LG 19LS3300-TA Schematic

Internal Use Only

North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com

LED LCD TV

SERVICE MANUAL

CHASSIS : LP24A

MODEL : 19LS3300 19LS3300-TA

CAUTION

BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

Printed in KoreaP/NO : MFL67452808 (1205-REV00)

CONTENTS

CONTENTS .............................................................................................. 2

SAFETY PRECAUTIONS ........................................................................ 3

SERVICING PRECAUTIONS .................................................................... 4

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION ................................................................ 9

TROUBLESHOOTING GUIDE ................................................................ 13

BLOCK DIAGRAM .................................................................................. 16

EXPLODED VIEW .................................................................................. 17

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

Only for training and service purposes

- 2 -

SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.

It will also protect the receiver and it's components from being damaged by accidental shorts of th e cir cuitry that may be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.

Leakage Current Cold Check(Antenna Cold Check)

With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.

Leakage Current Hot Check (See below Figure)

Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exp ose d metallic par t. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to

0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.

Leakage Current Hot Check circuit

Only for training and service purposes

- 3 -

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the

SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conict between the

following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before;

a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of its assemblies.

4. Unless specied otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a ammable mixture. Unless specied otherwise in this service manual, lubrication of contacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.

8. Use with this receiver only the test xtures specied in this service manual. CAUTION: Do not connect the test xture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some eld-effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device. Some solder removal devices not classied as “anti-static” can generate electrical charges sufcient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufcient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted oor can generate static electricity sufcient to damage an ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25 cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.

(500 °F to 600 °F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the circuit

board printed foil.

6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature

(500 °F to 600 °F)

b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it there only until the solder ows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or

splashed solder with a small wire-bristle brush.

Only for training and service purposes

- 4 -

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent at against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

Only for training and service purposes

- 5 -

SPECIFICATION

NOTE : Specifications and others are subject to change without notice for improvement

.

1. Application range

This specification is applied to the LP24A chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F), CST: 40 °C ± 5 °C

2) Relative Humidity: 65 % ± 10 %

3) Power Voltage : Standard input voltage (AC 100-240 V~, 50/60 Hz) * Standard Voltage of each products is marked by models.

4) Specification and performance of each parts are followed

ea ch drawing and s pe cificatio n b y p art number in accordance with BOM.

5) The receiver must be operated for about 5 minutes prior to

the adjustment.

3. Test method

1) Performance: LGE TV test method followed

2) Demanded other specification

- Safety : CE, IEC specification

- EMC : CE, IEC

4. Model General Specification

No. Item Specication Remarks

1. Market NON EU

1) PAL/SECAM B/G/D/K

2. Broadcasting system

3. Channel Storage

4. Receiving system Upper Heterodyne

5. Video Input PAL, SECAM, NTSC Rear (1EA)

6. Component Input Y/Cb/Cr, Y/Pb/Pr Rear (1EA)

7. USB Input MP3, JPEG Side(1EA)

8. AV Audio Output RF/AV/HDMI Audio Output Rear (1EA)

9. D-SUB INPUT S/W Upgrade Only Rear (1EA)

10. HDMI Input HDMI-DTV, Only PCM MODE Rear (1EA)

11. Audio Input (1EA) AV&Component L/R Input(1EA)

2) PAL-I/II

3) NTSC-M

PAL NTSC China(DK)

E2-C69 S21~S47

2~78 1~71

C1~C62 S1~S41

Only for training and service purposes

- 6 -

5. Component Video Input (Y, PB, PR)

No. Resolution H-freq(kHz) V-freq(Hz) Pixel clock(MHz) Proposed

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27.000 SDTV 480P

5. 720*480 31.50 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27.000 SDTV 576P 50Hz

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45.00 60.00 74.250 HDTV 720P

9. 1280*720 37.50 50.00 74.25 HDTV 720P 50Hz

10. 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz,

11. 1920*1080 33.72 59.94 74.176 HDTV 1080I

12. 1920*1080 33.75 60.00 74.25 HDTV 1080I

13. 1920*1080 56.25 50 148.5 HDTV 1080P

14. 1920*1080 67.432 59.94 148.350 HDTV 1080P

15. 1920*1080 67.5 60.00 148.5 HDTV 1080P

6. HDMI Input

6.1. PC Mode

* Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable

No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks

1. 640×480 31.469 59.94 25.17 VESA(VGA)

2. 800×600 37.879 60.317 40.00 VESA(SVGA)

3. 1024×768 48.363 60.004 65.00 VESA(XGA)

4. 1280×768 47.776 59.87 79.5 VESA(WXGA)

5. 1360×768 47.72 59.799 84.62 VESA(WXGA)

6 1366×768 47.7 60.00 84.62 WXGA

7. 1280×1024 63.595 60.00 108.875 SXGA

8. 1920×1080 66.647 59.988 138.625 WUXGA

* Monitor Range Limits Min Vertical Freq - 58 Hz / Max Vertical Freq - 63 Hz Min Horiz. Freq - 28 kHz / Max Horiz. Freq - 68 kHz Pixel Clock - 150 MHz

Only for training and service purposes

- 7 -

6.2. DTV Mode

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks

1. 720*480 15.73 59.94 13.500 SDTV, DVD 480I(525I)

Spec. out but display.2. 720*480 15.75 60.00 13.514 SDTV, DVD 480I(525I)

3. 720*576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz

4. 720*480 31.47 59.94 27 SDTV 480P

5. 720*480 31.5 60.00 27.027 SDTV 480P

6. 720*576 31.25 50.00 27 SDTV 576P

7. 1280*720 44.96 59.94 74.176 HDTV 720P

8. 1280*720 45 60.00 74.25 HDTV 720P

9. 1280*720 37.5 50.00 74.25 HDTV 720P

10. 1920*1080 28.125 50.00 74.25 HDTV 1080I

11 1920*1080 33.72 59.94 74.176 HDTV 1080I

12 1920*1080 33.75 60.00 74.25 HDTV 1080I

13 1920*1080 56.25 50.00 148.5 HDTV 1080P

14 1920*1080 67.432 59.94 148.350 HDTV 1080P

15 1920*1080 67.5 60.00 148.5 HDTV 1080P

16 1920*1080 27 24.00 74.25 HDTV 1080P

17 1920*1080 33.75 30.00 74.25 HDTV 1080P

18 1920*1080 26.97 23.97 74.25 HDTV 1080P

19 1920*1080 33.716 29.976 74.25 HDTV 1080P

Only for training and service purposes

- 8 -

ADJUSTMENT INSTRUCTION

1. Application Range

This specification sheet is applied to all of the LCD TV with LP24A chassis.

2. Designation

(1) Because this is not a hot chassis, it is not necessary to

use an isolation transformer. However, the use of isolation

transformer will help protect test instrument. (2) Adjustment must be done in the correct order. (3) The adjustment must be performed in the circumstance of

25 °C ± 5 °C of temperature and 65 % ± 10 % of relative

humidity if there is no specific designation. (4) The input voltage of the receiver must keep 100-220 V,

50/60Hz. (5) The standard signal level is approved in 65 dBµV ± 1 dBµV. (6) The receiver must be operated for over 5 minutes prior to

the adjustment when module is in the circumstance of

above 15 °C.

► In case of keeping module is in the circumstance of 0

°C, it should be placed in the circumstance of above 15 °C for 2 hours.

► In case of keeping module is in the circumstance of

below -20 °C, it should be placed in the circumstance of above 15 °C for 3 hours.

3) Click the “Config.” button and Change speed I2C Speed setting : 350Khz~400Khz

G

4) Read and write bin file Click “(1)Read” tab, and then load download file(XXXX. bin) by clicking “Read”.

3. PCB assembly adjustment method

3.1. Mstar Main S/W program download

3.1.1. Using D/L Jig

(1) Preliminary steps

1) Connect the download jig to D-sub(JK201) Jack.

(2) Download steps

1) Execute ‘ISP Tool’ program, the main window(Mstar ISP utility Vx.x.x) will be opened.

2) Click the “Connect” button and confirm “Dialog Box”.

5) Click “(2)Auto” tab and set as below

6) Click “(3)Run”.

7) After downloading, you can see the “(4)Pass” message.

3.1.2. Using the Memory Stick

** USB DOWNLOAD : Service Mode

1) Insert the USB memory Stick to the USB port. (The file name of bin file should start as “M8R…”. and Bin file should not be encrypted)

2) Automatically detect the bin file and ask download or not.

Only for training and service purposes

- 9 -

3) Press OK key then Message will be changed as below.

3.4. ADC Calibration

3.4.1. ADC Calibration-Component

(Using External pattern) * Required Equipments

■ Remote controller for adjustment

■ MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

4) Plug off and on TV set, then you can see downloading process.



5) Then, Plug off and on TV set again, and Download is finished

3.2. Input tool option.

- Adjust tool option refer to the BOM.

■ Tool Option Input : PCBA Check Process

■ Area Option Input : Set Assembly Process

- After Input Tool Option and AC off Before PCBA check, you have to change the Tool option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because being

different with some setting value depend on mod ule

maker, inch and market (2) Equipment : adjustment remote control. (3) Adjustment method

- The input methods are same as other chassis. (Use IN-START key on the Adjust Remote control.)

(If not changed the option, the input menu can differ the

model spec.)

Refer to Job Expression of each main cha ssis ass’y (EBTxxxxxxxx) for Option value. *Caution: Don’t Press “IN-STOP” key after completing the function inspection.

* Caution: Don’t connect HDMI cable when downloading the

EDID. If the cables are connected, Downloading of edid could be failed.

3.3. EDID data

- EDID D/L method: The EDID data is automatically saved.

■ HD MODEL

0 1 2 3 4 5 6 7 8 9 A B C D E F

0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01

10 01 16 01 03 80 A0 5A 78 0A F3 30 A4 54 46 96 26

20 0F 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01

30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28

40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30

50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C

60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD

70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 A6

80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05

90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00

A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35

B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10

C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16

D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71

E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00

F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A

3.4.2. Process

(1) Change the Input to Component mode. (2) Input the Component 480P@60 Hz 100% color Bar Y Pb

Pr signal into Compo nent. (MSPG-925F Model: 212 / Pattern: 65)

G

(3) Press ADJ key on R/C for adjustment. (4) Enter Password number. Password is “0413”. (5) Select “Auto-RGB” and press OK(■) key. (6) ADC adjustment is executed automatically. (7) When ADC adjustmen t is finished, this OSD appear

“COMPONENT - OK”.

3.4.3. Confirmation

(1) Adjust by commanding AUTO_COLOR_ADJUST (0xF1)

0x00 0x02 instruction

(2) We confirm whether “0x77 (offset), 0x78 (gain)” address of

EEPROM “0xBE” is “0xAA” or not.

(3) If “0x77”, “0x78” address of EEPROM “0xBE” isn’t “0xAA”,

we adjust once more

(4) We can confirm the ADC val ues from “0x56~0x5B”

addresses in a page “0xBE”

3.4.4. EEPROM Address

EEPROM Address

EEPROM Sub Address 0XBE

Red Gain 0X59

Green Gain 0X5A

Blue Gain 0X5B

Red Offset 0x56

Green Offset 0X57

Blue Offset 0X58

Only for training and service purposes

- 10 -

3.5 Check SW Version

4.5.1 Method

(1) Push In-star key on Adjust remote-controller. (2) SW Version check

Check “Main : Vx.xx” :

4.2. Adjustment of White Balance.

■ Purpose: Adjust the color temperat ure to reduce the deviation of the module color temperature.

■ Principle: To adjust the white balance without the saturation, Fix the one of R/G/B gain to C0 and decrease the others.

■ Adjustment mode : Three modes - Cool / Medium / Warm

(Medium data is automatically calibrated by the Cool data)

G

4. SET assembly adjustment method

4.1. Input Area-Option

(1) Profile : Must be changed the Area option value because

being different of each Country’s (2) Equipment : adjustment remote control. (3) Adjustment method

- The input methods are same as other chassis.(Use IN-START key on the Adjust Remote control.)

Refer to Job Expre ssion of each main chassis ass’y (EBTxxxxxxxx) for Option value.

Tool Option Area Option

Module Maker

Inch 0 : 22” (Default)

Frame 0 : LK230 (Default) TTX Group 0 : OFF

Module Rev.

0 : CMI 1 : THTF 2 : LPL

1 : 23” 2 : 32”

0 : Rev.0 (Default) 1 : Rev.1

Lang Group 0 : NONEU A

1 : NONEU H 2 : NONEU ALL

Def. Lang 0 : ENGLISH

1 : CHINESE 2 : ESPANOL 3 : PORTUGUES

1 : ON

I II SAVE 0 : OFF

1 : ON

HDEV MONO BlueBack Country

■ Adj. condition: normal temperature

1) Surrounding Temperature: 25 °C ± 5 °C

2) Warm-up time: About 5 Min

3) Surrounding Humidity: 20 % ~ 80 %

■ Required Equipment

■ Remote controller for adjustment

■ Color Analyzer : CA100+ or CA-210 or same product - LCD TV(CH: 9), (should be used in the calibrated ch by CS-1000)

■ Auto W/B adjustment instrument (only for Auto adjustment)

4.2.1. Connecting diagram of equipment for measuring

(For Automatic Adjustment)

(1) Enter the adjustment mode of DDC

■ 22Set command delay time : 50ms

■ Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key)

■ Maintain the DDC adjustment mode with same condition of Heat-run → Maintain after AC off/on in status of Heatrun pattern display

(2) Release the DDC adjustment mode

■ Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode.

■ Release the Adjust mode when receiving the aging off command(WB 00 FF) from adjustment equipment.

■ Need to transmit the aging off command to TV set after finishing the adjustment.

■ Check DDC adjust mode release by exit key and release DDC adjust mode.

(3) Enter the adjust mode of white balance

■ Enter the white balance adjustment mode with aging command(F3, 00, 00).

(4) Release the adjust mode of white balance

■ Enter the white balance adjustment mode with aging

command(F3, 00, FF)

* Luminance min value is 150cd in the Cool/Medium/Warm

mode(For LCD)

Only for training and service purposes

- 11 -

4.3. Adjustment of White Balance

(for Manual adjustment)

■ Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000

■ Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting.

■ For manual adjustment, it is also possible by the following sequence.

1) Select white pattern of heat-run by pressing “POWER ON” key on remote control for adjustment then operate heat run longer than 5 minutes. (If not executed this step, the condition for W/B may be different.)

2) Push “Exit” key.

3) Change to the AV mode by remote control.

4) Input external pattern (85% white pattern)

5) Push the ADJ key two times (entering White Balance mode) → Enter “0413” (Password)

6) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using ▲/▼(CH +/-) key on R/C..

7) Adjust R/ G/ B Gain using ◄/►(VOL +/-) key on R/C.

8) Adjust three modes all (Cool / Medium / Warm) : Fix the one of R/G/B gain and change the others

9) When adjustment is completed, Exit adjustment mode using EXIT key on R/C.

* CASE

First adjust the coordinate far away from the target value(x, y).

1) x, y > target i) Decrease the R, G.

2) x, y < target i) First decrease the B gain, ii) Decrease the one of the others.

3) x > target , y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R

4) x < target , y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G

■ Standard color coordinate and temperature when using the CA100+ or CA210 equipment (Sm all size inch ’s color coordinate is different from others, So use below table)

1) 22 inch Lamp(CMI & THTF)

Mode

Cool 0.271±0.002 0.276±0.002 13,000K 0.000

Medium 0.287±0.002 0.296±0.002 9,300K 0.000

Warm 0.315±0.002 0.332±0.002 6,500K 0.003

To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : Vivid(User) Dynamic Contrast : Off , Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)

Only for training and service purposes

Color coordinate

x y

Temp ∆uv

- 12 -

TROUBLE SHOOTING

No power

(LED indicator off)

Check 12V, 3.5V

of Power B/D

Pass

Check Output of

IC701, IC702, IC705,

IC704, IC709

Pass

Check LED Assy

Pass

Check P400 Connector

: [A] Process (for non-adapter models)

Fail

Check short of Main B/D

or Change Power B/D

Check short of

IC701, IC702, IC705,

IC704, IC709

Pass

Check Output of Q720

Change LED Assy

Fail

Re-soldering or Change defect part

No power

(LED indicator off)

Check output of adapter

(JK700 : 24V)

Pass

Check Output of

IC701, IC702, IC704,

IC705, IC706,IC707,IC708,

IC709,IC800

Pass

Check LED Assy

Pass

Check P400 Connector

: [A-1] Process (for adapter models)

Fail

Check short of Main B/D

or Change adapter

Check short of

IC701, IC702, IC704,

IC705, IC706,IC707,IC708,

IC709,IC800

Pass

Check Output of Q720

Change LED Assy

Fail

Re-soldering or Change defect part

Only for training and service purposes

- 13 -

No Raster

: [B] Process

Check LED status

On Display Unit

Pass

Check Panel Link Cable

Or Module

Pass

Check Inverter Connector

Or Inverter

Pass

Check PANEL_VCC of LVDS wafer

Pass

Check LVDS Cable

Fail

Repeat [A]/[A-1] Process

Change Panel Link Cable

Or Module

Change Inverter Connector

Or Inverter

Check Output of Q720

Change LVDS Cable

No Raster on COMPONENT Signal

Pass

Check Input source

Cable And Jack

Pass

Check The Input/Output

Of JK101

Pass

Check the Input/Output

Of IC501

Pass

Repeat [A]/[A-1], & [B] Process

Fail

Re-soldering or

Change the defect part

Re-soldering or

Change the defect part

No Raster on HDMI Signal

Pass

Check Input source

Cable And Jack

Pass

Check the Input/Output

Of JK203

Pass

Check the Input/Output

Of IC501

Pass

Repeat [A]/[A-1], & [B] Process

Fail

Change the defect part

Fail

Change the defect part

Re-soldering or

Only for training and service purposes

- 14 -

No Raster On AV Video Signal

No Signal On TV(RF) Signal

Pass

Check Input source

Cable And Jack

Pass

Check The Input/Output

Of JK101

Pass

Check the Input/Output

Of IC501

Pass

Repeat [A]/[A-1], & [B] Process

Fail

Re-soldering or

Change the defect part

Re-soldering or

Change the defect part

Pass

Check Input source

Cable And Jack

Pass

Check The Input/Output

Of TU401

Pass

Check the Input/Output

Of IC501

Pass

Repeat [A]/[A-1], & [B] Process

Fail

Change the defect part

Fail

Change the defect part

Re-soldering or

No Sound

Check The Input Source

Pass

Check The Input/Output

Of IC301

Pass

Check The Speaker

Pass

Check The Speaker Wire

Only for training and service purposes

Fail

Change The Source Input

Re-soldering or

Change the defect part

Change Speaker

- 15 -

BLOCK DIAGRAM

JK202

11

IF_N

10

IF_P

USB_5V

RF_AGC

Tuner SDA

Tuner SCL

7

4

LDO

IC705

ST_3.5V

Led_PWR

C10

Sub_SDA

F16

Sub_SCL

H16

KEY2

P400

B11

KEY1

C11

IR

B9

IR/KEY

USB_DP

USB_DN

R6

B13

A13

24Mhz

T6

R3

T3

6

T4

N10

N11

Audio R-Out

Audio L-Out

H2

TUNER

Tuner_5V

5

B+

P_15V

OP-AMP

P1N2

J1 R2 T2

H3K1

IC704

Out

Audio

IC302

x4 Gain

Common R In

Common L In

Pr In

Pb In

Common V In

P_6.8V

LDO

JK101

P600

XXX

Module

LVDS

Output

A Dim

P Dim

Inv. ON

Error Out

SPI_CLK

SPI_DI

SPI_CZ

SPI_DO

Main SCL

12 9 11 10

P706

POWER BOARD

6

5

2

1

P_15V

E16 A11 C12 B12

Panel_Vcc

IC706

MP1497

P_ST 3.5V

C15

C16

IC502

Main SDA

J15

B15

B16

H15

24C64

IC503

2Mbytes

Serial Flash

EEPROM

IC501

MST7833LNT

IC705

IC704

To USB

To TUNER

Main_6.8V

IC709

MP1497

Main_3.3V

Main_1.2V

IC701

MP20051

T8

Main_2.5V

Q710

R9P8R8 P9 T9

IC702

D1 D3

HDMI

SCL/SDA

D10D11

D-SUB

SCL/SDA

I2S_WS

I2S_SCK

I2S_SDO

I2S_MCLK

7

171819

2.5V REG

Sound AMP

33

35

32

34

S_AMP_15V

Audio_SCL

Audio_SDA

20 21

IC301

NTP7500

54

47

53

48

LPF

P301

(

(((

(

(((

(

Only for training and service purposes

- 16 -

EXPLODED VIEW

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essenti al that these special safet y parts shoul d be replac ed with the same compo nents as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

400

910

410

900

521

LV1

540

820

A10

* Set + Stand

A31

200

A21

A2

120

310

300

Only for training and service purposes

- 17 -

510

EAX64671103

LGE Internal Use Only

LP24B

COMPONENT / AV IN / AV AUDIO OUT

JK101

PPJ243-01

6B

[RD1]E-LUG

5B

[RD1]C-SPRING

4B

[RD1]CONTACT

5A

[WH1]C-SPRING

6A

[WH1]E-LUG

6G

[RD3]E-LUG

5G

[RD3]C-SPRING

4G

[RD3]CONTACT

5F

[WH2]C-SPRING

5E

[RD2]C-SPRING

7E

[RD2]E-LUG-S

ZD10 6

30V

ZD10 7

30V

C103 5600pF 50V

C104 5600pF 50V

2N3904S Q103-*1

2N3904S Q105-*1

For China

E

C

For China

E

C

C E

D105 30V

D104

30V

B

Q103

RT1C3904-T112

R124

1K

B

Q105

RT1C3904-T112

ZD100

SD05

2N3904S Q104-*1

2N3904S Q106-*1

R123

1K

R112 220K

R111 220K

R107

75

For China

E

C

For China

E

C

B

E

C

B

E

R116

10K

R115

10K

B

C101 10uF

Q104

RT1C3904-T112

C102 10uF

Q106

RT1C3904-T112

R120 12K

R119

12K

16V

POP NOISE

16V

POP NOISE

READY C105 560pF 50V

READY C106 560pF 50V

MNT_ROUT

MUTE_AOUT

MNT_LOUT

MUTE_AOUT

COMMON_RIN

COMMON_LIN

COMP_PR

5D

[BL]C-SPRING

4C

[GN]CONTACT

5C

[GN]C-SPRING

6C

[GN]E-LUG

ZD101

SD05

ZD102

SD05

R108

75

R109

COMP_PB

COMMON_VIN

75

V-OUT Buffer(DEBUG)

P_12V

DEBUG

RT1C3904-T112 Q102

R106

C

JP108

DEBUG

R101 75

E

DEBUG

R103

220

B

47

DEBUG

2N3904S Q102-*1

E

C

For China

MNT_VOUT

B

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT1

32CS410

INPUT1

2012/03/02

1 8

EAX64671103

LGE Internal Use Only

LP24B

I2C Control

JK201

SPG09-DB-010

6630TGA004Q

6

1

11

7

2

12

8

3

13

9

4

14

10

5

15

SHILED16

RED_GND

GND_2

RED

GREEN_GND

DDC_DATA

GREEN

BLUE_GND

H_SYNC

BLUE

NC

V_SYNC

GND_1

SYNC_GND

DDC_CLOCK

DDC_GND

ZD210 30V

ZD211

30V

READY

C211

33pF

READY

C210

33pF

DSUB_SDA

DSUB_SCL

HDMI(REAR)

R230 10K

SHIELD

20

JK203

B

HPD

19

+5V_POWER

18

DDC/CEC_GND

17

SDA

16

SCL

15

NC

14

CEC

13

CLK-

12

CLK_SHIELD

11

CLK+

10

DATA0-

9

DATA0_SHIELD

8

DATA0+

7

DATA1-

6

DATA1_SHIELD

5

DATA1+

4

DATA2-

3

DATA2_SHIELD

2

DATA2+

1

HPD

C

Q230

MMBT3904(NXP)

2SC3875S

E

R231 1K

HDMI_5V_DET

R236

10K

R237

R235

4.7K

10K

CEC HDMI_CK-

HDMI_CK+ HDMI_D0-

HDMI_D0+ HDMI_D1-

HDMI_D1+ HDMI_D2-

HDMI_D2+

5V_TUNER

A2

READY

R238

0

A1

D230 KDS184S

C

R232 10K

R233 10K

CEC

DDC_SDA DDC_SCL

HDMI_ARC

R234 100

CEC_C

USB(SIDE)

Close to SIDE_USB

C221

C220

100uF

10uF

16V

3AU04S-305-ZC-(LG)

JK202

1234

USB DOWN STR EAM

5

READY ZD220 30V

READY ZD221

30V

10V

USB_DN

USB_DP

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

INPUT2

L220

120-ohm

+3.3V_M

READY

R221

1K

OUT_2

OUT_1

R220

0

FLG

NC

IC202

AP2191SG-13

8

7

6

5

READY

+5V_USB

READY

D220

C

AC

A

READY

R223

4.7K

R222

510

READY

C222

0.1uF 50V

READY

L221

120OHM

READY

C223 10uF 16V

GND

1

IN_1

2

IN_2

3

EN

4

2012/03/0232CS410

INPUT2

2 8

EAX64671103

LGE Internal Use Only

LP24B

I2S_SDO

I2S_WS

I2S_SCK

AUAMP_SDA

AUAMP_SCL

HW_RESET

+3.3V_M

C301 100pF

50V

R340

10K

R328

4.7K

READY

C304 1000pF

50V

R307

3.3K

+3.5V_ST

B

R329

4.7K

READY

C303

4.7uF 16V

R312 100

R313 100

R338

10K

C

Q302

MMBT3904(NXP)

E

R315

100

OPT

C305

0.1uF 16V

C314 33pF 50V

OPT C302

10uF

10V

C310 10uF

OPT

10V

1000pF

C318

50V

BLM18PG121SN1D

C306

0.1uF 16V

C311

0.1uF 16V

R361 100

R362

R363

C313 33pF 50V

+3.3V_M

L309

C308

0.1uF 16V

100

SW_RESET

C341 10uF 10V

AGND_PLL AVDD_PLL DVDD_PLL

DGND_PLL

GND_1

DGND DVDD

SDATA

WCK BCK SDA

R306 10K

LF

I2S_MCLK

C307

1000pF

50V

R360 100

[EP]

1 2 3 4 5 6 7 8 9 10 11 12

GND_IO

CLK_I

VDD_IO

47

48

THERMAL

49

NTP-7500L

13

14

15

SCL

/FAULT

MONITOR0

50V

C312

BST1A

/RESET

43

44

45AD46

IC301

16

17

18

BST2B

MONITOR1

MONITOR2

C324

22000pF

50V

22000pF

OUT1A_2

PGND1A

41

42

19

20

PGND2B

OUT2B_1

PVDD1_2

PVDD1_3

OUT1A_1

38

39

40

21

22

23

OUT2B_2

PVDD2_1

PVDD2_2

SOUND_VCC

C316

0.1uF 50V

PVDD1_1

37

36 35 34 33 32 31 30 29 28 27 26 25

24

PVDD2_3

C317 10uF 35V

D301

1N4148W

100V

OPT

D302

1N4148W

100V

OPT

R316

12

C321 390pF

50V

C322 390pF

50V

R317

12

R318

R319

12

L303

10.0uH

L304

10.0uH

C327

0.47uF 50V

C329

0.1uF

C330

0.1uF

OUT1B_2 OUT1B_1 PGND1B BST1B

C320 22000pF 50V

VDR1 VCC_5 AGND VDR2 BST2A PGND2A OUT2A_2

C326 22000pF 50V

C32 5 1uF 25V

1uF 25V

C32 3

C309 1uF 25V

OUT2A_1

SOUND_VCC

C333

C360

0.1uF

10uF

50V R331

35V

D303

1N4148W

100V

OPT

D304

1N4148W

100V

OPT

R324

12

C342 390pF

50V

C337 390pF

50V

R325

12

R326

R327

12

L305

10.0uH

L306

10.0uH

C339

0.47uF 50V

SPK_L+

R320

4.7K

50V

R321

50V

4.7K

C336

R330

0.1uF

4.7K

50V

C331

4.7K

0.1uF 50V

SPEAKER_L

SPK_L-

SPK_L+ SPK_LSPK_R+ SPK_R-

SPK_R+

SPK_R-

SPEAKER_R

JP304

JP303

JP301

JP302

SPK_L+

SPK_L-

SPK_R+

SPK_R-

4

3

2

1 .

SMAW250-H04R

P301

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

AUDIO

AUDIO_OUT AMP : GAIN X 4

IC302

AS324MTR-E1

MNT_LOUT

MNT_ROUT

C350

0.1uF 16V

C355

0.1uF 16V

P_12V

Q350 MMBT3904(NXP)

C

B

E

R350

4.7K

MNT_L_AMP

MNT_R_AMP

P_12V

Q351 MMBT3904(NXP)

C

B

E

R35 9

4.7 K

R351 1K

C351 6800pF 50V

R358

C356 6800pF 50V

R354 5.6K

1K

10K

R352

C352 33pF 50V

R355

5.6K

33pF

C354

R356

10K

R353

6.8K

P_12V

C353

0.01uF 50V

50V

R357

6.8K

32CS410

AUDIO

1 OUT1

2 INPUT1-

3 INPUT1+

4 VCC

5 INPUT2+

6 INPUT2-

7 OUT2 8OUT3

14OUT4

13INPUT4-

12INPUT4+

11GND

10INPUT3+

9INPUT3-

2012/03/02

3 8

EAX64671103

LGE Internal Use Only

LP24B

12

SHIELD

TU401 TDTK-G703D

NC_1

1

NC_2

2

NC_3

3

RF_AGC

4

B+[+5V]

5

SDA

6

SCL

7

NC_4

8

NC_5

9

AIF+

10

AIF-

11

READY

R406

0

READY

R407

0

IF

Near the pin

C403

C404

10uF

0.01uF 50V

10V

5V_TUNER

READY

C402 100uF 16V

READY C401

0.1uF 16V

R401 100

C405 47pF 50V

C406 47pF 50V

READY

C400

0.1uF 16V

R404

47

R405

47

+3.3V_M

R402

4.7K

+3.3V_M

R403

4.7K

IF_P

IF_N

RF_AGC

TUNER_SDA

TUNER_SCL

KEY1 KEY2

LED

IR

R422

10K

READY

C420

0.1uF

+3.5V_ST

R424

4.7K

SUB_SCL SUB_SDA

+3.5V_ST

R426

10K

R423

10K

+3.5V_ST

READY

C427

0.1uF

READY

C421

0.1uF

50V

L424

120-ohm

C426

100pF

50V

READY

0.1uF

L426

120-ohm

C424

16V

READY

Soft/T

L422

L423

C428 47pF

50V

R420

100

R421

100

Non_Adapter

C422

470pF

50V

C425

1000pF

50V

Soft/T

ZD420

5.6V

Non_Adapter

C423

470pF

50V

Soft/T

ZD422

5.6V

ZD421

5.6V

10P_S/T

R415

0

IR

10P_S/T

R418 0

10P_S/T

R419 0

S/T_SCL

S/T_SDL

GND

KEY1

KEY2

ST_3.5V

GND

LED_R

GND

10P_S/T

12507WR-10L

1

2

3

4

5

6

7

8

IR

9

10

P400

11

.

NC

GND

KEY1

KEY2

ST_3.5V

GND

NC

IR

GND

NC

LED

12P_TACT

P401

12507WR-12L

1

2

3

4

5

6

7

8

9

10

11

12

13

.

GND

KEY1

KEY2

ST_3.5V

GND

S/T_SCL

S/T_SDL

15P_S/T

12507WR-15L

NC

1

NC

2

3

4

5

6

7

NC

8

IR

9

10

NC

11

NC

12

13

14

15

P402

16

.

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

TUNER & IR

32CS410

TUNER & IR

2012/03/02

4 8

EAX64671103

LGE Internal Use Only

LP24B

R560 4.7K

HD_Non_Mirror

R560-*1 4.7K

HD_Mirror

R561 4.7K

FHD_8Bit

R561-*14.7K

FHD_10Bit

+3.3V_M

R562 4.7K HD_Non_Mirror

R562-*1 4.7K

FHD_8BIT

R563 4.7K

HD_Mirror

R563-*1 4.7K

FHD_10BIT

+3.3V_M

R658 4.7K

Ready

R659 4.7K

Ready

MODEL_OPT3

MODEL_OPT2

MODEL_OPT1

+3.3V_M

*H/W OPTION

HD_Non_Mirror HD_Mirror FHD_8BIT FHD_10BIT

MODEL_OPT1

LOW LOW

LOW HIGH HIGH

MODEL_OPT2

HIGH

LOW

HIGH

MSTAR Vcc

+1.2V_VDDC

L500

120-ohm

C501 10uF

C502

0.1uF

C503

0.1uF

C504

0.1uF

C505

0.1uF

C506

0.1uF

ST 1.26V

VDDC

C500

0.1uF

G3

GND_3G1GND_4G2GND_5

GND_17P4GND_20R4GND_21R5GND_23T5GND_18P6GND_19P7GND_22R7GND_24

C540

0.047uF

C534

0.1uF

D6 D5 C7 B7 C6 B6 A6 C5 C4 A5 B5 B4 D4 A3 A2 B3 B2 B1 C3 D3 C1 C2 D1 D2 E4 E3 E2 F3 F2 F1 F4 H3 H2 J3 J2 J1 K3 K1 K2 L1 L2 M1 M2 N1 N2 P1 L3 M4 P2 R1 M3 N3 N4 P3 R2 T2

CEC HOTPLUGD RXCKN_D RXCKP_D RX0N_D RX0P_D RX1N_D RX1P_D DDCDD_DA RX2N_D RX2P_D DDCDD_CK HOTPLUGA RXCKN_A RXCKP_A RX0N_A RX0P_A RX1N_A RX1P_A DDCDA_DA RX2N_A RX2P_A DDCDA_CK ARC HSYNC0 BIN0P SOGIN0 GIN0P GIN0M RIN0P VSYNC0 BIN1P SOGIN1 GIN1P GIN1M RIN1P VSYNC1 CVBS2 CVBS1 CVBS0 VCOM CVBSOUT AUL0 AUR0 AUL1 AUR1 AUVAG AUREFM AUL2 AUR2 AUL3 AUR3 AUOUTL1 AUOUTR1 AUOUTL0 AUOUTR0

COMMON_VIN

HDMI_CK-

HDMI_CK+

HDMI_D0-

HDMI_D0+

HDMI_D2-

HDMI_ARC

COMP_PB

HPD

HDMI_D1HDMI_D1+

DDC_SDA

HDMI_D2+

DDC_SCL

COMP_PR

COMMON_LIN COMMON_RIN

R556

33

R555

33

R551

33

MNT_VOUT

MNT_L_AMP MNT_R_AMP

C543 1000pF

C542

0.047uF

R554

33

C532

220pF

C531

220pF

C541

0.047uF

C538

0.047uF

L506

120-ohm

R557

33

R546 220K

R552

68

R550

68

R547 220K

C535

C536

R553

68

2.2uF

C533 10uF

CEC_C

C539

0.047uF

C544

0.047uF

C537

0.047uF

R548

100

R549

100

XINT3XOUTR3NC_4P5VIFMR6VIFPT6RFAGCT4LVA4P/TTL_B0/LLV6P

R559

R545

1M

X501

24MHz

C528

C529

33pF

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

C527

0.1uF

READY C525

390pF

0.1uF

50V

R543

C519

50V

0

R566

33

51

C530-*1 120pF

50V

For NTSC

C530 220pF

50V

For PAL

L521 100NH

IF_N

C526

0.1uF 50V

R542

51

L505

120-ohm READY C524

390pF

R567

33 C520

0.1uF 50V

Close to MSTAR

IF_P

+3.3V_M

R541

10K

C523

0.1uF

R540

10K

Close to MSTAR

RF_AGC

C522

0.022uF 16V

T7

LVA4N/TTL_B1/LLV6N

LVA3P/TTL_B2/LLV5P

LVA3N/TTL_B3/LLV5N

LVACKP/TTL_B4/LLV4P

P10

R10

P11

R11

T11

P12

RXE0+

RXE0-

RXE1+

RXE1-

RXE2+

RXE2-

RXE0+

RXE0-

RXE1+

RXE1-

RXE2+

H10

H11

J10

J11

GND_7H9GND_8

GND_9

GND_10J9GND_11

LVACKN/TTL_B5/LLV4N

LVA2P/TTL_B6/LLV3P

LVA2N/TTL_B7/LLV3N

LVA1P/TTL_G0/LLV2P

LVA1N/TTL_G1/LLV2N

T12

R12

P13

R13

P14

RXECK+

RXECK-

RXE3+

RXE3-

RXE4+

RXE3+

RXE3-

RXE2-

RXECK-

RXECK+

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

MAIN SOC

K10

K11

A12

F13

G13

GND_1

GND_2

GND_15

GND_6

GND_12

GND_13K9GND_14

IC501

LGE7833

LVA0P/TTL_G2/LLV1P

LVA0N/TTL_G3/LLV1N

LVB4P/TTL_G4/LLV0P

LVB4N/TTL_G5/LLV0N

LVB3P/TTL_G6/RLV6P

LVB3N/TTL_G7/RLV6N

LVBCKP/TTL_R0/RLV5P

R14

T14

T15

R15

R16

P15

P16

RXE4-

RXO0+

RXO0-

RXO1+

RXO1-

RXO2+

RXO2-

RXE4+

RXE4-

RXO0+

RXO0-

RXO1+

RXO1-

RXO2+

VDDC

H8

H7

GND_16N6VDDC_7L8VDDC_6L7VDDC_5K8VDDC_4K7VDDC_3J8VDDC_2J7VDDC_1

LVBCKN/TTL_R1/RLV5N

LVB2P/TTL_R2/RLV4P

LVB2N/TTL_R3/RLV4N

LVB1P/TTL_R4/RLV3P

LVB1N/TTL_R5/RLV3N

LVB0P/TTL_R6/RLV2P

N14

N15

M14

M15

M16

L16

RXOCK+

RXOCK-

RXO3+

RXO3-

RXO4+

RXO4-

RXO3-

RXO4+

RXO3+

RXO2-

RXOCK-

RXOCK+

AVDD_1P2

LVB0N/TTL_R7/RLV2N

GPIO21/TCON21/VGH_ODD

GPIO20/TCON20/VGH_EVEN

GPIO19/TCON19/GCLK6

GPIO18/TCON18/GLKC5

K14

K16

L15

K15

RXO4-

AVDD_DDR

G8

D9

E13

M11

M10

AVDD_DDR_3

AVDD_DDR_1

AVDD_DDR_2

AVDD_DDR_5

AVDD_DDR_4

GPIO17/TCON17/GLKC4

GPIO16/TCON16/WPWM

GPIO15/TCON15/SCAN_BLK1

GPIO14/TCON14/SCAN_BLK

GPIO13/TCON13/LEDON

GPIO12/TCON12/DPM

GPIO11/TCON11/HCON

G16

F15

F14

E14

D14

D16

D15

RL_ON

R539

100

R533

10K

+3.5V_ST

RL_ON

MODEL_OPT1

MODEL_OPT2

MODEL_OPT3

AVDD_25

AVDD_ST33

N5

H6

K6

M5

J5

NC_3

AVDD_25

AVDD_REF

AVDD_AU25J6AVDD_AU33

GPIO10/TCON10/OTP_N

GPIO9/TCON9/OTP_P

GPIO8/TCON8/FLK3

GPIO7/TCON7/FLK2

GPIO6/TCON6/FLK

GPIO5/TCON5/SOE

G15

F16

H16

L14

J16

H15

J15

R531

R532

100

R530

100

R534

10K

+3.5V_ST

SUB_SDA SUB_SCL

EEP_SCL

AVDD_PLL

L5

K5

M6

L6

J4

AVDD_PLL

AVDD_MOD_2

AVDD_MOD_1

AVDD_MOD_4

AVDD_MOD_3

SPDIF_IN/GPIO61

SPDIF_OUT/GPIO60

I2S_MUTE_OUT/GPIO59

I2S_SD_OUT/GPIO58 I2S_BCK_OUT/GPIO57 I2S_MCK_OUT/GPIO56

I2S_WS_OUT/GPIO55

GPIO4/TCON4/GCLK3

GPIO3/TCON3/GCLK2

GPIO2/TCON2/GCLK1

GPIO1/TCON1/VST

GPIO0/TCON0/POL

GPIO30/TTL_LCK/RLV1P

E16

J14

H14

E15

N10

N11

R527

100

R529

R528

100

ERROR_OUT

TUNER_SCL

EEP_SDA

K4

H4

AVDD_33

AVDD_DVI

AVDD_DMPLL

K13

MVREF

D7

NC_1

L4

NC_2

TESTPIN

SPI_CZ SPI_DO SPI_DI SPI_CK

USB1_DP USB1_DM USB0_DP USB0_DM

DDCA_DA DDCA_CK

IRIN

HWRESET

GPIO66 GPIO67 GPIO68 GPIO69 GPIO70

GPIO63 GPIO64 GPIO62

D13 C13

C10 C11 B11 B15 B16 C16 C15

B13 A13 A14 A15

D11 D10 B9 A9

B12 C12 D12 A11 A10 B10 C9

G14 B14 C14 N9 P9 T9 N8 P8 R9 R8 T8

GND_EFUSE

SAR2/GPIO73 SAR1/GPIO74 SAR0/GPIO75

PWM0/GPIO26 PWM1/GPIO25

INT/GPIO65

GPIO29/TTL_LDE/RLV1N

GPIO28/TTL_LHSYNC/RLV0P

GPIO27/TTL_LVSYNC/RLV0N

N12

N13

R526

100

TUNER_SDA

R504

+2.5V_M

+3.5V_ST

AVDD_DDR

READY

1%

R502

1.2K

READY

1%

R503

C521

1.2K

0.1uF

0

22

R511 R512

R535

R523

100

22

R558 100

100

R517

100

R521

100

R513 100

R536

R522

100

R506

100

R507

100

R537 100

R518 100

HDMI_5V_DET

R505

100

FLASH_WP

PANEL_ON

INV_ON

SW_RESET AUAMP_SDA AUAMP_SCL

I2S_SDO I2S_SCK I2S_MCLK I2S_WS

R519

4.7K

READY

R520

4.7K

LED KEY1 KEY2

SPI_CZ SPI_DO

SPI_DI SPI_CLK

USB_DP USB_DN

DSUB_SDA DSUB_SCL

IR

HW_RESET

R515

1K

R538

4.7K

R564

4.7K

R565

4.7K

PWM_DIM

+3.5V_ST

MUTE_AOUT

+3.5V_ST +3.3V_M

+3.5V_ST

A_DIM

R514

1K

POWER_SW

H/W RESET

SERIAL FLASH(2MB)

FLASH_WP

RL_ON

R581 0

P_24V

P_12V

+3.5V_ST

READY

R582 0

4.7uF 10V

C580

EEPROM(64K)

R570

10K

SPI_CZ

SPI_DO

RL_ON

R580

33K

MMBT3904(NXP)

R583

1K

R584 1K

R585

R586

11K 1% READY

D583

KDS181

32CS410

L501

120-ohm

L502

120-ohm

L503

120-ohm

R508

3.3 R509

3.3

L504

120-ohm

IC503

AT24C64D-SSHM-T

A0

1

A1

2

A2

3

GND

4

R571

100

R572

100

R573 100

C

B

RL_ON

5.1K

Q580

For China

E

B

ISA1530AC1

Q581

B

KDS181

D582

R587

150

C582 47uF 25V LIFE_1000H

22LV2130-TD Must be applied 2000H REASON : CAP LIFE for CST TEST

R591

100

C581

R590

0.1uF

33K

16V

C507

C508

10uF

0.1uF

C512

C513

0.1uF

C514

C515

10uF

0.1uF

AVDD_PLL

C545 10uF

VCC

8

WP

7

SCL

6

SDA

5

READY

SPI_MACRONIX

IC502

MX25L1606EM2I-12G

CS#

1

SO/SIO1

2

WP#/AGC

3

GND

4

C

Q581-*1 MMBT3906(NXP)

E

R588

2K C E

C582-*1

47uF

25V

LIFE_2000H

C509

0.1uF

C516

0.1uF

+3.5V_ST

C572

0.01uF 50V

C574

C573

33pF

READY

8

7

6

5

R589 10K

C510

0.1uF

AVDD_25

AVDD 2.5V

C517

0.1uF

R578

22

R579

22

VCC

HOLD#

SCLK

Adapter_Model

SI/SIO0

2012/03/02

DDR 2.5V

C511

0.1uF

C518

C547

0.1uF

R577

R576

4.7K

+3.5V_ST

W25Q16BVSSIG(TRAY)

DO[IO1]

%WP[IO2]

C570

0.1uF

SPI_WINBOND

16V

R574

C571

100

33pF

R575

100

D581 KDS181

AVDD_DDR

ST 3.3V

AVDD_ST33

C548

0.1uF

EEP_SCL EEP_SDA

IC502-*1

CS

VCC

1

8

HOLD[IO3]

7

2

CLK

6

3

GND

DI[IO0]

4

5

SPI_CLK

SPI_DI

HW_RESET

MAIN SOC 5 8

EAX64671103

LGE Internal Use Only

LP24B

[51Pin LVDS Connector] (For FHD 60Hz_Large)

WAFER_FHD_51P

P600

FI-RE51S-HF-J-R1500

[01]

R602 0

1

FHD_51P_IPS

[02]

2

[03]

3

[04]

4

[05]

5

[06]

6

[07]

7

[08]

8

[09]

9

[10]

10

[11]

11

[12]

12

[13]

13

[14]

14

[15]

15

[16]

16

[17]

17

[18

18

[19]

19

[20]

20

[21]

21

[22]

22

[23]

23

[24]

24

[25]

25

[26]

26

[27]

27

[28]

28

[29]

29

[30]

30

[31]

31

[32]

32

[33]

33

[34]

34

[35]

35

[36]

36

[37]

37

[38]

38

[39]

39

[40]

40

[41]

41

[42]

42

[43]

43

[44]

44

[45]

45

[46]

46

[47]

47

[58]

48

[59]

49

[50]

50

[51]

51

52

.

R603 0

42" AUO

R601 10K

FHD_51P_BIT_SEL_LOW

R604 0

42" AUO

C603

READY

10uF 16V

+3.3V_M

READY

R628

4.7K

READY

R629

PANEL_VCC

C602

1000pF 50V

READY

10K

RXE0+

RXE0-

RXE1+

RXE1-

RXE2+

RXE2-

RXECK+

RXECK-

RXE3+

RXE3-

RXE4+

RXE4-

RXO0+

RXO0-

RXO1+

RXO1-

RXO2+

RXO2-

RXOCK+

RXOCK-

RXO3+

RXO3-

RXO4+

RXO4-

L601

120-ohm

C601

0.1uF 16V

42 Inch

[30Pin LVDS Connector] (For HD 60Hz_Large)

P603

FF10001-30

WAFER_HD_LARGE

[30]

1

[29]

R622 0 READY

2

[28]

3

[27]

4

[26]

5

[25]

6

[24]

7

[23]

8

[22]

9

[21]

10

[20]

11

[19]

12

[18]

13

[17]

14

[16]

15

[15]

16

[14]

17

[13]

18

[12]

19

[11]

20

R623 0 READY

[10]

21

[09]

22

R624 0 HD_LARGE

[08]

23

[07]

24

[06]

25

[05]

26

[04]

27

[03]

28

[02]

29

[01]

30

31

.

C628 10uF 16V

READY

C627 1000pF 50V

READY

RXE3-

RXE3+

RXECK-

RXECK+

RXE2-

RXE2+

RXE1-

RXE1+

RXE0-

RXE0+

PANEL_VCC

L621

120-ohm

26_32 inch

C626

0.1uF 16V

26_32 inch

+3.3V_M

READY R626

4.7K

READY

R627

10K

[30Pin LVDS Connector] (For HD 60Hz_19"/22")

P602

FF10001-30

WAFER_HD_19_22

[30]

1

[29]

2

[28]

3

[27]

4

[26]

5

22_THTF

[25]

R625

6

0

[24]

7

[23]

8

[22]

9

[21]

10

[20]

11

[19]

12

[18]

13

[17]

14

[16]

15

[15]

16

[14]

17

[13]

18

[12]

19

[11]

20

[10]

21

[09]

22

[08]

23

[07]

24

[06]

25

[05]

26

[04]

27

[03]

28

[02]

29

[01]

30

31

.

VESA

JEIDA

L/NC

TBD

H

L/NCH

L

TBD

LGD

CMI

AUO H/NC

IPS

C622 10uF 16V

READY

C621 1000pF 50V

READY

RXE3-

RXE3+

RXECK-

RXECK+

RXE2-

RXE2+

RXE1-

RXE1+

RXE0-

RXE0+

PANEL_VCC

L620

120-ohm

C620

0.1uF 16V

HD_19_22

LVDS_SEL

+3.3V_M

R620

4.7K READY

R621 10K READY

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LVDS

32CS410

LVDS

2012/03/02

6 8

EAX64671103

LGE Internal Use Only

LP24B

RL_ON

R701

4.7K

RL_ON

R702

10K

C701

100uF

C704

47uF

25V

16V

24V

SW

GND

B

C702

0.1uF

NON_ADAPTER

C705

0.1uF

NON_ADAPTER

RL_ON

NON_ADAPTER

P_12V

NON_ADAPTER

ADAPTER

JK700

JPD003N-M432-4F

ADAPTER_NON_LED_DRIVER

P705

SM14B-SRSS-TB

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

GND

+3.5V_ST

24V

GND

ERROR_OUT

INV_ON

NC

PWM_DIM

+3.5V_ST

RL_ON

R703

4.7K

C

RL_ON

Q702 2SC3052

E

NON_ADAPTER

L701

120-ohm

16V

NON_ADAPTER

L702

120-ohm

50V

P_24V_ADAPTER

C712

0.1uF 50V

ADAPTER

+24V_LED_driver

ADAPTER_NON_LED_DRIVER C713

0.1uF

50V

R759

0

READY

RL_ON

Q701 2SC3052

E

C

B

C714

0.01uF 50V ADAPTER_NON_LED_DRIVER

ERROR_OUT_26INCH

INV_CTL_26INCH

PWM_DIM_26INCH

22_LAMP

R700

0

R706 0

POWER_23_GND

RL_ON2

NORMAL_EXPEPT_32

P701

FW20020-24S

PWR ON

24V GND GND

3.5V

3.5V GND GND 12V 12V 12V

GND/P.DIM2

PWM_DIM_LED_DRIVER

FROM LIPS & POWER B/D

P_24V_ADAPTER

L704 120-ohm

NORMAL_32

P702

FM20020-24

P706

22_LAMP

SMAW200-12

24V

1

2

1

2

1

2

1

24V

3

4

3

4

3

2

GND

5

6

5

6

5

3

GND

7

8

7

8

7

4

3.5V

10

9

10

5

3.5V

11

12

11

12

11

6

GND

13

14

13

14

13

7

GND/V-sync

15

16

15

16

15

8

INV ON

17

18

17

18

17

9

A.DIM

20

19

20

10

P.DIM1

21

22

21 22

11

Err OUT

23

24

23 24

12

25

SLIM_32~52

P703

SMAW200-H24S2

POWER_24_GND

PWM_DIM_26INCH

ERROR_OUT_26INCH

R707

0

POWER_16_GND

R735 0

ADAPTER_NON_LED_DRIVER

ADAPTER

L703

120-ohm

NON_ADAPTER

POWER_18_INV_CTL

R710 100

R711 100

POWER_24_INV_CTL

POWER_20_PWM_DIM

POWER_22_PWM_DIM

POWER_24_PWM_DIM

LED_DRIVER

POWER_20_ERROR_OUT

POWER_24_ERROR_OUT

R734 100

ADAPTER_NON_LED_DRIVER

+24V_AMP

P_24V

POWER_SW

C707

0.1uF 50V

ADAPTER_NON_LED_DRIVER

R712 100

INV_CTL_26INCH

R720 0

POWER_18_A_DIM

R721 0

POWER_22_A_DIM

R722 0

POWER_20_A_DIM

0R723

0R724

0R725

0R726

0R727

100R732

100R733

C720

C721

2.2uF

0.1uF 50V

50V

R753 10K

B

P_24V

NON_ADAPTER

C708 68uF 35V READY

+3.3V_M

NON_LED_DRIVER

R714 1K

NON_LED_DRIVER

C

R716 10K

B

Q703

2SC3052

E

NON_LED_DRIVER

R718

10K

C709

2.2uF

R729 1K

ERROR_OUT

* Option block : ADAPTER

AO3407A Vgs : 10.8V(24V input) AO3407A Vgs : 8.3V(15V input)

R751 22K

R752

27K

C

Q731 MMBT3904(NXP)

E

S

AO3407A

G

D

CPI2520NHL3R3ME 2520

C722

0.01uF 50V

Q734

L731

R708

0

+3.5V_ST

R715 10K

R730

6.2K

3.3uH

SOUND_VCC

INV_ON

A_DIM

C723

3.3uF 50V

[Pinmap for EEFL]

18(12)

20(13)

22(14)

24(11)

LIPS

16

GND

INV_ON

PWM_DIM

ERR_OUT

23

[Pinmap for Edge LED]

LPB

16

18(12)

20(13)

22(14)

24(11)

23

PWM_DIM

NC

INV_ON

NC

PWM_DIM

ERR_OUT

NC

[Power for EEFL]

LGD

32"

’1O LIPS

37"

42"

’1O LIPS

47"

’1O LIPS

SOUND_VCC

C724

C725 68uF

0.01uF

35V

50V

READY

Close to AMP IC

CMI(PSU)

GND

INV_ON

PWM_DIM

ERR_OUT

CMI(PSU)

GND

INV_ON

PWM_DIM

AUO(PSU)

GND

INV_ON

NC

PWM_DIM

ERR_OUT

NCGND

NC

AUO(PSU)

GND

INV_ON

NC

PWM_DIM

ERR_OUT

NC

[Power for LED]

OS

’11 PSU

X

32"

37"

42"

47"

+24V_LED Driver

P_24V

ADAPTER

MLB-201209-0120P-N2

RL_ON2

L730

R756

10K

* Option block : ADAPTER

C727

2.2uF

C726

50V

0.1uF 50V

R757

27K

C

B

Q733

MMBT3904(NXP)

E

IPS(PSU)

LGD(PSU)

GND

INV_ON

NCVBR-A

PWM_DIM

ERR_OUT

PWM_DIM

ERR_OUT

NC

IPS(PSU)

LGD(PSU)PIN

GND

INV_ON

NC

PWM_DIM

ERR_OUT

PWM_DIM

ERR_OUTERR_OUT

NC

LGD

’11 PSU

’11 LPB

G

+24V_LED_driver

S

Q732

AO3407A

D

R755 22K

AO3407A Vgs : 10.8V

C728

0.01uF 50V

GND

VBR-A

NC

GND

NC

’11 PSU

** 3.5V_ST -> 1.26V VDDC

+3.5V_ST

C740 10uF 10V

R744

10K

C741

0.1uF 16V

V0 = 0.8*(1+(R2/R1))

IC701

MP20051

[EP]GND

IN_2

IN_1

8

7

NC

6

EN

5

THERMAL

9

OUT_1

1

OUT_2

2

FB

3

GND

4

R2 1%

R741

4.7K

R1

1%

R740

2.74K

R742

C742 10uF

6.3V

1

+1.2V_VDDC

READY

C746 10uF

6.3V

OUT:1.27V

** 3.3V_M -> 2.5V_M

C744

0.1uF 16V

R748 22K

R749

2.2K

Q711 2SC3052

VIN

IC702

AP2114H-2.5TRG1

VOUT

2

3

1

GND

D

Q710-*1

G

AO3435

AOS

S

Q710

RSR025P03

S

D

Rohm

G

READY

C751

4.7uF 16V

R743

1

C745 10uF

6.3V

L750

BLM18PG121SN1D

C752

0.1uF 16V

READY R750

10K

C754 10uF

10V

+2.5V_M

+3.3V_M

C743 10uF 10V

OS

** +3.5V_ST -> 3.3V_M

+3.5V_ST

C750

0.1uF 16V

C

B

E

POWER_SW

R747 10K

+3.5V_ST

Switching noise reducing [MPS recommend]

EP_GND

R781

C783

3.3uF 50V

C731

3.3uF 50V

R783 200K

1/8W

C784

3.3uF 50V

1% 120K

R795

22

VIN_2

VIN_1

1%

C785

0.1uF 50V

R1

R796

6.8K 1%

R797

1.6K

1%

P_24V

C730

0.1uF 50V

+12V/+15V

P_24V

RL_ON2

R793

0

0.1uF

BST

FREQ

GND

EN/SYNC

R2

MP4460DQ-LF-Z

10

9

8

7

6

IN

FB

GND

R782 100K

C733

50V

IC707

SW_1

1

THERMAL

SW_2

11

2

EN

3

COMP

4

$0.21

FB

5

IC708

MP8670DN-LF-Z

8

7

$0.37

6

5

close to pin

C732

220pF 50V

SW

1

BST

2

VCC

3

BG

4

D730

MBRA340T3G

R784

68K

R798

22

R799

0

0CZZB00110A : 22uF 20% 10V X7R 3216

EAE58111001 : 22uF 20% 16V X5R 3216

EAE62281601 : 22uF 20% 10V X5R 2012

L780

3.6uH

NR8040T3R6N

R785 18K

R786 30K 1/10W

1%

* Option block : ADAPTER

L790

4.7uH

SP-7850_4.7

C786

1uF 25V

C787

1uF 50V

Q730

4

5

G

D_1

3

6

S_3

D_2

2

7

S_2

D_3

1

8

S_1

D_4

SI4124DY-T1-GE3(VISHAY)

close to IC1009

* Option block : ADAPTER

Placed on SMD-TOP

R787 105K

1/10W 1%

C788

10uF 25V

C735 22uF 16V

C736 10uF 10V READY

real output : 12.3V

C789 10uF

25V

C734 22uF 16V

Placed on SMD-TOP

C737

0.1uF 50V

P_12V

C790

0.1uF 50V

+3.5V_ST

*12V -> PANEL_5V (OPTION)

PANEL_5V

IC706

GND

SS

IN

SW

MP1497DJ

1

2

3A

3

4

FB

8

VCC

7

EN

6

BST

5

P_12V

L781

500

C793

0.01uF

Closed IC706

C791

C792

10uF

0.1uF

25V

50V

**12V->TUNER 5V

P_12V

L770

500

C774

0.1uF

Closed IC709

C770

C772

10uF

0.1uF

25V

50V

GND

SS

IN

SW

IC709

MP1497DJ

1

2

3A

3

4

C771 1uF 25V

R771

33

FB

8

VCC

7

EN

6

BST

5

C794 1uF 25V

R794

33

NR8040T3R6N

L771

3.6uH

Closed IC709

R778 47K

C775

0.1uF 16V

R777

10K

C773

0.1uF 16V

NR8040T3R6N

L782

3.6uH

Closed IC706

R789 47K

C795

0.1uF 16V

R792

10K

C796

0.1uF 16V

R1

R770

51K

1%

R2

R772

6.8K

1%

+3.3V_M

V0 = 0.8*(1+(R1/R2))

R1

R790

R2

R791

30K

1%

5.6K

1%

C797 10uF 10V

READY

C799 10uF 10V

+5V_PANEL

C798

0.1uF 16V

+3.3V_M

V0 = 0.8*(1+(R1/R2))

OUT:6.8V

C777

C776

10uF

10V

READY

C779

0.1uF 50V

C778

0.1uF 50V

IC704

AP1117EG-13

5V_LDO_DIODE

IN

IC705

AP1117EG-13

5V_LDO_DIODE

** Switch Panel-Vcc

OUTPUT

R764 10K

P_12V

PANEL_12V

L761

120-ohm

R763

10K

B

C760

R761

1uF

33K

25V

PANEL_12V R762

33K

PANEL_5V

C

R762-*1 10K

Q721 MMBT3904(NXP)

E

Q720

AO3407A

S

G

PANEL_VCC

D

C761

R765

0.1uF

4.7K

16V

R766

4.7K

READY

R767

4.7K

+5V_PANEL

PANEL_5V L760 120-ohm

PANEL_ON

INPUT

3

1

ADJ/GND

R774

R773

ADJ/GND

R775

110

C780

0.1uF 16V

C781

0.1uF

16V

330

R776

330

5V_TUNER

+5V_USB

READY C782 100uF 16V

2OUT 3 IN

1

2OUT 3

IC704-*1

5V_LDO_BCD

1

AZ1117BH-ADJTRE1

ADJ/GND

INPUT

3

IC705-*1

5V_LDO_BCD

1

AZ1117BH-ADJTRE1

ADJ/GND

2

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

POWER

32CS410

2012/03/02

7 8POWER

EAX64671103

LGE Internal Use Only

LP24B

+3.5V_ST

R800

10K

R801

10K

READY

R802

10K

Q800

MMBT3904(NXP)

B

INV_ON

+3.3V_M

3.3K -> 1K (threshold voltage up)

R803

1K

R804

6.8K

READY

WLED_ENABLE

C

E

+24V_LED_driver

WLED_ENABLE

ERROR_OUT

PWM_DIM_LED_DRIVER

TN_module_LED_DRIVER_CIRCUIT

D801

G

D

Q801 AP18T10GH

S

R813

0.1 1%

PDS5100H-13

C806 1000pF

READY

must be modifed

R821-*2 59K 1/16W1% CMI_TN

R822-*2 59K 1/16W1% CMI_TN

R817 100

1/10W

R818 100K

1/10W

R826 10K 1/10W READY

C801

2.2uF 50V

R827 100

1/10W

C811 100pF 50V

R825 100

1/10W

READY

C802

2.2uF 50V

C814 100pF 50V

R816

4.7

1/10W

R819

1/10W

C813

0.33uF 50V

390

C804

0.1uF 50V

C810

0.1uF 50V

2010.06.30. hwson for thermal Issue

Operating Freq.

C803

0.1uF 50V

close to IC100

C104 : 10uF --> 2.2nF C106 : 0.68uF --> 0.33uF R111 : 470 --> 390

2010.02.07 for PQ/19V_LED

C812 2200pF 50V

close to IC100

R113/R114

F=7.35x10^9/RT

R828

16K 1%

R820 51K 1%

READY

C819 1uF 10V

R821

47K 1/10W

AUO_TN

1%

L801 33uH

C805

1000pF

50V

READY

must be modifed

[EP]PGND/LEDGND

IN

1

EN

2

COMP

3

RT

4

FLT

5

R822

51K 1/10W

5%

AUO_TN

R824 10K

1/8W

R823

7.5K 1/8W

R810

5.1 READY

DRV20VCC

19

THERMAL

21

IC800

MAX16814

7

6

OVP

SETI9SGND

NDRV

18

8

RSDT

R811

3.3 1/10W 5%

PGND

DIM

16CS17

15 14 13 12 11

10

R812 3K

1/8W

R120 : 6.8K --> 3K

R121 : 0.03 --> 0.1

2010.06.30 HWSON

OUT4 OUT3 LEDGND OUT2 OUT1

R821-*1 27K 1/10W

1%

LGD_TN

R822-*1 27K 1/10W

1%

LGD_TN

50V

R814 560K 1/10W

C807

2.2uF 100V

OVP setting

R815 13K 1/10W 5% 22_CMI_EDGE

C815 1000pF

50V

C808

C809

10uF

2.2uF

100V

R815-*1 11K 1/10W 5%

21.5_AUO_LGD_EDGE

C817

C816

1000pF

50V

ESD protection solution

C818 1000pF

50V

wafer modify & resister add

P800

12507WR-06L

1

2

3

4

5

6

7

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LED DRIVER

ILED=1500/RSETI

ILED spec

AUO_18.5_HD

AUO_21.5_FHD

LGD_21.5_FHD

CMI_18.5_HD 560Kohm

60mA_Typ 63mA_Max

110mA_Typ 120mA_Max

50mA_Typ 56mA_Max

R10011

47Kohm

27Kohm

59Kohm

R10013

51Kohm

27Kohm

59Kohm

Remark Max

61.35mA

111.11mA

50.85mA

OVP setting

AUO_18.5

AUO_21.5

LGD_21.5

CMI_18.5

CMI_21.5

Vs spec 34V_Typ

36V_Max

52.8V_Typ

57.6V_Max

51.2V_Typ 56V_Max

33V_Typ 34V_Max

44.8V_Typ

47.6V_Max

OVP=1.23x(1+R1/R2)

R10018

560Kohm

560KohmCMI_21.5_FHD

R10019

16Kohm

11Kohm

18Kohm

13Kohm

Remark

44.28V

63.85V

39.5V

54.26V

32CS410

min

TypModuleModule

18.5 AUO

21.5 LGD

18.5 CMI

21.5 CMI 47.6

30

4821.5 AUO

28

39.2

34

52.8

51.2

-

33

44.8

2012/03/02

LED DRIVER 8 8

36

57.6

56

34

LG 19LS3300-TA Schematic

Specifications and Main Features

Frequently Asked Questions

User Manual