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• HIGH DENSITY PROGRAMMABLE LOGIC
Output Routing Pool
B0 B1 B2 B3 B4 B5 B6 B7
A0
A1
A2
A3
A4
A5
A6
A7
C7
C6
C5
C4
C3
C2
C1
C0
Output Routing Pool
Output Routing Pool
CLK
Global Routing Pool (GRP)
0139/1024EA
Logic
Array
DQ
DQ
DQ
DQ
GLB
— 4000 PLD Gates
— 48 I/O Pins, Two Dedicated Inputs
— 144 Registers
— High Speed Global Interconnect
— Wide Input Gating for Fast Counters, State
Machines, Address Decoders, etc.
— Small Logic Block Size for Random Logic
• NEW FEATURES
— 100% IEEE 1149.1 Boundary Scan Testable
— ispJTAG™ In-System Programmable via IEEE 1149.1
(JTAG) Test Access Port
— User Selectable 3.3V or 5V I/O Supports Mixed-
Voltage Systems (V
— Open-Drain Output Option
• HIGH PERFORMANCE E
— fmax = 200 MHz Maximum Operating Frequency
—
tpd = 4.5 ns Propagation Delay
— TTL Compatible Inputs and Outputs
— Electrically Erasable and Reprogrammable
— Non-Volatile
— 100% Tested at Time of Manufacture
— Unused Product Term Shutdown Saves Power
• IN-SYSTEM PROGRAMMABLE
— Increased Manufacturing Yields, Reduced Time-to-
Market and Improved Product Quality
— Reprogram Soldered Devices for Faster Prototyping
• OFFERS THE EASE OF USE AND FAST SYSTEM
SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY
OF FIELD PROGRAMMABLE GATE ARRAYS
— Complete Programmable Device Can Combine Glue
Logic and Structured Designs
— Enhanced Pin Locking Capability
— Four Dedicated Clock Input Pins
— Synchronous and Asynchronous Clocks
— Programmable Output Slew Rate Control to
Minimize Switching Noise
— Flexible Pin Placement
— Optimized Global Routing Pool Provides Global
Interconnectivity
• ispDesignEXPERT™ – LOGIC COMPILER AND COMPLETE ISP DEVICE DESIGN SYSTEMS FROM HDL
SYNTHESIS THROUGH IN-SYSTEM PROGRAMMING
— Superior Quality of Results
— Tightly Integrated with Leading CAE Vendor Tools
— Productivity Enhancing Timing Analyzer, Explore
Tools, Timing Simulator and ispANALYZER™
— PC and UNIX Platforms
Copyright © 2000 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject
to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. June 2000
Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
1024ea_01 1
CCIO Pin)
2
CMOS® TECHNOLOGY
ispLSI® 1024EA
In-System Programmable High Density PLD
Functional Block DiagramFeatures
Description
The ispLSI 1024EA is a High Density Programmable
Logic Device containing 144 Registers, 48 Universal I/O
pins, two Dedicated Input pins, four Dedicated Clock
Input pins and a Global Routing Pool (GRP). The GRP
provides complete interconnectivity between all of these
elements. The ispLSI 1024EA features 5V in-system
diagnostic capabilities via IEEE 1149.1 Test Access Port.
The ispLSI 1024EA device offers non-volatile
reprogrammability of the logic, as well as the interconnects to provide truly reconfigurable systems. A functional
superset of the ispLSI 1024 architecture, the ispLSI
1024EA device adds user selectable 3.3V or 5V I/O and
open-drain output options.
The basic unit of logic on the ispLSI 1024EA device is the
Generic Logic Block (GLB). The GLBs are labeled A0,
A1…D7 (Figure 1). There are a total of 24 GLBs in the
ispLSI 1024EA device. Each GLB has 18 inputs, a
programmable AND/OR/Exclusive OR array, and four
outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP
and dedicated inputs. All of the GLB outputs are brought
back into the GRP so that they can be connected to the
inputs of any other GLB on the device.
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Functional Block Diagram
Figure 1. ispLSI 1024EA Functional Block Diagram
RESET
VCCIO
Generic
Logic Blocks
(GLBs)
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
I/O 8
I/O 9
I/O 10
I/O 11
I/O 12
I/O 13
I/O 14
I/O 15
TDO
TMS
TCK
TDI
Megablock
A0
A1
A2
A3
A4
lnput Bus
A5
Output Routing Pool (ORP)
A6
A7
B0 B1 B2 B3 B4 B5 B6 B7
Output Routing Pool (ORP)
Input Bus
I/O 16
I/O 17
I/O 18
I/O 19
I/O 20
I/O 21
I/O 22
Specifications ispLSI 1024EA
GOE 1/IN 5
GOE 0/IN 4
lnput Bus
I/O 47
I/O 46
I/O 45
I/O 44
I/O 43
I/O 42
I/O 41
I/O 40
I/O 39
I/O 38
I/O 37
I/O 36
I/O 35
I/O 34
I/O 33
I/O 32
Global
Routing
Pool
(GRP)
I/O 23
I/O 24
I/O 25
I/O 26
I/O 27
I/O 28
I/O 29
I/O 30
I/O 31
C7
C6
C5
C4
C3
C2
Output Routing Pool (ORP)
C1
C0
CLK 0
CLK 1
Clock
Network
Y0Y1Y2
CLK 2
IOCLK 0
IOCLK 1
0139B/1024EA
Y3
Distribution
The device also has 48 I/O cells, each of which is directly
connected to an I/O pin. Each I/O cell can be individually
programmed to be a combinatorial input, registered input, latched input, output or bi-directional
I/O pin with 3-state control. The signal levels are TTL
compatible voltages and the output drivers can source 4
mA or sink 8 mA. Each output can be programmed
independently for fast or slow output slew rate to minimize overall output switching noise. By connecting the
VCCIO pin to a common 5V or 3.3V power supply, I/O
output levels can be matched to 5V or 3.3V-compatible
voltages.
Eight GLBs, 16 I/O cells, dedicated inputs (if available)
and one ORP are connected together to make a
Megablock (Figure 1). The outputs of the eight GLBs are
connected to a set of 16 universal I/O cells by the ORP.
Each ispLSI 1024EA device contains three Megablocks.
The GRP has, as its inputs, the outputs from all of the
GLBs and all of the inputs from the bi-directional I/O cells.
All of these signals are made available to the inputs of the
GLBs. Delays through the GRP have been equalized to
minimize timing skew.
Clocks in the ispLSI 1024EA device are selected using
the Clock Distribution Network. Four dedicated clock pins
(Y0, Y1, Y2 and Y3) are brought into the distribution
network, and five clock outputs (CLK 0, CLK 1, CLK 2,
IOCLK 0 and IOCLK 1) are provided to route clocks to the
GLBs and I/O cells. The Clock Distribution Network can
also be driven from a special clock GLB (C0 on the ispLSI
1024EA device). The logic of this GLB allows the user to
create an internal clock from a combination of internal
signals within the device.
Programmable Open-Drain Outputs
In addition to the standard output configuration, the
outputs of the ispLSI 1024EA are individually programmable, either as a standard totem-pole output or an
open-drain output. The totem-pole output drives the
specified Voh and Vol levels, whereas the open-drain
output drives only the specified Vol. The Voh level on the
open-drain output depends on the external loading and
pull-up. This output configuration is controlled by a programmable fuse. The default configuration when the
device is in bulk erased state is totem-pole configuration.
The open-drain/totem-pole option is selectable through
the ispDesignEXPERT software tools.
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Specifications ispLSI 1024EA
Boundary Scan
Figure 2. Boundary Scan Waveforms and Timing Specifications
TMS
TDI
TCK
TDO
Data to be
captured
Data to be
driven out
T
btch
T
T
btvo
T
T
btcl
T
btcpsu
btuov
btsu
Data Captured
T
bth
T
btcp
T
btco
Valid Data Valid Data
T
btcph
T
btuco
Valid Data Valid Data
T
btoz
T
btuoz
Symbol Parameter Min Max Units
t
btcp
t
btch
t
btcl
t
btsu
t
bth
t
rf
t
btco
t
btoz
t
btvo
t
btcpsu
t
btcph
t
btuco
t
btuoz
t
btuov
TCK [BSCAN test] clock pulse width 100 – ns
TCK [BSCAN test] pulse width high 50 – ns
TCK [BSCAN test] pulse width low 50 – ns
TCK [BSCAN test] setup time 20 – ns
TCK [BSCAN test] hold time 25 – ns
TCK [BSCAN test] rise and fall time 50 – mV/ns
TAP controller falling edge of clock to valid output – 25 ns
TAP controller falling edge of clock to data output disable – 25 ns
TAP controller falling edge of clock to data output enable – 25 ns
BSCAN test Capture register setup time 40 – ns
BSCAN test Capture register hold time 25 – ns
BSCAN test Update reg, falling edge of clock to valid output – 50 ns
BSCAN test Update reg, falling edge of clock to output disable – 50 ns
BSCAN test Update reg, falling edge of clock to output enable – 50 ns
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Specifications ispLSI 1024EA
Absolute Maximum Ratings
1
Supply Voltage Vcc.................................. -0.5 to +7.0V
Input Voltage Applied........................-2.5 to VCC +1.0V
Off-State Output Voltage Applied .....-2.5 to VCC +1.0V
Storage Temperature................................ -65 to 150°C
Case Temp. with Power Applied .............. -55 to 125°C
Max. Junction Temp. (T
1. Stresses above those listed under the “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation of the device at these or at any other conditions above those indicated in the operational sections of this specification
is not implied (while programming, follow the programming specifications).
) with Power Applied ... 150°C
J
DC Recommended Operating Conditions
SYMBOL
VCC
VCCIO
VIL
VIH
PARAMETER
Supply Voltage
Supply Voltage: Output Drivers
Input Low Voltage
Input High Voltage
Commercial
5V
3.3V
TA = 0°C to + 70°C
MIN. MAX. UNITS
4.75
4.75
3.0
0
2.0
5.25
5.25
3.6
0.8
+1
V
cc
Table 2-0005/1024EA
V
V
V
V
V
Capacitance (TA=25oC, f=1.0 MHz)
SYMBOL
C
1
C
2
(Commercial/Industrial)
Y0 Clock Capacitance
PARAMETER
Erase/Reprogram Specifications
PARAMETER
Erase/Reprogram Cycles
UNITSTYPICAL TEST CONDITIONS
8Dedicated Input, I/O, Y1, Y2, Y3, Clock Capacitance
10
MINIMUM MAXIMUM UNITS
10000 — Cycles
pf
pf
V = 5.0V, V = 2.0V
CC
V = 5.0V, V = 2.0V
CC PIN
PIN
Table 2-0006/1024EA
Table 2-0008/1024EA
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