Monitor, Control, and Margin Multiple
Power Supplies
• Simultaneously monitors up to 12 power
supplies
• Provides up to 20 output control signals
• Provides up to eight analog outputs for
margining/trimming power supply voltages
• Programmable digital and analog circuitry
Power Supply Margin and Trim Functions
• Trim and margin up to eight power supplies
• Dynamic voltage control through I
• Four hardware selectable voltage profiles
• Independent Digital Closed-Loop Trim function
for each output
Embedded PLD for Sequence Control
• 48-macrocell CPLD implements both state
machines and combinatorial logic functions
Embedded Programmable Timers
• Four independent timers
• 32µs to 2 second intervals for timing sequences
Analog Input Monitoring
• 12 independent analog monitor inputs
• Differential inputs for remote ground sense
• Two programmable threshold comparators per
analog input
• Hardware window comparison
• 10-bit ADC for I
2
C monitoring
High-Voltage FET Drivers
• Power supply ramp up/down control
• Programmable current and voltage output
• Independently configurable for FET control or
digital output
2-Wire (I
• Comparator status monitor
• ADC readout
• Direct control of inputs and outputs
• Power sequence control
• Dynamic trimming/margining control
2
C/SMBus™ Compatible) Interface
2
C
Application Block Diagram
Primary
Supply
Primary
Supply
Primary
Supply
Primary
Supply
Primary
Supply
3.3V
2.5V
1.8V
POL#1
POL#N
Power Supply
Margin/Trim
Control Block
ADC
12 Analog Inputs
and Voltage Monitors
ispPAC-POWR1220AT8
8 Analog
Trim
Outputs
4 Timers
n
igraM/
m
ir
T
Enables
16 Digital
Outputs
48 Macrocells
6 Digital
Inputs
Other Control/Supervisory
Signals
4 MOSFET
Drivers
CPLD
83 Inputs
2
C
I
Interface
I
Bus
2
Voltage
C
itry
u
Other Board Circ
Monitoring
CPU
Digital Monitoring
Description
Lattice’s Power Manager II ispPAC-POWR1220AT8 is a
general-purpose power-supply monitor, sequence and
margin controller, incorporating both in-system programmable logic and in-system programmable analog
functions implemented in non-volatile E
nology. The ispPAC-POWR1220AT8 device provides 12
independent analog input channels to monitor up to 12
power supply test points. Each of these input channels
offers a differential input to support remote ground
sensing, and has two independently programmable
comparators to support both high/low and in-bounds/
out-of-bounds (window-compare) monitor functions. Six
general-purpose digital inputs are also provided for miscellaneous control functions.
The ispPAC-POWR1220AT8 provides 20 open-drain
digital outputs that can be used for controlling DC-DC
converters, low-drop-out regulators (LDOs) and optocouplers, as well as for supervisory and general-purpose logic interface functions. Four of these outputs
1
DS1015_01.4
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
(HVOUT1-HVOUT4) may be configured as high-voltage MOSFET drivers. In high-voltage mode these outputs can
provide up to 10V for driving the gates of n-channel MOSFETs so that they can be used as high-side power
switches controlling the supplies with a programmable ramp rate for both ramp up and ramp down.
The ispPAC-POWR1220AT8 incorporates a 48-macrocell CPLD that can be used to implement complex state
machine sequencing for the control of multiple power supplies as well as combinatorial logic functions. The status
of all of the comparators on the analog input channels as well as the general purpose digital inputs are used as
inputs by the CPLD array, and all digital outputs may be controlled by the CPLD. Four independently programmable
timers can create delays and time-outs ranging from 32µs to 2 seconds. The CPLD is programmed using LogiBuilder™, an easy-to-learn language integrated into the PAC-Designer
monitor the status of any of the analog input channel comparators or the digital inputs.
In addition to the sequence control functions, the ispPAC-POWR1220AT8 incorporates eight DACs for generating
trimming voltage to control the output voltage of a DC-DC converter. The trimming voltage can be set to four hardware selectable preset values (voltage profiles) or can be dynamically loaded in to the DAC through the I
Additionally, each power supply output voltage can be maintained typically within 0.5% tolerance across various
load conditions using the Digital Closed Loop Control mode. The operating voltage profile can either be selected
using external hardware pins or through the PLD outputs.
The on-chip 10-bit A/D converter can both be used to monitor the V
implementing digital closed loop mode for maintaining the output voltage of all power supplies controlled by the
monitoring and trimming section of the ispPAC-POWR1220AT8 device.
2
The I
C bus/SMBus interface allows an external microcontroller to measure the voltages connected to the V
inputs, read back the status of each of the V
comparator and PLD outputs, control logic signals IN2 to IN5, con-
MON
trol the output pins, and load the DACs for the generation of the trimming voltage of the external DC-DC converter.
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Pin Descriptions
NumberNamePin TypeVoltage RangeDescription
89VPS0Digital InputVCCDTrim Select Input 0 Registered by MCLK
90VPS1Digital InputVCCDTrim Select Input 1 Registered by MCLK
97IN1
1IN2
2IN3
4IN4
6IN5
7IN6
2
3
3
3
3
3
Digital InputVCCINP
Digital InputVCCINP
Digital InputVCCINP
Digital InputVCCINP
Digital InputVCCINP
Digital InputVCCINP
47VMON1Analog Input-0.3V to 5.75V
46VMON1GSAnalog Input-0.2V to 0.3V
50VMON2Analog Input-0.3V to 5.75V
48VMON2GSAnalog Input-0.2V to 0.3V
52VMON3Analog Input-0.3V to 5.75V
51VMON3GSAnalog Input-0.2V to 0.3V
54VMON4Analog Input-0.3V to 5.75V
53VMON4GSAnalog Input-0.2V to 0.3V
56VMON5Analog Input-0.3V to 5.75V
55VMON5GSAnalog Input-0.2V to 0.3V
58VMON6Analog Input-0.3V to 5.75V
57VMON6GSAnalog Input-0.2V to 0.3V
62VMON7Analog Input-0.3V to 5.75V
61VMON7GSAnalog Input-0.2V to 0.3V
64VMON8Analog Input-0.3V to 5.75V
63VMON8GSAnalog Input-0.2V to 0.3V
66VMON9Analog Input-0.3V to 5.75V
65VMON9GSAnalog Input-0.2V to 0.3V
68VMON10Analog Input-0.3V to 5.75V
67VMON10GS Analog Input-0.2V to 0.3V
70VMON11Analog Input-0.3V to 5.75V
69VMON11GS Analog Input-0.2V to 0.3V
72VMON12Analog Input-0.3V to 5.75V
71VMON12GS Analog Input-0.2V to 0.3V
3, 22, 36,
43, 88, 98
45, 87GNDA
13, 38, 94 VCCD
60VCCA
GNDD
8
8
7
7
GroundGroundDigital Ground
GroundGround Analog Ground
Power2.8V to 3.96VCore VCC, Main Power Supply
Power2.8V to 3.96VAnalog Power Supply
5VCCINPPower2.25V to 3.6VVCC for IN[1:6] Inputs
33VCCJPower2.25V to 3.6VVCC for JTAG Logic Interface Pins
39VCCPROGPower3.0V to 3.6V
6
0V to 10VOpen-Drain Output 1
12.5µA to 100µA Source
100µA to 3000µA Sink
86HVOUT1
Open Drain Output
Current Source/Sink
1
1
1
1
1
1
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
4
5
PLD Logic Input 1 Registered by MCLK
PLD Logic Input 2 Registered by MCLK
PLD Logic Input 3 Registered by MCLK
PLD Logic Input 4 Registered by MCLK
PLD Logic Input 5 Registered by MCLK
PLD Logic Input 6 Registered by MCLK
Voltage Monitor 1 Input
Voltage Monitor 1 Ground Sense
Voltage Monitor 2 Input
Voltage Monitor 2 Ground Sense
Voltage Monitor 3 Input
Voltage Monitor 3 Ground Sense
Voltage Monitor 4 Input
Voltage Monitor 4 Ground Sense
Voltage Monitor 5 Input
Voltage Monitor 5 Ground Sense
Voltage Monitor 6 Input
Voltage Monitor 6 Ground Sense
Voltage Monitor 7 Input
Voltage Monitor 7 Ground Sense
Voltage Monitor 8 Input
Voltage Monitor 8 Ground Sense
Voltage Monitor 9 Input
Voltage Monitor 9 Ground Sense
Voltage Monitor 10 Input
Voltage Monitor 10 Ground Sense
Voltage Monitor 11 Input
Voltage Monitor 11 Ground Sense
Voltage Monitor 12 Input
Voltage Monitor 12 Ground Sense
VCC for E
Not Powered by V
2
Programming when the Device is
CCD
or V
CCA
High-voltage FET Gate Driver 1
3
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Pin Descriptions (Cont.)
NumberNamePin TypeVoltage RangeDescription
Open Drain Output
85HVOUT2
Current Source/Sink
Open Drain Output
42HVOUT3
Current Source/Sink
Open Drain Output
40HVOUT4
Current Source/Sink
8OUT5_SMBA Open Drain Output
9OUT6Open Drain Output
10OUT7Open Drain Output
11OUT8Open Drain Output
12OUT9Open Drain Output
14OUT10Open Drain Output
15OUT11Open Drain Output
16OUT12Open Drain Output
17OUT13Open Drain Output
18OUT14Open Drain Output
19OUT15Open Drain Output
20OUT16Open Drain Output
21OUT17Open Drain Output
23OUT18Open Drain Output
24OUT19Open Drain Output
25OUT20Open Drain Output
84TRIM1Analog Output
83TRIM2Analog Output
82TRIM3Analog Output
80TRIM4Analog Output
79TRIM5Analog Output
75TRIM6Analog Output
74TRIM7Analog Output
6
0V to 10VOpen-Drain Output 2
12.5µA to 100µA Source
100µA to 3000µA Sink
6
0V to 10VOpen-Drain Output 3
12.5µA to 100µA Source
100µA to 3000µA Sink
6
0V to 10VOpen-Drain Output 4
12.5µA to 100µA Source
100µA to 3000µA Sink
6
0V to 5.5V
6
0V to 5.5VOpen-Drain Output 6
6
0V to 5.5VOpen-Drain Output 7
6
0V to 5.5VOpen-Drain Output 8
6
0V to 5.5VOpen-Drain Output 9
6
0V to 5.5VOpen-Drain Output 10
6
0V to 5.5VOpen-Drain Output 11
6
0V to 5.5VOpen-Drain Output 12
6
0V to 5.5VOpen-Drain Output 13
6
0V to 5.5VOpen-Drain Output 14
6
0V to 5.5VOpen-Drain Output 15
6
0V to 5.5VOpen-Drain Output 16
6
0V to 5.5VOpen-Drain Output 17
6
0V to 5.5VOpen-Drain Output 18
6
0V to 5.5VOpen-Drain Output 19
6
0V to 5.5VOpen-Drain Output 20
High-voltage FET Gate Driver 2
High-voltage FET Gate Driver 3
High-voltage FET Gate Driver 4
Open-Drain Output 5, (SMBUS Alert Active
Low)
-320mV to +320mV
from Programmable
Trim DAC Output 1
DAC Offset
-320mV to +320mV
from Programmable
Trim DAC Output 2
DAC Offset
-320mV to +320mV
from Programmable
Trim DAC Output 3
DAC Offset
-320mV to +320mV
from Programmable
Trim DAC Output 4
DAC Offset
-320mV to +320mV
from Programmable
Trim DAC Output 5
DAC Offset
-320mV to +320mV
from Programmable
Trim DAC Output 6
DAC Offset
-320mV to +320mV
from Programmable
Trim DAC Output 7
DAC Offset
4
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Pin Descriptions (Cont.)
NumberNamePin TypeVoltage RangeDescription
73TRIM8Analog Output
91RESETb
9
Digital I/O0V to 3.96VDevice Reset (Active Low)
95PLDCLKDigital Output0V to 3.96V
96MCLKDigital I/O0V to 3.96V8MHz Clock I/O (Tristate), CMOS Drive
34TDODigital Output0V to 5.5VJTAG Test Data Out
37TCKDigital Input0V to 5.5VJTAG Test Clock Input
28TMSDigital Input0V to 5.5VJTAG Test Mode Select
31TDIDigital Input0V to 5.5VJTAG Test Data In, TDISEL pin = 1
30ATDIDigital Input0V to 5.5VJTAG Test Data In (Alternate), TDISEL Pin = 0
32TDISELDigital Input0V to 5.5VSelect TDI/ATDI Input
92SCLDigital Input0V to 5.5VI
93SDADigital I/O0V to 5.5VI
44, 59RESERVEDReserved - Do Not Connect
26, 27, 29,
35, 41, 49,
76, 77, 78,
NCNo Internal Connection
81, 99, 100
1. [IN1...IN6] are inputs to the PLD. The thresholds for these pins are referenced by the voltage on VCCINP.
2. IN1 pin can also be controlled through JTAG interface.
3. [IN2..IN6] can also be controlled through I
4. The VMON inputs can be biased independently from VCCA. Unused VMONs should be tied to GNDD.
5. The VMONGS inputs are the ground sense line for each given VMON pin. The VMON input pins along with the VMONGS ground sense
pins implement a differential pair for each voltage monitor to allow remote sense at the load. VMONGS lines must be connected and are
not to exceed -0.2V - +0.3V in reference to the GNDA pin.
6. Open-drain outputs require an external pull-up resistor to a supply.
7. VCCD and VCCA pins must be connected together on the circuit board.
8. GNDA and GNDD pins must be connected together on the circuit board.
9. The RESETb pin should only
be used for cascading two or more ispPAC-POWR1220AT8 devices.
2
C/SMBus interface.
-320mV to +320mV
from Programmable
DAC Offset
Trim DAC Output 8
250kHz PLD Clock Output (Tristate), CMOS
Output
2
C Serial Clock Input
2
C Serial Data, Bi-directional Pin
5
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Absolute Maximum Ratings
Absolute maximum ratings are shown in the table below. Stresses beyond those listed may cause permanent damage to the device. Functional operation of the device at these or any other conditions beyond those indicated in the
recommended operating conditions of this specification is not implied.
SymbolParameterConditionsMin.Max.Units
V
CCD
V
CCA
V
CCINP
V
CCJ
V
CCPROG
V
IN
V
MON+
V
MONGS
V
TRI
I
SINKMAXTOTAL
T
S
T
A
Core supply-0.54.5V
Analog supply-0.54.5V
Digital input supply (IN[1:6])-0.56V
JTAG logic supply-0.56V
2
E
programming supply-0.54V
Digital input voltage (all digital I/O pins)-0.56V
V
input voltage-0.56V
MON
V
input voltage ground sense-0.56V
MON
Voltage applied to tri-stated pins
HVOUT[1:4]-0.511V
OUT[5:20]-0.56V
Maximum sink current on any output23mA
Storage temperature-65150
Ambient temperature-65125
o
C
o
C
Recommended Operating Conditions
SymbolParameterConditionsMin.Max.Units
V
CCD,
V
CCINP
V
CCJ
V
CCPROG
V
IN
V
MON
V
MONGS
V
CCA
Core supply voltage at pin2.83.96V
Digital input supply for IN[1:6] at pin2.255.5V
JTAG logic supply voltage at pin2.253.6V
E2 programming supply at pinDuring E2 programming3.03.6V
Input voltage at digital input pins-0.35.5V
Input voltage at V
Input voltage at V
pins-0.35.9V
MON
pins-0.20.3V
MONGS
OUT[5:20] pins-0.35.5V
V
OUT
T
APROG
T
A
Open-drain output voltage
Ambient temperature during
programming
HVOUT[1:4] pins in opendrain mode
-0.310.4V
-4085
Ambient temperaturePower applied-4085
Analog Specifications
SymbolParameterConditionsMin.Typ.Max.Units
1
I
CC
I
CCINP
I
CCJ
I
CCPROG
1. Includes currents on V
Supply current40mA
Supply current5mA
Supply current1mA
Supply currentDuring programming cycle40mA
CCD
and V
CCA
supplies.
o
C
o
C
6
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Voltage Monitors
SymbolParameterConditionsMin.Typ.Max.Units
R
IN
C
IN
V
RangeProgrammable trip-point range0.0755.734V
MON
SenseNear-ground sense threshold707580mV
V
Z
AccuracyAbsolute accuracy of any trip-point
V
MON
HYST
Input resistance556575kΩ
Input capacitance8pF
1
Hysteresis of any trip-point (relative to
setting)
0.20.7%
1%
CMRCommon mode rejection60dB
1. Guaranteed by characterization across V
range, operating temperature, process.
CCA
High Voltage FET Drivers
SymbolParameterConditionsMin.Typ.Max.Units
10V setting9.61010.4
V
PP
I
OUTSRC
I
OUTSINK
Gate driver output voltage
Gate driver source current
(HIGH state)
Gate driver sink current
(LOW state)
6V setting5.866.2
12.5
Four settings in
software
25
50
100
FAST OFF mode20003000
100
Controlled ramp
settings
250
500
V8V setting7.788.3
µA
µA
7
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Margin/Trim DAC Output Characteristics
SymbolParameterConditionsMinTypMaxUnits
Resolution8(7+sign)bits
FSRFull scale range+/-320mV
LSBLSB step size2.5mV
I
OUT
BPZ
TS
C_LOADMaximum load capacitance50pF
T
UPDATEM
TOSE
1. To 1% of set value with 50pf load connected to trim pins.
2. Total time required to update a single TRIMx output value by setting the associated DAC through the I2C port.
3. This is the total resultant error in the trimmed power supply output voltage referred to any DAC code due to the DAC’s INL, DNL, gain, output impedance, offset error and bipolar offset error across the industrial temperature range and the ispPAC-POWR1200AT8 operating V
and V
CCD
Output source/sink current-200200µA
Offset 10.6
Bipolar zero output voltage
(code=80h)
Offset 20.8
Offset 31.0
Offset 41.25
DAC code changed
TrimCell output voltage settling
1
time
Update time through I2C port
Total open loop supply voltage
3
error
ranges.
from 80H to FFH or
80H to 00H
Single DAC code
change
2
MCLK = 8MHz260µs
256µs
Full scale DAC corresponds to ±5% supply
-1%+1%V/V
voltage variation
2.5ms
V
CCA
ADC Characteristics
SymbolParameterConditionsMin.Typ.Max.Units
ADC Resolution 10 Bits
T
CONVERT
V
IN
ADC Step Size LSB
EattenuatorError Due to AttenuatorProgrammable Attenuator = 3+/- 0.1%
1. Maximum voltage is limited by V
ADC Error Budget Across Entire Operating Temperature Range
SymbolParameterConditionsMin.Typ.Max.Units
TADC Error
1. Total error, guaranteed by characterization, includes INL, DNL, Gain, Offset, and PSR specs of the ADC.
Measurement Range 0 - 2.048V, VMONxGS > -200mV, Attenuator =1
-8+/-48mV
+/-6 mV
+/-10 mV
V
8
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Power-On Reset
SymbolParameterConditionsMin.Typ.Max.Units
T
GOOD
V
TL
V
TH
V
T
T
POR
C
L
1. Corresponds to VCCA and VCCD supply voltages.
Power-on reset to valid VMON comparator
output
Threshold below which RESETb is LOW
Threshold above which RESETb is HIGH
Threshold above which RESETb is valid
Minimum duration dropout required to trigger
RESETb
Capacitive load on RESETb for master/slave
operation
1
1
1
2.5ms
2.3V
2.7V
0.8V
15µs
200pF
AC/Transient Characteristics
Over Recommended Operating Conditions
SymbolParameterConditionsMin.Typ.Max.Units
Voltage Monitors
t
PD16
t
PD64
Propagation delay input to
output glitch filter OFF
Propagation delay input to
output glitch filter ON
Oscillators
f
CLK
f
CLKEXT
f
PLDCLK
Internal master clock
frequency (MCLK)
Externally applied master
clock (MCLK)
PLDCLK output frequencyf
Timers
Timeout Range
Resolution
Range of programmable
timers (128 steps)
Spacing between available
adjacent timer intervals
AccuracyTimer accuracyf
7.688.4MHz
7.28.8MHz
= 8MHz250kHz
CLK
f
= 8MHz0.0321966ms
CLK
= 8MHz-6.67-12.5%
CLK
16µs
64µs
13%
9
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Digital Specifications
Over Recommended Operating Conditions
SymbolParameterConditionsMin.Typ.Max.Units
I
IL,IIH
I
OH-HVOUT
I
PU
V
IL
V
IH
V
OL
V
OH
I
SINKTOTAL
1. VPS[0:1], SCL, SDA referenced to V
Input leakage, no pull-up/pull-down+/-10µA
HVOUT[1:4] in open
Output leakage current
drain mode and pulled
3560µA
up to 10V
Input pull-up current (TMS, TDI,
TDISEL, ATDI, MCLK)
70µA
VPS[0:1], TDI, TMS,
ATDI, TDISEL, 3.3V
0.8
supply
Voltage input, logic low
1
VPS[0:1], TDI, TMS,
ATDI, TDISEL, 2.5V
0.7
V
supply
SCL, SDA30% V
IN[1:6]30% V
CCD
CCINP
VPS[0:1], TDI, TMS,
ATDI, TDISEL, 3.3V
2.0
supply
Voltage input, logic high
1
VPS[0:1], TDI, TMS,
ATDI, TDISEL, 2.5V
1.7
V
supply
HVOUT[1:4] (open drain mode), I
TDO,MCLK,PLDCLKI
TDO, MCLK, PLDCLKI
SCL, SDA70% V
IN[1:6]70% V
= 10mA0.8
SINK
= 20mA0.8
SINK
= 4mA0.4
SINK
= 4mAV
SRC
CCD
CCINP
V
CCD
V
CCINP
- 0.4V
CCD
VOUT[5:20]I
All digital outputs130mA
; IN[1:6] referenced to V
CCD
; TDO, TDI, TMS, ATDI, TDISEL referenced to V
CCINP
CCJ
.
10
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
I2C Port Characteristics
100KHz400KHz
SymbolDefinition
F
I2C
T
SU;STA
T
HD;STA
T
SU;DAT
T
SU;STO
T
HD;DAT
T
LOW
T
HIGH
T
F
T
R
T
TIMEOUT
T
POR
T
BUF
1. If F
is less than 50kHz, then the ADC DONE status bit is not guaranteed to be set after a valid conversion request is completed. In this
I2C
case, waiting for the T
readout. When F
I2C clock/data rate100
After start4.70.6us
After start40.6us
Data setup250100ns
Stop setup40.6us
Data hold; SCL= Vih_min = 2.1V0.33.450.30.9us
Clock low period4.71.3us
Clock high period40.6us
Fall time; 2.25V to 0.65V 300 300ns
Rise time; 0.65V to 2.25V 1000 300ns
Detect clock low timeout25352535ms
Device must be operational after power-on reset500500ms
Bus free time between stop and start condition4.71.3us
CONVERT
is greater than 50kHz, ADC conversion complete is ensured by waiting for the DONE status bit.
I2C
minimum time after a convert request is made is the only way to guarantee a valid conversion is ready for
1
400
UnitsMin.Max.Min.Max.
1
KHz
11
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Timing for JTAG Operations
SymbolParameterConditionsMin.Typ.Max.Units
t
ISPEN
t
ISPDIS
t
HVDIS
t
HVDIS
t
CEN
t
CDIS
t
SU1
t
H
t
CKH
t
CKL
f
MAX
t
CO
t
PWV
t
PWP
Figure 2. Erase (User Erase or Erase All) Timing Diagram
Program enable delay time10——µs
Program disable delay time30——µs
High voltage discharge time, program30——µs
High voltage discharge time, erase200——µs
Falling edge of TCK to TDO active——15ns
Falling edge of TCK to TDO disable——15ns
Setup time5——ns
Hold time10——ns
TCK clock pulse width, high20——ns
TCK clock pulse width, low20——ns
Maximum TCK clock frequency——25MHz
Falling edge of TCK to valid output——15ns
Verify pulse width30——µs
Programming pulse width20——ms
VIH
TMS
VIL
t
SU1
VIH
TCK
VIL
Update-IR Run-Test/Idle (Erase) Select-DR Scan
State
t
t
SU1
H
t
CKH tGKL
t
H
Figure 3. Programming Timing Diagram
VIH
TMS
VIL
TCK
State
t
SU1
VIH
VIL
Update-IRRun-Test/Idle (Program)Select-DR Scan
t
t
SU1
H
t
t
CKL
CKH
CKH
t
SU1
t
SU2
t
t
SU1
H
t
CKL
t
H
t
CKH
t
H
t
CKH
t
SU1
t
H
t
H
t
CKH
t
SU1
t
PWP
t
t
SU1
Instruction, then clock to the Run-Test/Idle state
Clock to Shift-IR state and shift in the Discharge
t
H
CKH
t
t
SU1
H
t
t
CKH
GKL
Run-Test/Idle (Discharge)
t
SU1
t
H
t
CKH
Specified by the Data Sheet
t
Update-IR
Clock to Shift-IR state and shift in the next
Instruction, which will stop the discharge process
12
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Figure 4. Verify Timing Diagram
VIH
TMS
VIL
t
H
t
CKH
TCK
VIH
VIL
t
t
SU1
t
H
SU1
t
t
CKH
CKL
t
H
t
SU1
t
PWV
t
H
t
CKH
t
SU1
t
t
H
SU1
t
t
CKH
CKL
State
Update-IRRun-Test/Idle (Program)Select-DR Scan
Update-IR
Clock to Shift-IR state and shift in the next Instruction
Figure 5. Discharge Timing Diagram
t
(Actual)
t
SU1
Clock to Shift-IR state and shift in the Verify
Instruction, then clock to the Run-Test/Idle state
HVDIS
t
t
H
SU1
t
t
CKH
CKL
Run-Test/Idle (Verify)
t
H
t
CKH
Specified by the Data Sheet
t
SU1
t
PWV
Actual
t
PWV
t
H
t
CKH
TMS
TCK
State
VIH
VIL
t
H
VIH
VIL
t
t
SU1
t
H
SU1
t
CKH tCKL
Update-IR Run-Test/Idle (Erase or Program)
t
SU1
t
PWP
t
H
t
CKH
Select-DR Scan
Theory of Operation
Analog Monitor Inputs
The ispPAC-POWR1220AT8 provides 12 independently programmable voltage monitor input circuits as shown in
Figure 6. Two individually programmable trip-point comparators are connected to an analog monitoring input. Each
comparator reference has 368 programmable trip points over the range of 0.664V to 5.734V. Additionally, a 75mV
‘zero-detect’ threshold is selectable which allows the voltage monitors to determine if a monitored signal has
dropped to ground level. This feature is especially useful for determining if a power supply’s output has decayed to
a substantially inactive condition after it has been switched off.
13
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Figure 6. ispPAC-POWR1220AT8 Voltage Monitors
ispPAC-POWR1220AT8
To ADC
Comp A/Window
Select
Window Control
MUX
Glitch
Filter
Glitch
Filter
Filtering
VMONxA
Logic
Signal
VMONxB
Logic
Signal
VMONx Status
I2C Interface
Unit
PLD
Array
VMONx
VMONxGS
Differential
Input Buffer x
Trip Point A
Trip Point B
Comp A
+
–
Comp B
+
–
Analog Input
Figure 6 shows the functional block diagram of one of the 12 voltage monitor inputs - ‘x’ (where x = 1...12). Each
voltage monitor can be divided into three sections: Analog Input, Window Control, and Filtering. The first section
provides a differential input buffer to monitor the power supply voltage through VMONx+ (to sense the positive ter-
minal of the supply) and VMONxGS (to sense the power supply ground). Differential voltage sensing minimizes
inaccuracies in voltage measurement with ADC and monitor thresholds due to the potential difference between the
ispPAC-POWR1220AT8 device ground and the ground potential at the sensed node on the circuit board.
The voltage output of the differential input buffer is monitored by two individually programmable trip-point comparators, shown as CompA and CompB. Table 1 shows all 368 trip points spanning the range 0.664V to 5.734V to
which a comparator’s threshold can be set.
Each comparator outputs a HIGH signal to the PLD array if the voltage at its positive terminal is greater than its programmed trip point setting, otherwise it outputs a LOW signal.
A hysteresis of approximately 1% of the setpoint is provided by the comparators to reduce false triggering as a
result of input noise. The hysteresis provided by the voltage monitor is a function of the input divider setting. Table 3
lists the typical hysteresis versus voltage monitor trip-point.
AGOOD Logic Signal
All the VMON comparators auto-calibrate immediately after a power-on reset event. During this time, the digital
glitch filters are also initialized. This process completion is signalled by an internally generated logic signal:
AGOOD. All logic using the VMON comparator logic signals must wait for the AGOOD signal to become active.
Programmable Over-Voltage and Under-Voltage Thresholds
Figure 7 (a) shows the power supply ramp-up and ramp-down voltage waveforms. Because of hysteresis, the comparator outputs change state at different thresholds depending on the direction of excursion of the monitored power
supply.
14
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Figure 7. (a) Power Supply Voltage Ramp-up and Ramp-down Waveform and the Resulting Comparator
Output, (b) Corresponding to Upper and Lower Trip Points
UTP
LTP
(a)
Monitored Power Supply Votlage
(b)
Comparator Logic Output
During power supply ramp-up the comparator output changes from logic 0 to 1 when the power supply voltage
crosses the upper trip point (UTP). During ramp down the comparator output changes from logic state 1 to 0 when
the power supply voltage crosses the lower trip point (LTP). To monitor for over voltage fault conditions, the UTP
should be used. To monitor under-voltage fault conditions, the LTP should be used.
Tables 1 and 2 show both the under-voltage and over-voltage trip points, which are automatically selected in software depending on whether the user is monitoring for an over-voltage condition or an under-voltage condition.
15
Lattice SemiconductorispPAC-POWR1220AT8 Data Sheet
Table 1. Trip Point Table Used For Over-Voltage Detection