Lattice ispLSI 1024EA User Manual

• HIGH DENSITY PROGRAMMABLE LOGIC
Output Routing Pool
B0 B1 B2 B3 B4 B5 B6 B7
A0 A1 A2 A3 A4 A5 A6 A7
C7 C6 C5 C4 C3 C2 C1 C0
Output Routing Pool
Output Routing Pool
CLK
Global Routing Pool (GRP)
0139/1024EA
Logic Array
DQ
DQ
DQ
DQ
GLB
— 4000 PLD Gates — 48 I/O Pins, Two Dedicated Inputs — 144 Registers — High Speed Global Interconnect — Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
• NEW FEATURES — 100% IEEE 1149.1 Boundary Scan Testable — ispJTAG™ In-System Programmable via IEEE 1149.1
(JTAG) Test Access Port
— User Selectable 3.3V or 5V I/O Supports Mixed-
Voltage Systems (V
— Open-Drain Output Option
• HIGH PERFORMANCE E — fmax = 200 MHz Maximum Operating Frequency
tpd = 4.5 ns Propagation Delay
— TTL Compatible Inputs and Outputs — Electrically Erasable and Reprogrammable — Non-Volatile — 100% Tested at Time of Manufacture — Unused Product Term Shutdown Saves Power
• IN-SYSTEM PROGRAMMABLE — Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
— Reprogram Soldered Devices for Faster Prototyping
• OFFERS THE EASE OF USE AND FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
Logic and Structured Designs — Enhanced Pin Locking Capability — Four Dedicated Clock Input Pins — Synchronous and Asynchronous Clocks — Programmable Output Slew Rate Control to
Minimize Switching Noise — Flexible Pin Placement — Optimized Global Routing Pool Provides Global
Interconnectivity
• ispDesignEXPERT™ – LOGIC COMPILER AND COM­PLETE ISP DEVICE DESIGN SYSTEMS FROM HDL SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. June 2000 Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
1024ea_01 1
CCIO Pin)
2
CMOS® TECHNOLOGY
ispLSI® 1024EA
In-System Programmable High Density PLD
Functional Block DiagramFeatures
Description
The ispLSI 1024EA is a High Density Programmable Logic Device containing 144 Registers, 48 Universal I/O pins, two Dedicated Input pins, four Dedicated Clock Input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 1024EA features 5V in-system diagnostic capabilities via IEEE 1149.1 Test Access Port. The ispLSI 1024EA device offers non-volatile reprogrammability of the logic, as well as the intercon­nects to provide truly reconfigurable systems. A functional superset of the ispLSI 1024 architecture, the ispLSI 1024EA device adds user selectable 3.3V or 5V I/O and open-drain output options.
The basic unit of logic on the ispLSI 1024EA device is the Generic Logic Block (GLB). The GLBs are labeled A0, A1D7 (Figure 1). There are a total of 24 GLBs in the ispLSI 1024EA device. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinato­rial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any other GLB on the device.
Functional Block Diagram
Figure 1. ispLSI 1024EA Functional Block Diagram
RESET
VCCIO
Generic
Logic Blocks
(GLBs)
I/O 0 I/O 1 I/O 2 I/O 3
I/O 4 I/O 5 I/O 6 I/O 7
I/O 8
I/O 9 I/O 10 I/O 11
I/O 12 I/O 13 I/O 14 I/O 15
TDO
TMS
TCK
TDI
Megablock
A0
A1
A2
A3
A4
lnput Bus
A5
Output Routing Pool (ORP)
A6
A7
B0 B1 B2 B3 B4 B5 B6 B7
Output Routing Pool (ORP)
Input Bus
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
Specifications ispLSI 1024EA
GOE 1/IN 5 GOE 0/IN 4
lnput Bus
I/O 47 I/O 46 I/O 45 I/O 44
I/O 43 I/O 42 I/O 41 I/O 40
I/O 39 I/O 38 I/O 37 I/O 36
I/O 35 I/O 34 I/O 33 I/O 32
Global
Routing
Pool
(GRP)
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
C7
C6
C5
C4
C3
C2
Output Routing Pool (ORP)
C1
C0
CLK 0 CLK 1
Clock
Network
Y0Y1Y2
CLK 2 IOCLK 0 IOCLK 1
0139B/1024EA
Y3
Distribution
The device also has 48 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, registered in­put, latched input, output or bi-directional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to mini­mize overall output switching noise. By connecting the VCCIO pin to a common 5V or 3.3V power supply, I/O output levels can be matched to 5V or 3.3V-compatible voltages.
Eight GLBs, 16 I/O cells, dedicated inputs (if available) and one ORP are connected together to make a Megablock (Figure 1). The outputs of the eight GLBs are connected to a set of 16 universal I/O cells by the ORP. Each ispLSI 1024EA device contains three Megablocks.
The GRP has, as its inputs, the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew.
Clocks in the ispLSI 1024EA device are selected using the Clock Distribution Network. Four dedicated clock pins (Y0, Y1, Y2 and Y3) are brought into the distribution network, and five clock outputs (CLK 0, CLK 1, CLK 2, IOCLK 0 and IOCLK 1) are provided to route clocks to the GLBs and I/O cells. The Clock Distribution Network can also be driven from a special clock GLB (C0 on the ispLSI 1024EA device). The logic of this GLB allows the user to create an internal clock from a combination of internal signals within the device.
Programmable Open-Drain Outputs
In addition to the standard output configuration, the outputs of the ispLSI 1024EA are individually program­mable, either as a standard totem-pole output or an open-drain output. The totem-pole output drives the specified Voh and Vol levels, whereas the open-drain output drives only the specified Vol. The Voh level on the open-drain output depends on the external loading and pull-up. This output configuration is controlled by a pro­grammable fuse. The default configuration when the device is in bulk erased state is totem-pole configuration. The open-drain/totem-pole option is selectable through the ispDesignEXPERT software tools.
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Specifications ispLSI 1024EA
Boundary Scan
Figure 2. Boundary Scan Waveforms and Timing Specifications
TMS
TDI
TCK
TDO
Data to be
captured
Data to be
driven out
T
btch
T
T
btvo
T
T
btcl
T
btcpsu
btuov
btsu
Data Captured
T
bth
T
btcp
T
btco
Valid Data Valid Data
T
btcph
T
btuco
Valid Data Valid Data
T
btoz
T
btuoz
Symbol Parameter Min Max Units
t
btcp
t
btch
t
btcl
t
btsu
t
bth
t
rf
t
btco
t
btoz
t
btvo
t
btcpsu
t
btcph
t
btuco
t
btuoz
t
btuov
TCK [BSCAN test] clock pulse width 100 ns TCK [BSCAN test] pulse width high 50 ns TCK [BSCAN test] pulse width low 50 ns TCK [BSCAN test] setup time 20 ns TCK [BSCAN test] hold time 25 ns TCK [BSCAN test] rise and fall time 50 mV/ns TAP controller falling edge of clock to valid output 25 ns TAP controller falling edge of clock to data output disable 25 ns TAP controller falling edge of clock to data output enable 25 ns BSCAN test Capture register setup time 40 ns BSCAN test Capture register hold time 25 ns BSCAN test Update reg, falling edge of clock to valid output 50 ns BSCAN test Update reg, falling edge of clock to output disable 50 ns BSCAN test Update reg, falling edge of clock to output enable 50 ns
3
Specifications ispLSI 1024EA
Absolute Maximum Ratings
1
Supply Voltage Vcc.................................. -0.5 to +7.0V
Input Voltage Applied........................-2.5 to VCC +1.0V
Off-State Output Voltage Applied .....-2.5 to VCC +1.0V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (T
1. Stresses above those listed under the Absolute Maximum Ratings may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications).
) with Power Applied ... 150°C
J
DC Recommended Operating Conditions
SYMBOL
VCC VCCIO VIL
VIH
PARAMETER
Supply Voltage Supply Voltage: Output Drivers
Input Low Voltage Input High Voltage
Commercial 5V
3.3V
TA = 0°C to + 70°C
MIN. MAX. UNITS
4.75
4.75
3.0 0
2.0
5.25
5.25
3.6
0.8 +1
V
cc
Table 2-0005/1024EA
V V V V V
Capacitance (TA=25oC, f=1.0 MHz)
SYMBOL
C
1
C
2
(Commercial/Industrial) Y0 Clock Capacitance
PARAMETER
Erase/Reprogram Specifications
PARAMETER
Erase/Reprogram Cycles
UNITSTYPICAL TEST CONDITIONS
8Dedicated Input, I/O, Y1, Y2, Y3, Clock Capacitance
10
MINIMUM MAXIMUM UNITS
10000 Cycles
pf
pf
V = 5.0V, V = 2.0V
CC
V = 5.0V, V = 2.0V
CC PIN
PIN
Table 2-0006/1024EA
Table 2-0008/1024EA
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