• ARCHITECTURE FEATURES
— Enhanced Pin-Locking Architecture with Single-
Level Global Routing Pool and SuperWIDE GLBs
— Wrap Around Product Term Sharing Array Supports
up to 35 Product Terms Per Macrocell
— Macrocells Support Concurrent Combinatorial and
Registered Functions
— Macrocell Registers Feature Multiple Control
Options Including Set, Reset and Clock Enable
— Four Dedicated Clock Input Pins Plus Macrocell
Product Term Clocks
— Slew and Skew Programmable I/O (SASPI/O™)
Supports Programmable Bus Hold, Pull-up, Open
Drain and Slew and Skew Rate Options
— Six Global Output Enable Terms, Two Global OE
Pins and One Product Term OE per Macrocell
• ispDesignEXPERT™ – LOGIC COMPILER AND COMPLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
Functional Block Diagram
Generic
Input Bus
Generic
Input Bus
Logic Block
Logic Block
Logic Block
Logic Block
Input Bus
Generic
Global Routing Pool
(GRP)
Generic
Input Bus
Input Bus
Generic
Logic Block
Generic
Logic Block
Input Bus
Boundary
Scan
Interface
Logic Block
Generic
Input Bus
Logic Block
Generic
Input Bus
ispLSI 5000V Description
The ispLSI 5000V Family of In-System Programmable
High Density Logic Devices is based on Generic Logic
Blocks (GLBs) of 32 registered macrocells and a single
Global Routing Pool (GRP) structure interconnecting the
GLBs.
Outputs from the GLBs drive the Global Routing Pool
(GRP) between the GLBs. Switching resources are provided to allow signals in the Global Routing Pool to drive
any or all the GLBs in the device. This mechanism allows
fast, efficient connections across the entire device.
Each GLB contains 32 macrocells and a fully populated,
programmable AND-array with 160 logic product terms
and five extra control product terms. The GLB has 68
inputs from the Global Routing Pool which are available
in both true and complement form for every product term.
The 160 product terms are grouped in 32 sets of five and
sent into a Product Term Sharing Array (PTSA) which
allows sharing up to a maximum of 35 product terms for
a single function. Alternatively, the PTSA can be bypassed for functions of five product terms or less. The
five extra product terms are used for shared GLB controls, set, reset, clock, clock enable and output enable.
The 32 registered macrocells in the GLB are driven by the
32 outputs from the PTSA or the PTSA bypass. Each
macrocell contains a programmable XOR gate, a programmable register/latch/toggle flip-flop and the
necessary clocks and control logic to allow combinatorial
or registered operation. The macrocells each have two
outputs, which can be fed back through the Global
Routing Pool. This dual output capability from the
macrocell allows efficient use of the hardware resources.
One output can be a registered function for example,
while the other output can be an unrelated combinatorial
function. A direct register input from the I/O pad facilitates efficient use of this feature to construct high-speed
input registers.
Macrocell registers can be clocked from one of several
global or product term clocks available on the device. A
global and product term clock enable is also provided,
eliminating the need to gate the clock to the macrocell
registers. Reset and preset for the macrocell register is
provided from both global and product term signals. The
macrocell register can be programmed to operate as a Dtype register, a D-type latch or a T-type flip flop.
The 32 outputs from the GLB can drive both the Global
Routing Pool and the device I/O cells. The Global
Routing Pool contains one line from each macrocell
output and one line from each I/O pin.
The input buffer threshold has programmable TTL/3.3V/
2.5V compatible levels. The output driver can source
4mA and sink 8mA in 3.3V mode. The output drivers
have a separate VCCIO reference input which is independent of the main VCC supply for the device. This
feature allows the output drivers to drive either 3.3V or
2.5V output levels while the device logic and the output
current drive is always powered from 3.3V. The output
drivers also provide individually programmable edge
rates and open drain capability. A programmable pullup
resistor is provided to tie off unused inputs and a programmable bus-hold latch is available to hold tristate
outputs in their last valid state until the bus is driven again
by some device.
The ispLSI 5000V Family features 3.3V, non-volatile insystem programmability for both the logic and the
interconnect structures, providing the means to develop
truly reconfigurable systems. Programming is achieved
through the industry standard IEEE 1149.1-compliant
Boundary Scan interface. Boundary Scan test is also
supported through the same interface.
An enhanced, multiple cell security scheme is provided
that prevents reading of the JEDEC programming file
when secured. After the device has been secured using
this mechanism, the only way to clear the security is to
execute a bulk-erase instruction.
ispLSI 5000V Family Members
The ispLSI 5000V Family ranges from 256 macrocells to
512 macrocells and operates from a 3.3V power supply.
All family members will be available with multiple package options. The ispLSI 5000V Family device matrix
showing the various bondout options is shown in the table
below.
The interconnect structure (GRP) is very similar to Lattice's
existing ispLSI 1000, 2000 and 3000 families, but with an
enhanced interconnect structure for optimal pin locking
and logic routing. This eliminates the need for registered
I/O cells or an Output Routing Pool.
Global PTOE 0
Global PTOE 1
Global PTOE 2
Global PTOE 3
Global PTOE 4
Global PTOE 5
PTSA bypass
DQ
D/T
Clk En
R/L
Clk
RP
D/T
Clk En
Clk
Delay
Slew
rate
2.5V/3.3V
Output
Open
drain
DQD
VCCIOVCCIOVCC
To GRP
Q
Register/
Latch
I/O Pad
Programmable
Speed/Power
Option
RP
6
Specifications ispLSI 5256VA
Global Clock Distribution
The ispLSI 5000V Family has four dedicated clock input
pins: CLK0 - CLK3. CLK0 input is used as the dedicated
master clock that has the lowest internal clock skew with
no clock inversion to maintain the fastest internal clock
Figure 5. ispLSI 5000V Global Clock Structure
CLK 0
CLK 1
IO/CLK 2
IO/CLK 3
speed. The clock inversion is available on the remaining
CLK1 - CLK3 signals. By sharing the pins with the I/O
pins, CLK2 and CLK3 can not only be inverted but also is
available for logic implementation through GRP signal
routing. Figure 5 shows these different clock distribution
options.
CLK0
CLK1
To GRP
CLK2
CLK3
To GRP
GSET/GRST
SET/RESET
7
Figure 6. Boundary Scan Register Circuit for I/O Pins
Specifications ispLSI 5256VA
HIGHZ
EXTEST
SCANIN
(from previous
cell)
Shift DR
Clock DR
BSCAN
Registers
DQDQ
DQ
DQ
Update DR
BSCAN
Latches
DQ
Reset
TOE
Normal
Function
EXTEST
PROG_MODE
Normal
Function
OE
SCANOUT
(to next cell)
0
1
0
1
I/O Pin
Figure 7. Boundary Scan Register Circuit for Input-Only Pins
Input Pin
SCANIN
DQ
(from previous
cell)
Shift DR
Clock DR
8
SCANOUT
(to next cell)
Specifications ispLSI 5256VA
Figure 8. Boundary Scan Waveforms and Timing Specifications
TMS
TDI
TCK
TDO
Data to be
captured
Data to be
driven out
T
btch
T
T
btvo
T
T
btcl
T
btuov
btsu
btcpsu
Data Captured
T
bth
T
btcp
T
btco
Valid DataValid Data
T
btcph
T
btuco
Valid DataValid Data
T
btoz
T
btuoz
SYMBOLPARAMETERMINMAX UNITS
t
btcpTCK [BSCAN test] clock pulse width
t
btchTCK [BSCAN test] pulse width high
t
btclTCK [BSCAN test] pulse width low
t
btsuTCK [BSCAN test] setup time
t
bthTCK [BSCAN test] hold time
t
rfTCK [BSCAN test] rise and fall time
t
btcoTAP controller falling edge of clock to valid output
t
btozTAP controller falling edge of clock to data output disable
t
btvoTAP controller falling edge of clock to data output enable
t
btcpsuBSCAN test Capture register setup time
t
btcphBSCAN test Capture register hold time
t
btucoBSCAN test Update reg, falling edge of clock to valid output
t
btuozBSCAN test Update reg, falling edge of clock to output disable
t
btuovBSCAN test Update reg, falling edge of clock to output enable
125–ns
62.5–ns
62.5–ns
25–ns
25–ns
50–mV/ns
–25ns
–25ns
–25ns
25–ns
25–ns
–50ns
–50ns
–50ns
9
Specifications ispLSI 5256VA
Absolute Maximum Ratings
1, 2
Supply Voltage Vcc.................................. -0.5 to +5.4V
Input Voltage Applied............................... -0.5 to +5.6V
Tri-Stated Output Voltage Applied........... -0.5 to +5.6V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (TJ) with Power Applied ... 150°C
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
2. Compliance with the Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM is a requirement.
DC Recommended Operating Condition
MIN.MAX.UNITS
3.00
3.003.60V
2.3
3.60
3.60
Table 2 - 0005/5256
V
V
V
V
CC
CCIO
SYMBOL
PARAMETER
Supply Voltage
I/O Reference Voltage
Commercial
Industrial
= 0°C to +70°C
T
A
T
= -40°C to +85°C
A
Capacitance (TA=25°C,f=1.0 MHz)
SYMBOL
C
1
C
2
C
3
PARAMETER
I/O Capacitance
Clock Capacitance
Global Input Capacitance
10
10
10
UNITSTYPICALTEST CONDITIONS
pfV = 3.3V, V = 2.0V
pfV = 3.3V, V = 2.0V
pfV = 3.3V, V = 2.0V
3-state levels are measured 0.5V from steady-state
active level.
GND to V
≤ 1.5ns 10% to 90%
Output Load Conditions (See Figure 8)
3.3V2.5V
TEST CONDITIONR1
A35pF
Active High
B
Active Low
Active High to Z
at V -0.5V
C
D35pF
OH
Active Low to Z
at V +0.5V
OL
Slow Slew
R1R2
316Ω
∞
316Ω
∞
316Ω
∞
348Ω
348Ω
∞
348Ω
∞
∞
511Ω
∞
511Ω
∞
511Ω
∞
CCIO
1.5V
1.5V
See figure
Table 2 - 0003/5384
R2CL
475Ω
475Ω
∞
475Ω
∞
∞
Table 2 - 0004A/5384
min
35pF
35pF
5pF
5pF
Specifications ispLSI 5256VA
Figure 9. Test Load
V
CCIO
R
1
Device
Output
R
2
*
CL includes Test Fixture and Probe Capacitance.
C
*
L
Test
Point
0213D
DC Electrical Characteristics for 3.3V Range
Over Recommended Operating Conditions
SYMBOL
VCCIO
VIL
VIH
VOL
VOH
I/O Reference Voltage3.0–3.6V
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
1. I/O voltage configuration must be set to VCC.
PARAMETER
V
OH
V
OH
= 8 mA
I
OL
I
OH
1
CONDITIONMIN.TYP.MAX. UNITS
≤ V
OUT
≤ V
OUT
= -4 mA
or V
or V
≤ V
OUT
≤ VOL(max)
OUT
OL (max)
-0.3
2.0
–
2.4
–
–
–
–
0.8
5.25
0.4
–
Table 2-0007/5256VA
V
V
V
V
11
Specifications ispLSI 5256VA
DC Electrical Characteristics for 2.5V Range
Over Recommended Operating Conditions
SYMBOL
V
V
V
V
V
CCIO
IL
IH
OL
OH
I/O Reference Voltage
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
1. I/O voltage configuration must be set to VCCIO.
PARAMETER
V
OH(min)
V
OH(min)
V
CCIO=min
V
CCIO=min
V
CCIO=min
V
CCIO=min
DC Electrical Characteristics
Over Recommended Operating Conditions
SYMBOL
IIL
IIH
1
IPU
IBHL
IBHH
IBHLO
IBHLH
IBHT
IVCCIO
Input or I/O Low Leakage Current0V ≤ V ≤ V (Max.)
Input or I/O High Leakage Current
I/O Active Pullup Current
Bus Hold Low Sustaining Current
Bus Hold High Sustaining Current
Bus Hold Low Overdrive Current
Bus Hold High Overdrive Current
Bus Hold Trip Points
Current Needed for V
1. Pullup is capable of pulling to a minimum voltage of V
PARAMETER
PinAll I/Os Pulled-up, (Total I/Os * I
CCIO
(V
CCIO
V
≤ VIN ≤ 5.25V
CCIO
0V
≤ VIN ≤ V
VIN = V
VIN = V
0V ≤ VIN ≤ V
0V ≤ VIN ≤ V
under no-load conditions.
OH
1
CONDITIONMIN.TYP.MAX. UNITS
≤ V
≤ V
or V
OUT
or V
OUT
, VIN=VIH or VIL, IOL= 100µA
, VIN=VIH or VIL, IOL= 2mA
, VIN=VIH or VIL, IOH= -100µA
, VIN=VIH or VIL, IOH= -2mA
tidcom22Input Pad and Buffer, Combinatorial Input–0.7–0.9–1.4ns
tidreg23Input Pad and Buffer, Registered Input–4.7–6.6–9.7ns
todcom24Output Pad and Buffer, Combinatorial Output–1.3–1.7–2.6ns
todreg25Output Pad and Buffer, Registered Output–1.8–2.8–4.6ns
todz26Output Buffer Enable/Disable–1.3–1.7–2.6ns
tslf27Slew Rate Adder, Fast Slew–0–0–0ns
tsls28Slew Rate Adder, Slow Slew–7.5–10–15ns
tslfd29Programmable Delay Adder, Fast Slew–0.5–0.7–1ns
tslsd30Programmable Delay Adder, Slow Slew–8–10.7–16ns
tandhs40AND Array, High Speed Mode–3–4–6ns
tandlp41AND Array, Low Power Mode–5–6.6–10ns
PTSA
t5ptcom425 Product Term Bypass, Combinatorial–1–1.4–2ns
t5ptreg435 Product Term Bypass, Registered–1–1.7–2.3ns
t5ptxcom445 Product Term XOR, Combinatorial–2.5–3.6–5ns
t5pxtreg455 Product Term XOR, Registered–1.5–2.2–3.3ns
tptsacom46Product Term Sharing Array, Combinatorial–3–4.1–6ns
tptsareg47Product Term Sharing Array, Registered–2.0–2.7–4.3ns
PTSA Controls
tpck48Product Term Clock Delay–0.5–0.7–1ns
tpcken49Product Term CLKEN Delay–1–1.4–2ns
tscken50Shared Product Term CLKEN Delay–1–1.4–2ns
tsck51Shared Product Term Clock Delay–0.5–0.7–1ns
tptsacken52Product Term Sharing Array CLKEN Delay–2.0–2.4–4ns
tsrst53Shared Product Term Set/Reset Delay–2.5–3.4–5ns
tprst54Product Term Set/Reset Delay–1.5–2–3ns
tpoe55Product Term Output Enable/Disable–2.5–3.4–5ns
tgpoe56Global PT Output Enable/Disable–11.5–15.4–17ns
-125-100-70
MIN MAX MIN MAX MIN MAXUNIT
1. Internal Timing Parameters are not tested and are for reference only.Timing Rev. 4.0
2. Refer to Timing Model in this data sheet for further details.
14
Specifications ispLSI 5256VA
Internal Timing Parameters
1
Over Recommended Operating Conditions
PARAM#
2
DESCRIPTION
GRP
tgrpi57GRP Delay from I/O Pad–1.5–2–3ns
tgrpm58GRP Delay from Macrocell–1.0–1.2–1.2ns
1. Internal Timing Parameters are not tested and are for reference only.Timing Rev. 4.0
2. Refer to Timing Model in this data sheet for further details.
-125-100-70
MIN MAX MIN MAX MIN MAXUNIT
ispLSI 5256VA Timing Model
Output
Buffer
Buffer Delays
t
#22
odcom
t
#23
odreg
t
#24
odz
#28
#27
#25
#26
Slew
t
t
t
t
slsd
slfd
slf
sls
I/O
Pad
OUTPUT
I/O
Pad
INPUT
Input
Pad
Input
Buffer
#20
t
idcom
t
idreg
#21
#56
#55
Dedicated
Input Buffers
t
#57
gclk0
t
#58
gclk123
t
#59
gclken0
t
#60
gclken1
#61
t
grst
t
#62
goe
t
#63
toe
GRP
t
grpm
t
grpi
AND Array
#38
t
andhs
t
andlp
#39
GLB/Macrocell
PTSA
t
#40
5ptcom
t
#44
ptsacom
t
#42
5ptxcom
PT Controls
#49
#46
#50
#47
#48
#51
#52
#53
#54
#41
#45
#43
t
sck
t
pck
t
ptsacken
tpcken
tscken
t
srst
t
prst
t
poe
t
gpoe
t
5ptxreg
t
ptsareg
t
5ptreg
t
#37
ftog
Register
t
#29
mbp
t
mlat
#30
t
#32
msu
t
#33
mh
t
#31
mco
#35
t
mhce
t
msuce
#34
#36
t
mrst
15
Power Consumption
Specifications ispLSI 5256VA
Power consumption in the ispLSI 5256VA device depends on two primary factors: the speed at which the
device is operating and the number of product terms
used. The product terms have a fuse-selectable speed/
power tradeoff setting. Each group of four product terms
has a single speed/power tradeoff control fuse that acts
Figure 10. Typical Device Power Consumption vs fmax
400
ispLSI 5256VA
High Speed Mode
350
300
250
(mA)
CC
I
200
150
on the complete group of four. The fast “high-speed”
setting operates product terms at their normal full power
consumption. For portions of the logic that can tolerate
longer propagation delays, selecting the slower “lowpower” setting will significantly reduce the power
dissipation for these product terms. Figure 10 shows the
relationship between power and operating speed.
ispLSI 5256VA
Low Power Mode
100
020406080100120140
f
max (MHz)
Notes: Configuration of 16 16-bit Counters
Typical Current at 3.3V, 25° C
ICC can be estimated for the ispLSI 5256VA using the following equation:
High Speed Mode: ICC = 30 + (# of PTs * 0.456) + (# of nets * Max. freq * 0.0039)
Low Power Mode: ICC = 30 + (# of PTs * 0.22) + (# of nets * Max. freq * 0.0039)
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max. freq = Highest Clock Frequency to the device
The I
on average exists. These values are for estimates only. Since the value of I
and the program in the device, the actual I
estimate is based on typical conditions (VCC = 3.3V, room temperature) and an assumption of 2 GLB loads
CC
should be verified.
CC
is sensitive to operating conditions
CC
0127/5256va
16
Specifications ispLSI 5256VA
Signal Descriptions
Signal NameDescription
TMSInput - This pin is the Test Mode Select input, which is used to control the JTAG state machine.
TCKInput - This pin is the Test Clock input pin used to clock through the JTAG state machine.
TDIInput - This pin is the JTAG Test Data In pin used to load data.
TDOOutput - This pin is the JTAG Test Data Out pin used to shift data out.
TOE / I/O0Input/Output - This pin functions as either the Test Output Enable pin or an I/O pin based upon
customer's design. TOE tristates all I/O pins when a logic low is driven.
GOE0, GOE1Input - These two pins are the Global Output Enable input pins.
GSET/GRSTDedicated Set/Reset Input - This pin is available to all registers in the device and can
independently be configured as preset, reset or no effect on each register. The global polarity
(active high or low input) for this pin is also selectable.
I/OInput/Output – These are the general purpose I/O used by the logic array.
GNDGround
1
NC
VCCVcc
CLK0, CLK1Dedicated clock inputs for all registers. Both clocks are muxed before being used as the clock
CLK2 / I/O,Input/Output - These pins function as either dedicated clock inputs for all registers or an I/O
CLK3 / I/Opin based upon customer's design. Both clocks are muxed before being used as the clock input
VCCIOInput - This pin is used if an optional 2.5V output is to be used. Every I/O can independently
1. NC pins are not to be connected to any active signals, VCC or GND.
No connect.
input to all registers in the device.
to all registers in the device.
select either 3.3V or the optional voltage as its output level. If the optional output voltage is
not required, this pin must be connected to the Vcc supply. Programmable pull-up resistors and
bus-hold latches only draw current from this supply.