LAMINA BL-2000 User Manual

Page 1
laminaceramics.com
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
Bright Lights. Bright Ideas.
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•HIGH LUMINOUS FLUX IN SMALL FOOTPRINT
•SUPERIOR THERMAL PERFORMANCE FOR IMPROVED RELIABILITY
•LONG
HIGH LUMEN MAINTENANCE
•N
O MERCURY OR LEAD
•CUSTOM SIZES AND SHAPES AVAILABLE
As the market leader in the development and manufacture of super-bright LED
arrays, Lamina brings solid state lighting to applications which until now were
only possible with traditional lighting sources.
Lamina’s LED arrays are manufactured by combining high brightness LEDs from
industry-leading LED manufacturers with Lamina's proprietary packaging tech-
nology, multilayer Low Temperature Co-Fired Ceramic on Metal (LTCC-M). LTCC-M
is a breakthrough in thermal performance for LED packaging technology, a key
factor in determining LED life and reliability. Unmatched thermal performance
coupled with package interconnectivity allows Lamina to densely cluster multiple
LEDs to achieve exceptionally high luminous intensity in very small footprints.
Lamina’s arrays are available in white, RGB and monochrome, from 1W to
100W, and also are available in custom packages.
Lamina BL-2000 white LED arrays are configured with seven cavities, each popu-
lated with multiple LEDs. Multiple LED die in each cavity, a unique feature made
possible with Lamina’s packaging techology, assure Lamina light engines deliver
optimal color uniformity.
Lamina’s white 4300K LED light engines are designed with an enhanced spectral
distribution rich in red for applications demanding improved color rendition (90
typcial CRI) and warmer color temperatures.
Brilliant Light!
BL-2000SERIES
GENERAL ILLUMINATION
TASK LIGHTING
•TABLE LAMPS
•F
LASHLIGHTS
SIGNAGE & CHANNEL LETTERS
ARCHITECTURAL LIGHTING
•DECORATIVE AND MINI-ACCENT
•C
OVE AND
UNDER-
SHELF
•G
ARDEN AND PATHWAY
•STEP LIGHTS
AUTOMOTIVE
•INTERIOR
LCD BACKLIGHT
•COMPUTER DISPLAYS
•HEADS UP DISPLAYS
SIGNALS
•AIRFIELD TAXIWAY
•TRAFFIC
•SECURITY
•BEACONS
•R
AIL
Lamina Light Engines
BL-2000 White
WHITE
4300K LED LIGHT ENGINE
Typical Applications
Page 2
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To see how you can realize all these design benefits, to request a sample, or to speak with an engineer about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
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TM
0.100 [2.54] MAX
0.555 [14.10] SQ
0.570 [14.48] SQ
4X MOUNTING HOLE
FOR 2-56 SCREW
1
4
3
2
Mechanical Specifications
ATTACHMENT RECOMMENDATIONS
Lamina’s BL-2000 Series is configured with solder pads compatible with Sn63 or Sn62 solder. As with many electrical devices, non-acid RMA type sol­der flux should be used to pre­pare the solder pads before application of solder. If wire attachment is performed with a soldering iron, care must be taken to minimize heat transfer to the die and minimize leach­ing of the solderable pads.
ASSEMBLY RECOMMENDATIONS
Lamina BL-2000 LED arrays are designed for attachment to heatsinks with conductive epoxy or screw down for flange mount devices with thermal grease in the joint. In limited cases, thermal transfer tape can be used, but will generally result in higher than desired thermal resistance creating excessive heat and reducing light output and die life.
Technical Data
Part # BL-222D1-00244
Symbol Min Typical Max Unit
Color Temperature ** CCT 3500 4300 5500
ºK
Voltage* V
F
-24- V
Test Current I
F
- 0.21 - A
Power* P - 5 - W
Luminous Flux* Φ
V
91 100 - lm
Thermal Resistance T
R
- 2.63 3.5
ºC
/W
*Note 1. Optical and Electrical specifications are given for the specified drive current at a 25
ºC junction temperature.
**Note 2. Typical CRI is 90.
Page 3
laminaceramics.com
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
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Electrical Connections
Typical Beam Pattern
H
EAT SINK
R
ECOMMENDATIONS
Lamina LED arrays provide effi­cient transfer of heat from the individual LED die to a cus­tomer supplied heat sink. All Lamina LED arrays must be operated at or below 125ºC. A heat sink must be attached to the array with sufficient cooling capacity to keep the die junc­tion below 25ºC. The tempera­ture rise from the array base to the die junction may be deter­mined by calculating the prod­uct of the maximum package thermal resistance and the desired operating power level.
The appropriate heat sink may then be determined by:
O
PTICAL RECOMMENDATIONS
Lamina LED arrays project a Lambertian radiation pattern, with projection angles built into the package cavity at approxi­mately 125º. It will be neces­sary for users to create an opti­cal reflector and lens structure that meets their light disper­sion requirements. Please con­tact Lamina Application Engineering for support with your optical needs.
Junction Temperature Rise (Tj (rise)) = Operating Power (P) x Lamina Array Thermal
Resistance (Tr)
Heat Sink Thermal Resistance
(ºC/W) = (125 - Tj (rise) ­Maximum Ambient Temperature)/P
Page 4
laminaceramics.com
To see how you can realize all these design benefits, to request a sample, or to speak with an engineer about your design, contact Lamina at 800.808.5822 or 609.265.1401 or visit www.laminaceramics.com.
Bright Lights. Bright Ideas.
TM
Specifications subject to change without notice.
Lamina Ceramics
120 Hancock Lane
Westampton, NJ 08060
REV.10.01.04
© 2004 Lamina Ceramics
Luminous Flux with Junction Temperature
L
IGHT OUTPUT VS
. JUNCTION
TEMPERATURE
Light output from LED die will decrease with increasing junc­tion temperature. This effect is particularly acute for die in the 580 to 750 nm range. As a result we recommend that the LED array heat sink design be optimized to maintain the die junction temperature as low as possible.
ESD PROTECTION
LEDs are static sensitive and susceptible to Electrostatic Discharge (ESD) damage. Lamina LED arrays must be handled using ESD damage control precautions.
HANDLING PRECAUTION
Contact with the silicone based encapsulant on the surface of the light engine must be avoid­ed to prevent damage. Do not apply pressure to the silicone based encapsulant or allow it to come into contact with sharp objects. Lamina LED arrays must be handled from the sides.
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