LG 21FC2RGE Schematic

COLOR TV SERVICE MANUAL

CHASSIS: CP-079A

CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CONTENTS

Contents

Location & Function of control

Safety Precautions

Specifications

Adjustment

Block Diagram

R,G,B Section / Deflection Section

Audio AMP. Section

Exploded View

Exploded View Parts List

Replacement Parts List

Schematic Diagram

POWER MUTE

1 2

EYE/*

Q W

VIE

PSM SSM/*

FAVOURITE

16 8

8 9

( )

L ST

SLEEP

RA C/*

Location and function of controls

All the functions can be controlled with the remote control handset. Some functions can also be adjusted with the buttons on the front panel of the set.

TV/AVMENU

1513 14

I/II/*XDP/*

Remote control handset

Before you use the remote control handset, please install the batteries. See the previous page.

1. POWER

switches the set from On to standby or standby to On.

2. NUMBER BUTTONS

switches the set On from standby or directly select a Programme number.

3. MENU

selects a menu.

4. EYE/ (option)

switches the eye function On or Off.

5. / (Programme Up/Down) selects a programme or a menu item. switches the set on from standby.

(Volume Up/Down) adjusts the volume. adjusts menu settings.

accepts your selection or displays the current mode.

POWER

PSM

EYE/*

SLEEP

VOL

TV AV

FAVOURITE

ARC/*

MUTE

SSM

Q VIEW

I/II/*

VOL

XDP/*

LIST

6. Q. VIEW

returns to the previously viewed programme.

7. PSM (Picture Status Memory)

recalls your preferred picture setting.

8. XDP/*

Select excellent Digital picture.

9. MUTE

switches the sound On or Off.

10. TV/AV

selects TV or AV mode. clears the menu / text from the screen switches the set On from Standby.

11. I/II/* (option)

selects the language during dual language broadcast selects the sound

(option)

output.

12. LIST

displays the programme table. press LIST key again to clear the LIST table from the screen.

13. SLEEP

sets the sleep timer.

14. SSM/* (option) (Sound Status Memory)

recalls your preferred sound setting.

15. ARC/* (option)

change picture format (Normal/zoom).

16.FAVOURITE

pressing each time this button will select a stored favourite programme.

Remarks :

1. Some keys in remote can be non-functional, these keys are use in other models.

2. Keys marked * are non functional.

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety related characteristics. These parts are identified by in the Schematic Diagram and Replacement PartsList. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X RADIATION,Shock, Fire, or other Hazards. Do not modify the originaldesign without permission of manufacturer.

General Guidance

An Isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitary that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattageresistor (Oxide Metal Film Resistor,over 1W), keep the resistor l0mm away fromPCB.

Keep wires away from highvoltage or high temperature parts.

Due to high vacuum and large surface area of picture tube, extreme care should be used in handling the Picture Tube. Do not lift the Picture tube by it's Neck.

X-RAY Radiation

Warning:

The source of X RAY RADIATION in this TV receiver is the High Voltage Section and the Picture Tube.

For continued X RAY RADIATION protection, the replacement tube must be the same type tube as specified in the Replacement Parts List.

Before returning the receiver tothe customer,

always perform anAC leakage current check onthe exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operatewithout damage of electrical shock.

Leakage Current Cold Check (AntennaCold Check)

With the instrument AC plug removed from AC source connect an electrical jumper across the twoAC plug prongs. Place the AC switch in the on position, connect one lead of ohm meter to the AC plug prongs tied together and touch other ohm meter lead in turn to each exposed metallic parts such asantenna terminals, phone jacks, etc.

If the exposed metallic part has a return path to the chassis, the measured resistance should be between1MW and 5.2MW.

When the exposed metal has no return path to the chassis the reading must be infinite.

An other abnormality exists that must be corrected before the receiver is returned to thecustomer.

Leakage Current Hot Check (Seebelow Figure)

Plug the AC cord directly into theAC outlet.

Do not use a line Isolation Transformer during this check.

Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.

Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.

Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each esposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5mA. In case any measurement is out of the limits sepcified, there is

possibility of shock hazard and the set must be checked and repaired before it is returned tothe customer.

To determine the presence of high voltage, use an accurate high impedance HV meter.

Adjust brightness, color, contrast controls to minimum. Measure the high voltage.

The meter reading should indicate

+ +

23.5 .5KV: 14 19 inch, 26 1.5KV: 19 21 inch,

+ +

29.0 1.5KV: 25 29 inch, 30.0 1.5KV: 32 inch, If the meter indication is out of tolerance, immediate service and

correction is required to prevent the possibility of premature component failure.

Leakage Current Hot Check circuit

AC Volt meter

To Instrument's exposed METALLIC PARTS

1.5 Kohm10W

0.15uF

Good Earth Ground such as WATER PIPE, CONDUIT etc.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this servicemanual

and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 ofthis publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board module

or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity

installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at thepoint wherethe picturetube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contactwith high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton tipped stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90% 99%strength)

CAUTION: This is a flammablemixture. Unless specified otherwise in this service manual, lubrication of

contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this servicemanual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting thetest receiver positive lead.

Always remove the test receiverground lead last.

9. Use with this receiver only the test fixtures specified in this service

manual.

CAUTION: Do not connect the test fixture ground strap to any heatsink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits andsome fieldeffect

transistors and semicounductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by staticby static electricity.

1. Immediately before handling any semiconductor component or semiconductor equipped assembly, drain off any electostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on aconductive surfacesuch as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded tip soldering iron to solder or unsolder ES devices.

4. Use only an anti static type solder removal device. Some solder removal devices not classified as "anti static" can generate electrical charges sufficent to demageES devices.

5. Do not use freon propelled chemicals. These can generate electrical charges sufficient to damageES devices.

6. Do not remove a repalcement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted togetherby conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the ieads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safetyprecautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the bruching together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded tip, low wattage soldering iron and appropriate tip size and shape that will maintantip temperaturewithin therange or 500º F to 600º F.

2. Use an appropriate gauge of RMA resin core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tipclean and well tinned.

4. Thorohly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brushwith a metal handle.

Do not use freon propelled spray oncleaners.

5.Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500º F

to 600º F) b.Heat the component leaduntil the solder melts. c. Quickly draw the melted solder with an anti static, suction type

solder removal device or withsolder braid.

CAUTION: Work quickly to avoid overheating the circuiboard

printed foil.

6. Use the following soldering technique. a.Allow the soldering irontip to reach a normal temperature (500º F

to 600º F)

b.First, hold the soldering iron tip and solder the strand against the

component lead the solder melts.

c. OuIckly move the soldering iron tip to the junction of the

component lead and the printedcircuit foil, and hold it t h e r e only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in parapraphs 5 and 6above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the leadwith the soldering iron tip as the soldermelts.

2. Draw away the melted solder with an anti static suction type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefullyinsert the replacement IC in the circuit boare.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire bristle brush. (It is not necessary to reapply acrylic coatingto the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bendinto a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heatand remove all solder from around the transistorleads.

2. Removethe heatsink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insertnew transistor in the circuit board.

5. Soldereach transistor lead, and clip offexcess lead.

6. Replaceheatsink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bendthe two remaining leads perpendicula y to the circuitboard.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on thecircuit board.

4. Securelycrimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary,apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced

component and adjacent components andthe circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to installa jumperwire onthe copper pattern side of the circuit board. (Usethis technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copperas absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end ofthe remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around theIC pin. Solder the IC connection.

4. Route the jumper wire along the pathof the out away copper pattern and let it overlap the previously scraped end of the

good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involoves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4inch of copper, to ensure thata hazardous condition will not exist if the jumperwire opens.

2. Trace along the copper patternfrom both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components orsharp edges.

SPECIFICATIONS

Note : Specification and others are subject to change without notice for improvement.

< Video input system:

PAL B/G, D/K, I/I SECAM B/G, D/K,L/L** NTSC M **

NTSC 4.43

< Intermediate Frequency (Unit : Mhz)

VISION IF : 38.9MHz COLOR IF : 34.47MHz(4.43)

35.32MHz(3.58) : NTSC M

( )

VIF 4.25000 MHz V I F 4.40625MHz**

: SECAM**

< Tuning range

Band

B/G

D/K

VHF-Low Ch2-4 Ch1-5

VHF-High

Ch5-12

Ch6-12

Hyper

UHF

For TV

SOUND IF : 33.4MHz (B/G)

< Power requirement : 110 240V, 50/60Hz

< Power consumption :

< STAND-BY : <6W

32.9MHz (I/I)

32.4MHz (D/K)

34.4MHz (M)

For CATV

I/I

NTSC

S1'-S3', S1

S2-S10,

Ch2-13

Ch4-13

S11-S20

S21-S41

Chl4-69Ch21-69

< Tuning system : <Feature : Auto programme /Manual programme

FVS Auto Sleep 100 Programme memory (option) Turbo Picture* 200 Programme memory(W/0 TXT) PSM (Picture Status Memory)

< Antenna input impedance : VHF/UHF 75 ohm, unbalanced Auto Volume Level

< OSD (On Screen Display) : EASY_MENU Favourite Program

< Voice coil impedance : 8 ohm

< Sound output :

Dual/Stereo : A2/NICAM(Option)

< External connection : Head Phone Jack

< External In/Output

Audio In:O.5Vrms±3dB, over 10Kohm Audio Out:0.5Vrms±3dBb,below 1Kohm Video In/Out:1Vp p±3d8, 75ohm DVD In Y: 1Vp p±3dB

*Depend on model. ** For Export model.

A/V in : 2 PERI Connector(Full Scart) :1 (option) DVD in (option)

Pb,Pr : 0.7Vp p±3dB

Programme Editing

SSM (Sound Status Memory)

XDP*

DISASSEMBLY INSTRUCTIONS

Important note

This set is disconnected from the power supply through the converter. transformer. An isolating transformer is necessary for service operations on the primary side ofthe converter transformer.

Back Cabinet Removal

Removal the screws residing on the back cabinet and carefully separate the back cabinet fromthe front cabinet cabinet. (Fig. 2 1).

CPT Removal

1. Pull out the CPT board from the CPTneck.

2. Place the frontcabinet on soft material not tomar the front surface or damage control knobs.

3. Remove 5 screws securing the picture tube mounting brackets to the front cabinet.

4. Carefully separate CPTfrom the front cabinet.

Chassis Assy Removal

Grasp both side of Frameand pull it backward smoothly.

PICTURE TUBE HANDLING CAUTION

Due tohigh vacuum and large surface area of picture tube, great care must be exercised when handlingpicture tube.Always lift picture tube by grasping it firmly aroundfaceplate. NEVER LIFT TUBE BY ITS NECK! The picture tube must not be scratched or subjected to excessive pressure as fractureof glassmay result in an implosion of considerable violence which can cause personal injury or property damage.

Remove Screws

CPT

board

Main PCB

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