— 4000 PLD Gates
— 48 I/O Pins, Two Dedicated Inputs
— 144 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
• NEW FEATURES
— 100% IEEE 1149.1 Boundary Scan Testable
— ispJTAG™ In-System Programmable via IEEE 1149.1
(JTAG) Test Access Port
— User Selectable 3.3V or 5V I/O Supports Mixed-
Voltage Systems (V
— Open-Drain Output Option
• HIGH PERFORMANCE E
— fmax = 200 MHz Maximum Operating Frequency
—
tpd = 4.5 ns Propagation Delay
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
The ispLSI 1024EA is a High Density Programmable
Logic Device containing 144 Registers, 48 Universal I/O
pins, two Dedicated Input pins, four Dedicated Clock
Input pins and a Global Routing Pool (GRP). The GRP
provides complete interconnectivity between all of these
elements. The ispLSI 1024EA features 5V in-system
diagnostic capabilities via IEEE 1149.1 Test Access Port.
The ispLSI 1024EA device offers non-volatile
reprogrammability of the logic, as well as the interconnects to provide truly reconfigurable systems. A functional
superset of the ispLSI 1024 architecture, the ispLSI
1024EA device adds user selectable 3.3V or 5V I/O and
open-drain output options.
The basic unit of logic on the ispLSI 1024EA device is the
Generic Logic Block (GLB). The GLBs are labeled A0,
A1…D7 (Figure 1). There are a total of 24 GLBs in the
ispLSI 1024EA device. Each GLB has 18 inputs, a
programmable AND/OR/Exclusive OR array, and four
outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP
and dedicated inputs. All of the GLB outputs are brought
back into the GRP so that they can be connected to the
inputs of any other GLB on the device.
Functional Block Diagram
Figure 1. ispLSI 1024EA Functional Block Diagram
RESET
VCCIO
Generic
Logic Blocks
(GLBs)
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
TDO
TMS
TCK
TDI
Megablock
A0
A1
A2
A3
A4
lnput Bus
A5
Output Routing Pool (ORP)
A6
A7
B0B1B2B3B4B5B6B7
Output Routing Pool (ORP)
Input Bus
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
Specifications ispLSI 1024EA
GOE 1/IN 5
GOE 0/IN 4
lnput Bus
I/O 47
I/O 46
I/O 45
I/O 44
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 38
I/O 37
I/O 36
I/O 35
I/O 34
I/O 33
I/O 32
Global
Routing
Pool
(GRP)
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
C7
C6
C5
C4
C3
C2
Output Routing Pool (ORP)
C1
C0
CLK 0
CLK 1
Clock
Network
Y0Y1Y2
CLK 2
IOCLK 0
IOCLK 1
0139B/1024EA
Y3
Distribution
The device also has 48 I/O cells, each of which is directly
connected to an I/O pin. Each I/O cell can be individually
programmed to be a combinatorial input, registered input, latched input, output or bi-directional
I/O pin with 3-state control. The signal levels are TTL
compatible voltages and the output drivers can source 4
mA or sink 8 mA. Each output can be programmed
independently for fast or slow output slew rate to minimize overall output switching noise. By connecting the
VCCIO pin to a common 5V or 3.3V power supply, I/O
output levels can be matched to 5V or 3.3V-compatible
voltages.
Eight GLBs, 16 I/O cells, dedicated inputs (if available)
and one ORP are connected together to make a
Megablock (Figure 1). The outputs of the eight GLBs are
connected to a set of 16 universal I/O cells by the ORP.
Each ispLSI 1024EA device contains three Megablocks.
The GRP has, as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI 1024EA device are selected using
the Clock Distribution Network. Four dedicated clock pins
(Y0, Y1, Y2 and Y3) are brought into the distribution
network, and five clock outputs (CLK 0, CLK 1, CLK 2,
IOCLK 0 and IOCLK 1) are provided to route clocks to the
GLBs and I/O cells. The Clock Distribution Network can
also be driven from a special clock GLB (C0 on the ispLSI
1024EA device). The logic of this GLB allows the user to
create an internal clock from a combination of internal
signals within the device.
Programmable Open-Drain Outputs
In addition to the standard output configuration, the
outputs of the ispLSI 1024EA are individually programmable, either as a standard totem-pole output or an
open-drain output. The totem-pole output drives the
specified Voh and Vol levels, whereas the open-drain
output drives only the specified Vol. The Voh level on the
open-drain output depends on the external loading and
pull-up. This output configuration is controlled by a programmable fuse. The default configuration when the
device is in bulk erased state is totem-pole configuration.
The open-drain/totem-pole option is selectable through
the ispDesignEXPERT software tools.
2
Specifications ispLSI 1024EA
Boundary Scan
Figure 2. Boundary Scan Waveforms and Timing Specifications
TMS
TDI
TCK
TDO
Data to be
captured
Data to be
driven out
T
btch
T
T
btvo
T
T
btcl
T
btcpsu
btuov
btsu
Data Captured
T
bth
T
btcp
T
btco
Valid DataValid Data
T
btcph
T
btuco
Valid DataValid Data
T
btoz
T
btuoz
SymbolParameterMinMaxUnits
t
btcp
t
btch
t
btcl
t
btsu
t
bth
t
rf
t
btco
t
btoz
t
btvo
t
btcpsu
t
btcph
t
btuco
t
btuoz
t
btuov
TCK [BSCAN test] clock pulse width100–ns
TCK [BSCAN test] pulse width high50–ns
TCK [BSCAN test] pulse width low50–ns
TCK [BSCAN test] setup time20–ns
TCK [BSCAN test] hold time25–ns
TCK [BSCAN test] rise and fall time50–mV/ns
TAP controller falling edge of clock to valid output–25ns
TAP controller falling edge of clock to data output disable–25ns
TAP controller falling edge of clock to data output enable–25ns
BSCAN test Capture register setup time40–ns
BSCAN test Capture register hold time25–ns
BSCAN test Update reg, falling edge of clock to valid output–50ns
BSCAN test Update reg, falling edge of clock to output disable–50ns
BSCAN test Update reg, falling edge of clock to output enable–50ns
3
Specifications ispLSI 1024EA
Absolute Maximum Ratings
1
Supply Voltage Vcc.................................. -0.5 to +7.0V
Input Voltage Applied........................-2.5 to VCC +1.0V
Off-State Output Voltage Applied .....-2.5 to VCC +1.0V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (T
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
Input Pulse Levels
Input Rise and Fall Time 10% to 90%
Input Timing Reference Levels
Output Timing Reference Levels
Output Load
3-state levels are measured 0.5V from
steady-state active level.
GND to 3.0V
1.5ns
1.5V
1.5V
See Figure 3
Table 2-0003/1024EA
Figure 3. Test Load
Output Load Conditions (see Figure 3)
TEST CONDITIONR1R2CL
A470Ω390Ω35pF
Active High
B
Active Low
Active High to Z
at V -0.5V
C
Active Low to Z
at V +0.5V
OH
OL
∞390Ω35pF
470Ω390Ω35pF
∞390Ω5pF
470Ω390Ω5pF
Table 2-0004/1024EA
DC Electrical Characteristics
Over Recommended Operating Conditions
SYMBOL
V
OL
V
OH
I
IL
I
IH
I
IL-PU
1
I
OS
2, 4, 5
I
CC
Output Low Voltage
Output High Voltage
Input or I/O Low Leakage Current
Input or I/O High Leakage Current
I/O Active Pull-Up Current
Output Short Circuit CurrentV
Operating Power Supply Current
PARAMETER
I
= 8 mA
OL
I
= -2 mA, V
OH
I
= -4 mA, V
OH
0V ≤ V
IN
- 0.2)V ≤ VIN ≤ V
(V
CCIO
V
≤ V
CCIO
0V ≤ V
IN
= 5.0V or 3.3V, V
CCIO
V
= 0.0V, VIH = 3.0V
IL
f
TOGGLE
1. One output at a time for a maximum duration of one second. V
CONDITIONMIN.TYP.
= 3.0V
CCIO
= 4.75V
CCIO
≤ VIL (Max.)
CCIO
≤ 5.25V
IN
≤ V
IL
= 0.5V——-240mA
OUT
= 1 MHz
= 0.5V was selected to avoid test
OUT
—
2.4——V
2.4——V
—
—
—
—
—152mA—
problems by tester ground degradation. Characterized but not 100% tested.
2. Measured using eight 16-bit counters.
3. Typical values are at V
4. Unused inputs held at 0.0V.
5. Maximum I
Power Consumption section of this data sheet and the Thermal Management section of the Lattice Semiconductor
Data Book CD-ROM to estimate maximum I
varies widely with specific device configuration and operating frequency. Refer to the
1. Unless noted otherwise, all parameters use a GRP load of four GLBs, 20 PTXOR path, ORP and Y0 clock.
2. Refer to Timing Modelin this data sheet for further details.
3. Standard 16-bit counter using GRP feedback.
4. Reference Switching Test Conditions section.
TEST
COND.
A1Data Propagation Delay, 4PT Bypass, ORP Bypassns
A2Data Propagation Delay, Worst Case Pathns
A3Clock Frequency with Internal FeedbackMHz
—4Clock Frequency with External FeedbackMHz
—5Clock Frequency, Max. ToggleMHz
—6GLB Reg. Setup Time before Clock,4 PT Bypassns
A7GLB Reg. Clock to Output Delay, ORP Bypassns
—8GLB Reg. Hold Time after Clock, 4 PT Bypassns
—9GLB Reg. Setup Time before Clockns
—10 GLB Reg. Clock to Output Delayns
—11 GLB Reg. Hold Time after Clockns
A12 Ext. Reset Pin to Output Delayns
—13 Ext. Reset Pulse Durationns
B14 Input to Output Enablens
C15 Input to Output Disablens
B16 Global OE Output Enablens
C17 Global OE Output Disablens
—19 External Synchronous Clock Pulse Duration, Lowns
—20I/O Reg. Setup Time before Ext. Sync Clock (Y2, Y3)ns
—21I/O Reg. Hold Time after Ext. Sync. Clock (Y2, Y3)ns
2
DESCRIPTION#
1
1
( )
twh + twl
3
1
( )
tsu2 + tco1
-200
MIN. MAX.
—4.5
—
6.0
200—
3.0
—
0.0
3.5
—
0.0
—
3.5
—
—
—4.5
—4.5
2.0
2.0
3.0
0.0
—
—
—
3.5
—
—
4.0
—
5.5
—
7.0
7.0
—
—
—
—
143
250
-125
MIN. MAX.
—7.5
—
10.0
125—
4.5
—
0.0
5.5
—
0.0
—
5.0
—
—
—7.0
—7.0
3.0
3.0
3.0
0.0
—
—
—
4.5
—
—
5.5
—
10.0
—
12.0
12.0
—
—
—
—
100
167
-100
MIN. MAX.
—10.0
—
12.5
100—
—
77
125
—
—
6.0
6.0
—
—
0.0
—
7.0
7.0
—
—
0.0
13.5
—
6.5
—
15.0
—
15.0
—
—9.0
—9.0
—
4.0
—
4.0
3.5
—
0.0
—
Table 2-0030A/1024EA
UNITS
v.2.5
6
Specifications ispLSI 1024EA
Internal Timing Parameters
PARAM.
2
1
Inputs
tiobp
tiolat
tiosu
tioh
tioco
tior
tdin
22 I/O Register Bypassns
23 I/O Latch Delayns
24 I/O Register Setup Time before Clockns
25 I/O Register Hold Time after Clockns
26 I/O Register Clock to Out Delayns
27 I/O Register Reset to Out Delayns
28 Dedicated Input Delayns
41 GLB Register Hold Time after Clockns
42 GLB Register Clock to Output Delayns
43 GLB Register Reset to Output Delayns
44 GLB Product Term Reset to Register Delayns
45 GLB Product Term Output Enable to I/O Cell Delayns
46 GLB Product Term Clock Delayns
47 GLB Feedback Delayns
3
ORP
torp
torpbp
1. Internal Timing Parameters are not tested and are for reference only.
2. Refer to Timing Model in this data sheet for further details.
3. The XOR adjacent path can only be used by hard macros.
48 ORP Delayns
49 ORP Bypass Delayns
-200
MIN. MAX.
—
0.3
—
4.0
3.0
—
0.0
—
—
4.0
—
4.0
—
1.1
—
1.3
—
1.5
—
1.7
—
2.1
—
2.5
—
1.7
—
1.8
—
1.9
—
1.9
—
1.9
—
0.6
0.2
—
1.0
—
—
1.4
—
3.8
—
2.5
—
2.1
1.5
2.5
—
0.0
—
0.8
—
0.1
-125
MIN.MIN.MAX.MAX.
0.3
—
4.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
4.6
4.6
1.9
1.7
1.9
2.1
2.5
2.9
3.4
3.1
3.6
3.6
3.6
1.2
—
—
1.4
4.9
3.8
5.7
3.9
1.3
0.2
3.0
0.0
0.3
3.5
2.8
-100
—
0.4
—
4.0
3.4
0.0
1.4
4.0
3.5
—
—
—
5.0
—
5.0
—
2.2
—
2.1
—
2.3
—
2.5
—
2.9
—
3.3
—
4.9
—
3.8
—
4.3
—
4.3
—
4.3
—
2.1
—
—
—
1.7
—
5.0
—
4.5
—
7.2
4.7
—0.3—0.3
—
1.4
—
0.4
Table 2-0036A/1024EA
UNITSDESCRIPTION#
ns
v.2.5
7
Specifications ispLSI 1024EA
Internal Timing Parameters
1
Outputs
tob
tsl
toen
todis
tgoe
50 Output Buffer Delayns
51 Output Buffer Delay, Slew Limited Adderns
52 I/O Cell OE to Output Enabledns
53 I/O Cell OE to Output Disabledns
54 Global OEns
Clocks
tgy0
tgy1/2
tgcp
tioy2/3
tiocp
55 Clock Delay, Y0 to Global GLB Clock Line (Ref. clk)ns
56 Clock Delay, Y1 or Y2 to Global GLB Clock Linens
57 Clock Delay, Clock GLB to Global GLB Clock Linens
58 Clock Delay, Y2 or Y3 to I/O Cell Global Clock Linens
59 Clock Delay, Clock GLB to I/O Cell Global Clock Linens
Global Reset
tgr
1. Internal Timing Parameters are not tested and are for reference only.
60 Global Reset to GLB and I/O Registersns
-200
MIN. MAX.
0.9
—
—
5.0
3.1
—
—
3.1
—
1.4
0.9
0.9
0.9
0.9
0.8
1.8
0.0
0.0
0.8
0.0
-125
MIN.MIN.MAX.MAX.
—
1.7
—
5.0
—
4.0
—
4.0
—
3.0
1.1
1.1
0.9
0.9
0.8
1.8
0.0
0.0
0.8
2.82.8
——
2.1
-100
2.0
—
5.0
—
5.1
—
5.1
—
3.9
—
1.9
1.9
1.5
1.5
1.8
0.8
0.0
0.0
2.8
0.8
5.1
—
Table 2-0037A/1024EA
UNITSDESCRIPTION#PARAM.
v.2.5
8
ispLSI 1024EA Timing Model
Specifications ispLSI 1024EA
I/O CellORPGLBGRPI/O Cell
Feedback#47
Ded. In
I/O Pin
(Input)
Reset
Y1,2,3
Y0
GOE 0,1
#60
#28
I/O Reg Bypass
#22
Input
Register
D
RST
#23 - 27
GRP4
#30
Q
GRP Loading
Delay
#29, 31 - 33
Clock
Distribution
#56 - 59
#55
#54
#34 Comb 4 PT Bypass
Reg 4 PT Bypass
#35
20 PT
XOR Delays
#36 - 38
#60
Control
RE
PTs
OE
CK
#44 - 46
Derivations of tsu, th and tco from the Product Term Clock
Power consumption in the ispLSI 1024EA device depends on two primary factors: the speed at which the
device is operating, and the number of product terms
Figure 4. Typical Device Power Consumption vs fmax
260
240
220
200
180
CC (mA)
I
160
140
120
100
50100150200
0
Notes: Configuration of eight 16-bit counters
fmax (MHz)
Typical current at 5V, 25°C
GRP/GLB/1024EA
used. Figure 4 shows the relationship between power
and operating speed.
ispLSI 1024EA
250
Icc can be estimated for the ispLSI 1024EA using the following equation:
Icc = 17mA + (# of PTs * .726) + (# of nets * Max Freq * .0043)
Where:
# of PTs = Number of Product Terms used in design
# of nets = Number of Signals used in device
Max freq = Highest Clock Frequency to the device (in MHz)
The Icc estimate is based on typical conditions (Vcc = 5.0V, room temperature) and an assumption of four GLB
loads on average exists. These values are for estimates only. Since the value of Icc is sensitive to operating
conditions and the program in the device, the actual Icc should be verified.
Input/Output Pins - These are the general purpose I/O pins used by the logic array.
22,
30,
34,
45,
53,
57,
72,
80,
84,
95,
3,
7
This is a dual function pin. It can be used either as Global Output Enable for all I/O cells or it can be
used as a dedicated input pin.
This is a dual function pin. It can be used either as Global Output Enable for all I/O cells or it can be
used as a dedicated input pin.
Input - Functions as an input pin to load programming data into the device and also used as one of
the two control pins for the ispJTAG state machine.
Input - Controls the operation of the ISP state machine.
Output - Functions as an output pin to read serial shift register data.
Input - Functions as a clock pin for the Serial Shift Register.
Active Low (0) Reset pin which resets all of the GLB and I/O registers in the device.
Dedicated Clock input. This clock input is connected to one of the clock inputs of all of the GLBs on
the device.
Dedicated Clock input. This clock input is brought into the clock distribution network, and can
optionally be routed to any GLB on the device.
Y2
Y3
GND
VCC
VCCIO
2
NC
1. Pins have dual function capability which is software selectable.
2. NC pins are not to be connected to any active signals, Vcc or GND.
60
59
14,
61,
10,
65,
16
1,
24,
38,
51,
74,
87,
15,
62,
11,
66,
2,
25,
39,
52,
75,
88,
36,
89,
40,
85,
12,
26,
49,
63,
76,
99,
Dedicated Clock input. This clock input is brought into the clock distribution network, and can
optionally be routed to any GLB and/or any I/O cell on the device.
Dedicated Clock input. This clock input is brought into the clock distribution network, and can
optionally be routed to any I/O cell on the device.
Ground (GND)
37,
90
Vcc
41,
86
Supply voltage for output drivers, 5V or 3.3V.
No Connect