDC_CTL

HDMI_SCL

HDMI_SDA

P301

KCN-DS-1-0089

6630TGA004K

6

1

7

2

8

3

9

4

10

5

SHILED16

11

12

13

14

15

RED_GND

GND_2

RED

GREEN_GND

DDC_DATA

GREEN

BLUE_GND

H_SYNC

BLUE

NC

V_SYNC

GND_1

SYNC_GND

DDC_CLOCK

DDC_GND

D303
30V

D304

30V

PC(Control)

DSUB_SDA

DSUB_SCL

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX61462901 2009/08/20

HDMI/RGB

3 7

TUNER

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

ONLY_TA
TU401
TDTC-G427D

13

GND

10

11

12

1

2

3

4

5

6

7

8

9

NC
B1_5V
NC
SCL
SDA
B2_5V
NC
AS
NC
NC
AIF
AIF

C403

C406

0.01uF

10uF

50V

10V

Near the pin

C404

C407

0.01uF

10uF

50V

10V

READY

R401

0

READY
R426

0

C401

0.01uF
50V

5V_TUNER

R409

0

5V_TUNER

R408

0

R418
100

C413

0.1uF
16V

R411

L401

680

820nH

C409

R410

1.2K

0.01uF
50V

READY
C410

0.1uF
16V

B

C

E

R41222R427

R404

0

R406

6.8K

R407
1K

Layout placement

Close to Tuner

BFS17W
Q401

READY

READY
C755
22pF
50V

22

C417

0.1uF
16V

C405

0.01uF
50V

R413

0

R435
330

R402
330

D401 30V

R423

C402
47uF
25V

12K

VIF_12V

R405

0

5V_M 5V_M

R432

4.7K

R415

47

C411
47pF
50V

R414

47

C412
47pF
50V

TU_CTL_VIF

R433

4.7K

TU_AGC

TUNER_SCL

TUNER_SDA

5V_M

R424

10K

TU_SW_VIF

R417
10K

5V_M

B

C414

0.01uF
50V

TU_SW_VIF

R425

3.3K

TU_SW_VIF

C

2SC3875S(ALY)
Q403

E

5V_M

TU_SW_VIF
R419

6.8K

TU_SW_VIF
R420

6.8K

Layout placement
Close to Mstar IC

ONLY_TA

L403

K7257M

1

INPUT

TU_SW_VIF

D403
KDS114E(KEC)
35V

TU_SW_VIF

R429

0

SWITCHING_INPUT

NON_TU_SW
R430

0

2

CHIP_CARRIER

3

4

OUTPUT1

READY
L404

2.2uH

5

OUTPUT2

VIF1

VIF2

ONLY_MA
TU401-*1

TDVH-H426F

ANT_PWR

1

B1[+5V]

2

NC[RF_AGC]

3

SCL

4

SDA

5

B2[+5V]

6

NC[VTU]

7

AS

8

NC_1

9

NC_2

10

NC_3

11

AIF

12

13

SHIELD

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TU_CTL_SIF

PAL-BG,DK,I NTSC-M

High LowTU_CTL_VIF

TU_CTL_SIF LowHigh

5V_M

R436

10K

TU_SW_SIF

R403
10K

C415

0.01uF
50V

5V_M

TU_SW_SIF

R416

3.3K

TU_SW_SIF

C

2SC3875S(ALY)
Q402

B

E

NTSC
PAL/MULTI

5V_M

TU_SW_SIF
R421

6.8K

TU_SW_SIF

R422

6.8K

TU_SW_SIF

D402
KDS114E(KEC)
35V

TU_SW_SIF

R428

0

SWITCHING_INPUT

NON_TU_SW
R431

R429 R430R428 R431

X
O

X O
O

1INPUT

2

0

X X

ONLY_TA

L402

K9653D

4

OUTPUT_1

5

OUTPUT_2

3 INPUT-GND/CHIP_CARRIER_GND

ONLY_MA

L403-*1
M3953M

1INPUT

2INPUT-GND

CHIP_CARRIER-GND

4 OUTPUT_1

5 OUTPUT_2

3

SIF1

SIF2

1INPUT

2INPUT-GND

L403 L402

O

M3953

M9370

K7257 K9653

EAX61462901 2009/08/20

TUNER

ONLY_MA

L402-*1
M9370M

3

CHIP_CARRIER-GND

4 7

4 OUTPUT_1

5 OUTPUT_2

AUDIO

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

SW_RESET

I2S_MCLK

3.3V_M

READY
R502

4.7K

3.3V_M

1.8V_M

READY

R501
22K

R504
10K

READY

R503

0

B

ST_3.3V

R505
10K

C

RT1C3904-T112

Q501

E

L502

120-ohm

L501

120-ohm

C501
100pF
50V

C503

10uF
16V

C502
10uF

16V

C510
1uF
10V

HIGH : ACTIVE

LOW : RESET

R506
100

R508
100

C504
1000pF
50V

R507

3.3K

C505

0.1uF
50V

C506

0.1uF
50V

C511

0.1uF
50V

C507
1000pF
50V

C509
1uF
25V

C508

0.1uF
50V

22000pF

BST1A
VDR1A
RESET

AD
DVSS_1
VSS_IO

CLK_I

VDD_IO

DGND_PLL
AGND_PLL

LFM
AVDD_PLL
DVDD_PLL

TEST0

C512

50V

1
2
3
4
5
6
7
8
9
10
11
12
13
14

C552

0.1uF
50V

OUT1A_1

OUT1A_2

PGND1A_1

PGND1A_2

53

54

55

56

Main AMP

15

16

17

18

WCK19BCK20SDA21SCL

DVDD

SDATA

DVSS_2

PVDD1A_1

PVDD1A_2

PVDD1B_2

51

52

IC501
NTP-3100L

C516

0.1uF
50V

C515

0.1uF
50V

PVDD1B_1

49

50

22

MONITOR_0

24V_15V_NTP

C517
10uF
35V

PGND1B_2

OUT1B_1

OUT1B_2

47

48

23

24

FAULT26VDR2B27BST2B

MONITOR_1

MONITOR_2

PGND1B_1

45

46

25

C519
1uF
25V

C520
22000pF
50V

VDR1B

BST1B

44

PGND2B_1

MLB-201209-0120P-N2

L505

120-ohm

R520

4.7K

R521

4.7K

C534

0.01uF
50V

R522

3.3

R523

3.3
C535

0.01uF
50V

MLB-201209-0120P-N2

L506

120-ohm

C523
1uF
25V

READY
D501
100V

READY
D502
100V

R550

18

R551

18

R516

18
C521

1000pF
50V

C522
1000pF
50V

R517

18

R518

18

R519

18

L503

DA-8580

2S

1S 1F

EAP38319001

C529

0.1uF

C527

0.47uF
50V

50V

C530

0.1uF
50V

2F

43

NC

42

VDR2A

41

BST2A

40

PGND2A_2

39

PGND2A_1

38

OUT2A_2

37

OUT2A_1

36

PVDD2A_2

35

PVDD2A_1

34

PVDD2B_2

33

PVDD2B_1

32

OUT2B_2

31

OUT2B_1

30

PGND2B_2

29

28

C524

22000pF

50V

C531

0.1uF
50V

C528

0.1uF
50V

C526
22000pF
50V

READY
C532

0.1uF
50V

C525
1uF
25V

READY
D503
100V

READY
D504
100V

24V_15V_NTP

C533

0.1uF
50V

C538
10uF
35V

R534

18

R535

18

R524

18

C536
1000pF
50V

C537
1000pF
50V

R525

18

R526

18

R527

18

L504

DA-8580

2S

1S 1F

EAP38319001

MLB-201209-0120P-N2

L507

120-ohm

C542

R530

4.7K

R531

4.7K

0.01uF
50V

R532

3.3

R533

3.3
C543

0.01uF
50V

MLB-201209-0120P-N2

L508

120-ohm

C540

0.1uF

C539

0.47uF
50V

50V

C541

0.1uF
50V

2F

SPK_L+

SPK_L-

SPK_R­SPK_R+
SPK_L­SPK_L+

SPK_R+

SPK_R-

R-SOUND-N

R-SOUND-P

L-SOUND-N

L-SOUND-P

P501

SMAW250-04

1

2

3

4

MNT_LOUT

MNT_L_AMP

MNT_R_AMP

MNT_ROUT

C544

0.1uF
50V

C545

0.1uF
50V

12V_AUDIO

RT1C3904-T112

C

Q502

E
R536

4.7K

12V_AUDIO

RT1C3904-T112

C

Q503

E
R537

4.7K

AMP:GAIN X 4

B

C546
6800pF
50V

B

C547
6800pF
50V

R538

1K

R542

5.6K

R543

5.6K

C549
33pF
50V

R539

1K

HOTEL_OPT

R541-*1 15K

C548
33pF
50V

12V_AUDIO

C550

0.01uF
50V

HOTEL_OPT

R544-*1 15K

NON_HOTEL_OPT

R544

12K

NON_HOTEL_OPT

R541
12K

R546

6.8K

R547

6.8K

AUAMP_SDA

AUAMP_SCL

IC502

1 OUT1

LM324D

2 INPUT1-

3 INPUT1+

4 VCC

5 INPUT2+

6 INPUT2-

7 OUT2 8OUT3

14OUT4

13INPUT4-

12INPUT4+

11GND

10INPUT3+

9INPUT3-

I2S_SDO

I2S_WS

I2S_SCK

3.3V_M

R528

4.7K

R529

4.7K

R509 100

R510 100

R511 100

R512 100

R513 100

READY
C513
33pF
50V

READY
C514
33pF
50V

C518
1000pF

50V

HOTEL_OPT

R514

0

R515

0

MULTI_PW_SW

HIGH : ACTIVE

LOW : MUTE

AMP_MUTE_HOTEL

Chinese Hotel Option

24V_15V_NTP

HOTEL_OPT

R549

HOTEL_OPT

0

C551

0.1uF
50V

AUDIO_R

SW_RESET

AMP_MUTE_HOTEL

SPK_R+_HOTEL
SPK_R-_HOTEL

HOTEL_OPT

R540

200

B

3.3V_M

C

E

HOTEL_OPT

R548

0

HOTEL_OPT
R545
10K

HOTEL_OPT
RT1C3904-T112

Q504

HOTEL_OPT

P502

12505WS-09A00

1

2

3

4

5

6

7

8

9

10

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

EAX61462901 2009/08/20

AUDIO

5 7

MAIN(MARIA8)

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

G_TX1+

G_TX1-

B_TX0+

R_TX2-

HPDCTL

TXCLK-

B_TX0-

TXCLK+

AVDD_ADC

VDDC_4

RXACN

RXACP

RXA0N

RXA0P

AVDD_ADC_3

RXA1N

RXA1P

HOTPLUG

RXA2N

147

148

149

150

151

152

153

154

155

R_TX2+

RXA2P

AVSS_ADC_1

BIN1

SOGIN1

GIN1

R640

C629

0.047uF

68

GIN1M

RIN1

VSYNC1

AVDD_ADC_1

HSYNC0

BIN0

GIN0M

GIN0

SOGIN0

RIN0

VSYNC0

AVDD_ADC_2

CVBS3/C1
CVBS2/Y1
CVBS1/C0
CVBS0/Y0

VCOM0

COMP_PB

COMP_Y

COMP_PR

CVBS_VIN

AVDD_ADC

R636

33

R641

68

R637

33

R638

0

R639

33

AVDD_ADC

33

R629

READY

33

R630

READY

47

R631

READY

33

R632

68

R633

C641 0.1uF

C621 0.047uF

C630

0.047uF

C622 0.047uF

C623

1000pF

C624

0.047uF

C651

0.1uF

C616

0.047uF
READY

C617

0.047uF
READY

C618 0.047uF

READY

C619

0.047uF

C620

0.047uF

CVBSOUT2

L606

CVBSOUT

AVSS_ADC_2

AVDD_MPLL

XTAL_OUT

XTAL_IN

AVSS_MPLL
AVDD_VIF_1
AVDD_VIF_2

600

AVSS_VIF_1

AVSS_VIF_2

AVDD_VIF_3

AVDD_AUSDM
LINE_IN_0L
LINE_IN_0R
LINE_IN_1L
LINE_IN_1R
LINE_IN_2L

VIFIP
VIFIM
SIFIM
SIFIP

VR27

TAGC

MNT_VOUT_T

C614
10uF
10V

C648 0.1uF

R642

C646 0.1uF

0.1uF

C652

C615

0.1uF
16V

C645

0.1uF

C642

0.1uF

C625

2.2uF

C626

2.2uF

C627

2.2uF

2.2uF

C628

200

C612

27pF

14.31818MHz
X601

C613

27pF

Seperate with IC ground

AVDD_MPLL

R628

1M

AVDD_VIF
AVDD_VIF

VIF2

VIF1

C607

0.1uF
16V

SIF1

R625

5.6K

TU_AGC

SIF2

C608

0.1uF
16V

C610
100pF
50V

AVDD_VIF

R639

1uF
10V

5V_M

L601
120-ohm

AVDD_AUSDM

COMP_L

COMP_R

CVBS_LIN

CVBS_RIN

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS

FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR

ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

156

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46

47

48

AUCOM49AUVRM50AUVRP51AUVAG

LINE_IN_2R

C6310.1uF

4.7uF

0.1uF

C632

Close to IC as close as possible

C633 10uF

C634

1uF

C635

52

AVSS

DAC_OUT_L

53

54

DAC_OUT_R

0.01uF

C636

R643 22K

55

LINE_OUT_L

1K

R644

MNT_L_AMP

E_DIM

VDDC

AVDDP1

100

0.1uF
R670

C659 0.1uF

C665

PWM3

AVDDP_1_7

GND_7

144

145

146

MARIA8(LGE7871)

56

57

58

GND_1

VDDC_1

AVDDP_1_1

LINE_OUT_R

0.01uF

0.1uF

1K

C661

C653

R645

VDDC

22K

0.01uF

C637

R646

MNT_R_AMP

I2S_WS

SW_RESET

I_DIM

I2S_MCLK

I2S_SDO

I2S_SCK

0

100

R657

R669

AUSD0

AUSCK

AUWS

AUMCKO

GPIOM1

PWM2

138

139

140

141

142

143

IC604

59

60

GPIOD1061GPIOD1162GPIOB1363GPIOB1264GPIOB1165GPIOB10

100

R659

0

R654

R652 0

TU_CTL_VIF

TU_CTL_SIF

0

R656

TUNER_SDA

TUNER_SCL

0

R650

AVDDP1

ST_3.3V

HWRESET

HDMI_SDA

4.7K

0.1uF
READY

C667

RESET

135

HDMI_SCL

0.1uF

C656

DDCD_SCL

DDCD_SDA

133

134

POWER_SW

R663

R684 100

CEC

WAKEUP

136

137

66

GPIOB967GPIOB868GPIOB369GPIOB270GPIOB171GPIOB0

100

R660

PANEL_STATUS

100

R634

LED_B

ST_3.3V

KEY2

AVDDP2

R665 100

SAR0

AVDDP_2

131

132

AVDDP_1_2

100

R635

KEY1

R666 4.7K

R668 4.7K

R667 100

SAR1

130

72

73

GND_2

0.1uF

C660

AVDDP1

LED_R

SAR2

129

74

VDDC_2

0.01uF

C647

VDDC

ST_3.3V

IR

4.7K

R648

READY

100

R671

INT

IRIN

128

75

PWM176PWM0

DSUB_SDA

MUTE_LINE

4.7K

R672

22

100

READY

R647

R673

DDCA_DAT

126

127

GND_3

DSUB_SCL

4.7K

R674

22

R675

DDCA_CLK

125

77

78

AVDDP_1_3

0.1uF

C658

AVDDP1

AVDDP_1_6

124

GND_6

123

LVA0P

122

LVA0N

121

LVA1P

120

LVA1N

119

LVA2P

118

LVA2N

117

LVACLKP

116

LVACLKN

115

LVA3P

114

LVA3N

113

GND_5

112

AVDDP_1_5

111

LVB0P

110

LVB0N

109

LVB1P

108

LVB1N

107

LVB2P

106

LVB2N

105

LVBCLKP

104

LVBCLKN

103

LVB3P

102

LVB3N

101

AVDDP_1_4

100

GND_4

99

VDDC_3

98

TXD0/GPIOD0

97

RXD0/GPIOD1

96

RXD1/GPIOD2

95

TXD1/GPIOD3

94

GPIOD4

93

GPIOD5

92

AUMUTE/GPIOD6

91

GPIOD7

90

SPI_CK

89

SPI_CZ

88

SPI_DI

87

SPI_DO

86

GPIO/SPI_SIO2

85

GPIO/SPI_SIO3

84

GPIO_5

83

GPIO_4

82

GPIO_3

81

GPIO_2

80

GPIO_1

79

R677

R678

R664

C644

0.1uF

C662

0.1uF
16V

100

R685

100

R681

R682

R661

100

R649

R651

C657

0.1uF
C666

0.1uF

100

100

100

100

100

100

AVDDP1

AVDDP1

AVDDP1

VDDC

R689

1K

READY
R690

1K

TXCLKE-

TXCLKE+

READY

R692 4.7K
R693 4.7K

R698

1K

READY

R699

1K

SERIAL FLASH 2M

FLASH_WP

EEPROM(A0)

TXCE0-

TXCE0+

TXCE1-

TXCE1+

TXCE2-

TXCE2+

TXCE3-

TXCE3+

TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKE-

MAIN_SCL

MAIN_SDA

AUAMP_SDA

ST_3.3V

AUAMP_SCL

OPC_EN

MUTE_LINE

FLASH_WP

SPI_CLK

SPI_CZ

SPI_DI

SPI_DO

3.3V_M

3.3V_M

ST_3.3V

DISP_EN

PANEL_ON

RL_ON

HDMI_5V_DET

DDC_CTL

ST_5V

C611

4.7uF
10V

D603

KDS181

3.3V_M

READY

R601

0

R605

0

R604

1K

R603

1K

19_22inch

R606

10K

26_32inch

R606-*1

20K

READY

R679

4.7K

R680

4.7K

READY

R687

4.7K

R688

4.7K

P_24V_SMALL_15V

P_12V_SMALL_15V

RL_ON

HDCP EEPROM(A8)

L602

120-ohm

C638
10uF
10V

JTP-1127WEM

SW601

1

3

2 4

R621

100

R624
33K

KDS181

D601

R609
150

C601
47uF
25V

26_32inch

R627

0

EAX61462901

MARIA8

R608
10K

R607
100

AT24C64AN-10SU-2.7

A0

A1

A2

GND

R602

4.7K

R676

AVDDP1

0

R683

AVDD_ADC

0

R686

AVDD_VIF

0

READY

R691

AVDD_AUSDM

0

R662

0

C604

0.1uF
16V

ISA1530AC1

Q601

26_32inch

R626

33K
READY
C609

4.7uF
10V

SPI_CZ

SPI_DO

IC601

1

2

3

4

CAT24WC08W-T

A0

1

A1

2

A2

3

VSS

4

R612

2K

R613
10K

R610

100

R611

100

VCC

8

WP

7

SCL

6

SDA

5

IC602

VCC

8

WP

7

SCL

6

SDA

5

ST_3.3V

ST_3.3V

1.2V_VDDC_M8

KDS181

D602

26_32inch
Q603
RT1C3904-T112

C

B

E

IC603

MX25L1605AM2C-15G

CS#

1

SO

2

WP#

3

GND

4

3.3V_M

C602

0.01uF
50V

R615

22

R616

22

3.3V_M

R614

4.7K

R655
100

READY
R658

0

L604

120-ohm

L605

120-ohm

L603

120-ohm

R619

1K

READY
C605

2.2uF
16V

B

C603

0.1uF
16V

READY
R653

0

R617

22

R618

22

ST_5V

8

7

6

5

3.3V_M

R697

4.7K

C650
10uF
10V

C649
10uF
10V

C640

4.7uF

6.3V

R623

10K

C

RT1C3904-T112
Q602

E

3.3V_M

VCC

C606

R620

100

R622

100

0.1uF
16V

R696

4.7K

HOLD#

SCLK

SI

MAIN_SCL
MAIN_SDA

DDC_CTL
MAIN_SCL
MAIN_SDA

C664

0.01uF
50V

C663

0.01uF
50V

C643

C654

10uF

0.01uF

10V

50V

RESET

HWRESET

MULTI_PW_SW

2009/08/20

6 7

SPI_CLK

SPI_DI

AVDDP2

AVDD_MPLL

VDDC

Power

Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only

STAND_BY VOLTAGE

5V_M -> 1.2V_VDDC_M8, 3.3V_M, 1.8V_M

P_5V

P_12V_SMALL_15V

P_24V_SMALL_15V

READY

R702

0

I_DIM

E_DIM

OPC_OUT

FM20020-24

NC

1

GND

3

GND

5

5.2V

7

5.2V

9

GND

11

12V

13

GND

15

24V

17

NC

19

A.Dim

21

NC

23

26_32inch

P701

25

R725

10K

C706

2.2uF
16V

OPC_DISABLE

R715

1K

OPC_DISABLE

R716

6.2K

OPC_ENABLE

R714
1K

OPC_ENABLE

R717

6.2K

Power ON

2

GND

4

GND

6

5.2V

8

5.2V

10

GND

12

12V

14

GND

16

24V

18

Inverter ON

20

Error Out

22

PWM Dim

24

Non Sharp32

R722

0

DC_DIM

R709-*1

PWM_DIM

READY
R706

0

1K

R709

100

READY
C701

2.2uF
16V

R704

0

NON_CMO32

R705

0

CMO32

R708

0

P_5V

DISP_EN

19_22inch/Sharp32

R710

0

26_32inch

R719

2.2K

26_32inch

2SC3875S

Q702

3

2

1

19_22inch

R723

0

26_32inch

R763

47K

P_12V_SMALL_15V

P_24V_SMALL_15V

3.3V_M

R755
10K

2SC3875S

Q701
R713
10K

ST_3.3V

26_32inch

R758
10K

READY

R762

10K

5V_M

R712

3K

3

2

1

R707

0

Non Sharp32

R711

4.7K

Sharp32

R721

0

Non Sharp32

C702

0.47uF
25V

RL_ON

P_5V

R724

0

15V

15V

GND

GND

Inverter_ON

PWM_Dim

A.Dim

19_22inch

P703

SMAW200-11

1

2

3

4

5V

5

5V

6

NC

7

NC

8

9

10

11

PANEL_STATUS

BD9130EFJ-E2

IC702

5V_M

R726

0

C715
10uF
10V

R730
12K

C717
560pF
50V

ADJ

1

VCC

2

ITH

3

GND

4

MAX 2A

EN

R740

8

10K

PVCC

7

C716
10uF
10V

READY
R739

3.3
READY

C725
2200pF
50V

L707

2.2uH
C726

0.1uF
16V

READY
C747
1uF
25V

C727
10uF
10V

C728
10uF
10V

R2

R744

2K

R745

3.3K

R1

SW

6

PGND

5

V0 = 0.8*(1+(R2/R1))

R753

0

IC704

C723

0.1uF
50V

AZ1085S-3.3TR/E1

INPUT

3

MAX 3A

1

ADJ/GND

2

OUTPUT

OUT:3.3V

C729
100uF
16V

C733
10uF
10V

C735

0.1uF
50V

R738

0

MULTI VOLTAGE

**Switch 12V:P12V, P5V -> 5V_12V_LCD

26_32inch

P_12V_SMALL_15V

P_5V

ST_3.3V

PANEL_ON

P_5V

POWER_SW

L706

120-ohm

19_22inch/Sharp32

L705

120-ohm

R756
10K

READY
R727
10K

R729

10K

19_22inch

R733-*1

10K

R764

10K

B

R734

22K

R735

1.6K

B

R732

33K

26_32inch

R733

33K

RT1C3904-T112

C

Q703

E

C

RT1C3904-T112
Q704

E

READY
C718
68uF
35V

R765

10K

C

B

Q706
RT1C3904-T112E

R728
10K

C721
1uF
25V

C719
1uF
25V

SI4925BDY

EBK32753101

S1

1

G1

2

S2

3

G2

4

Q705

**Switch 5V:P5V -> 5V_M

D1_2

8

D1_1

7

D2_2

6

D2_1

5

MLB-201209-0120P-N2

L708

120-ohm

C731

0.1uF
50V

C734
10uF

10V

AP1117EG-13

IN

3

C737

0.01uF

50V

IC705

MAX 1A

1

ADJ/GND

R747

4.7K

2

OUT

R749

4.7K

OUT:1.85V

R750

R1

120

R751

R2

56

R752

4.7K

1.2V_VDDC_M8

OUT:1.27V

3.3V_M

NTP,AUDIO DSP

C742
10uF
10V

C744

0.1uF
50V

READY
C746
1uF
25V

1.8V_M

V0 = 1.25*(1+(R2/R1))

C745
100uF
16V

C748

0.01uF
50V

5V_12V_LCD

PANEL

5V_M

ST_5V

R701
10K

L703

120-ohm

R718

0

C705
10uF
16V

AP2121N-3.3TRE1

VIN

3

MAX 300mA

5V_M

R703

1.2K

SAM2333
LD701

IC701

1

GND

C709

0.01uF
50V

VOUT

2

P_5V

ST_5V

Power indicator

C711

0.01uF
50V

C710
10uF
10V

C713

0.01uF
25V

READY
C714
1uF
25V

ST_5V

ST_3.3V

P_24V_SMALL_15V

P_12V_SMALL_15V

L702

500

L701

120-ohm

19_22inch

R760

0

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT

1

C707

C703

0.01uF

68uF

50V

35V

C704

C708

47uF

0.01uF

25V

50V

L710

26_32inch

120-ohm
READY
C754
10uF
16V

19_22inch

AS7812ADTR-E1

IC707

3

2

GND

OUTPUT

C712

0.1uF
50V

19_22inch

C752
1uF
25V

19_22inch

19_22inch

C751

0.1uF
50V

24V_15V_NTP

12V_AUDIO

VIF_12V

R761

0

TUNER VOLTAGE

**DC-DC CONVERTER
12V->5V_TUNER

19_22inch

D701

50V

26_32inch

R731

0

P_12V_SMALL_15V

CIC21J501NE

L704

500

READY
C753
100pF
50V

READY

C724
560pF
50V

C720
10uF
25V

IC706

AP1117EG-13

3

1

ADJ/GND

R757

330

OUT

2

READY

R759

C749

110

0.1uF
16V

2009/08/20

7 7

5V_TUNER

C740

C741

10uF

10uF

16V

R746

10

16V

V0 = 0.8*(1+(R1/R2))

26_32inch

R741

10K

R736

R1

43K

R737

R2

5.6K

C722
10uF

25V

MP2212DN

IC703

1FB

MAX 3A

2GND

3IN

4BS

R742

0

8 EN/SYNC

7 SW_2

6 SW_1

5 VCC

C739

0.47uF
50V

26_32inch

R743

2K

C730
1uF
25V

OUT:6.8V

5V_M

19_22inch

R748

10

19_22inch

C738

0.1uF
50V

L709

3.6uH

C736

0.1uF
50V

C732
100uF
16V

5V_M

C743

0.1uF
16V

IN

EAX61462901

POWER