Lanner VES-270 User Manual
Embedded &
Industrial Computing
Hardware Platforms for Embedded and Industrial Computing
VES-270
V1.0
>>
User's Manual
Publication date:2014-05-14
About
About
Overview
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of interest topics or important messages. Below is a
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NOTE: This check mark indicates that
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Online Resources
The listed websites are links to the on-line product
information and technical support.
Resource Website
Lanner http://www.lannerinc.com
Product Resources
RMA http://eRMA.lannerinc.com
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indicates that there is a caution or
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http://www.lannerinc.com/
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Acknowledgement
Intel, Pentium and Celeron are registered trademarks of
Intel Corp.
Microsoft Windows and MS-DOS are registered trademarks
of Microsoft Corp.
All other product names or trademarks are properties of
their respective owners.
Compliances and Certification
CE Certication
This product has passed the CE test for environmental
specifications. Test conditions for passing included the
equipment being operated within an industrial enclosure.
In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly
recommend the use of CE-compliant industrial enclosure
products.
FCC Class A Certication
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when
the equipment is operated in a commercial environment.
This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications. Operation
of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required
to correct the interference at his own expense.
Copyright and Trademarks
This document is copyrighted, © 2014. All rights are
reserved. The original manufacturer reserves the right to
make improvements to the products described in this
manual at any time without notice.
No part of this manual may be reproduced, copied,
translated or transmitted in any form or by any means
without the prior written permission of the original
manufacturer. Information provided in this manual is
intended to be accurate and reliable. However, the original
manufacturer assumes no responsibility for its use, nor for
any infringements upon the rights of third parties that
may result from such use.
Embedded and Industrial Computing
2
TTaTTable of Contentsbeable of Contents
Chapter 1: Introduction 4
System Specication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Chapter 2: System Components 6
System Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block Diagram: The MainBoard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Chapter 3: Board Layout 9
Motherboard Layout- Top View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Motherboard Layout-Bottom View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Connectors and Jumpers List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Chapter 4: Active Displays Support 17
Appendix A: Terms and Conditions 18
Warranty Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
RMA Service . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
3
Chapter 1
Introduction
Chapter 1:
Introduction
Thank you for choosing the VES-270. The VES-270 is
Lanner’s flagship COM Express R2.0 Type 6 module.
It features the new Core i7/i3 processors with QM77
chipset.
This COM Express module provides a rich I/O capabilities
via high-bandwidth interfaces such as PCI Express, Serial
ATA 2.0/3.0, and Hi-Speed USB 2.0/3.0 connectivity.
Other I/O capabilities include general-purpose I/O
(GPIO), SMbus, and displays supporting LVDS, HDMI, DVI
and DisplayPort as well as Intel® 82579LM (PHY) Gigabit
Ethernet.
System Specification
System
CPU Intel® Core™ i7 / i3 (FCBGA 1023) Processors
BIOS AMI 64Mbit SPI BIOS
System Chipset Intel® QM77 Express Chipset
System Memory
Expansion 7 PCIe x1, 1 PCIe x16
MIO 4 SATA ports, SMbus
USB 8 x USB 2.0, 4 x USB 3.0
DIO 4-bit GPI and 4-bit GPO
Chipset Intel® QM77 Chipset Integrated
Memory DVMT 5.0 Up to 512 MB
Resolution
Display Supported HDMI, DVI, DisplayPort
LVDS Interface Dual-channel 18/ 24-bit LVDS
Chipset Intel® QM77 Integrated
Interface Intel® High Denition Audio
LAN Chip Intel® 82579LM (PHY) Gigabit Ethernet
Ethernet Interface 10/ 100/ 1000 Base-Tx Gigabit Ethernet Compatible
Power Requirement +9 ~ +19 V
ACPI
Power Type AT / ATX
Operating Temperature 0 ~ 60°C (32 ~ 140°F)
Storage Temperature -40 ~ 75°C (-40 ~ 167°F)
Operating Humidity 0% ~ 90% Relative Humidity, Non-condensing
Size (L x W) 125 mm x 95 mm (5” x 3.7”)
Weight 0.2 kg (0.44 lbs)
Two 204-pin DDR3 SODIMM Sockets, Supports Up to
16GB DDR3 1333/ 1600 SDRAM
I/O
Display
CRT Mode: 2048 x 1536
LCD / Simultaneous Mode: 1920 x 1200
Audio Interface
Ethernet
Mechanical & Environmental
Single Power ATX Support S0, S3, S4, S5, ACPI 3.0
Compliant
Embedded and Industrial Computing
Ordering Information
VES-270-7A COM Express® R2.0 Type 6 Module with Intel® CoreTM i7-
VES-270-3A
3517UE CPU and QM77 Chipset
COM Express® R2.0 Type 6 Module with Intel® Core
3120ME CPU and QM77 Chipset
TM
i3-
4
Chapter 1
Package Contents
Your package contains the following items:
VES-270 Embedded Board •
Drivers and User’s Manual CD •
Introduction
Embedded and Industrial Computing
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Chapter 2
Chapter 2:
System Components
System Drawing
Mechanical dimensions of the VES-270.
Unit: mm
System Components
Embedded and Industrial Computing
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