Laird BT85, BT850-ST, BT850-SA User Manual

A
User Guide
BT85x Series
Bluetooth v4.2 Dual-Mode USB HCI Module
Version 1.0
BT85x Series
Datasheet
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R
EVISION HISTORY
Version Date Notes Contributor Approver
1.0 07 Nov 2017 Initial Release Jacky Kuo Jonathan Kaye
BT85x Series
Datasheet
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C
ONTENTS
1 Scope ....................................................................................................................................................... 4
2 Operational Description ........................................................................................................................... 4
3 Block Diagram and Descriptions ............................................................................................................... 5
4 Specifications ........................................................................................................................................... 6
5 Pin Definitions .......................................................................................................................................... 6
6 DC Electrical Characteristics ..................................................................................................................... 8
7 RF Characteristics ..................................................................................................................................... 8
8 Interface .................................................................................................................................................. 9
8.1. Global Coexistence Interface .................................................................................................................... 9
8.2. USB Interface ......................................................................................................................................... 10
8.3. PCM Interface ........................................................................................................................................ 10
8.3.1. Slot Mapping .......................................................................................................................................... 10
8.3.2. Frame Synchronization ........................................................................................................................... 10
8.3.3.
Data Formatting
....................................................................................................................................... 13
8.3.4. Wideband Speech Support ..................................................................................................................... 13
8.3.5. Multiplexed Bluetooth Over PCM ........................................................................................................... 14
8.3.6. Burst PCM Mode .................................................................................................................................... 14
8.4. I2S Interface............................................................................................................................................ 15
8.5. BSC (Cypress Serial Control) Master Interface ......................................................................................... 17
9 Antenna Performance ............................................................................................................................ 19
10 Mechanical Dimensions and Land Pattern .............................................................................................. 21
11 Implementation Note ............................................................................................................................. 22
11.1. PCB Layout on Host PCB ......................................................................................................................... 22
11.1.1. Antenna Keep-out and Proximity to Metal or Plastic .............................................................................. 22
11.1.2. USB Dongle Design Example Using BT850-SA .......................................................................................... 23
12 Application Note for Surface Mount Modules ........................................................................................ 24
12.1. Introduction ........................................................................................................................................... 24
12.2. Shipping ................................................................................................................................................. 24
12.2.1. Tray Package .......................................................................................................................................... 24
12.2.2. Tape and Reel Package Information ....................................................................................................... 25
12.3. Reflow Parameters ................................................................................................................................. 26
13 Japan (MIC) Regulatory .......................................................................................................................... 27
13.1. Antenna Information .............................................................................................................................. 27
14 FCC Regulatory ....................................................................................................................................... 28
15 Industry Canada Regulatory ................................................................................................................... 30
16 European Union Regulatory ................................................................................................................... 32
17 Ordering Information ............................................................................................................................. 33
17.1. General Comments ................................................................................................................................ 33
18 Bluetooth SIG Approvals......................................................................................................................... 33
19 Additional Assistance ............................................................................................................................. 35
BT85x Series
Datasheet
Embedded Wireless Solutions Support Center: http://ews-support.lairdtech.com www.lairdtech.com/bluetooth
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1 S
COPE
This document describes key hardware aspects of the Laird BT85x Bluetooth HCI module and Adapter . This document is mainly intended to assist device manufacturers and related parties with the integration of this module into their host devices. Data in this document are drawn from several sources including data sheets for the Cypress CYW20704A2. Because the BT850-Sx is currently in development stage, this document is preliminary and the information in this document is subject to change. Please contact Laird Technologies or visit the product page on the Laird website to obtain the most recent version of this document.
BT850-SA
BT850-ST
BT851
2 O
PERATIONAL DESCRIPTION
The BT85x series of USB HCI modules and Adapter leverage the Cypress CYW20704 A2 chipset to provide exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth and Bluetooth Low Energy support. The Bluetooth v4.2 core specification shortens your development time and provides enhanced throughput, security and privacy.
The BT850 modules are ideal when designers need both performance and minimum size. For maximum flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and Cypress’GCI coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for integrated antenna or an external antenna via a trace pin.
These modules present a Bluetooth standard HCI interface with native support for Windows, Linux and Android Bluetooth software stacks for operating system backed devices. The BT851 Pluggable USB Adapter with inbuilt Bluetooth stack simply plugs into any Windows, Android or Linux device via external USB connection.
Additionally, Laird has partnered with Searan for support of their ultra small, flexible ‘dotstack’ platform for embedded Cortex M3 and M4 implementations.
Features and Benefits
Application Areas
Bluetooth v4.
2 - Du
al Mode (Classic Bluetooth and BLE)
Compact footprint 2-wire Cypress Global Coexistence Interface (GCI) High antenna radiation gain and efficiency Good interference rejection for multi-com system (GSM/WCDMA) Class 1 output – 8 dBm USB, I2S, and PCM  Industrial temperature range 512 k EEPROM support Bluetooth Controller subsystem FCC, IC, CE, RCM and Giteki approvals
Medical devices
ePOS terminals Barcode scanners Industrial cable replacement IoT Platforms Automotive
Diagnostic Equipment
Personal Digital Assistants (PDA)
BT85x Series
Datasheet
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3 B
LOCK DIAGRAM AND DESCRIPTIONS
Figure 1: BT850 module block diagram
CYW20704A2
(Main chip)
The BT85x is based on CYW20704A2 dual mode chip. The chip is a single-chip radio with on-
chip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides I2S/PCM and USB interfaces. There are two general purpose I/Os be configured for
proprietary of Cypress GCI used and a general purpose I/O can be configured for
scan/inquire/paging/data traffic of indicator. These three I/O pins are controlled by
firmware.
Antenna BT850-SA & BT851 – The antenna is a ceramic monopole chip antenna.
BT850-ST – Trace Pad provision for use with a range of certified External Antennas
Band Pass
Filter
The band pass filter filters the out-of-band emissions from the transmitter to meet the
specific regulations for type approvals of various countries.
EEPROM There are 512 k bits EEPROM embedded on the BT85x which can be used to store
parameters, such as BD_ADDR, USB enumeration information, maximum TX power, PCM
configuration, USB product ID, USB vendor ID, and USB product description. With that, the
BT850 module can support UHE/HCI Proxy mode.
Crystal The embedded 40 MHz crystal is used for generating the clock for the entire module.
BT85x Series
Datasheet
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4 S
PECIFICATIONS
Table 1: BT850 specifications
Categories Feature Implementation
Wireless
Specification
Bluetooth® V4.2 Dual Mode – BR / EDR / LE
Frequency 2.402 - 2.480 GHz
Maximum Transmit
Power
Class 1
+8 dBm from antenna
Receive Sensitivity -94 dBm
Range Circa 100 meters
Data Rates Up to 3 Mbps (over-the-air)
Host Interface USB Full speed USB 2.0
GPIO 3.3V for all general purpose I/Os
Operational Modes
HCI Host Controller Interface over USB
UHE USB HID Emulation
EEPROM 2-wire 512 K bits
Coexistence 802.11 (Wi-Fi) 2-Wire Cypress Global Coexistence Interface (GCI)
Supply Voltage Supply 3.3V +/-10%
Power
Consumption
Current
Idle Mode ~8 mA
File Transfer ~43 mA
Antenna Options Internal
External
Multilayer ceramic antenna
Trace Pad
Physical Dimensions
8.5 x 13 x 1.6 mm (BT850-Sx - modules)
16 x 43 x 11 (BT851 – USB dongle)
Environmental Operating -30° C to +85° C
Storage -40° C to +85° C
Miscellaneous
Lead Free Lead-free and RoHS-compliant
Warranty 1-Year warranty
Approvals Bluetooth® Controller Subsystem Approved
FCC/IC/CE/RCM/Giteki
All BT85x series
5 P
IN DEFINITIONS
Table 2: BT850 pin definitions
Pin No. Pin Name I/O Supply Domain
Description If Unused
1 NC NC
2 NC
3 GND GND Ground GND
4 USB_D+ Bidirectional
3V3 USB data plus N/A
BT85x Series
Datasheet
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Pin No. Pin Name I/O Supply Domain
Description If Unused
5 USB_D- Bidirectional
3V3 USB data negative N/A
6 GND GND Ground GND
7 NC NC
8 RESET Input 3v3
Active-low reset
input
N/A
9 3v3 Input 3v3
Module main DC
power supply,
Input to internal 1.2V
and 2.5V LDO
N/A
10 NC NC
11 GND GND Ground GND
12 GND GND Ground GND
13 GND GND Ground GND
14 GND GND Ground GND
15 GND GND Ground GND
16 GND GND Ground GND
17 RF
BT850-ST RF signal
output (50Ω) BT850-SA No
connection
18 GND GND Ground GND
19
I2S_WS/PCM_SYNC Bidirectional
3V3 PCM sync/I2S word
select
NC
20 I2S_CLK/PCM_CLK Bidirectional
3V3 PCM/I2S clock NC
21 I2S_DI/PCM_IN Bidirectional
3V3 PCM/I2S data input NC
22 I2S_OUT/PCM_OUT Bidirectional
3V3 PCM/I2S data output
NC
23 NC NC
24 GND GND Ground GND
25
BT_SECI_IN Input 3V3 Coexistence data
input
NC
26
BT_SECI_OUT Output 3V3 Coexistence data
output
NC
27 NC NC
28
GPIO_5 Bidirectional
3V3 Programmable
input/output line
NC
Pin Definition Note:
b
For to meet the pin alignment of BT800, there are several pins which must be put to NC status
(No Connection).
The GPIO_5 controlled by the default firmware for the status of BT850 indications.
BT85x Series
Datasheet
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6 DC E
LECTRICAL CHARACTERISTICS
Table 3: Recommended operating conditions
Rating Min Max Unit
Storage temperature -40 +150
C
Operating Temperature -30 +85 ⁰C
3V3 Input 3.0 3.6 V
Table 4: Digital I/O characteristics
Normal Operation Min Typ. Max Unit
VIL Input Low Voltage (VDDO = 3.3V) - - 0.8 V
VIH Input High Voltage (VDDO = 3.3V) 2.0 - - V
VOL Output Low Voltage - - 0.4 V
VOH Output High Voltage 3V3-0.4 - - V
IIL Input Low Current - - 1.0 µA
IIH Input High Current - - 1.0 µA
IOL Output Low Current
(VDDO = 3.3V, VOL = 0.4V)
- - 2.0 mA
IOH Output Low Current
(VDDO = 3.3V, VOH = 2.9V)
- - 2.0 mA
CIN Input Capacitance - - 0.4 pF
Table 5: Current consumption
Normal Operation Peak (8 dBm)
AVG Unit
Idle - 8 mA
Inquiry 23 22 mA
File Transfer 43 26 mA
LE Connected (Master) 26 - mA
LE Scan (Master) 26 - mA
LE File Transfer 27 26 mA
7 RF C
HARACTERISTICS
Table 6: BDR/EDR/LE transmitter characteristics (Input = 3V3 @ 25
℃℃℃℃
)
Parameter Min Typ. Max BT. Spec. Unit
GFSK Maximum RF Transmit Power 6 8 10 20 dBm
EDR Maximum RF Transmit Power 2 4 6 20 dBm
RF power variation over temperature range - 2.0 - - dB
RF power variation over BT band - 2 - - dB
RF power control step 2 4 8 - dB
BT85x Series
Datasheet
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Parameter Min Typ. Max BT. Spec. Unit
Initial Carrier Frequency Tolerance - 10 -
±
75 kHz
20 dB Bandwidth - 920 - 1000 kHz
In-Band Spurious
Emissions
1.0 MHz < |M-N| < 1.5 MHz - - -39 -26 dBc
1.5 MHz < |M-N| < 2.5 MHz - - -39 -20 dBm
|M-N| ≧ 2.5 MHz - - -47 -40 dBm
Drift rate - 10 - +/-25 kHz
F
1Avg
- 152 - 140<>175
kHz
F
2Max
100 - - 99.9 %
F
2Avg
/
∆F
1Avg
- 1.0 - 0.8
LE F
1Avg
- 245 - 225<>275
kHz
LE F
2Max
100 - - 99.9 %
LE F
2Avg
/ F
1Avg
- 1.0 -
0.8
Table 7: BDR/EDR/LE receiver sensitivity (Input = 3V3 @ 25
℃℃℃℃
)
Parameter Conditions Min Typ. Max BT. Spec. Unit
Sensitivity
GFSK, 0.1% BER, 1Mbps -90 -70 dBm
π/4-DQPSK, 0.01% BER, 2Mbps -94 -70 dBm
8-DPSK, 0.01% BER, 3Mbps -87 -70 dBm
GFSK, 30.8% PER, 1Mbps -94 -70 dBm
Sensitivity variation All Modulations (Over BT band) 2 dB
8 I
NTERFACE
8.1. Global Coexistence Interface
The BT850-Sx supports the proprietary Cypress Global Coexistence Interface (GCI) which is a two-wire interface.
The following key features are associated with the interface:
Enhanced coexistence data can be exchanged over GCI_SECI_IN and GCI_SECI_OUT a two-wire interface,
one serial input (GCI_SECI_IN), and one serial output (GCI_SECI_OUT). The both pins are controlled by the configuration file that is stored in EEPROM from the host.
It supports generic UART communication between WLAN and Bluetooth devices. To conserve power, it is disabled when inactive. It supports automatic resynchronization upon waking from sleep mode. It supports a baud rate of up to 4 Mbps.
Error! Reference source not found. shows the 2-wire BT coexistence interface assignments.
Table 8: BT GCI two-wire coexistence
Coexistence Signal Name Signal Assignment Pin Number
BT_SECI_IN GPIO_6 B6
BT_SECI_OUT GPIO_7 C6
BT85x Series
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8.2. USB Interface
BT85x has a full-speed (12 Mbps) USB interface for communicating with other compatible digital devices. The USB interface on the BT85x acts as a USB peripheral, responding to requests from a master host controller.
BT85x supports the Universal Serial Bus Specification (USB v2.0 Specification) and USB Battery Charging Specification, available from http://www.usb.org. For more information on how to integrate the USB interface on BT85xd, see Figure 15 located in the following section: USB Dongle Design Example Using BT850.
The following USB interface features are supported:
USB Protocol, revision 2.0, full-speed compliant with LPM support (up to 12 Mbps) Bluetooth HCI HID, DFU, UHE (proprietary method to emulate an HID device at system boot) Integrated detach resistor USB termination when interface is not in use Internal modules, certification, and non-specification compliant operation
8.3. PCM Interface
The BT850-Sx supports two independent PCM interfaces that share the pins with I2S interfaces. The PCM interface on the BT850-Sx can connect to linear PCM Codec devices in master or slave mode. In master mode, the BT850-Sx generates the PCM_CLK and PCM_SYNC signals; in slave mode, these signals are provided by another master on the PCM interface and are inputs to the BT850-Sx.
The configuration of the PCM interface may be adjusted by the host through the use of vendor-specific HCI commands.
8.3.1. Slot Mapping
The BT850-Sx supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM interface. These three channels are time-multiplexed onto the single PCM interface by using a time-slotting scheme where the 8 kHz or 16 kHz audio sample interval is divided into as many as 16 slots. The number of slots is dependent on the selected interface rate of 128 kHz, 512 kHz, or 1024 kHz. The corresponding number of slots for these interface rate is 1, 2, 4, 8, and 16, respectively. Transmit and receive PCM data from an SCO channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots to allow other devices to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the PCM clock during the last bit of the slot.
8.3.2. Frame Synchronization
The BT850-Sx supports both short- and long-frame synchronization in both master and slave modes. In short­frame synchronization mode, the frame synchronization signals an active-high pulse at the audio frame rate that is a single-bit period in width and is synchronized to the rising edge of the bit clock. The PCM slave looks for a high on the falling edge of the bit clock and expects the first bit of the first slot to start at the next rising edge of the clock.
Figure 2 and Table 9 shows PCM Timing Diagram and Specifications for the master mode of short-frame.
BT85x Series
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Figure 2: PCM timing diagram (Short-Frame Sync, Master Mode)
Table 9: PCM Interface timing specifications (Short-Frame Sync, Master Mode)
Ref No.
Characteristics Minimum Typical Maximum Unit
1 PCM bit clock frequency - - 12 MHz
2 PCM bit clock LOW 41 - - ns
3 PCM bit clock HIGH 41 - - ns
4 PCM_SYNC setup 0 - 25 ns
5 PCM_OUT delay 0 - 25 ns
6 PCM_IN setup 8 - - ns
7 PCM_IN hold 8 - - ns
8
Delay from rising edge of PCM_BCLK during last bit
period to PCM_OUT becoming high impedance
0 - 25 ns
Figure 3 and Table 10 shows PCM Timing Diagram and Specifications for the slave mode of short-frame.
Figure 3: PCM timing diagram (Short-Frame Sync, Slave Mode)
Table 10: PCM Interface timing specifications (Short-Frame Sync, Slave Mode)
Ref No.
Characteristics Minimum Typical Maximum Unit
1 PCM bit clock frequency - - 12 MHz
2 PCM bit clock LOW 41 - - ns
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