Laird MSD45N Hardware Integration Manual

Laird MSD45N

Hardware Integration Guide
Version 1.1

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Version

Revision Date

Change Description

Hardware Integration Guide, version 1.1

REVISION HISTORY

1.0 25 July 2014 Initial Release

1.1 5 August 2014 Added note to SDIO Timing Requirements regarding SDIO bus clock rate.

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Hardware Integration Guide, version 1.1

CONTENTS

Scope ............................................................................................................................................................. 4

Operational Description .............................................................................................................................. 4

Block Diagram .............................................................................................................................................. 5

Specifications ............................................................................................................................................... 5

Recommended Operating Conditions and DC Electrical Characteristics ................................................. 8

SDIO Timing Requirements ......................................................................................................................... 9

Pin Definitions ............................................................................................................................................ 10

MSD40NBT and MSD45N Pin Comparison Table ...................................................................................... 13

Integration Considerations ....................................................................................................................... 14

Mechanical Specifications ......................................................................................................................... 15

Connector Overview ................................................................................................................................ 15

MSD45N Attached to T-Board ............................................................................................................. 15

Mounting 16

RF Layout Design Guidelines ..................................................................................................................... 16

Regulatory .................................................................................................................................................. 17

Certified Antennas ................................................................................................................................... 17

Documentation Requirements .................................................................................................................. 17

FCC 17

Industry Canada ................................................................................................................................... 19

European Union ................................................................................................................................... 21

Appendix A: Schematic .............................................................................................................................. 24

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Hardware Integration Guide, version 1.1

SCOPE

This document describes key hardware aspects of the Laird MSD45N radio module. This document is
intended to assist device manufacturers and related parties with the integration of this radio into their host
devices. Data in this document is drawn from a number of sources and includes information found in the
Qualcomm Atheros (QCA) AR6003 data sheet issued in January 2010, along with other documents provided
from Qualcomm Atheros.

The information in this document is subject to change. Please contact Laird Technologies or visit

http://www.lairdtech.com/wireless

to obtain the most recent version of this document.

OPERATIONAL DESCRIPTION

This device is a Laird MSD45N radio module which supports IEEE 802.11a/b/g/n
standards via an SDIO (Secure Digital Input/Output) interface. The radio operates
in unlicensed portions of the 2.4 GHz and 5 GHz radio frequency spectrum. The
device is compliant with IEEE 802.11a, 802.11b, 802.11g, and 802.11n standards
using Direct Sequence Spread Spectrum (DSSS) and Orthogonal Frequency
Division Multiplexing (OFDM). The device supports all 802.11a, 802.11b,

802.11g, and 802.11n data rates and automatically adjusts data rates and
operational modes based on various environmental factors.

When operating on channels in the UNII-2 and UNII-2 Extended bands that are in
the 5GHz portion of the frequency spectrum and are subject to Dynamic Frequency Selection requirements,
the MSD45N fully conforms to applicable regulatory requirements. In the event that specified types of radar
are detected by the network infrastructure, the MSD45N fully conforms to commands from the infrastructure
for radar avoidance.

The MSD45N interfaces to host devices via a 60-pin connector. The device is based on the Qualcomm
Atheros AR6003 chip which is an integrated device providing a Media Access Controller (MAC), a Physical
Layer Controller (baseband or BB processor), and fully integrated dual-band radio transceiver. To maximize
operational range, the MSD45N incorporates external 2.4 and 5 GHz power amplifiers (PA) to increase
transmit power. The frequency stability for both 2.4 GHz (802.11b and 802.11g) and 5 GHz (802.11a)
operation is +/- 20 ppm.

On the interface connector (Molex 60-pin connector; pin 21), an I/O voltage level configuration (either 3.3 V
or 1.8 V) is required from the host platform to configure the SDIO bus signal to run at a 3.3 V or 1.8 V signal
level. The MSD45N also provides the 3-wire Wi-Fi/BT coexistence signals to ensure the performance of Wi-Fi
and BT system when they reside in the same platform. A cellular coexistence filter is implemented on the
MSD45N to provide robust performance when implemented with a cellular system.

The MSD45N has its own RF shielding and does not require shielding provided by the host device into which
it is installed in order to maintain compliance with applicable regulatory standards. As such, the device may
be tested in a standalone configuration via an extender card.

The device buffers all data inputs so that it will comply with all applicable regulations even in the presence of
over-modulated input from the host device. Similarly, the MSD45N incorporates power regulation to comply
with all applicable regulations even when receiving excess power from the host device.

The MSD45N combines the 2.4 and 5 GHz signal path to signal U.FL type antenna connectors to support dual
band transmission and receive. An antenna diversity function is

NOT supported in this product. Supported

host device antenna types include dipole and monopole antennas.

Regulatory operational requirements are included with this document and may be incorporated into the
operating manual of any device into which the MSD45N is installed. The MSD45N is designed for installation
into mobile devices such as vehicle mount data terminals (which typically operate at distances greater than 20
cm from the human body) and portable devices such as handheld data terminals (which typically operate at
distances less than 20 cm from the human body). See “Documentation Requirements

” for more information.

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Feature

Description

Physical Interface

Wi-Fi Interface
Note:

Antenna Interface

Main Chip

Input Voltage Requirements

I/O Signalling Voltage

Average Current
Consumption

Note:

Mode

1.8 V

3.3 V

Avg.

Current

Max.

Current

Avg.

Current

(mA)

Max.

Current

(mA)

802.11a

Transmit

0.11

0.11

496

500

Receive

0.11 - 0.2

-

Standby

TBD

TBD

TBD

TBD

802.11b

Transmit

0.11

0.11

380

420

Receive

0.11 - 0.2

-

Standby

TBD

TBD

TBD

TBD

802.11g

Transmit

0.11

0.11

355

410

Receive

0.11 - 0.2

-

Hardware Integration Guide, version 1.1

BLOCK DIAGRAM

Figure 1: MSD45 Block Diagram

Note: Transmitter frequencies for Wi-Fi are 2412-2462 MHz and 5180-5805 MHz.

SPECIFICATIONS

Table 1: Specifications

Molex 54722-0607 60-pin connector (mates to Molex 55560-0607 60-pin
connector)

1-bit or 4-bit Secure Digital I/O

Can support 1.8 V or 3.3 V depending on the supply voltage on VDDIO

(pin-21).
1 Hirose U.FL connector
Qualcomm Atheros AR6003 single-chip client

3.3 VDC ± 5% (core)

3.3 VDC ± 5%

1.8 VDC ± 5%

(At maximum transmit
power setting)

Standby

radio operating in PM1
powersave mode.

refers to the

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Standby TBD TBD TBD TBD

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Feature

Description

802.11n
(2.4 GHz)

Transmit

0.11

0.11

342

420

Receive

0.11 - 0.2

-

Standby

TBD

TBD

TBD

TBD

802.11n
(5 GHz)

Receive

0.11 - 0.2

-

Standby

TBD

TBD

TBD

TBD

Sleep

N/A

TBD

TBD

TBD

TBD

Operating Temperature

Operating Humidity

Storage Temperature

Storage Humidity

Maximum Electrostatic
Discharge

Length

Width

Thickness

Weight

Mounting

Wi-Fi Media

Wi-Fi Media Access Protocol

Network Architecture Types

Wi-Fi Standards

Wi-Fi Data Rates Supported
Wi-Fi Modulation

802.11n Spatial Streams

Regulatory Domain Support

2.4 GHz Frequency Bands

Hardware Integration Guide, version 1.1

-20° to 70°C (-4° to 158°F)
10 to 90% (non-condensing)

-40° to 85°C (-40° to 185°F)
10 to 90% (non-condensing)
Maximum Contact Discharge (CD): 4 kV

Maximum Air Discharge (AD): 8 kV
32 mm (1.26 in.)
22 mm (0.87 in.)

3.38 mm (0.17 in.)

0.2 g (0.08 oz.)
60-pin connector, three grounded mounting holes (M2 screws)
Direct Sequence-Spread Spectrum (DSSS)

Complementary Code Keying (CCK)
Orthogonal Frequency Divisional Multiplexing (OFDM)

Carrier sense multiple access with collision avoidance (CSMA/CA)
Infrastructure and ad hoc
IEEE 802.11a, 802.11b, 802.11d, 802.11e, 802.11g, 802.11h, 802.11i, 802.11n

802.11a (OFDM): 6, 9, 12, 18, 24, 36, 48, 54 Mbps

802.11b (DSSS, CCK): 1, 2, 5.5, 11 Mbps

802.11g (OFDM): 6, 9, 12, 18, 24, 36, 48, 54 Mbps

802.11n (OFDM,HT20,MCS 0-7): 6.5,13,19.5, 26, 39,52, 58.5, 72.2 Mbps

7.2,14.4, 21.7, 28.9,43.3, 57.8, 65 Mbps
BPSK @ 1, 6, 6.5, 7.2 and 9 Mbps

QPSK @ 2, 5.5, 11, 12, 13, 14.4,18, 19.5 and 21.7 Mbps
16-QAM @ 24, 26, 28.9, 36, 39 and 43.3 Mbps
64-QAM @ 48, 52, 54, 57.8, 58.5, 65, and 72.2 Mbps

1x1 SISO (Single Input, Single Output)
FCC (Americas, Parts of Asia, and Middle East)

ETSI (Europe, Middle East, Africa, and Parts of Asia)
MIC (Japan) (formerly TELEC)
KC (Korea) (formerly KCC)

ETSI: 2.4 GHz to 2.483 GHz
FCC: 2.4 GHz to 2.483 GHz
MIC (Japan): 2.4 GHz to 2.495 GHz
KC: 2.4 GHz to 2.483 GHz

Transmit 0.11 0.11 422 500

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Feature

Description

2.4 GHz Operating
Channels

ETSI:13 (3 non-overlapping)
FCC:11 (3

MIC (Japan):14 (4 non-overlapping)

5 GHz Frequency Bands

ETSI

FCC

5 GHz Operating Channels

ETSI:1
FCC: 23 non

Transmit Power

Note:

Note:

802.11a:

802.11b:

802.11g:

802.11n

802.11n

Typical Receiver Sensitivity

Note:

802.11a:

802.11b:

802.11g:

802.11n

802.11n
MCS7 Mbps -71 dBm

Operating Systems
Supported

Security

Standards

Note:

Encryption

Encryption Key Provisioning

Hardware Integration Guide, version 1.1

Transmit power

varies according to
individual country
regulations. All values
nominal, +/-2 dBm.

Laird 45 series radios
support a single
spatial stream and 20
MHz wide channels
for N rates.

All values nominal,

+/-3 dBm.

non-overlapping)

5.15 GHz to 5.35 GHz

5.47 GHz to 5.725 GHz

5.15 GHz to 5.35 GHz

5.725 GHz to 5.82 GHz

9 non-overlapping)

-overlapping

KCC:13 (3 non-overlapping)

MIC 5.15 GHz to 5.35 GHz
KC 5.15 GHz to 5.35 GHz

5.47 GHz to 5.725 GHz

5.725 GHz to 5.82 GHz

MIC: 8 non-overlapping
KC: 8 non-overlapping

6 Mbps 15 dBm (32 mW)

54 Mbps 15 dBm (32 mW)

1 Mbps 16 dBm (40 mW)

11 Mbps 16 dBm (40 mW)

6 Mbps 16 dBm (40 mW)

54 Mbps 14 dBm (25 mW)

(2.4 GHz): 6.5 Mbps (MCS0) 16 dBm (40 mW)

65 Mbps (MCS7) 12 dBm (16 mW)

(5 GHz): 6.5 Mbps (MCS0) 15 dBm (32 mW)

65 Mbps (MCS7) 12 dBm (16 mW)

6 Mbps -91 dBm

54 Mbps -73 dBm (PER <=10%)

1 Mbps -92 dBm

11 Mbps -84 dBm (PER <=10%)

6 Mbps -91 dBm

54 Mbps -74 dBm (PER <=10%)

(2.4 GHz): MCS0 Mbps -89 dBm

MCS7 Mbps -71 dBm

(5 GHz): MCS0 Mbps -89 dBm

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Android, Linux, Windows CE, Windows Mobile (NDIS5)

Wireless Equivalent Privacy (WEP)
Wi-Fi Protected Access (WPA)
IEEE 802.11i (WPA2)

Support for Federal Information Processing Standards (FIPS) is pending.

Wireless Equivalent Privacy (WEP, RC4 Algorithm)
Temporal Key Integrity Protocol (TKIP, RC4 Algorithm)
Advanced Encryption Standard (AES, Rijndael Algorithm)

Static (40-bit and 128-bit lengths)
Pre-Shared (PSK)
Dynamic

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Feature

Description

802.1X Extensible Authentication Protocol Types

EAP
EAP
EAP
PEAP-GTC

Compliance

ETSI Regulatory Domain

FCC Regulatory Domain

Industry Canada

Certifications

Note:

Warranty

Limited Lifetime

All specifications are subject to change without notice

Symbol

Parameter

Min.

Typ.

Max.

Unit

VCC3_3

Power supply voltage with respect to ground

-0.3 - 4.0 V

VDD_IO

Power supply voltage with respect to ground

-0.3 - 4.0 V

+/-2%, 10KHz~100KHz
Max. values not exceeding Operating voltage

- - 2 %
RFin

Symbol

Parameter

Min.

Typ.

Max.

Unit

VCC3_3

Power supply voltage with respect to ground

3.14 3.3 3.46 V

Power supply voltage with respect to ground

1.71

1.8

1.89

Hardware Integration Guide, version 1.1

-FAST

-TLS

-TTLS

EN 300 328
EN 301 489-1
EN 301 489-17
EN 301 893
EN 60950-1
EN 62311
EU 2002/95/EC (RoHS)

FCC 15.247 DTS – 802.11b/g (Wi-Fi) – 2.4 GHz & 5.8 GHz
FCC 15.407 UNII – 802.11a (Wi-Fi) – 2.4 GHz & 5.4 GHz

PEAP-MSCHAPv2
PEAP-TLS
LEAP

RECOMMENDED OPERATING CONDITIONS AND DC ELECTRICAL CHARACTERISTICS

Table 2: Absolute Maximum Ratings

Voltage Ripple

Table 3: Recommended Operating Conditions

VDD_IO

These certifications

are pending.

Maximum RF input (reference to 50 ohm) - - +10 dBm

RSS-210 – 802.11a/b/g/n (Wi-Fi) – 2.4 GHz, 5.8 GHz, 5.2 GHz, and 5.4 GHz
Wi-Fi Alliance

802.11a, 802.11b, 802.11g , 802.11n
WPA Enterprise
WPA2 Enterprise

Cisco Compatible Extensions (Version 4)

3.14

3.3

3.46 V V

Note: VDD_IO is a voltage from the host platform to configure the I/O signal level. It can be set 1.8 or 3.3 V.

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Symbol

Parameter

Min.

Typ.

Max.

Unit

Hardware Integration Guide, version 1.1

SDIO Timing Requirements

The following figure (Figure 1) and table display SDIO default mode timing.

Note: The SDIO bus should not exceed a 25 MHz clock rate.

Figure 2: SDIO Default Mode Timing

Note: Timing is based on CL ≤ 40 pF load on CMD and Data.

Table 4: SDIO Timing Requirements

fPP Frequency – Data Transfer mode 0 - 50 MHz
tWL Clock low time 7 - - ns
tWH Clock high time 7 - - ns
tTLH Clock rise time - - 10 ns
tTHL Clock low time - - 10 ns
Inputs: CMD, DAT (referenced to CLK)
tISU Input setup time 6 - - ns
tIH Input hold time 2 - - ns
Outputs: CMD, DAT (referenced to CLK)
tODLY Output delay time – Data Transfer mode 0 - 14 ns

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Pin

#

Name

I/O

Default

State

Ref.

Description

If Unused

Note:

Hardware Integration Guide, version 1.1

PIN DEFINITIONS

Table 5: Pin Definitions

-

1 GND

2 No Connect - - No internal connection. Leave it open Leave open

3 BT_PRIORITY I Hi-Z VDD_IO

4 No Connect - - No internal connection. Leave it open Leave open

5 No Connect - - No internal connection. Leave it open Leave open

6 No Connect - - No internal connection. Leave it open Leave open

7 No Connect - - No internal connection. Leave it open Leave open

8 No Connect - - No internal connection. Leave it open Leave open

9 No Connect - - No internal connection. Leave it open Leave open

10 No Connect - - No internal connection. Leave it open Leave open

11 No Connect - - No internal connection. Leave it open Leave open

12 No Connect - - No internal connection. Leave it open Leave open

13 VCC3_3 - 3.3 V Module Power

14 No Connect - - No internal connection. Leave it open Leave open

15 No Connect - - No internal connection. Leave it open Leave open

16 No Connect - - No internal connection. Leave it open Leave open

17 No Connect - - No internal connection. Leave it open Leave open

18 No Connect - - No internal connection. Leave it open Leave open

19 No Connect - - No internal connection. Leave it open Leave open

20 No Connect - - No internal connection. Leave it open Leave open

21 VDD_IO

22 No Connect - - No internal connection. Leave it open Leave open

23 No Connect No internal connection. Leave it open Leave open

24 No Connect - - No internal connection. Leave it open Leave open

25 No Connect No internal connection. Leave it open Leave open

26 No Connect - - No internal connection. Leave it open Leave open

27 SDIO_DATA_2 I/O Pull-H VDD_IO

28 WL_ACTIVE O Low VDD_IO

29 VCC3_3 - 3.3 V Module Power

-

Ground

3-Wire Wi-Fi/BT coexistence signal
BT_PRIORITY for Bluetooth coexistence

I/O bus voltage configuration;

Either 3.3 V or 1.8 V

SDIO Data2

See “Integration Considerations” for additional
integration information.

3-Wire Wi-Fi/BT coexistence signal;
WLAN_ACTIVE for Bluetooth
coexistence

Must be
connected to
GND

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Pin

#

Name

I/O

Default

State

Ref.

Description

If Unused

Hardware Integration Guide, version 1.1

30 GND

­Ground

Must be
connected to
GND

31 GND

­Ground

Must be
connected to
GND

32 No Connect - - No internal connection. Leave it open Leave open

33 No Connect - - No internal connection. Leave it open Leave open

34 No Connect - - No internal connection. Leave it open Leave open

35 No Connect - - No internal connection. Leave it open Leave open

36 BT_ACTIVE I Hi-Z VDD_IO

3-Wire Wi-Fi/BT coexistence signal;
BT_ACTIVE for Bluetooth coexistence

37 No Connect - - No internal connection. Leave it open Leave open

38 No Connect - - No internal connection. Leave it open Leave open

39 No Connect - - No internal connection. Leave it open Leave open

40 No Connect - - No internal connection. Leave it open Leave open

41 No Connect - - No internal connection. Leave it open Leave open

Used for the following:

 Antenna switch control signal when

sharing antenna with BT signal. See
“Sharing Antenna Implementation”
for more information.

42

WL_LED_ACT/

ANTE

O LOW VCC3_3

 LED indicator for Wi-Fi is active

(sending a signal).

43 No Connect - - No internal connection. Leave it open Leave open

44 No Connect - - No internal connection. Leave it open Leave open

45 No Connect - - No internal connection. Leave it open Leave open

46 No Connect - - No internal connection. Leave it open Leave open

47 No Connect - - No internal connection. Leave it open Leave open

48 CHIP_PWD_L I Pull-H VDD_IO

Input signal to power down the
module. Active low

See Note 1

.

See Note Regarding CHIP_PWD_L.

49 No Connect - - No internal connection. Leave it open Leave open

50 No Connect - - No internal connection. Leave it open Leave open

51 No Connect - - No internal connection. Leave it open Leave open

52 No Connect - - No internal connection. Leave it open Leave open

53 No Connect - - No internal connection. Leave it open Leave open

54 No Connect - - No internal connection. Leave it open Leave open

55 SDIO_CMD I/O Pull-H VDD_IO SDIO Command

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Pin

#

Name

I/O

Default

State

Ref.

Description

If Unused

Hardware Integration Guide, version 1.1

56 SDIO_CLK I Hi-Z VDD_IO SDIO Clock (25 MHz max)

57 SDIO_DATA_0 I/O Pull-H VDD_IO SDIO Data 0

58 SDIO_DATA_3 I/O Pull-H VDD_IO SDIO Data 3

59 SDIO_DATA_1 I/O Pull-H VDD_IO SDIO Data 1

60 GND

­Ground

Must be
connected to
GND

Note 1: If the following lines are available on the radio you are integrating into your system, you must

connect and control them with the host device.

 CHIP_PWD_L
 SYS_RST_L
 BT_RST_L
 VDDIO_DR

If the radio stays powered up and the host goes down or is reset, communications cannot be re­established with the radio. The host SDIO controller must re-establish communication with the
radio by reloading the radio firmware after a power-on or a reset.

Note Regarding CHIP_PWD_L: During power on/down period, the CHIP_PWD_L must be held in low state
longer than 5 µsec (T

To reset the MSD45N, set the CHIP_PWD_L in low state longer than 5 µsec (T

and TB) after the VCC3_3 reaches its high state. See Figure 3.

A

). See Figure 4.

C

Figure 3: Power on/down timing

Figure 4: Reset timing

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Pin #

Pin Name

Pin Name

Pin #

Pin Name

Pin Name

MSD40NBT

MSD45N

MSD40NBT

MSD45N

1

2

32

No Connect

3

BT_PRIORITY

BT_PRIORITY

33

No Connect

No Connect

4

5

35

No Connect

6

BT_UART_RXD

No Connect

36

RSVD

BT_ACTIVE

7

8

38

No Connect

9

39

No Connect

10

11

41

No Connect

12

BT_WAKE_B

No Connect

42

RSVD

WL_LED_ACT/ANTE

13

14

44

No Connect

15

No Connect

No Connect

45

No Connect

No Connect

16

17

47

No Connect

18

48

CHIP_PWD_L

19

20

50

No Connect

21

No Connect

VDD_IO

51

No Connect

No Connect

22

23

53

No Connect

24

BT_PCM_CLK

No Connect

54

RSVD

No Connect

25

26

56

SDIO_CLK

27

57

SDIO_D0

28

29

59

SDIO_D1

30

GND

GND

60

GND

GND

Hardware Integration Guide, version 1.1

MSD40NBT and MSD45N Pin Comparison Table

GND GND
BT_UART_TXD No Connect

BT_GPIO_6 No Connect
BT_UART_RTS_N No Connect

BT_HOST_WAKE_B No Connect
RSVD No Connect
RSVD No Connect
BT_PCM_OUT No Connect
BT_UART_CTS_N No Connect

VCC3_3 VCC3_3
No Connect No Connect

No Connect No Connect
No Connect No Connect
No Connect No Connect
No Connect No Connect
BT_PCM_SYNC No Connect

31

34

37

40

43

46

49

GND
BT_RST_L

No Connect
No Connect

No Connect
No Connect
No Connect
No Connect
No Connect

No Connect
No Connect

No Connect
No Connect
CHIP_PWD_L
No Connect
RSVD

GND

No Connect

No Connect

No Connect

No Connect

No Connect

No Connect

BT_PCM_IN No Connect
No Connect No Connect

No Connect No Connect
SYS_RST_L No Connect
SDIO_DATA_2 SDIO_D2
RSVD WL_ACTIVE
VCC3_3 VCC3_3

52

55

58

RSVD
RSVD

SDIO_CMD
SDIO_CLK
SDIO_DATA_0
SDIO_DATA_3
SDIO_DATA_1

No Connect

SDIO_CMD

SDIO_D3

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Note: Although these values may vary with the properties of your host interface and the PCB, they

Note:

found to be unnecessary, zero (0) ohm jumpers may be used in their place.

Notes:

after VCC3_3 ramps up and settles

Hardware Integration Guide, version 1.1

Integration Considerations

The following Wi-Fi information should be taken into consideration when integrating the MSD45N.

Series resistors are recommended in all six SDIO lines (27-56 ohms typically):

 SDIO_CLK
 SDIO_CMD
 SDIO_DATA_0

are a reasonable starting point.

The series resistors in the SDIO bus provide several design benefits:

 If a host controller has too high of a drive strength, then bus ringing may result. Series

 Adding 27-56 ohms of series resistance on the SDIO bus will reduce sharp transitional

 Having the series resistors in the PCB layout allows for design flexibility; if they are later

resistors can reduce this ringing on the I/O lines.

edges, which may reduce EMI.

 SDIO_DATA_1
 SDIO_DATA_2
 SDIO_DATA_3

Also note the following:

 Rout the SDIO bus as short and as similar in length as possible.
 Keep the clock trace separate from other signal traces.

No pull-up is required on the CLK line.

Make sure to apply the proper voltage on the VDD_IO input to the SiP to match the
signalling voltage of the SDIO host interface (1.8V or 3.3V typically, but it can be
anything in between these values).

The SDIO host must wait a minimum of 5 µsec before initiating access to the MSD45N

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Units are millimeters

Hardware Integration Guide, version 1.1

MECHANICAL SPECIFICATIONS

Connector Overview

MSD45N connector: Molex 54722-0607 60-pin connector

Mating connector (on board): Molex 55560-0607 60-pin connector

Figure 5: Mechanical Drawing

MSD45N Attached to T-Board

Figure 6: MSD45N attached to T-board

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Hardware Integration Guide, version 1.1

Mounting

The MSD45N connects to the host via a 60-pin connector. In addition, there are three mounting holes used
to secure the device to the host using 2 mm mounting screws.

Laird recommends a 1.5 mm metal spacer (bushing) with a conductive mounting screw to connect the
exposed ground pads of the radio circuit board to the host ground plane. A 1.5 mm conductive metal spacer
with a maximum OD of 4 mm maximizes grounding of the radio and helps to reduce emissions from the
radio circuit board. The spacer may also prevent the MSD board from slanting and breaking the connection
to the host device when the board is attached to the host.

Figure 7: Mounting Recommendations

RF LAYOUT DESIGN GUIDELINES

The following is a list of RF layout design guidelines and recommendation when installing a Laird radio into
your device.

 Do not run antenna cables directly above or directly below the radio.
 Do not place any parts or run any high speed digital lines below the radio.
 If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the

devices as far apart from each other as possible.

 Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird

radio from the antenna. In addition, do not place antennas directly above or directly below the radio.

 Laird recommends the use of a double shielded cable for the connection between the radio and the

antenna elements.

 Laird has provided three plated mounting holes that can be used for grounding. When additional ground

plane is required, you may use some or all of these grounded mounting holes.

 Use proper electro-static-discharge (ESD) procedures when installing the Laird radio module.

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Model

Type

Connector

Maximum Gain

2.4-2.5 GHz:

5.15-5.35 GHz:

5.6 GHz:

2.4 GHz:
5 GHz:

2.5 GHz only:

2.4-2.5 GHz:

4.9-5.1 GHz:

5.15-5.35 GHz:

5.7-5.9 GHz:

Hardware Integration Guide, version 1.1

REGULATORY

Certified Antennas

The MSD45N will be tested to the regulatory standards defined in the “Certifications” section of the
Specifications table above. Laird Technologies plans to conduct these tests with the following antennas:

MAG.LAYERS
EDA-1513-25GR2-B2-CY

MAG.LAYERS
PCA-4606-2G4C1-A13-CY

Laird
NanoBlade-IP04

Laird
MAF95310 Mini NanoBlade Flex

Laird
NanoBlue-IP04

Ethertronics
WLAN_1000146

Antennas of differing types and higher gains may be integrated as well. If necessary, with the Laird
Manufacturing Utility software utility, OEMs may reduce the transmit power of the MSD45N to account for
higher antenna gain. In some cases, OEMs may be able to reduce certification efforts by using antennas that
are of like type and equal or lesser gain to the above listed antennas.

Dipole

PCB Dipole TNOV

PCB Dipole IPEX MHF

PCB Dipole IPEX MHF

PCB Dipole IPEX MHF

Magnetic
Dipole

SMA
Jack Reverse

IPEX MHF

2 dBi

2.2 dBi

2 dBi

3.9 dBi

4 dBi

2.79 dBi

3.38 dBi

2 dBi

2 dBi

3.5 dBi

3.5 dBi

3.5 dBi

Documentation Requirements

In order to maintain regulatory compliance, when integrating the Laird MSD45N into a host device and
leveraging Laird’s grants and certifications, it is necessary to meet the documentation requirements set forth
by the applicable regulatory agencies. The following sections (FCC, Industry Canada, and European Union)
outline the information that may be included in the user’s guide and external labels for the host devices into
which the MSD45N is integrated.

FCC

Note: You must place “Contains FCC ID: SQG-MSD45N” on the host product in such a location that it

can be seen by an operator at the time of purchase.

User’s Guide Requirements

When integrating the MSD45N into a host device, the integrator must include specific information in the
user’s guide for the device into which the MSD45N is integrated. The integrator must not provide information
to the end user regarding how to install or remove this RF module in the user’s manual of the device into
which the MSD45N is integrated. The following FCC statements must be added in their entirety and without
modification into a prominent place in the user’s guide for the device into which the MSD45N is integrated:

www.lairdtech.com/wireless

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Hardware Integration Guide, version 1.1

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:

1. Reorient or relocate the receiving antenna.

2. Increase the separation between the equipment and receiver.

3. Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

4. Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for

compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.

This device is restricted to

indoor

use when operated in the 5.15 to 5.25 GHz frequency range.

FCC requires this product to be used indoors for the frequency range 5.15 to 5.25 GHz to reduce the
potential for harmful interference to co-channel Mobile Satellite systems.

This device does not permit operations on channels 116-128 (5580 – 5640 MHz) for 11na and 120-128
(5600-5640 MHz) for 11a which overlap the 5600 -5650 MHz band.

IMPORTANT NOTE: FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:

 The antenna must be installed such that 20 cm is maintained between the antenna and users, and
 The transmitter module may not be co-located with any other transmitter or antenna,
 For all products marketed in the United States, the OEM must limit the operation channels from

CH1 to CH11 for 2.4 GHz band by the supplied firmware programming tool. The OEM shall not
supply any tool or information to the end-user regarding Regulatory Domain change.

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Hardware Integration Guide, version 1.1

As long as the three conditions above are met, further transmitter testing is not required. However, the
OEM integrator is still responsible for testing their end-product for any additional compliance
requirements required with this module installed.

IMPORTANT NOTE: In the event that these conditions cannot be met (for example, certain laptop

configurations or co-location with another transmitter), then the FCC authorization
is no longer considered valid and the FCC ID cannot be used on the final product.
In these circumstances, the OEM integrator is responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna is installed such that 20 cm is
maintained between the antenna and users. The final end product must be labeled in a visible area with the
following: “Contains FCC ID: SQG-MSD45N”.

Manual Information to the End User

The OEM integrator may NOT provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warnings as show in this Hardware
Integration Guide.

Industry Canada

Note: You must place “Contains IC ID: 3147A-MSD45N” on the host product in such a location that it

can be seen by an operator at the time of purchase.

User’s Guide Requirements (for Model # MSD45N)

RF Radiation Hazard Warning

To ensure compliance with FCC and Industry Canada RF exposure requirements, this device must be installed
in a location where the antennas of the device will have a minimum distance of at least 20 cm from all
persons. Using higher gain antennas and types of antennas not certified for use with this product is not
allowed. The device shall not be co-located with another transmitter.

Installez l'appareil en veillant à conserver une distance d'au moins 20 cm entre les éléments rayonnants et les
personnes. Cet avertissement de sécurité est conforme aux limites d'exposition définies par la norme CNR­102 at relative aux fréquences radio.

Maximum Antenna Gain – If the integrator configures the device such that the antenna is detectable from
the host product.

This radio transmitter (identify the device by certification number, or model number if Category II) has been
approved by Industry Canada to operate with the antenna types listed below with the maximum permissible
gain and required antenna impedance for each antenna type indicated. Antenna types not included in this
list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with
this device.

Antenna list refer to Certified Antennas

Le présent émetteur radio (IC: XXXXX-XXXXXXXXX) a été approuvé par Industrie Canada pour fonctionner
avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise
pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au
gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

www.lairdtech.com/wireless

.

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Hardware Integration Guide, version 1.1

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de
brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement.

This device is intended only for OEM integrators under the following conditions:

 The antenna must be installed such that 20 cm is maintained between the antenna and users, and
 The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements
required with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

 L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les

utilisateurs, et

 Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions cannot be met (for example certain laptop configurations or co­location with another transmitter), then the Canada authorization is no longer considered valid
and the IC ID can not be used on the final product. In these circumstances, the OEM integrator will
be responsible for re-evaluating the end product (including the transmitter) and obtaining a
separate Canada authorization.

NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations

d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du
Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final.
Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris
l'émetteur) et l'obtention d'une autorisation distincte au Canada.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20
cm may be maintained between the antenna and users. The final end product must be labeled in a visible
area with the following: “Contains IC: ”.

Plaque signalétique du produit final

Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être
installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le
produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: ".

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

www.lairdtech.com/wireless

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Hardware Integration Guide, version 1.1

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon
d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce
module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements
comme indiqué dans ce manuel.

European Union

User’s Guide Requirements

The integrator must include specific information in the user’s guide for the device into which the MSD45N is
integrated. In addition to the required FCC and IC statements outlined above, the following R&TTE
statements must be added in their entirety and without modification into a prominent place in the user’s
guide for the device into which the MSD45N is integrated:

This device complies with the essential requirements of the R&TTE Directive 1999/5/EC. The following test
methods have been applied in order to prove presumption of conformity with the essential requirements of
the R&TTE Directive 1999/5/EC:

 EN60950-1:2006+A11+A1+A12:2011

Safety of Information Technology Equipment

 EN 62311: 2008 / Article 3(1)(a) and Article 2 2006/95/EC)

Assessment of electronic and electrical equipment related to human exposure restrictions for
electromagnetic fields (0 Hz-300 GHz)

 EN 300 328 V1.8.1: 2012-06

Electromagnetic compatibility and Radio spectrum Matters (ERM); Wideband transmission systems;
Data transmission equipment operating using wide band modulation techniques; Harmonized EN
covering the essential requirements of article 3.2 of the R&TTE Directive

 EN 301 893 V1.7.1: 2012-06

Broadband Radio Access Networks (BRAN); 5 GHz high performance RLAN; Harmonized EN covering the
essential requirements of article 3.2 of the R&TTE Directive

 EN 301 489-1 V1.9.2: 2011

Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC)
standard for radio equipment and services; Part 1: Common technical requirements

 EN 301 489-17 V2.2.1 2012

Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC)
standard for radio equipment; Part 17: Specific conditions for Broadband Data Transmission Systems

This device is a 2.4 GHz wideband transmission system (transceiver), intended for use in all EU member states
and EFTA countries, except in France and Italy where restrictive use applies.

In Italy the end-user should apply for a license at the national spectrum authorities in order to obtain
authorization to use the device for setting up outdoor radio links and/or for supplying public access to
telecommunications and/or network services.

This device may not be used for setting up outdoor radio links in France and in some areas the RF output
power may be limited to 10 mW EIRP in the frequency range of 2454 – 2483.5 MHz. For detailed information
the end-user should contact the national spectrum authority in France.

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esky

[Czech]

ř

Dansk

[Danish]

Deutsch

[German]

Eesti

[Estonian]

English

Español

[Spanish]

Ελληνική

[Greek]

ΣΧΕΤΙΚΕΣ ΔΙΑΤΑΞΕΙΣ ΤΗΣ ΟΔΗΓΙΑΣ

Français

[French]

Italiano

[Italian]

Latviski

[Latvian]

ī

Lietuvių

[Lithuanian]

Nederlands

[Dutch]

Malti

[Maltese]

Magyar

[Hungarian]

Polski

[Polish]

Português

[Portuguese]

Slovensko

[Ime proizvajalca]

izjavlja, da je ta

[tip opreme]

v skladu z bistvenimi zahtevami in

Hardware Integration Guide, version 1.1

Č

[Jméno výrobce]

požadavky a dalšími p

Undertegnede

typebetegnelse]

1999/5/EF.

Hiermit erklärt
Übereinstimmung mit den grundlegenden Anforderungen und den übrigen
einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet.

Käesolevaga kinnitab

type of equipment]

direktiivist tulenevatele teistele asjakohastele sätetele.

Hereby,
compliance with the essential requirements and other relevant provisions of Directive
1999/5/EC.

Por medio de la presente
cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o
exigibles de la Directiva 1999/5/CE.

ΜΕ ΤΗΝ ΠΑΡΟΥΣΑ
ΣΥΜΜΟΡΦΩΝΕΤΑΙ ΠΡΟΣ ΤΙΣ ΟΥΣΙΩΔΕΙΣ ΑΠΑΙΤΗΣΕΙΣ ΚΑΙ ΤΙΣ ΛΟΙΠΕΣ

Par la présente
conforme aux exigences essentielles et aux autres dispositions pertinentes de la
directive 1999/5/CE.

[name of manufacturer]

tímto prohlašuje, že tento

íslušnými ustanoveními směrnice 1999/5/ES.

[fabrikantens navn]

overholder de væsentlige krav og øvrige relevante krav i direktiv

erklærer herved, at følgende udstyr

[Name des Herstellers]

[tootja nimi = name of manufacturer]

vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud

, declares that this

[nombre del fabricante]

[name of manufacturer]

[nom du fabricant]

déclare que l'appareil

[typ zařízení]

, dass sich das Gerät

je ve shodě se základními

[type of equipment]

declara que el

ΔΗΛΩΝΕΙ ΟΤΙ

1999/5/ΕΚ.

[udstyrets

[Gerätetyp]

seadme

in

[seadme tüüp =

is in

[clase de equipo]

[type of equipment]

[type d'appareil]

est

Con la presente
conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla
direttiva 1999/5/CE.

Aršo

[name of manufacturer /izgatavotājanosaukums]

ā

rtas tips]

iek

tajiemnoteikumiem.

saist

Šiuo

[manufacturer name]

reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas.

Hierbij verklaart
overeenstemming is met de essentiële eisen en de andere relevante bepalingen van
richtlijn 1999/5/EG.

Hawnhekk,
mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva
1999/5/EC.

Alulírott,
követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak.

Niniejszym

zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy

1999/5/EC.

[Nome do fabricante]

requisitos essenciais e outras disposições da Directiva 1999/5/CE.

[nome del costruttore]

atbilstDirektīvas 1999/5/EK būtiskajāmprasībām un citiemar to

deklaruoja, kad šis

[naam van de fabrikant]

[isem tal-manifattur]

[gyártó neve]

[nazwa producenta]

nyilatkozom, hogy a

oświadcza, że

declara que este

dichiara che questo

[equipment type]

dat het toestel

, jiddikjara li dan

[... típus]

[nazwa wyrobu]

[tipo de equipamento]

[tipo di apparecchio]

deklarē, ka

[type of equipment /

atitinka esminius

[type van toestel]

[il-mudel tal-prodott]

megfelel a vonatkozó alapvetõ

jest zgodny z

está conforme com os

è

in

jikkonforma

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[Slovenian]

Slovensky

[Slovak]

Suomi

[Finnish]

Svenska

[Swedish]

Hardware Integration Guide, version 1.1

ostalimi relevantnimi določili direktive 1999/5/ES.

[Menovýrobcu]

týmtovyhlasuje, že

[typzariadenia]

spĺňazákladnépožiadavky a

všetkypríslušnéustanoveniaSmernice 1999/5/ES.

[Valmistaja = manufacturer]
tyyppimerkintä]

tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä

vakuuttaa täten että

[type of equipment = laitteen

koskevien direktiivin muiden ehtojen mukainen.

Härmed intygar

[företag]

att denna

[utrustningstyp]

står I överensstämmelse med de
väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv
1999/5/EG.

Labeling Requirements

The final end product must be labeled in a visible area with the following notice:

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Laird MSD45N

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Hardware Integration Guide, version 1.1

APPENDIX A: SCHEMATIC

The following MSD45N schematic may be used as a reference.

Figure 8: Laird MSD45N Schematic

www.lairdtech.com/wireless

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Europe: [phone]

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Laird Technologies:
WH-MSD45N