Lattice iCE40 Ultra User Manual
iCE40 Ultra™ Mobile Development Platform User Guide
EB90 Version 1.1, June 2015
iCE40 Ultra Mobile Development Platform User Guide
Introduction
This platform is designed to develop and demonstrate various mobile applications using the iCE40 Ultra device.
The board is in the form factor of a bar phone featuring various sensors and connectivity to external mobile software development platforms.
Kit Contents
The following items are included in the development kit:
• Main Board – The main board is mounted in lower plastic enclosures.
• Key Set – The key set includes keys A, B, C, and Custom. Key A is installed on the main unit by default.
• DragonBoard Interface Module
• Interconnecting Cables – The cables include USB mini-B cable, DragonBoard interface ribbon cable, and +5 V
supply flywire.
Variants
The unit is built in two variants with different sets of RGB LED and IR LED parts.
Variant A includes the following parts on the board:
• RGB LED used at D12: AEBMT-RGBZ by Advanced Optoelectronics Technology
• IR LED used at D7: SFH 4645 by Osram Opto Semiconductors
Variant B includes the following parts on the board:
• RGB LED used at D13: APTF1616SEEZGQBDC by Kingbright
• IR LED used at D7: VSMB2948SL by Vishay Semiconductor
The variants can be distinguished through the populated status of D12 and D13.
• Variant A: D12 is populated and D13 is not populated
• Variant B: D12 is not populated and D13 is populated
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iCE40 Ultra Mobile Development Platform User Guide
MAX44008 (I2C)
RGB ALS
APP PROCESSOR (SPI)
(10 pin CONN)
3.3v
BMP180 (I2C)
Pressure
IR LED (TX)
HIGH POWER
WHITE LED
JUMPER SEL
POOL-B I2C
POOL-A I2C
POWER SUPPLIES
(from USB / Battery)
FT2232H
SPI CONFIG FLASH (SPI)
USB
CHEETAH CONN
LSM330DLC (I2C)
Accel. & Gyro
HALL SENSOR
THESE CONNECTIONS VIA INTERCONNECT
[40 pin FPC connector]
TMD27711 (I2C)
Proximity & ALS #2
Key-socket selection
FINGERPRINT SENSOR I2S MIC#2
SPI
Li-ion BatteryCHARGER
Key-socket selection
RGB LED
I2S MIC#1 SMA CONN
CURRENT MEASURE
CURRENT
MEASURE
BLE Module
IR RX
LSM303DLHC (I2C)
Magentometer
SHT20 (I2C)
Humidity &Temp.
TMD27711 (I2C)
Proximity & ALS #1
POOL-B I2C
POOL-B I2C
3.3V
3.3V
SMA CONN
Operated together
Optional
CONFIG SPI & BANK 1
BANK 2
BANK 0
iCE5LP4KSWG36
SPI
UART
Demo Board Architecture
Figure 1 shows the demo board architecture. The different I2C sensors are split up and wired on two separate I2C
buses as Pool A and Pool B. The other sensors that are not I2C are either wired separately or are connected
instead of Pool B and other resources on the board. Changes to connectivity are user controllable and achieved by
means of changing the keys – a method to replace using multiple jumpers to re-route wiring to different resources.
Figure 1. Block Diagram
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Figure 2. Top View of Main Unit
iCE40 Ultra Mobile Development Platform User Guide
Jumper selection between
IR and White High Power LEDs
BMP180
Pressure Sensor
CDONE LED
RGB LED
iCE40 Ultra
27 MHz
Oscillator
Barcode LED
(Red)
Power Switch
Power LED
SMA Footprint
J15 (Jumper
Pool Header)
IR LED (Emitter)
BLE Module
MAX4408 RGB ALS Sensor
High Power White LED
TMD2711 Proximity Sensor
External Power and
Charging Status Indicator
CRST Button
FPC1080A Fingerprint Sensor
TMD2711 Proximity Sensor
AP Connector
IR Rx (TSMP58000)
SHT20 Humidity Sensor
ADMP441 I2S Mic
USB Port
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Figure 3. Bottom View of Main Unit
ADMP441 I2S Mic
LSM303DLHC
Magnetometer Sensor
LSM330DLC
Accelerometer and
Gyroscope Sensor
iCE40 Ultra Mobile Development Platform User Guide
Key Socket
Battery
Connector
FTDI FT2232H
M25P80
SPI Flash
USB Port
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iCE40 Ultra Mobile Development Platform User Guide
Features
• Supports BLE (Bluetooth Low Energy) module
• Supports OTA (Over-The-Air) configuration of FPGA
• Form factor similar to mobile phone
Sensor list
The following table lists the different sensors used on the board.
Table 1. Sensor List
Number Sensor Function Interface Sensor Part Number Manufacturer
1 RGB LED (Variant 1) Direct AEBMT-RGBZ AOT
2 RGB LED (Variant 2) Direct APTF1616SEEZGQBDC Kingbright
3 High Current IR Tx LED
(Variant A)
4 High Current IR Tx LED
(Variant B)
5 High Current Visible LED Direct XBDA WT-00-0000-
6 IR Rx Direct TSMP58000 Vishay Semiconductor
7 Proximity Sensor
(Two numbers)
8 RGB Light Sensor I2C MAX44008 Maxim-IC
9 Temperature Sensor I2C BMP180 (integrated) Bosch
10 Barometric Pressure I2C BMP180 Bosch
11 Accelerometer I2C LSM330DLC
12 Gyroscope I2C
13 Magnetometer I2C LSM303DLHC ST Micro
14 Humidity I2C SHT20 Sensirion
15 Hall Direct BU52051NV X-TR Rohm Semiconductor
16 Fingerprint SPI FPC1080A Fingerprints
17 MEMS Mic (Two numbers) I2S ADMP441 Invensense
Direct SFH4645 Osram Opto
Direct VSMB2948SL Vishay Semiconductor
Cree Inc.
00000LCE3
I2C TMD27711 A MS-TA OS USA Inc
ST Micro
Key-socket Arrangement
Three predefined keys and one user defined key is provided to allow the user to change the wiring of the board
between different sensor sets as described in Table 2. The table also denotes pin assignments to the iCE40 Ultra
FPGA on the board. While selecting and inserting a particular key of choice, ensure that you align the aligning
arrow on the key and on the main PCB. The keys are mechanically delicate, and hence, you must be careful while
inserting and removing the keys. Figure 4 shows the four keys and socket on the main board.
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iCE40 Ultra Mobile Development Platform User Guide
Orient the direction of the key
using these arrows
Figure 4. Key-socket Arrangement
Pin assignments iCE40 Ultra FPGA
Table 2 lists the complete pin assignments for the iCE40 Ultra FPGA for the different keys and other hard wired
peripherals on the board
Table 2. Pin Assignment
Pin
Number Pin Name Bank
A4 VCCIO_0 Bank 0 3V3 3V3 3V3
B5 IOT_46B_G0 Bank 0 Not used / Optional ext
A6 RGB2 Bank 0 BLED (RGB LED) BLED (RGB LED) I2S_CE1 (Microphone 1)
B6 RGB1 Bank 0 GLED (RGB LED) GLED (RGB LED) I2S_SCK1 (Microphone
C6 RGB0 Bank 0 RLED (RGB LED) RLED (RGB LED) I2S_SD1 (Microphone 1)
A2 IRLED Bank 0 HPLED (IRLED or VLED) HPLED (IRLED or VLED HPLED (IRLED or VLED
A1 VSSIO_LED Bank 0 GNDGNDGND
C3 SPI_VCCIO1 Bank 1 3V3 3V3 3V3
D1 IOB_33B_SI_M
OSI_SPI1
F2 IOB_32A_SO_
MISO_SPI1
E1 IOB_34A_SCK_
SCK_SPI1
F1 IOB_35B_SS_
MCSNO_SPI1
E4 IOB_12A_G4_C
DONE
D3 CRESET_B Bank 1 CRESET CRESET CRESET
B2 IOB_31B Bank 1 HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR HALL_OUT/BMP_XCLR
C1 IOB_30A Bank 1 PoolA_Sensor_SDA PoolA_Sensor_SDA PoolA_Sensor_SDA
E2 IOB_29B Bank 1 Pool_Sensor_SCL Pool_Sensor_SCL Pool_Sensor_SCL
D2 IOB_27B Bank 1 CLK_STNDBY#
B1 IOB_26A Bank 1 FP_RSTn
E3 IOB_20A Bank 1 UART_TX (BLE) UART_TX (BLE) UART_TX (BLE)
Bank 1 ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI ICE_SI/FLSH_MOSI
Bank 1 ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO ICE_SO/FLSH_MISO
Bank 1 FLSH_SCLK FLSH_SCLK FLSH_SCLK
Bank 1 FLSH_CS FLSH_CS FLSH_CS
Bank 1 CDONE CDONE CDONE
Pin Assignment for
Default Key A
SMA clock
(Osc. Standby)
(Fingerprint reset)
Pin Assignment for
Key B
Not used / Optional ext
SMA clock
CLK_STNDBY#
(Osc. Standby)
FP_RSTn
(Fingerprint reset)
Pin Assignment for
Key C
I2S_WS1 (Microphone 1
(DP R51))
1)
CLK_STNDBY#
(Osc. Standby)
FP_RSTn (
Fingerprint reset)
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iCE40 Ultra Mobile Development Platform User Guide
Pin
Number Pin Name Bank
F3 IOB_16A Bank 1 UART_RX (BLE) UART_RX (BLE) UART_RX (BLE)
B4 IOB_10A Bank 1 PROC_INTR PROC_INTR PROC_INTR
C2 IOB_25B_G3 Bank 1 PROC_CS PROC_CS PROC_CS
F4 IOB_11B_G5 Bank 1 CLK (27 MHz) CLK (27 MHz) CLK (27 MHz)
C4 VCCIO_2 Bank 2 3V3 3V3 3V3
E5 IOB_7B Bank 2 BAR_LED FP_INTR (Fingerprint) S_LR2 (Microphone 2)
F5 IOB_6A Bank 2 IR_IN (IR Rx) IR_IN (IR Rx) I2S_LR1
D5 IOB_5B_MCSN
0_SPI2
D6 IOB_4A_SCK_
SPI2
E6 IOB_3B_G6_M
OSI_SPI2
F6 IOB_2A_MISO_
SPI2
D4 VPP_2V5 Power 2V5 2V5 2V5
B3 VCCPLL Power 1V2 1V2 1V2
A5 VCC Power 1V2 1V2 1V2
C5 GND1 Power GNDGNDGND
A3 GND2 Power GNDGNDGND
Bank 2 Spare GPIO on Exp
Bank 2 PoolB_Sensor_SCL FP_SCK (Fingerprint) I2S_SD2
Bank 2 PoolB_Sensor_SDA FP_MOSI (Fingerprint) ISS_SCK2
Bank 2 Spare GPIO on Exp
Pin Assignment for
Default Key A
Header p.16
Header p.20
Pin Assignment for
Key B
FP_CS (Fingerprint) I2S_WS2
FP_MISO (Fingerprint) I2S_CE2
Pin Assignment for
Key C
(Microphone 1)
(Microphone 2)
(Microphone 2)
(Microphone 2)
(Microphone 2)
External Interfacing
The board can be interface to external systems by one of two methods:
• SPI based application processor interface via J16 (AP Conn)
• BLE wireless module
For DragonBoard based SPI based application processor interfacing, a DragonBoard interfacing module and a
connecting ribbon cable are required (provided). Figure 5 shows the interfacing module, connecting cable, and
method to power the module from the DragonBoard.
A BLE module provides a feature on the board for wireless interfacing using Bluetooth Low energy version 4.
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iCE40 Ultra Mobile Development Platform User Guide
Figure 5. Data and 5 V Wiring from DragonBoard to DB Interface Module
Clocking
The board features an onboard 27 MHz oscillator. When an external clock is required, the SMA footprint can be
populated with a suitable SMA SMD connector (such as Molex part # 732511350). You must depopulate R51 on
the board.
Daisy Chain Interconnect / Expansion Connector
Daisy chain interconnect to the iCE FPGA by means of a connecting cable between two boards is possible via J10
on the main board. Refer to the schematics for the pin assignments of J10. All the pins of the FPGA are accessible
on this connector – and hence also forms a convenient way to tap into, or expand from any pin on the FPGA.
Basic Usage Procedures
Powering the Board
The board may be powered using one of three following methods:
• USB cable: USB A to mini B cable (supplied) connected to a PC may be used to power the board
• +5 V supplied to the DragonBoard interface module used to power the board through the provided ribbon cable.
The +5 V can be tapped from the DragonBoard as indicated in the Figure 5.
• Internal rechargeable battery not supplied with the kit. It must be procured separately. An example is the Nokia
BL-5C Lithium-ion battery shown in Figure 7.
Charging the Battery
The battery is charged when USB power is applied. Glowing of the green LED D3 (CHG) indicates the charging of
the battery. Glowing of the green LED D4 (EPW) indicates that an external charging power (USB) is applied. Glowing D3 indicates that charging is in progress. If D3 does not glow and D4 (EPW) glows, it means that charging is
complete.
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