Table 2. 6-Pin PCI Express Power Connector Pinout ....................................... 8
Table 3. Thermal Results and Specification ................................................. 9
Table 4. Mean Time Between Failure (MTBF) .............................................. 10
Table 5. Languages Supported ............................................................... 12
NVIDIA GRID K1
Graphics Board BD-06633-001_v02 | iv
Page 5
OVERVIEW
The NVIDIA GRID™ K1 is a dual-slot 10.5 inch PCI Express Gen3 graphics board with
™
four NVIDIA Kepler
GB of DDR3 memory (4 GB per GPU), and a 130 W maximum power limit. The NVIDIA
GRID K1 graphics board uses a passive heat sink that requires system airflow to
properly operate the card within thermal limits. It is designed to accelerate graphics in
virtual desktop environments, making it the ideal graphics processor for Microsoft
RemoteFX and VMware vSGA.
graphics processing units (GPUs). The NVIDIA GRID K1 has 16
Four GK107 GPUs
Core clock: 850 MHz
Number of processor cores: 768 (192 per GPU)
Full Microsoft DirectX 11, Shader Model 5.0 support
Full OpenGL 4.3 support
Memory clock: 891 MHz
Interface: 128-bit
Total board memory: 16 GB (4 GB per GPU)
● 32 pieces of 256M × 16 DDR3
BIOS
Four 2Mbit serial ROMs (one per GPU)
Virtualization Solutions
Citrix XenServer with NVIDIA GRID Hypervisor + XenDesktop with HDX
Microsoft Windows Server 2012 + RemoteFX
Microsoft Windows Server 2008 R2 + RemoteFX
VMware ESXi + View with vSGA
Table 1 lists the configuration for the NVIDIA GRID K1 graphics board.
Table 1. Board Configuration
Specification SKU 502 Description
Generic SKU reference 699-52401-0502-xxx
Chip 4× GK107
Core clock 850 MHz
Memory clock 891 MHz
NVIDIA CUDA® cores 768 (192 per GPU)
Frame buffer 16 GB (4 GB per GPU)
Memory I/O 128-bit
Memory configuration 32 pcs 256M × 16 DDR3
Display connectors None
Power connector One 6-pin PCI Express auxi li a ry power co nn ecto r
Total board power 130 W
The NVIDIA GRID K1 graphics board conforms to the PCI Express Gen3 ×16 (4.376
inches by 10.5 inches) form factor. Figure 2 shows the NVIDIA GRID K1 graphics board
without the top cover installed.
The NVIDIA GRID K1 board features a vented bracket, as shown in Figure 3. OEMs
who qualify for bracket modifications have the option of receiving modules with no
bracket installed.
The NVIDIA GRID K1 graphics board utilizes power from the 6-pin PCI Express power
connector. Figure 5 shows the 6-pin PCI Express power connector specifications and
Table 2 shows the connector’s pinout.
The NVIDIA GRID K1 graphics board uses passive heat sinks that require system
airflow to properly operate the card within thermal limits. Table 3 provides thermal
information necessary to deliver reliable operation of the NVIDIA GRID K1 GPU. This
information is not intended to provide a specific thermal management solution.
For more detailed information regarding thermal specifications for the NVIDIA GRID
K1 graphics board, refer to the NVIDIA GRID K1 System Design Guide (DG-06428-001).
Table 3. Thermal Results and Specification
Test Application Temperature (°C)*
GPU Junction temperature (Tj) at TDP** 96 °C
GPU slowdown temperature (maximum Tj) 96 °C
GPU shutdown temperature (Tj) 101 °C
Maximum fan inlet temperature 45 °C (at 17 CFM)
Notes:
* Junction temp erature is reported by N V I DIA thermal sensor
** TDP = thermal desig n power
The meant time between failure (MTBF) ratings for the NVIDIA GRID K1 are tabulated
in Table 4. The calculation of these values uses the Bellcore’s Parts Count method in
controlled environments.
Table 4. Mean Time Between Failure (MTBF)
Condition (Bellcore Code) MTBF
Ground Benign (GB) environment, 35 °C * 242,324 hours
Ground Fixed (GF) environment, 35 °C ** 121,991 hours
Notes:
*Bellcore Code GB relates to non-mobile equ ipment used in ideal en v ir on m e n t (lab, medical, an d t est
equipment).
**Bellcore Code GF relates to non-mobile equipment used in less th an ideal environments (rack mount or
other instrumentation or equipment used in buildings without controlled temperatures).
Australian Communications Authority and Radio Spectrum Management Group of
New Zealand (C-Tick)
Bureau of Standards, Metrology, and Inspection (BSMI)
Conformité Européenne (CE)
Federal Communications Commission (FCC)
Industry Canada - Interference-Causing Equipment Standard (ICES)
Korean Communications Commission (KCC)
Underwriters Laboratories (cUL, UL)
Voluntary Control Council for Interference (VCCI)
English (US) X
English (UK) X
Arabic X
Chinese, Simplified X
Chinese, Traditional X
Czech X
Danish X
Dutch X
Finnish X
French X
French (Canada) X
German X
Greek X
Hebrew X
Hungarian X
Italian X
Japanese X
Korean X
Norwegian x
Portuguese (Brazil ) X
Portuguese
(European/Iberian)
Russian X
Slovak X
Slovenian X
Spanish X
Swedish X
Thai X
Turkish X
ALL NVIDIA DESIGN SPECIFICATI ONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS, AND OTHER
DOCUMENTS (TOGETHER AND SEPARATELY, “MATERIALS”) ARE BEING PROVIDED “AS IS.” NVIDIA MAKES NO
WARRANTIES, EXPRESSED, IMPLIED, STATUTORY, OR OTHERWISE WITH RESPECT TO THE MATERIALS, AND
EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES OF N ONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR
A PARTICUL AR PURPOSE.
Information furnished is believed to be accurate and reliable. However, NVIDIA Corporation assumes no
responsibility for the consequences of use of such information or for any infringement of patents or other
rights of third parties that may result from its use. No license is granted by implication of otherwise under
any patent rights of NVIDIA Corporation. Specifications mentioned in this publication are subject to change
without notice. This publication supersedes and replaces all other information pre viously supplied. NVIDIA
Corporation products are not authorized as critical components in life support devices or systems without
express written approval of NVIDIA Corporation.
Trademarks
NVIDIA, the NVIDIA logo, CUDA, Kepler, and N VIDIA GRID are trademarks and/or registered trademarks of
NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of
the respective companies with which they are associated.