Lattice Semiconductor Corporation ISPLSI2128VL-135LQ160, ISPLSI2128VL-135LB208, ISPLSI2128VL-135LB100, ISPLSI2128VL-100LT176, ISPLSI2128VL-100LT100 Datasheet

...
ispLSI® 2128VL
Global Routing Pool (GRP)
Output Routing Pool (ORP) Output Routing Pool (ORP)
Output Routing Pool (ORP) Output Routing Pool (ORP)
Output Routing Pool (ORP) Output Routing Pool (ORP)
CLK 0
Output Routing Pool (ORP) Output Routing Pool (ORP)
CLK 1
CLK 2
Logic Array
GLB
DQ
DQ
DQ
DQ
0139A/2128VL
C7
C6
C5
C4
C3
C2
C1
C0
D3
D2
D1
D0
D7
D6
D5
D4
B4
B5
B6
B7
B0
B1
B2
B3
A0
A1
A2
A3
A4
A5
A6
A7
*128 I/O version shown
2.5V In-System Programmable
SuperFAST™ High Density PLD
• SuperFAST HIGH DENSITY IN-SYSTEM
• 2.5V LOW VOLTAGE 2128 ARCHITECTURE
• HIGH PERFORMANCE E
• IN-SYSTEM PROGRAMMABLE
• 100% IEEE 1149.1 BOUNDARY SCAN TESTABLE
• THE EASE OF USE AND FAST SYSTEM SPEED OF
• ispDesignEXPERT™ – LOGIC COMPILER AND COM-
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. September 2000 Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
2128vL_02 1
Features
— 128 and 64 I/O Pin Versions, Eight Dedicated Inputs — 128 Registers — High Speed Global Interconnect — Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc. — Small Logic Block Size for Random Logic — 100% Functional, JEDEC and Pinout Compatible
with ispLSI 2128V and 2128VE Devices
— Interfaces with Standard 3.3V Devices (Inputs and
I/Os are 3.3V Tolerant) — 125 mA Typical Active Current
2
CMOS® TECHNOLOGY
fmax = 150 MHz Maximum Operating Frequency
tpd = 6.0 ns Propagation Delay
— — Electrically Erasable and Reprogrammable — Non-Volatile — 100% Tested at Time of Manufacture — Unused Product Term Shutdown Saves Power
— 2.5V In-System Programmability (ISP™) Using
Boundary Scan Test Access Port (TAP) — Open-Drain Output Option for Flexible Bus Interface
Capability, Allowing Easy Implementation of Wired-
OR Bus Arbitration Logic — Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality — Reprogram Soldered Devices for Faster Prototyping
PLDs WITH THE DENSITY AND FLEXIBILITY OF FPGAS — Enhanced Pin Locking Capability
— Three Dedicated Clock Input Pins — Synchronous and Asynchronous Clocks — Programmable Output Slew Rate Control — Flexible Pin Placement — Optimized Global Routing Pool Provides Global
Interconnectivity
PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms
Functional Block Diagram*
Description
The ispLSI 2128VL is a High Density Programmable Logic Device available in 128 and 64 I/O-pin versions. The device contains 128 Registers, eight Dedicated Input pins, three Dedicated Clock Input pins, two dedi­cated Global OE input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 2128VL fea­tures in-system programmability through the Boundary Scan Test Access Port (TAP) and is 100% IEEE 1149.1 Boundary Scan Testable. The ispLSI 2128VL offers non­volatile reprogrammability of the logic, as well as the interconnect to provide truly reconfigurable systems.
The basic unit of logic on the ispLSI 2128VL device is the Generic Logic Block (GLB). The GLBs are labeled A0, A1 .. D7 (see Figure 1). There are a total of 32 GLBs in the ispLSI 2128VL device. Each GLB is made up of four macrocells. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any GLB on the device.
Specifications ispLSI 2128VL
Functional Block Diagram
Figure 1. ispLSI 2128VL Functional Block Diagram (128-I/O and 64-I/O Versions)
I/O 127
I/O 126
I/O 125
I/O 124
I/O 123
I/O 122
I/O 121
I/O 120
I/O 119
I/O 118
I/O 117
I/O 116
I/O 115
I/O 114
I/O 113
I/O 112
I/O 111
I/O 110
I/O 109
I/O 108
I/O 107
I/O 106
I/O 105
I/O 104
I/O 103
I/O 102
I/O 101
I/O 100
I/O 99
I/O 98
I/O 97
I/O 96
IN 7
RESET
GOE 0 GOE 1
I/O 10 I/O 11
I/O 12 I/O 13 I/O 14 I/O 15
I/O 16 I/O 17 I/O 18 I/O 19
I/O 20 I/O 21 I/O 22 I/O 23
I/O 24 I/O 25 I/O 26 I/O 27
I/O 28 I/O 29 I/O 30 I/O 31
TDI/IN 0
TMS/IN 1
BSCAN
IN 6
I/O 42
I/O 43
Input Bus
D5
D4
Global
Routing
Pool
(GRP)
B3
Input Bus
I/O 44
I/O 45
I/O 46
I/O 47
I/O 48
D2
D3
B5
B4
I/O 49
I/O 50
I/O 51
I/O 52
I/O 53
I/O 54
I/O 55
I/O 56
I/O 57
D0
D1
C7
C6
C5
C4
Input Bus
C3
C2
C1
Output Routing Pool (ORP) Output Routing Pool (ORP)
C0
B7
B6
CLK 0
CLK 1
CLK 2
0139B/2128VL
I/O 60
I/O 61
I/O 62
I/O 63
Y0Y1Y2
I/O 58
I/O 59
Megablock
G
e
n
e
r
c
L
i
o
g
c
i
)
s
(
s
G
L
k
B
o
l
c
B
I/O 0 I/O 1 I/O 2 I/O 3
I/O 4 I/O 5 I/O 6 I/O 7
I/O 8 I/O 9
A0
A1
A2
A3
Input Bus
A4
A5
A6
Output Routing Pool (ORP) Output Routing Pool (ORP)
A7
TDO/IN 2
Output Routing Pool (ORP) Output Routing Pool (ORP)
D7
D6
B0
B1
B2
Output Routing Pool (ORP) Output Routing Pool (ORP)
I/O 32
I/O 33
I/O 34
I/O 35
I/O 36
I/O 37
I/O 38
I/O 39
I/O 40
TCK/IN 3
I/O 41
IN 5 IN 4
I/O 95 I/O 94 I/O 93 I/O 92
I/O 91 I/O 90 I/O 89 I/O 88
I/O 87 I/O 86 I/O 85 I/O 84
I/O 83 I/O 82 I/O 81 I/O 80
I/O 79 I/O 78 I/O 77 I/O 76
I/O 75 I/O 74 I/O 73 I/O 72
I/O 71 I/O 70 I/O 69 I/O 68
I/O 67 I/O 66 I/O 65 I/O 64
RESET
GOE 0 GOE 1
I/O 10 I/O 11
I/O 12 I/O 13 I/O 14 I/O 15
TDI/IN 0
TMS/IN 1
BSCAN
Megablock
G
e
n
e
r
i
k
o
s
l
c
B
I/O 0 I/O 1 I/O 2 I/O 3
I/O 4 I/O 5 I/O 6 I/O 7
Input Bus
I/O 8 I/O 9
Output Routing Pool (ORP)
I/O 63
I/O 62
I/O 61
I/O 60
I/O 59
I/O 58
c
L
o
g
c
i
D7
D6
B1
D5
B2
Output Routing Pool (ORP)
I/O 20
I/O 21
I/O 22
I/O 23
)
(
s
G
L
B
A0
A1
A2
A3
A4
A5
A6
A7
B0
I/O 16
I/O 17
I/O 18
I/O 19
TCK/IN 3
TDO/IN 2
I/O 57
I/O 56
Input Bus
Output Routing Pool (ORP)
D4
D3
Global
Routing
Pool
(GRP)
B3
B4
Input Bus
I/O 55
I/O 54
I/O 53
I/O 52
D2
D1
B5
B6
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
*Not available on 84-PLCC Device
I/O 51
I/O 50
I/O 49
I/O 48
IN 7*
IN 6*
Input Bus
Output Routing Pool (ORP)
CLK 1
CLK 2
0139B/2128VL.64IO
IN 5* IN 4*
I/O 47 I/O 46 I/O 45 I/O 44
I/O 43 I/O 42 I/O 41 I/O 40
I/O 39 I/O 38 I/O 37 I/O 36
I/O 35 I/O 34 I/O 33 I/O 32
D0
C7
C6
C5
C4
C3
C2
C1
C0
B7
CLK 0
Y0Y1Y2
I/O 30
I/O 31
The 128-I/O 2128VL contains 128 I/O cells, while the 64­I/O version contains 64 I/O cells. Each I/O cell is directly connected to an I/O pin and can be individually pro­grammed to be a combinatorial input, output or bi-directional I/O pin with 3-state control, and the output drivers can source 4mA or sink 8mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise. Device pins can be safely driven to 3.3V signal levels to support mixed-voltage systems.
Eight GLBs, 32 or 16 I/O cells, two dedicated inputs and two or one ORPs are connected together to make a Megablock (see Figure 1). The outputs of the eight GLBs are connected to a set of 32 or 16 universal I/O cells by the two or one ORPs. Each ispLSI 2128VL device con­tains four Megablocks.
The GRP has as its inputs, the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew.
Clocks in the ispLSI 2128VL device are selected using the dedicated clock pins. Three dedicated clock pins (Y0, Y1, Y2) or an asynchronous clock can be selected on a
GLB basis. The asynchronous or Product Term clock can be generated in any GLB for its own clock.
Programmable Open-Drain Outputs
In addition to the standard output configuration, the outputs of the ispLSI 2128VL are individually program­mable, either as a standard totem-pole output or an open-drain output. The totem-pole output drives the specified Voh and Vol levels, whereas the open-drain output drives only the specified Vol. The Voh level on the open-drain output depends on the external loading and pull-up. This output configuration is controlled by a pro­grammable fuse. The default configuration is a totem-pole configuration. The open-drain/totem-pole option is se­lectable through the ispDesignEXPERT software tools.
2
Specifications ispLSI 2128VL
Absolute Maximum Ratings
1
Supply Voltage Vcc................................ -0.5 to +4.05V
Input Voltage Applied............................. -0.5 to +4.05V
Off-State Output Voltage Applied .......... -0.5 to +4.05V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (TJ) with Power Applied ... 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications).
DC Recommended Operating Condition
V V
V
CC
IL IH
SYMBOL
Supply Voltage
Input Low Voltage Input High Voltage
PARAMETER
Commercial Industrial
TA = 0°C to + 70°C
= -40°C to + 85°C
T
A
MIN. MAX. UNITS
2.3
2.3
-0.3
1.7
2.7
2.7
0.7
3.6
Table 2-0005/2128VL
V V V V
Capacitance (TA=25°C, f=1.0 MHz)
SYMBOL
C
1
C
2
C
3
I/O Capacitance Clock and Global Output Enable Capacitance
PARAMETER
Erase Reprogram Specifications
PARAMETER MINIMUM MAXIMUM UNITS
Erase/Reprogram Cycles
UNITSTYPICAL TEST CONDITIONS
8Dedicated Input Capacitance 6
10
10,000 Cycles
pf pf pf V = 2.5V, V = 0.0V
V = 2.5V, V = 0.0V
CC
V = 2.5V, V = 0.0V
CC I/O
CC Y
IN
Table 2-0006/2128VL
Table 2-0008/2128VL
3
Switching Test Conditions
Specifications ispLSI 2128VL
Input Pulse Levels Input Rise and Fall Time
Input Timing Reference Levels Output Timing Reference Levels Output Load
3-state levels are measured 0.15V from steady-state active level.
GND to V
1.5ns 10% to 90%
See Figure 2
CC
V
/2
CC
/2
V
CC
Table 2 - 0003/2128VL
Figure 2. Test Load
Device
Output
V
CC
R
1
Test
Point
R
2
C
*
L
Output Load Conditions (see Figure 2)
TEST CONDITION R1 R2 CL
A 250 218 35pF
Active High
B
Active Low Active High to Z
at V -0.15V
C
Active Low to Z at V +0.15V
OH
OL
250
250
218 35pF
35pF
218 5pF
Table 2-0004/2128VL
5pF
*
CL includes Test Fixture and Probe Capacitance.
0213A/2128VL

DC Electrical Characteristics

Over Recommended Operating Conditions
——VIOH = -100µA
— — — — —
125
3
0.2
-10 10
-150
-150
-100
Table 2-0007/2128VL
SYMBOL
V
OL
V
OH
5
I
IL
I
IH
I
IL-isp
I
IL-PU
1
I
OS
2, 4
I
CC
Output Low Voltage
Output High Voltage
Input or I/O Low Leakage Current Input or I/O High Leakage Current BSCAN Input Pull-Up Current I/O Active Pull-Up Current Output Short Circuit Current
Operating Power Supply Current
PARAMETER
IOL = 100µA I
OL
I
OH OH
0V V V (Max.)
V
IH
0V V V 0V V V V = 2.5V, V = 0.5V
CC OUT
V = 0.0V, V = 2.5V
IL IH
f = 1 MHz
CLK
1. One output at a time for a maximum duration of one second. V
CONDITION MIN. TYP. MAX. UNITS
= 8mA
= -1mA
= -4mA
IN IL
(min) VIN ≤ 3.6V
IL
IN IN IL
——0.4 V
VCC - 0.2
2.0
1.8 ——VI
— — — — —
= 0.5V was selected to avoid test
OUT
problems by tester ground degradation. Characterized but not 100% tested.
2. Measured using eight 16-bit counters.
3. Typical values are at V
4. Maximum I
varies widely with specific device configuration and operating frequency. Refer to Power Consumption
CC
= 2.5V and TA = 25°C.
CC
section of this data sheet and Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum I
CC
.
5. With no pull-up resistors.
V
V
µA µA µA µA
mA mA
4
External Timing Parameters
Over Recommended Operating Conditions
Specifications ispLSI 2128VL
3
TEST
COND.
tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl
1. Unless noted otherwise, all parameters use a GRP load of four, 20 PTXOR path, ORP and Y0 clock.
2. Standard 16-bit counter using GRP feedback.
3. Reference Switching Test Conditions section.
A 1 Data Propagation Delay, 4PT Bypass, ORP Bypass 7.5 10.0 ns A 2 Data Propagation Delay —— ns A 3 Clock Frequency with Internal Feedback 135 100 MHz
4 Clock Frequency with External Feedback ——MHz 5 Clock Frequency, Max. Toggle ——MHz 6 GLB Reg. Setup Time before Clock, 4 PT Bypass ——ns A 7 GLB Reg. Clock to Output Delay, ORP Bypass —— ns 8 GLB Reg. Hold Time after Clock, 4 PT Bypass 0.0 ns 9 GLB Reg. Setup Time before Clock 6.0 ns A 10 GLB Reg. Clock to Output Delay —— ns 11 GLB Reg. Hold Time after Clock 0.0 ns A 12 Ext. Reset Pin to Output Delay, ORP Bypass —— ns 13 Ext. Reset Pulse Duration 5.5 ns
B 14 Input to Output Enable —— ns C 15 Input to Output Disable —— ns B 16 Global OE Output Enable —— ns C 17 Global OE Output Disable —— ns
18 External Synchronous Clock Pulse Duration, High 3.5 ——ns 19 External Synchronous Clock Pulse Duration, Low 3.5 ——ns
DESCRIPTION#PARAMETER
1
2
1
( )
tsu2 + tco1
-150
MIN. MAX.
6.0
8.5
150 111
166
4.0
4.0
0.0
5.0
5.0
0.0
6.0
5.0
10.0
10.0
6.0
6.0
3.0
3.0
MIN.
95
143
5.0
-135
10.0
4.5
— —
5.5
8.0
12.0
12.0
7.0
7.0
-100
MIN.MAX. MAX.
13.0
77
100
6.5
5.0
0.0
8.0
6.0
0.0
13.5
6.5
15.0
15.0
9.0
9.0
5.0
5.0
Table 2-0030/2128VL
UNITS
5
Specifications ispLSI 2128VL
Internal Timing Parameters
1
Over Recommended Operating Conditions
PARAMETER
Inputs
t
io
t
din
GRP
t
grp
GLB
t
4ptbpc
t
4ptbpr
t
1ptxor
t
20ptxor
t
xoradj
t
gbp
t
gsu
t
gh
t
gco
t
gro
t
ptre
t
ptoe
t
ptck
ORP
t
orp
t
orpbp
Outputs
t
ob
t
sl
t
oen
t
odis
t
goe
Clocks
t
gy0
t
gy1/2
Global Reset
t
gr
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
2
20 Input Buffer Delay ns 21 Dedicated Input Delay ns
22 GRP Delay ns
23 4 Product Term Bypass Path Delay (Combinatorial) ns 24 4 Product Term Bypass Path Delay (Registered) ns 25 1 Product Term/XOR Path Delay ns 26 20 Product Term/XOR Path Delay ns 27 XOR Adjacent Path Delay ns 28 GLB Register Bypass Delay ns 29 GLB Register Setup Time before Clock 1.7 ns 30 GLB Register Hold Time after Clock 4.8 ns 31 GLB Register Clock to Output Delay ns 32 GLB Register Reset to Output Delay ns 33 GLB Product Term Reset to Register Delay ns 34 GLB Product Term Output Enable to I/O Cell Delay ns 35 GLB Product Term Clock Delay 2.8 ns
36 ORP Delay ns 37 ORP Bypass Delay ns
38 Output Buffer Delay ns 39 Output Slew Limited Delay Adder ns 40 I/O Cell OE to Output Enabled ns 41 I/O Cell OE to Output Disabled ns 42 Global Output Enable ns
43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 2.6 ns 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 2.8 ns
45 Global Reset to GLB
DESCRIPTION#
3
-135-150
MIN.
1.0
0.4
2.2
1.5
1.2
1.1
3.2
2.5
3.2
3.0
4.2
4.0
4.2
4.0
4.2
4.0
0.5
0.0
— —
— —
— —
— — — — —
— —
0.3
1.1
6.6
5.8
4.5
1.5
0.5
1.6
2.0
4.0
4.0
3.0
2.1
2.3
4.8
1.7
1.2
3.3
2.8
0.3
0.6
4.9
5.0
2.1
4.2
1.2
1.4
0.4
1.6
2.0
3.5
3.5
2.5
2.1
1.7
1.7
2.3
1.9
1.9
3.4
ns
-100
MIN.MAX.MIN. MAX. MAX.
0.9
2.7
1.8
5.2
4.7
6.2
6.2
6.2
1.0
— —
0.3
4.3
8.9
7.4
4.8
1.5
0.5
1.6
2.0
4.9
4.9
4.1
2.6
2.8
7.1
Table 2-0036/2128VL
UNITS
6
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