LANGER EMV-Technik E 1 User Manual

2016.08.15. E1 user manual
User manual
Immunity development system
E 1
through measurement and modification at the development stage
Copyright (C) Dipl.- Ing. Gunter Langer Nöthnitzer Hang 31 01728 Bannewitz
10.04.2014
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Table of contents: Page
1 Description of the E1 immunity development system 3
2 Description of the E1 components 4
2.1 SGZ 21 pulse density counter / burst generator 5
2.1.1 SGZ 21 as a disturbance generator 5
2.1.2 SGZ 21 as a pulse density counter 6
2.1.3 Preparing the SGZ 21 as a disturbance generator 6
2.1.4 Preparing the SGZ 21 as a pulse density counter and for signal monitoring 7
2.2 Field sources 8
2.2.1 Field sources for magnetic fields 8
2.2.2 Field sources for electric fields 9
2.2.3 Measurement set-up with SGZ 21 to inject burst current with field sources 11
2.3 Sensor 11
2.3.1 Principal mode of operation of the sensor 12
2.4 Magnetic field probes 13
3 The pulse density method 14
4 Prerequisites for interference suppression in a device under test 17
5 Measurement strategies for interference suppression in a device under test 17
5.1 Analysis of the interference current paths 19
5.1.1 Basic principle of magnetic coupling – two-pole injection into the DUT 19
5.1.2 Basic principle of electric coupling – single-pole injection into the DUT 24
5.2 Localisation of weak points with field sources 26
5.2.1 Mechanism of action behind magnetic field coupling 27
5.2.2 Mechanism of action behind electric field coupling 28
5.2.3 Practical procedure for coupling with magnetic field sources 29
5.2.4 Practical procedure for coupling with electric field sources 34
5.3 Monitoring of logic signals from the device under test 39
5.3.1 Use of the pulse density method to evaluate immunity levels 40
5.3.2 Monitoring of logic signals from the device under test 41
5.4 Measurement of burst-related magnetic fields 42
6 Safety instructions 44
7 Warranty 44
8 Technical specifications 45
9 Scope of delivery 46
10 Optional components 47
10.1 S2 magnetic field probe set 47
10.2 Digital or analog optical signal transmission 48
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1 Description of the E1 immunity development system
The E1 immunity development system is an advanced tool for the electronics developer to examine the immunity of modules to pulsed interference (burst/ESD) in experiments. The system allows him to analyse the interference immunity in the confined space of a module. The selective injection of disturbance current into individual sections (disturbance current paths) and application of pulsed electric (E fields) or magnetic (H fields) fields to selected areas of the module's surface are decisive for the localisation of weak points. While pulsed disturbances are applied to the device under test, the signals can be monitored simultaneously via optical fibre without interaction.
The E1 immunity development system has been specially designed for the development process. It helps the developer suppress interference in devices/modules or further harden them since it allows him to clarify the immediate causes of immunity problems and test the effects of counter-measures directly.
The E1 immunity development system cannot be used for standard compliance tests. Testing a module's immunity on the basis of the IEC 61000-4-4 and IEC 61000-4-2 standards, however, is an ideal starting point for examining the device under test with the E1. The disturbances generated by the standard burst generator in accordance with the standard are injected into the supply lines of the device under test and flow back to the generator via ground. The paths on which the pulse-shaped disturbances flow through the device module are not known. An unknown percentage of these disturbances encounters an unknown victim in the device and generates a functional fault. This weak point can usually be pinpointed to a few square centimetres of a module but can only be localised with difficulty in a standard compliance test. The developer does not yet know if and where the disturbance current with its associated magnetic field induces a voltage pulse in a conductor loop or couples electric field capacitively to sensitive lines.
Exact information about the fault pattern that has occurred is the decisive result of a failed compliance test. But the fault pattern does not reveal precisely where the weak point of the device under test lies. A test in accordance with the standard should thus initially be performed to determine the immunity of the device under test so as to identify the fault pattern. The developer can then use the E1 at his workplace to analyse the causes of the immunity problems, where the functional faults shown in the fault pattern provide a certain orientation for interference suppression. The immunity development system allows the developer to verify the effectiveness of EMC modifications carried out in the interference suppression process immediately and thus to achieve a significant reduction in the development time and development costs.
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2 Description of the E1 components
The E1 immunity development system comprises a SGZ 21 pulse density / burst generator, an S31 optical sensor, an MS 02 magnetic field probe with optical fibre output, magnetic and electric field sources and numerous accessories.
Figure 1: E1 hardware scope of delivery.
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2.1 SGZ 21 pulse density counter / burst generator
The SGZ 21 (Figure 2) is a burst generator with potential-free pulse generation on the one hand, and on the other hand the SGZ°21 is also a pulse density counter to measure the disturbance pulses of the device under test.
Figure 2: SGZ 21 pulse density counter / burst generator.
Generator ON/OFF: to switch the SGZ 21 on or off Intensity: potentiometer to gradually adjust the intensity of the disturbance pulses Pulse shape: toggle switch to change between steep and flat pulses Counter display: six-digit counter to measure the pulse density SIGNAL LED display: to indicate the received light signal SPIKE LED display: to indicate the received light signal with pulse trap; the pulse is stretched to a visible
width of 50 ms
Burst output: symmetric output galvanically isolated from ground Counter's optical fibre input: input socket for 2.2 mm plastic optical fibre
The power supply is located on the left side of the generator. A 12 V power supply unit is included in the scope of delivery.
2.1.1 SGZ 21 as a disturbance generator
The SGZ 21 generates potential-free, pulse-shaped disturbances whose edges have a rise time of approx. 2 ns and a fall time of approx. 10 ns. In contrast, a standard generator generates pulse shapes of 5/50 ns. The SGZ 21's smaller pulse width prevents the device under test from being destroyed. Furthermore, working at a lower disturbance voltage level ensures greater safety for the engineer. The SGZ 21 allows partial injection into structural parts, cables, shielding, earth connections and primarily directly into the modules. The disturbance current of the SGZ 21 is generated via a differential output. Consequently, the generated pulsed current does not relate to the generator housing potential.
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The path that the disturbance current takes through the device under test can be defined by contacting the device under test accordingly. Disturbance current can thus be injected into defined sections of the module without significantly influencing the environment. The peak values of the disturbance pulses are between 0 and 1500 volt. They are constantly changed but are stochastically evenly distributed.
- The SGZ 21 has a symmetric output that is galvanically isolated from ground. The disturbance pulses are
coupled out capacitively with alternating polarity.
- The pulse shape toggle switch of the SGZ 21 can be used to change over between steep and flat pulses
to adjust the disturbance effect.
2.1.2 SGZ 21 as a pulse density counter
A counter with an optical input (2.2 mm plastic optical fibre) is integrated in the SGZ 21 (Figure 2). A sensor that is located in the device under test (Chapter 0) or a magnetic field probe transmits light pulses to the SGZ 21 counter via an optical fibre and the optical input. The received light pulses are initially displayed by the "Signal" and the "Spike" LEDs and then counted by the counter. The counter's peak time is 1 s. Using the pulse density method (Chapter 3) allows a very fast assessment of the sensitivity of a device under test.
The SGZ 21 can be operated standing perpendicular on its rear so that you can easily read the counter from above – e.g. when working standing up.
2.1.3 Preparing the SGZ 21 as a disturbance generator
Generator cables and connecting terminals are needed to operate the SGZ 21 as a disturbance generator. The generator cables are connected to the SGZ 21 output sockets via the 4 mm plug (banana plug). The generator cables (Figure 3) end in two-pole 0.64 mm plug pins. Both pins are connected to the core of the cable. Only one plug pin of each generator cable is used to connect the 250 mm long extension cable (Figure 5).
The connection to the device under test is via alligator clips or micro-kleps (miniature clamp-type test probes with rotating grip jaws) (Figure 4). The field sources contained in the E1 system can be connected directly to the extension cables as required.
Figure 3: Generator cables (bottom); two extension cables (top).
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Figure 4: Alligator clips on the left and micro-kleps on the right.
2.1.4 Preparing the SGZ 21 as a pulse density counter and for signal monitoring
The optical fibre has to be inserted into the input up to the limit stop and fastened with the knurled screw (Figure 6).
Figure 6: Optical fibre connection on the SGZ 21.
Figure 5: SGZ 21 with generator cables plus an alligator clip and a micro-klep.
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2.2 Field sources
The field sources are supplied with disturbance current from the SGZ 21 and generate either pulsed magnetic or electric fields depending on the type of field source used. The field intensities of these pulsed fields are comparable to those generated by burst currents on the surface of modules during standard compliance tests. The field sources can be used to subject small areas of the device under test or individual conductor runs to defined disturbances. The field sources contained in the E1 system are optimised so that they generate either a magnetic field or an electric field. Furthermore, the field sources are of different sizes, allowing the developer to apply the pulsed field to differently dimensioned areas on the module. In addition, there are special field sources for specific tasks such as magnetic field sources that couple to conductors via a specially shaped field. Different types of probe heads are offered that are designed for certain measurement tasks. They allow the developer to pinpoint weak points to the millimetre or to search for critical links and connections such as components, conductor runs or IC pins on the defined interference path. The sensitivity of different IC pins can be assessed. Following localisation, the sensitive areas can be treated in a specific way.
E-field-sensitive weak points cannot be identified with H-field sources. Special E-field probes have to be used to localise these weak points. Apart from conductor run sections, high-resistance components such as pull-up resistors or quartz generators may also prove critical in this respect.
2.2.1 Field sources for magnetic fields
The E1 contains four field sources which are able to generate magnetic fields. Thanks to the probe head's various designs, two types of measurements can be performed:
a) Determination of an IC pin's / conductor's sensitivity irrespective of whether a layout-related disturbance is conducted to the IC. This measurement provides the developer with an overview of which IC pins and/or conductor runs are sensitive in general.
b) Localisation of weak points in the layout The disturbance fields applied from outside during the standard compliance test couple to the module's conductor runs at weak points in the layout. The disturbances are passed on to the IC via the conductor runs. The disturbance process triggered by the standard compliance test on the module is generally due to electric and magnetic field coupling. The E1 system contains field sources which have been custom­developed to simulate these field coupling phenomena for fault localisation.
Field pattern
Use
Design
BS 02 is a field source to localise weak points in the layout. The magnetic field source produces a B-field line bundle with a diameter of > 5 cm. It is suitable for investigations on both devices and modules. The size of the probe allows the developer to apply the field to large areas of housing surfaces and inner spaces, connecting elements and modules with conducting structures as well as ICs to identify weak points that are sensitive to magnetic fields.
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BS 04DB is a field source to localise weak points in the layout. It generates a B-field line bundle in the millimetre range (approx. 3 mm). The field beam emerging from the probe's face can be used to scan the surface of circuit boards and resolve magnetically sensitive weak points in small spaces of 3 mm in the field of layout and packaging. The BS°04DB allows the localisation of critical conductor run sections, components and component connections.
BS 05D is a field source to localise weak points in the layout. The magnetic field source generates a B-field line bundle with a diameter of approx. 3 mm similar to the BS 04 DB. But the field lines are at an angle of 90° to the probe shaft. The probe is thus ideal to localise weak points between two printed circuit boards or in hard-to-reach locations of modules between components, for example. Before using the BS 05D field probe, the weak point should be roughly narrowed down with the BS 02 or BS 04DB probe.
BS 05DU is a field source that can be used to determine an individual IC pin's/conductor's sensitivity. The magnetic field source generates a circular magnetic field in the millimetre range. It can also be used as a mini coupling clamp to couple disturbance current into selected individual conductor runs, IC pins, SMD devices and thin lines (ribbon cable). A module often has several insensitive and only a few sensitive signal connections (conductor runs, IC pins). The field source is the ideal tool to quickly identify the sensitive ones and carry out appropriate layout modifications.
2.2.2 Field sources for electric fields
The E1 contains five field sources which are able to generate electric fields. Thanks to the probe head's various designs, two types of measurements can be performed: a) Determination of an IC pin's/conductor's sensitivity b) Localisation of weak points in the layout
The size of the coupling electrode in the probe head is the field sources' distinguishing feature.
ES 08D is a probe tip that can be used to determine an individual IC pin's/conductor's sensitivity. A galvanic isolating point with capacitive coupling of approx. 1 pF is contained in the probe tip which is ideal for very small structures. The pin/conductor run is contacted with the probe tip and its sensitivity determined by changing the intensity on the SGZ 21 ("Intensity" controller) in the test. The field source has to be connected via two poles. One conductor is connected to the probe tip via a coupling capacitance of 1 pF. The second conductor is connected to a counter-electrode, preventing disturbance current from flowing through the device under test unintentionally and thus affecting other areas.
Connection: two-pole
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ES 05D is a field source that can be used to determine the sensitivity of an IC pin/conductor or individual components. The E-field source has a narrow line-shaped coupling electrode in its probe head. This design makes it ideal for being placed on conductor runs and small components and their connections, wires and individual SMD components such as resistors and capacitors. Individual plug contacts or cores of ribbon cables can also be examined. The probe is placed on the component/conductor run to inject the E-field.
Connection: two-pole
ES 02 is a field source to localise weak points in the layout. The size of the field source allows the developer to couple the field to large areas of housing surfaces and inner spaces, connecting elements and components with conducting structures and ICs (e.g. bus systems, LCD displays). The tip of the E-field source can be used to localise small weak points that are sensitive to E-field (conductor runs, quartz crystal oscillators, pull-up resistors, ICs).
Connection: two-pole
ES 01 is a field source to localise weak points in the layout. The field source allows electric coupling to large areas. The probe is ideal for applying an electric field to extensive or line-shaped weak points with a size of 5 to 10 cm and ranks between the ES 02 and ES 00 field sources (please refer to the corresponding description). The ES 02 may be too small and the ES 00 source too large for certain purposes. The ES 01 can also be used to couple disturbance current to a module. The intensity of the disturbance current can be controlled by the distance between the probe and the module.
Connection: single-pole
ES 00 is a field source to localise weak points in the layout. The field source allows electric coupling to large-area or line­shaped structures (150 cm²). Electrically sensitive weak points often extend over large areas from 10 to 15 cm of a module (LCD display, bus systems). These weak points do not respond to small field sources. Large-area field sources such as the ES 00 are needed to identify this type of weak points. The source can also be used for coupling to housings. The ES 00 can also be used to couple disturbance current to a module. The intensity of the disturbance current can be controlled by the distance between the probe and the module.
Connection: single-pole
Key to designations
Example: BS 04 DB
Type of field
Size
Attenuation
Special field shape
BS Field source for magnetic
field
ES Field source for electric
field
00 01 02
D Common-mode
attenuation
B Bundled field lines
U Circular field
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2.2.3 Measurement set-up with SGZ 21 to inject burst current with field sources
The field sources are connected directly to the "Burst output" (Figure 2) of the SGZ 21 via the generator and extension cables. Magnetic field sources are always connected via two poles (Figure 7).
Apart from the field sources themselves, the connecting cables also generate fields that may couple to the device under test and affect the measurement result. Cables should thus always be kept away from the device under test if possible.
2.3 Sensor
The S31 sensor (Figure 8) is a digital probe head to transmit binary signals from the device under test. The sensor has a three-pin shrouded header (RM 2.5 mm). One pin of the shrouded header is the 3.5 V auxiliary power supply. The second pin is the ground pin. The third pin is the input of the probe head. The sensor input is connected internally to a digital IC input. This is connected to digital signals, VCC (</= 5 V) and ground inside the device under test. The IC output supplies an optical transmitter. The transmitter is connected to a 2 mm conical socket to accommodate a 2.2 mm plastic optical fibre (LWL). The light signals from the sensor are transmitted to the "LWL" counter input of the SGZ 21 via an optical fibre.
The level changeover switch allows the signal to be negated. The sensor can be used in two different ways:
a) to detect logic signals in the device under test b) to detect disturbances in the device under test
to a) It is helpful if important signals (Reset, CE) of the device under test are monitored so as to find the causes of problems in immunity investigations with the SGZ 21. When using a conventional oscilloscope probe head, the disturbances are led to the oscilloscope via the probe head. The disturbances would affect the oscilloscope. In addition, the probe head would change the disturbance current paths of the device under test and thus falsify the measurement results. This is the reason why probe heads with an optical fibre connection have to be used. The S31 sensor is such a probe head.
to b) The IC input of the S31 sensor has an immunity level that can be used to detect disturbances in the device under test. The sensor's sensitivity to disturbance pulses depends on the sensitivity of the __00 IC (four NAND gates) that is mounted on it. The user can define the sensor's sensitivity by selecting the IC to be mounted from a certain IC family.
Figure 7: SGZ 21 with BS°04DB magnetic field source.
Depending on their type, field sources for electric fields are connected via one pole or two poles (Figure 31).
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Figure 8: S31 sensor with an IC mounted (top) and without IC (bottom).
Pulse stretching
Which fast transient disturbances the S31 sensor of the E1 can detect depends on the IC mounted. The pulse widths of these disturbances may be in the nanosecond range. Due to the low limit frequency of the optical system (5 MHz), such short disturbances cannot be transmitted. A pulse stretching circuit which stretches short pulses to 100 ns is integrated in the sensor. The optical fibre is then able to transmit these pulses. Neither can the optical system of the sensor transmit frequencies above 5 MHz. The same sensor circuit reduces frequencies > 5 MHz to 5 MHz. Without this circuit, the optical system would not be able to transmit anything. It would assume a high or low state. The circuit ensures that fault states are transmitted from the device under test.
2.3.1 Principal mode of operation of the sensor
The sensor is integrated in the device under test and connected to the line of interest. A three-pole socket (included in the scope of delivery) is glued to the device under test with super glue in the immediate vicinity of the interesting signal line, if possible at the input, and wired with a short CuL wire; the ground, 3­5 V voltage and sensor input are also wired before the sensor is connected (Figure 9). The wiring should be short and laid directly on the module's surface so as to prevent the formation of loops where magnetic or electric fields could couple in.
The S31 sensor is supplied with a 3 to 5 volt voltage from the device under test. If this is not possible, a battery module can be used (not included in the scope of delivery).
Figure 9: S31 sensor connected to an IC in the device under test, for example, via a three-pole socket.
ICs which have been damaged during the measurement can be easily replaced.
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2.4 Magnetic field probes
The magnetic field probe is used to measure burst-related magnetic fields in the device under test. The disturbance current i of the SGZ 21 generates a magnetic field B. The magnetic field which penetrates the probe head induces a voltage in the probe head's induction coil. The voltage drives an optical transmitter diode that is located in the MS 02 probe shaft (Figure 10). Each disturbance pulse of the SGZ 21 causes a light pulse of the optical transmitter diode. The transmitter diode has a 2.2 mm conical socket and is integrated in the MS 02 probe shaft. An optical fibre is guided from the rear end of the MS 02 probe shaft through to the socket of the transmitter diode. The light pulse is transmitted to the SGZ 21 in the same way as with the S31 sensor (Chapter 2.3). The measurement of the magnetic field is based on the pulse density method (Chapter 3).
Figure 10: Measuring a magnetic field with the MS 02 probe.
Fields which penetrate the probe's induction coil in the orthogonal direction induce a voltage. Fields whose direction coincides with the coil plane do not induce a voltage and are thus not detected. The maximum voltage corresponds to the direction of the magnetic field (Figure 11). The MS 02 magnetic field probe is used to determine the field distribution. The probe emits a light pulse for each magnetic field pulse which is detected. The value shown on the SGZ 21 counter is proportional to the mean magnetic field strength measured (Chapter 3, pulse density method). The field line configuration and field density are indicative of the disturbance current distribution in the device under test.
The MS 02 is a passive probe and does not require any auxiliary power. The power needed to generate the light pulses is taken from the burst-related magnetic field. The MS 02 is connected to the SGZ 21 counter input via an optical fibre.
Figure 11: The MS 02 magnetic field probe can detect a magnetic field which is orthogonal to the probe opening/probe shaft.
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3 The pulse density method
The pulse density method is a measuring method which can be used to determine the relative immunity of a device under test. The effect of EMC modifications can be evaluated based on the relative immunity. Furthermore, the pulse density method is the basis for measuring burst-related magnetic fields with MS 02 magnetic field probes and the optional S2 magnetic field measuring system (Chapter 10).
Figure 12: Ramp-like rise of the SGZ 21 disturbance pulses. The immunity level is exceeded n times at different immunity level voltages u.
Figure 12 shows how the pulse density method functions in principal. The voltage u of the disturbance pulses gradually rises from a minimum value to a maximum value up a ramp over the time T = 1 s. This process is continuously repeated. If the disturbance pulses encounter an immunity level u1 in the device under test, the disturbance pulses which are greater than u1 will exceed the immunity level u1. This is n = 11 pulses in the example. If the device under test has a higher immunity level, u3, for example, n = 3 pulses will exceed the immunity level. The number of pulses which exceed the immunity level is inversely proportional to the value of the immunity level.
This principle can be implemented with the E1 components, i.e. the SGZ 21 and the S31 sensor or the MS 02 magnetic field probe. The SGZ 21 generates disturbance pulses which are injected into the device under test. The S31 sensor is used to create an immunity level in the device under test. If the immunity level of the S31 sensor is exceeded, a light pulse is transmitted to the SGZ 21 counter via optical fibre. The counter counts how often the immunity level is exceeded. Depending on the immunity level, the value in the aforementioned example is: n = 3, n = 7, n = 11. These values are proportional to the immunity of the device under test relative to the immunity level of the sensor.
This means: the immunity of the device under test is high at n = 3 and the immunity of the device under test is low at n = 11.
The pulses that are counted in practice may be in the range between 0 and 3,000. A low value is indicative of a high immunity while a higher value is indicative of a low immunity.
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There are two possibilities of creating an immunity level with the S31 sensor in the circuitry of a device under test.
Figure 13: Artificial magnetic field immunity level established by mounting the S31 sensor with enamelled copper wire as a simulated conductor run.
Figure 13 shows the simulation of a signal conductor run with enamelled copper wire. The enamelled copper wire is connected to ground on one side and to the input of the S31 sensor on the other. The SGZ 21 is connected to the device under test via two poles. The disturbance pulses i
Stör
from the SGZ 21 penetrate the device under test and generate a burst-related magnetic field B. The burst-related magnetic field induces a disturbance voltage in the inserted enamelled copper wire loop which becomes effective on the S31 sensor input. A light pulse is triggered when the immunity level of S31 is exceeded.
Figure 14: Artificial electric field immunity level established by mounting the S31 sensor with enamelled copper wire as a simulated conductor run.
Figure 14 shows the simulation of a signal conductor run with enamelled copper wire. The enamelled copper wire is connected to a pull-up resistor on one side and to the S31 sensor input on the other. The SGZ 21 is connected to the device under test via one pole. An electric field is generated at the surface of the device under test. The electric field couples capacitively to the enamelled copper wire and generates a disturbance voltage on the S31 sensor input. A light pulse is triggered when the immunity level of S31 is exceeded.
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