— 3.3-V & 5-V JEDEC-compliant operations
— JTAG (IEEE 1149.1) compliant for boundary scan testing
— 3.3-V & 5-V JTAG in-system programming
— PCI compliant (-5/-55/-6/-65/-7/-10/-12 speed grades)
— Safe for mixed supply voltage system designs
— Programmable pull-up or Bus-Friendly
— Hot-socketing
— Programmable security bit
— Individual output slew rate control
◆
Advanced E
◆
Lead-free package options
2
CMOS process provides high-performance, cost-effective solutions
2
CMOS 3.3-V & 5-V CPLD families
TM
TM
performance for guaranteed fixed timing
and refit feature
Industrial
PD
TM
inputs and I/Os
Lead-
Free
Package
Options
Available!
Publication# ISPM4A Rev: M
Amendment/ 0
Issue Date: September 2006
Page 2
Table 1. ispMACH 4A Device Features
3.3 V Devices
FeatureM4A3-32M4A3-64M4A3-96M4A3-128M4A3-192M4A3-256M4A3-384M4A3-512
Macrocells326496128192256384512
User I/O options3232/64486496128/160/192160/192160/192/256
(ns)5.05.55.55.56.05.56.57.5
t
PD
f
(MHz)182167167167160167154125
CNT
t
(ns)4.04.04.04.04.54.04.55.5
COS
(ns)3.03.53.53.53.53.53.55.0
t
SS
Static Power (mA)2025/52405585110/150149/155179
JTAG CompliantYesYesYesYesYesYesYesYes
PCI CompliantYesYesYesYesYesYesYesYes
5 V Devices
FeatureM4A5-32M4A5-64M4A5-96M4A5-128M4A5-192M4A5-256
Macrocells326496128192256
User I/O options3232486496128
(ns)5.05.55.55.56.06.5
t
PD
f
(MHz)182167167167160154
CNT
t
(ns)4.04.04.04.04.55.0
COS
(ns)3.03.53.53.53.53.5
t
SS
Static Power (mA)2025405574110
JTAG CompliantYesYesYesYesYesYes
PCI CompliantYesYesYesYesYesYes
2ispMACH 4A Family
Page 3
GENERAL DESCRIPTION
The ispMACH
Complex Programmable Logic Device (CPLD) solution of easy-to-use silicon products and software tools.
The overall benefits for users are a guaranteed and predictable CPLD solution, faster time-to-market,
greater flexibility and lower cost. The ispMACH 4A devices offer densities ranging from 32 to 512
macrocells with 100% utilization and 100% pin-out retention. The ispMACH 4A families offer 5-V (M4A5xxx) and 3.3-V (M4A3-xxx) operation.
ispMACH 4A products are 5-V or 3.3-V in-system programmable through the JTAG (IEEE Std. 1149.1)
interface. JTAG boundary scan testing also allows product testability on automated test equipment for
device connectivity.
All ispMACH 4A family members deliv er First-Time-Fit and easy system integration with pin-out retention
after any design change and refit. For both 3.3-V and 5-V operation, ispMACH 4A products can deliver
guaranteed fixed timing as fast as 5.0 ns t
using up to 20 product terms per output (Table 2).
™
4A family from Lattice offers an exceptionally flexible architecture and delivers a superior
and 182 MHz f
PD
through the SpeedLocking feature when
CNT
Table 2. ispMACH 4A Speed Grades
Speed Grade
Device
M4A3-32
M4A5-32
M4A3-64/32
M4A5-64/32
M4A3-64/64CC, IC, II
M4A3-96
M4A5-96
M4A3-128
M4A5-128
M4A3-192
M4A5-192
M4A3-256/128CCC, IC, II
M4A5-256/128CCC, II
M4A3-256/192
M4A3-256/160
M4A3-384CC, IC, II
M4A3-512CC, IC, II
-5-55-6-65-7-10-12-14
CC, IC, II
CC, IC, II
CC, IC, II
CC, IC, II
CC, IC, I I
CC, II
Note:
1. C = Commercial, I = Industrial
ispMACH 4A Family3
Page 4
The ispMACH 4A family offers 20 density-I/O combinations in Thin Quad Flat Pack (TQFP), Plastic
Quad Flat Pack (PQFP), Plastic Leaded Chip Carrier (PLCC), Ball Grid Array (BGA), fine-pitch BGA
(fpBGA), and chip-array BGA (caBGA) packages ranging from 44 to 388 pins (Table 3). It also offers I/O
safety features for mixed-voltage designs so that the 3.3-V devices can accept 5-V inputs, and 5-V devices
do not overdrive 3.3-V inputs. Additional features include Bus-Friendly inputs and I/Os, a programmable
power-down mode for extra power savings and individual output slew rate control for the highest speed
transition or for the lowest noise transition.
The fundamental architecture of ispMACH 4A devices (Figure 1) consists of multiple, optimized PAL
blocks interconnected by a central switch matrix. The central switch matrix allows comm unication between
P AL bloc ks and routes inputs to the PAL blocks. T ogether , the PAL blocks and central switch matrix allo w
the logic designer to create large designs in a single device instead of having to use multiple devices.
The key to being able to make effective use of these devices lies in the interconnect schemes. In the
ispMACH 4A architecture, the macrocells are flexibly coupled to the product terms through the logic
allocator, and the I/O pins are flexibly coupled to the macrocells due to the output switch matrix. In
addition, more input routing options are provided by the input switch matrix. These resources provide the
flexibility needed to fit designs efficiently.
PAL Block
®
Clock/Input
Pins
Note 3
Dedicated
Input Pins
Clock
Generator
33/
34/
36
Logic
Array
Input
Switch
Matrix
Central Switch Matrix
Logic
Allocator
with XOR
4
Output/
Buried
Macrocells
16
PAL Block
PAL Block
Note 2
I/O
1616
8
Note 1
Output Switch Matrix
16
I/O Cells
Pins
I/O
Pins
I/O
Pins
17466G-001
Figure 1. ispMACH 4A Block Diagram and PAL Block Structure
Notes:
1. 16 for ispMACH 4A devices with 1:1 macrocell-I/O cell ratio (see next page).
2. Block clocks do not go to I/O cells in M4A(3,5)-32/32.
3. M4A(3,5)-192, M4A(3,5)-256, M4A3-384, and M4A3-512 have dedicated clock pins which cannot be used as inputs and do not connect to the central switch
matrix.
ispMACH 4A Family5
Page 6
Table 4. Architectural Summary of ispMACH 4A devices
The Macrocell-I/O cell ratio is defined as the number of macrocells versus the number of I/O cells
internally in a PAL block (Table 4).
The central switch matrix takes all dedicated inputs and signals from the input switch matrices and routes
them as needed to the P AL blocks . F eedback signals that return to the same P AL block still must go through
the central switch matrix. This mechanism ensures that PAL blocks in ispMACH 4A devices comm unicate
with each other with consistent, predictable delays.
The central switch matrix makes a ispMACH 4A device more adv anced than simply several PAL devices on
a single chip. It allows the designer to think of the device not as a collection of blocks, but as a single
programmable device; the software partitions the design into PAL bloc ks through the central switch matrix
so that the designer does not have to be concerned with the internal architecture of the device.
Each PAL block consists of:
Product-term array
◆
◆
Logic allocator
Macrocells
◆
◆
Output switch matrix
◆
I/O cells
Input switch matrix
◆
◆
Clock generator
Notes:
1. M4A3-64/64 internal switch matrix functionality embedded in central switch matrix.
6ispMACH 4A Family
Page 7
Product-T erm Array
The product-term array consists of a number of product terms that form the basis of the logic being
implemented. The inputs to the AND gates come from the central switch matrix (Table 5), and are provided
in both true and complement forms for efficient logic implementation.
Table 5. PAL Block Inputs
DeviceNumber of Inputs to PAL Block
M4A3-32/32 and M4A5-32/32
M4A3-64/32 and M4A5-64/32
M4A3-64/64
M4A3-96/48 and M4A5-96/48
M4A3-128/64 and M4A5-128/64
M4A3-192/96 and M4A5-192/96
M4A3-256/128 and M4A5-256/128
M4A3-256/160 and M4A3-256/192
M4A3-384
M4A3-512
33
33
33
33
33
34
34
36
36
36
Logic Allocator
Within the logic allocator, product terms are allocated to macrocells in “product term clusters.” The
availability and distribution of product term clusters are automatically considered by the software as it fits
functions within a PAL block. The size of a product term cluster has been optimized to provide high
utilization of product terms, making complex functions using many product terms possible. Yet when few
product terms are used, there will be a minimal number of unused—or wasted—product terms left over.
The product term clusters available to each macrocell within a PAL block are shown in Tables 6 and 7.
Each product term cluster is associated with a macrocell. The size of a cluster depends on the configuration
of the associated macrocell. When the macrocell is used in synchronous mode
(Figure 2a), the basic cluster has 4 product terms. When the associated macrocell is used in asynchronous
mode (Figure 2b), the cluster has 2 product terms. Note that if the product term cluster is routed to a
different macrocell, the allocator configuration is not determined by the mode of the macrocell actually
being driven. The configuration is always set b y the mode of the macrocell that the cluster will drive if not
routed away, re gardless of the actual routing.
In addition, there is an extra product term that can either join the basic cluster to give an extended cluster,
or drive the second input of an exclusive-OR gate in the signal path. If included with the basic cluster, this
provides for up to 20 product terms on a synchronous function that uses four extended 5-product-term
clusters. A similar asynchronous function can have up to 18 product terms.
When the extra product term is used to extend the cluster, the value of the second XOR input can be
programmed as a 0 or a 1, giving polarity control. The possible configurations of the logic allocator are
shown in Figures 3 and 4.
ispMACH 4A Family7
Page 8
Table 6. Logic Allocator for All ispMACH 4A Devices (except M4A(3,5)-32/32)
Note that the configuration of the logic allocator has absolutely no impact on the speed of the signal. All
configurations have the same delay. This means that designers do not have to decide between optimizing
resources or speed; both can be optimized.
If not used in the cluster, the extra product ter m can act in conjunction with the basic cluster to provide
XOR logic for such functions as data comparison, or it can work with the D-,T-type flip-flop to provide
for J-K, and S-R register operation. In addition, if the basic cluster is routed to another macrocell, the extra
product term is still available for logic. In this case, the first X OR input will be a logic 0. This circuit has the
flexibility to route product ter ms elsewhere without giving up the use of the macrocell.
Product term clusters do not “wrap” around a PAL block. This means that the macrocells at the ends of
the block have fewer product terms available.
ispMACH 4A Family9
Page 10
Macrocell
The macrocell consists of a storage element, routing resources, a clock multiplexer, and initialization
control. The macrocell has two fundamental modes: synchronous and asynchronous (Figure 5). The mode
chosen only affects clocking and initialization in the macrocell.
Power-Up
Reset
PAL-Block
Initialization
Product Terms
Common PAL-block resource
Individual macrocell resources
From Logic Allocator
From
PAL-Clock
Generator
Block CLK0
Block CLK1
Block CLK2
Block CLK3
SWAP
APAR
D/T/L
a. Synchronous mode
To Output and Input
Switch Matrices
Q
17466G-009
Power-Up
Reset
Individual
Initialization
Product Term
SWAP
To Output and Input
From Logic
Allocator
From PAL-Block
Clock Generator
Individual Clock
Product Term
Block CLK0
Block CLK1
APAR
D/T/L
b. Asynchronous mode
Q
Switch Matrices
17466G-010
Figure 5. Macrocell
In either mode, a combinatorial path can be used. For combinatorial logic, the synchronous mode will
generally be used, since it provides more product terms in the allocator.
10ispMACH 4A Family
Page 11
The flip-flop can be configured as a D-type or T-type latch. J-K or S-R registers can be synthesized. The
primary flip-flop configurations are shown in Figure 6, although others are possible. Flip-flop functionality
is defined in Table 8. Note that a J-K latch is inadvisable as it will cause oscillation if both J and K inputs
are HIGH.
a. D-type with XOR
c. Latch with XOR
AP AR
DQ
AP AR
LQ
G
AP AR
DQ
b. D-type with programmable D polarity
AP AR
LQ
G
d. Latch with programmable D polarity
AP AR
TQ
e. T-type with programmable T polarity
g. Combinatorial with programmable polarity
Figure 6. Primary Macrocell Configurations
f. Combinatorial with XOR
17466G-011
ispMACH 4A Family11
Page 12
Table 8. Register/Latch Operation
0,1, ↓ (↑)
↑ (↓)
↑ (↓)
0, 1, ↓ (↑)
↑ (↓)
↑ (↓)
1(0)
0(1)
0(1)
1
Q+
Q
0
1
Q
Q
Q
Q
0
1
ConfigurationInput(s)CLK/LE
D-type Register
T-type Register
D-type Latch
Note:
1. Polarity of CLK/LE can be programmed
D=X
D=0
D=1
T=X
T=0
T=1
D=X
D=0
D=1
Although the macrocell shows only one input to the register, the X OR gate in the logic allocator allows the
D-, T-type register to emulate J-K, and S-R behavior. In this case, the available product ter ms are divided
between J and K (or S and R). When configured as J-K, S-R, or T-type , the extra product term must be used
on the XOR gate input for flip-flop emulation. In any register type, the polarity of the inputs can be
programmed.
The clock input to the flip-flop can select any of the four P AL block cloc ks in synchronous mode, with the
additional choice of either polarity of an individual product term clock in the asynchronous mode.
The initialization circuit depends on the mode. In synchronous mode (Figure 7), asynchronous reset and
preset are provided, each driven by a product ter m common to the entire PAL block.
A reset/preset swapping feature in each macrocell allows for reset and preset to be exchanged, providing
flexibility. In asynchronous mode (Figure 8), a single individual product term is provided for initialization.
It can be selected to control reset or preset.
Note that the reset/preset swapping selection feature effects power-up reset as well. The initialization
functionality of the f lip-flops is illustrated in Table 9. The macrocell sends its data to the output switch
matrix and the input switch matrix. The output switch matrix can route this data to an output if so desired.
The input switch matrix can send the signal back to the central switch matrix as feedback.
Note:
1. Transparent latch is unaffected by AR, AP
Table 9. Asynchronous Reset/Preset Operation
ARAPCLK/LE
00XSee Table 8
01X1
10X0
11X0
1
Q+
ispMACH 4A Family13
Page 14
Output Switch Matrix
The output switch matrix allows macrocells to be connected to any of several I/O cells within a P AL block.
This provides high flexibility in deter mining pinout and allows design changes to occur without effecting
pinout.
In ispMACH 4A devices with 2:1 Macrocell-I/O cell ratio, each PAL block has twice as many macrocells
as I/O cells. The ispMACH 4A output switch matrix allows for half of the macrocells to drive I/O cells
within a P AL block, in combinations according to Figure 9. Each I/O cell can choose from eight macrocells;
each macrocell has a choice of four I/O cells. The ispMACH 4A devices with 1:1 Macrocell-I/O cell ratio
allow each macrocell to drive one of eight I/O cells (Figure 9).
The I/O cell (Figures 10 and 11) simply consists of a programmable output enable, a feedback path, and
flip-flop (except ispMACH 4A devices with 1:1 macrocell-I/O cell ratio). An individual output enable
product term is provided for each I/O cell. The feedback signal drives the input switch matrix.
Individual
Output Enable
Product Term
From Output
Switch Matrix
To Input
Switch
Matrix
D/L
Q
Block CLK0
Block CLK1
Block CLK2
Block CLK3
Power-up reset
17466G-01717466G-018
Figure 10. I/O Cell for ispMACH 4A Devices with 2:1
Macrocell-I/O Cell Ratio
Figure 11. I/O Cell for ispMACH 4A Devices with 1:1
Individual
Output Enable
Product Term
From Output
Switch Matrix
To Input
Switch
Matrix
Macrocell-I/O Cell Ratio
The I/O cell (Figure 10) contains a flip-flop, which provides the capability for storing the input in a D-type
register or latch. The clock can be any of the PAL bloc k clocks. Both the direct and registered versions of
the input are sent to the input switch matrix. This allows for such functions as “time-domain-multiplex ed”
data comparison, where the first data value is stored, and then the second data value is put on the I/O pin
and compared with the previous stored value.
Note that the flip-flop used in the ispMACH 4A I/O cell is independent of the flip-flops in the macrocells.
It powers up to a logic low.
Zero-Hold-Time Input Register
The ispMACH 4A devices have a zero-hold-time (ZHT) fuse whic h controls the time delay associated with
loading data into all I/O cell registers and latches. When programmed, the ZHT fuse increases the data path
setup delays to input storage elements, matching equiv alent delays in the clock path. When the fuse is erased,
the setup time to the input storage element is minimized. This feature facilitates doing worst-case designs
for which data is loaded from sources which hav e low (or zero) minimum output propagation delays from
clock edges.
ispMACH 4A Family17
Page 18
Input Switch Matrix
The input switch matrix (Figures 12 and 13) optimizes routing of inputs to the central switch matrix.
Without the input switch matrix, each input and feedback signal has only one wa y to enter the central switch
matrix. The input switch matrix provides additional ways for these signals to enter the central switch matrix.
From Input Cell
Direct
From Macrocell 2
From Macrocell 1
Registered/Latched
From Macrocell
From I/O Pin
To Central Switch Matrix
17466G-00217466G-003
Figure 12. ispMACH 4A with 2:1 Macrocell-I/O Cell
Ratio - Input Switch Matrix
To Central Switch Matrix
Figure 13. ispMACH 4A with 1:1 Macrocell-I/O Cell
Ratio - Input Switch Matrix
18ispMACH 4A Family
Page 19
PAL Block Clock Generation
Each ispMACH 4A device has four clock pins that can also be used as inputs. These pins drive a clock
generator in each PAL block (Figure 14). The clock generator provides four clock signals that can be used
anywhere in the PAL block. These four PAL block clock signals can consist of a large number of
combinations of the true and complement edges of the global clock signals. Table 14 lists the possible
combinations.
GCLK0
GCLK1
GCLK2
GCLK3
Figure 14. PAL Block Clock Generator
1. M4A(3,5)-32/32 and M4A(3,5)-64/32 have only two clock pins, GCLK0 and GCLK1. GCLK2 is tied to GCLK0, and GCLK3 is tied to GCLK1.
Table 14. PAL Block Clock Combinations
Block CLK0 Block CLK1 Block CLK2 Block CLK3
GCLK0
GCLK1
GCLK0
GCLK1
X
X
X
X
GCLK1
GCLK1
GCLK0
GCLK0
X
X
X
X
Block CLK0
(GCLK0 or GCLK1)
Block CLK1
(GCLK1 or GCLK0)
Block CLK2
(GCLK2 or GCLK3)
Block CLK3
(GCLK3 or GCLK2)
1
1
X
X
X
X
GCLK2 (GCLK0)
GCLK3
(GCLK1)
GCLK2 (GCLK0)
GCLK3
(GCLK1)
17466G-004
X
X
X
X
GCLK3 (GCLK1)
GCLK3 (GCLK1)
(GCLK0)
GCLK2
GCLK2
(GCLK0)
Note:
1. Values in parentheses are for the M4A(3,5)-32/32 and M4A(3,5)-64/32.
This feature provides high flexibility for partitioning state machines and dual-phase clocks. It also allows
latches to be driven with either polarity of latch enable, and in a master-slave configuration.
ispMACH 4A Family19
Page 20
ispMACH 4A TIMING MODEL
The primary focus of the ispMACH 4A timing model is to accurately represent the timing in a ispMACH
4A device, and at the same time, be easy to understand. This model accurately describes all combinatorial
and registered paths through the device, making a distinction between internal feedback and external
feedback. A signal uses internal feedback when it is fed back into the switch matrix or block without ha ving
to go through the output buffer. The input register specifications are also reported as internal feedback.
When a signal is fed back into the switch matrix after having gone through the output buffer, it is using
external feedback.
The parameter, t
, is defined as the time it takes to go from feedback through the output buffer to the
BUF
I/O pad. If a signal goes to the internal feedback rather than to the I/O pad, the parameter designator is
followed by an “i”. By adding t
example, t
PD
= t
PDi
+ t
. A diagram representing the modularized ispMACH 4A timing model is shown
BUF
to this internal parameter, the external parameter is derived. For
BUF
in Figure 15. Refer to the application note entitled MACH 4 Timing and High Speed Design for a more detailed
discussion about the timing parameters.
(External Feedback)
(Internal Feedback)
COMB/DFF/TFF/
IN
BLK CLK
INPUT REG/
INPUT LATCH
t
SIRS
t
HIRS
t
SIL
t
HIL
t
SIRZ
t
HIRZ
t
SILZ
t
HILZ
t
PDILi
t
ICOSi
t
IGOSi
t
PDILZi
Q
Central
Switch
Matrix
LATCH/SR*/JK*
*emulated
t
t
SS(T)
PDi
t
PDLi
t
CO(S/A)i
t
GO(S/A)i
t
SRi
Q
t
SA(T)
t
H(S/A)
t
S(S/A)L
t
t
PL
H(S/A)L
t
SRR
S/R
t
BUF
t
SLW
t
EA
t
ER
OUT
17466G-025
Figure 15. ispMACH 4A Timing Model
SPEEDLOCKING FOR GUARANTEED FIXED TIMING
The ispMACH 4A architecture allows allocation of up to 20 product terms to an individual macrocell with
the assistance of an XOR gate without incur ring additional timing delays.
The design of the switch matrix and PAL blocks guarantee a fixed pin-to-pin delay that is independent of
the logic required by the design. Other competitive CPLDs incur serious timing delays as product terms
expand beyond their typical 4 or 5 product term limits. Speed and SpeedLocking combine to give designs
easy access to the performance required in today’s designs.
20ispMACH 4A Family
Page 21
IEEE 1149.1-COMPLIANT BOUNDARY SCAN TESTABILITY
All ispMACH 4A devices have boundary scan cells and are compliant to the IEEE 1149.1 standard. This
allows functional testing of the circuit board on which the device is mounted through a serial scan path that
can access all critical logic nodes. Internal registers are linked internally, allowing test data to be shifted in
and loaded directly onto test nodes, or test node data to be captured and shifted out for verification. In
addition, these devices can be linked into a board-level serial scan path for more complete board-level
testing.
IEEE 1149.1-COMPLIANT IN-SYSTEM PROGRAMMING
Programming devices in-system provides a number of significant benefits including: rapid prototyping,
lower inventor y levels, higher quality, and the ability to make in-field modifications. All ispMACH 4A
devices provide In-System Programming (ISP) capability through their Boundary ScanTest Access Ports.
This capability has been implemented in a manner that ensures that the port remains compliant to the IEEE
1149.1 standard. By using IEEE 1149.1 as the communication interface through which ISP is achieved,
customers get the benefit of a standard, well-defined interface.
ispMACH 4A devices can be programmed across the commercial temperature and voltage range. The PCbased ispVM™ software facilitates in-system programming of ispMACH 4A devices. ispVM takes the
JEDEC file output produced by the design implementation software, along with information about the
JTAG chain, and creates a set of vectors that are used to drive the JTAG chain. ispVM software can use
these vectors to drive a JTAG chain via the parallel port of a PC. Alternatively, ispVM software can output
files in formats understood by common automated test equipment. This equpment can then be used to
program ispMACH 4A devices during the testing of a circuit board.
PCI COMPLIANT
ispMACH 4A devices in the -5/-55/-6/-65/-7/-10/-12 speed grades are compliant with the PCI Local Bus
Specification version 2.1, published by the PCI Special Interest Group (SIG). The 5-V devices are fully PCI-
compliant. The 3.3-V devices are mostly compliant but do not meet the PCI condition to clamp the inputs
as they rise above V
because of their 5-V input tolerant feature.
CC
SAFE FOR MIXED SUPPLY VOLTAGE SYSTEM DESIGNS
Both the 3.3-V and 5-V VCC ispMACH 4A devices are safe for mixed supply voltage system designs. The
5-V devices will not overdrive 3.3-V devices above the output voltage of 3.3 V, while they acce pt inputs
from other 3.3-V devices. The 3.3-V device will accept inputs up to 5.5 V. Both the 5-V and 3.3-V versions
have the same high-speed performance and provide easy-to-use mixed-voltage design capability.
PULL UP OR BUS-FRIENDLY INPUTS AND I/Os
All ispMACH 4A devices hav e inputs and I/Os whic h feature the Bus-Friendly circuitry incorporating two
inverters in series which loop back to the input. This double inversion weakly holds the input at its last
driven logic state. While it is good design practice to tie unused pins to a known state , the Bus-Friendly input
structure pulls pins away from the input threshold voltage where noise can cause high-frequency switching.
At power-up, the Bus-Friendly latches are reset to a logic level “1.” For the circuit diagram, please refer to
the document entitled MACH Endurance Characteristics on the Lattice Data Book CD-ROM or Lattice web
site.
All ispMACH 4A devices have a programmable bit that configures all inputs and I/Os with either pull-up
or Bus-Friendly characteristics. If the device is configured in pull-up mode, all inputs and I/O pins are
ispMACH 4A Family21
Page 22
weakly pulled up. For the circuit diagram, please refer to the document entitled MACH Endurance
Characteristics on the Lattice Data Book CD-ROM or Lattice web site.
POWER MANAGEMENT
Each individual PAL block in ispMACH 4A devices features a programmable low-power mode, which
results in power savings of up to 50%. The signal speed paths in the low-power PAL block will be slower
than those in the non-low-power PAL block. This feature allows speed critical paths to r un at maximum
frequency while the rest of the signal paths operate in the low-power mode.
PROGRAMMABLE SLEW RATE
Each ispMACH 4A device I/O has an indi vidually programmable output slew rate control bit. Each output
can be individually configured for the higher speed transition (3 V/ns) or for the lower noise transition (1
V/ns). For high-speed designs with long, unterminated traces, the slow-slew rate will introduce fewer
reflections, less noise, and keep ground bounce to a minimum. For designs with short traces or well
terminated lines, the fast slew rate can be used to achieve the highest speed. The slew rate is adjusted
independent of power.
POWER-UP RESET/SET
All flip-flops power up to a known state for predictable system initialization. If a macrocell is configured to
SET on a signal from the control generator, then that macrocell will be SET during device power-up. If a
macrocell is configured to RESET on a signal from the control generator or is not configured for set/reset,
then that macrocell will RESET on power-up. To guarantee initialization values, the V
monotonic, and the clock must be inactive until the reset delay time has elapsed.
rise must be
CC
SECURITY BIT
A programmable security bit is provided on the ispMACH 4A devices as a deterrent to unauthorized
copying of the array configuration patterns. Once programmed, this bit defeats readback of the
programmed pattern by a device prog rammer, securing proprietary designs from competitors.
Programming and verification are also defeated by the security bit. The bit can only be reset by erasing the
entire device.
HOT SOCKETING
ispMACH 4A devices are well-suited for those applications that require hot socketing capability. Hot
socketing a device requires that the device, when pow ered down, can tolerate activ e signals on the I/Os and
inputs without being damaged. Additionally, it requires that the effects of the powered-down MACH
devices be minimal on active signals.
Latchup Current (TA = -40°C to +85°C) . . . . . . . . . .200 mA
Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect de vice
reliability.
CC
+ 0.5 V
Commercial (C) Devices
Ambient Temperature (TA)
Operating in Free Air. . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Supply Voltage (VCC)
with Respect to Ground. . . . . . . . . . . . . . +4.75 V to +5.25 V
Industrial (I) Devices
Ambient Temperature (TA)
Operating in Free Air. . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage (VCC)
with Respect to Ground. . . . . . . . . . . . . . . +4.50 V to +5.5 V
Operating ranges define those limits between which the functionality of the device is
guaranteed.
Output LOW VoltageIOL = 24 mA, VCC = Min, VIN = VIH or V
Input HIGH Voltage
Input LOW Voltage
Guaranteed Input Logical HIGH Voltage for all Inputs
(Note 2)
Guaranteed Input Logical LOW Voltage for all Inputs
(Note 2)
Input HIGH Leakage CurrentVIN = 5.25 V, VCC = Max (Note 3) 10μA
Input LOW Leakage CurrentVIN = 0 V, V
Off-State Output Leakage Current HIGHV
Off-State Output Leakage Current LOWV
Output Short-Circuit CurrentV
OUT
OUT
OUT
= Max (Note 3)–10μA
CC
= 5.25 V, VCC = Max, VIN = V
= 0 V, VCC = Max , VIN = V
= 0.5 V, VCC = Max (Note 4)–30–160mA
or V
IH
IL
or V
IH
IL
(Note 1)0.5V
IL
2.4V
3.33.6V
2.0V
0.8V
or VIL (Note 3)10μA
IH
or VIL (Note 3)–10μA
IH
Notes:
1. Total I
for one PAL block should not exceed 64 mA.
OL
2. These are absolute values with respect to device ground, and all overshoots due to system or tester noise are included.
3. I/O pin leakage is the worst case of I
IL
and I
(or IIH and I
OZL
OZH
).
4. Not more than one output should be shorted at a time and duration of the short-circuit should not exceed one second.
= 0.5 V has been chosen to avoid test problems caused by tester ground degradation.
Latchup Current (TA = -40°C to +85°C) . . . . . . . . . .200 mA
Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not implied. Expo-
Commercial (C) Devices
Ambient Temperature (TA)
Operating in Free Air. . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Supply Voltage (VCC)
with Respect to Ground. . . . . . . . . . . . . . . . +3.0 V to +3.6 V
Industrial (I) Devices
Ambient Temperature (TA)
Operating in Free Air. . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Supply Voltage (VCC)
with Respect to Ground. . . . . . . . . . . . . . . . +3.0 V to +3.6 V
Operating ranges define those limits between which the functionality of the device is
guaranteed.
sure to Absolute Maximum Ratings for extended periods may affect de vice
reliability.
Input capacitanceVIN=2.0 V3.3 V or 5 V, 25°C, 1 MHz6pF
Output capacitanceV
=2.0V3.3 V or 5 V, 25°C, 1 MHz8pF
OUT
Note:
1. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where this parameter may be affected.
40ispMACH 4A Family
Page 41
I
vs. FREQUENCY
CC
These curves represent the typical power consumption for a particular device at system frequency. The
selected “typical” pattern is a 16-bit up-down counter. This pattern fills the device and exercises every
macrocell. Maximum frequency shown uses internal feedback and a D-type register. Power/Speed are
optimized to obtain the highest counter frequency and the lowest power. The highest frequency (LSBs) is
placed in common P AL blocks , which are set to high power . The lowest frequency signals (MSBs) are placed
in a common PAL block and set to lowest power.
400
VCC = 5 V or 3.3 V, TA = 25º C
M4A-512/160
(mA)
CC
I
350
300
250
200
150
100
50
250
200
M4A-384/160
M4A-256/160
M4A-256/128
M4A-192/96
M4A-96/48
M4A-128/64
M4A-64/64
M4A-64/32
M4A-32/32
0
0
20
40
60
80
100
120
140
160
180
200
Frequency (MHz)
Figure 19. ispMACH 4A ICC Curves at High Speed Mode
VCC = 5 V or 3.3 V, TA = 25º C
M4A-512/160
M4A-384/160
M4A-256/160
(mA)
CC
I
150
100
50
M4A-256/128
M4A-192/96
M4A-96/48
M4A-128/64
M4A-64/64
M4A-64/32
M4A-32/32
0
0
20
40
60
80
Frequency (MHz)
100
120
140
160
180
200
Figure 20. ispMACH 4A ICC Curves at Low Power Mode
ispMACH 4A Family41
Page 42
44-PIN PLCC CONNECTION DIAGRAM (M4A(3,5)-32/32 AND M4A(3,5)-64/32)
T op V iew
44-Pin PLCC
A2
A1
A0
M4A(3,5)-32/32
A8
A9
A10
A11
M4A(3,5)-64/32
A2
I/O5
A1
I/O6
A0
I/O7
TDI
CLK0/I0
GND
TCK
B0
I/O8
B1
I/O9
B2
I/O10
B3
I/O11
M4A(3,5)-64/32
A3A4A5A6A7
A3A4A5A6A7
I/O4
I/O3
I/O2
I/O1
I/O0
3
I/O15
B7
2
22
1
I/O Cell
PAL Block
23
VCC
5
641
4
7
8
9
C7
10
11
12
13
14
15
16
17
19
20
I/O13
21
I/O14
1827
I/O12
B4B5B6
B7B6B5
D7D6D5
GND
VCC
I/O31
I/O30
43
44
42
25
24
26
GND
I/O16
I/O17
I/O18
C7C6C5C4C3
I/O29
40
28
I/O19
B4
D4
I/O28
39
38
37
36
35
34
33
32
31
30
29
I/O20
M4A(3,5)-64/32
I/O27
D3
I/O26
D2
I/O25
D1
I/O24
D0
TDO
GND
CLK1/I1
TMS
C0
I/O23
C1
I/O22
C2
I/O21
M4A(3,5)-64/32
B3
B2
B1
B0
M4A(3,5)-32/32
B8
B9
B10
PIN DESIGNATIONS
CLK/I= Clock or Input
GND = Ground
I/O= Input/Output
V
= Supply Voltage
CC
TDI= Test Data In
TCK = Test Clock
TMS = Test Mode Select
TDO = Test Data Out
A12
A13
A14
A15
B15
B14
B13
B12
B11
17466G-026
42ispMACH 4A Family
Page 43
44-PIN TQFP CONNECTION DIAGRAM (M4A(3,5)-32/32 AND M4A(3,5)-64/32)
Most ispMACH devices are dual-marked with both Commercial and Industrial grades. The Industrial speed grade is slower, i.e.,
M4A3-256/128-7YC-10YI
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local Lattice sales office to confir m
availability of specific valid combinations and to check on newly released combinations.