Lattice iCE40 UltraPlus User Manual

User Guide

FPGA-UG-02057 Version 1.0

June 2018

iCE40 UltraPlus 6:1 MIC Aggregation over SPI
Demo

iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo
User Guide

Contents

Acronymns in This Document ........................................................................................................................................ 3

1. Introduction .......................................................................................................................................................... 4

2. Functional Description ........................................................................................................................................... 4

2.1. Demo Design Overview ................................................................................................................................ 4

3. Demo Setup .......................................................................................................................................................... 5

3.1. Hardware Requirements ............................................................................................................................... 5

3.2. Software Requirements ................................................................................................................................ 5

3.3. Configuring the MDP Board .......................................................................................................................... 5

3.3.1. Setting Jumpers and Switches ................................................................................................................... 5

4. Programming the Demo ........................................................................................................................................ 7

4.1. Programming the Bitstream to the iCE40 UltraPlus MDP ............................................................................... 7

5. Running the Demo ................................................................................................................................................. 9

5.1. Using Windows Application .......................................................................................................................... 9

5.2. Oscilloscope Connection Points .................................................................................................................. 10

Appendix A. Schematic Diagram .................................................................................................................................. 11

Appendix B. Bill of Materials ........................................................................................................................................ 12

Technical Support ....................................................................................................................................................... 13

Revision History .......................................................................................................................................................... 13

Figures

Figure 2.1. iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo Overview ..................................................................... 4

Figure 2.2. iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo Block Diagram .............................................................. 4

Figure 3.1. iCE40 UltraPlus MDP Configuration .............................................................................................................. 5

Figure 3.2. 8 to 1 Mic Aggregator Board (Daughter Board) ............................................................................................. 6

Figure 3.3. iCE40 UltraPlus MDP and 8 to 1 Mic Aggregator Board ................................................................................. 6

Figure 4.1. Device Properties ......................................................................................................................................... 7

Figure 5.1. J30 Section on MDP Board ......................................................................................................................... 10

Figure 5.2. Header to Connect to the Oscilloscope ....................................................................................................... 10

Tables

Table 3.1. Detailed Information of the Board Configuration ........................................................................................... 6

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

2 FPGA-UG-02057-1.0

© 2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.

iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo

Acronym

Definition

I²S

Inter-IC Sound

PCM

Pulse Code Modulation

PDM

Pulse Density Modulation

FPGA

Field-Programmable Gate Array

MDP

Mobile Development Platform

SPI

Serial Peripheral Interface

SSP

System Solution Platform

User Guide

Acronymns in This Document

A list of acronyms used in this document.

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-UG-02057-1.0 3

© 2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.

iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo

iCE40

UltraPlus

Device

6 PDM

microph ones

Applications

SPI

PDM2PCM

CIC Filter 1

CIC Filter 2
CIC Filter 3

CIC Filter 4
CIC Filter 5
CIC Filter 6

Compensation Filter 1

Compensation Filter 2
Compensation Filter 3
Compensation Filter 4

Compensation Filter 5
Compensation Filter 6

PDM data from

daughter board’s

6 microphones

iCE40 UltraPlus

Audio

Buffer

SPI Bus

Applications

(SPI master)

Control

Signals

PCM
Data

SPI

Signals

User Guide

1. Introduction

I²S (Inter-IC Sound) bus is widely used to communicate Pulse Code Modulation (PCM) audio data between integrated
circuits in an electronic device. The standard I²S protocol, however, is designed to transfer only two channels (LEFT and
RIGHT) on a data line. This limitation can be addressed by using Serial Peripheral Interface (SPI), an interface bus
commonly used to send data between microcontrollers and small peripherals.

The iCE40 UltraPlus™ 6:1 MIC Aggregation over SPI demo addresses a market opportunity to transfer up to six
microphones channels using an SPI bus.

2. Functional Description

2.1. Demo Design Overview

The iCE40 UltraPlus 6:1 MIC Aggregation over SPI demo implements an SPI bus using the iCE40 UltraPlus FPGA. The
demo uses FPGA-B on the primary iCE40 UltraPlus Mobile Development Platform (MDP), plus a daughter board with six
Pulse Density Modulation (PDM) microphones for the input sources. Sound generated by the microphones can be
captured and heard through Windows applications. This version of the the project design uses the Lattice Radiant
Software tool.

Figure 2.1 shows an overview diagram of the iCE40 UltraPlus 6:1 MIC Aggregation over SPI demo.

Figure 2.2 shows the iCE40 UltraPlus 6:1 MIC Aggregation over SPI demo block diagram.

Figure 2.1. iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo Overview

Figure 2.2. iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo Block Diagram

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

© 2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.

4 FPGA-UG-02057-1.0

iCE40 UltraPlus 6:1 MIC Aggregation over SPI Demo

J23 Pins 2-3

SW5-1 ON

SW5-2 OFF

J28 – Disconnect

J27 Pins 9-10

J26 Pins 9-10

R30

J25 Pins 1-2

J25 Pins 5-6

J19 Pins 1-2 and

Pins 3-4 (Horizontal)

J17 Pins 9-10

User Guide

3. Demo Setup

The following hardware and software are required to run the iCE40 UltraPlus 6:1 MIC Aggregation over SPI demo.

3.1. Hardware Requirements

 iCE40 UltraPlus MDP (PN: iCE40UP5K-MDP-EVN)
 8 to 1 Mic Aggregator Board (Daughter Board) (PN: LF-81AGG-EVN)

3.2. Software Requirements

 Lattice Radiant 1.0
 Radiant Programmer (Version 1.0 or later)
 System Solution Platform (SSP)

Note: SSP installer and installation guide are included with this solution under SSP folder. Follow the instructions in the
guide to install this application properly.

3.3. Configuring the MDP Board

3.3.1. Setting Jumpers and Switches

Board reconfiguration is needed before running this demo. Figure 3 highlights (in orange boxes) all switches and
jumpers need to be verified or reconfigured on Mobile Development Platform (MDP) board.

Figure 3.1. iCE40 UltraPlus MDP Configuration

Note: This demo uses FPGA-B.

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-UG-02057-1.0 5

© 2018 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal.