Laird BT85, BT850-ST, BT850-SA User Manual

A

User Guide

BT85x Series

Bluetooth v4.2 Dual-Mode USB HCI Module

Version 1.0

BT85x Series

Datasheet

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R

EVISION HISTORY

Version Date Notes Contributor Approver

1.0 07 Nov 2017 Initial Release Jacky Kuo Jonathan Kaye

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C

ONTENTS

1 Scope ....................................................................................................................................................... 4

2 Operational Description ........................................................................................................................... 4

3 Block Diagram and Descriptions ............................................................................................................... 5

4 Specifications ........................................................................................................................................... 6

5 Pin Definitions .......................................................................................................................................... 6

6 DC Electrical Characteristics ..................................................................................................................... 8

7 RF Characteristics ..................................................................................................................................... 8

8 Interface .................................................................................................................................................. 9

8.1. Global Coexistence Interface .................................................................................................................... 9

8.2. USB Interface ......................................................................................................................................... 10

8.3. PCM Interface ........................................................................................................................................ 10

8.3.1. Slot Mapping .......................................................................................................................................... 10

8.3.2. Frame Synchronization ........................................................................................................................... 10

8.3.3.

Data Formatting

....................................................................................................................................... 13

8.3.4. Wideband Speech Support ..................................................................................................................... 13

8.3.5. Multiplexed Bluetooth Over PCM ........................................................................................................... 14

8.3.6. Burst PCM Mode .................................................................................................................................... 14

8.4. I2S Interface............................................................................................................................................ 15

8.5. BSC (Cypress Serial Control) Master Interface ......................................................................................... 17

9 Antenna Performance ............................................................................................................................ 19

10 Mechanical Dimensions and Land Pattern .............................................................................................. 21

11 Implementation Note ............................................................................................................................. 22

11.1. PCB Layout on Host PCB ......................................................................................................................... 22

11.1.1. Antenna Keep-out and Proximity to Metal or Plastic .............................................................................. 22

11.1.2. USB Dongle Design Example Using BT850-SA .......................................................................................... 23

12 Application Note for Surface Mount Modules ........................................................................................ 24

12.1. Introduction ........................................................................................................................................... 24

12.2. Shipping ................................................................................................................................................. 24

12.2.1. Tray Package .......................................................................................................................................... 24

12.2.2. Tape and Reel Package Information ....................................................................................................... 25

12.3. Reflow Parameters ................................................................................................................................. 26

13 Japan (MIC) Regulatory .......................................................................................................................... 27

13.1. Antenna Information .............................................................................................................................. 27

14 FCC Regulatory ....................................................................................................................................... 28

15 Industry Canada Regulatory ................................................................................................................... 30

16 European Union Regulatory ................................................................................................................... 32

17 Ordering Information ............................................................................................................................. 33

17.1. General Comments ................................................................................................................................ 33

18 Bluetooth SIG Approvals......................................................................................................................... 33

19 Additional Assistance ............................................................................................................................. 35

BT85x Series

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1 S

COPE

This document describes key hardware aspects of the Laird BT85x Bluetooth HCI module and Adapter . This
document is mainly intended to assist device manufacturers and related parties with the integration of this
module into their host devices. Data in this document are drawn from several sources including data sheets for
the Cypress CYW20704A2.
Because the BT850-Sx is currently in development stage, this document is preliminary and the information in
this document is subject to change. Please contact Laird Technologies or visit the product page on the Laird
website to obtain the most recent version of this document.

BT850-SA

BT850-ST

BT851

2 O

PERATIONAL DESCRIPTION

The BT85x series of USB HCI modules and Adapter leverage the Cypress CYW20704 A2 chipset to provide
exceptionally low power consumption with outstanding range for OEMs needing both Classic Bluetooth and
Bluetooth Low Energy support. The Bluetooth v4.2 core specification shortens your development time and
provides enhanced throughput, security and privacy.

The BT850 modules are ideal when designers need both performance and minimum size. For maximum
flexibility in integration, they support a host USB interface, I2S and PCM audio interfaces, GPIO, and Cypress’GCI
coexistence (2-Wire). The modules provide excellent RF performance and identical footprint options for
integrated antenna or an external antenna via a trace pin.

These modules present a Bluetooth standard HCI interface with native support for Windows, Linux and Android
Bluetooth software stacks for operating system backed devices. The BT851 Pluggable USB Adapter with inbuilt
Bluetooth stack simply plugs into any Windows, Android or Linux device via external USB connection.

Additionally, Laird has partnered with Searan for support of their ultra small, flexible ‘dotstack’ platform for
embedded Cortex M3 and M4 implementations.

Features and Benefits

Application Areas



Bluetooth v4.

2 - Du

al Mode (Classic Bluetooth and BLE)

 Compact footprint
 2-wire Cypress Global Coexistence Interface (GCI)
 High antenna radiation gain and efficiency
 Good interference rejection for multi-com system (GSM/WCDMA)
 Class 1 output – 8 dBm
 USB, I2S, and PCM
 Industrial temperature range
 512 k EEPROM support
 Bluetooth Controller subsystem
 FCC, IC, CE, RCM and Giteki approvals



Medical devices

 ePOS terminals
 Barcode scanners
 Industrial cable replacement
 IoT Platforms Automotive

Diagnostic Equipment

 Personal Digital Assistants (PDA)

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3 B

LOCK DIAGRAM AND DESCRIPTIONS

Figure 1: BT850 module block diagram

CYW20704A2

(Main chip)

The BT85x is based on CYW20704A2 dual mode chip. The chip is a single-chip radio with on-

chip LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.

Dedicated signal and baseband processing is included for full Bluetooth operation. The chip

provides I2S/PCM and USB interfaces. There are two general purpose I/Os be configured for

proprietary of Cypress GCI used and a general purpose I/O can be configured for

scan/inquire/paging/data traffic of indicator. These three I/O pins are controlled by

firmware.

Antenna BT850-SA & BT851 – The antenna is a ceramic monopole chip antenna.

BT850-ST – Trace Pad provision for use with a range of certified External Antennas

Band Pass

Filter

The band pass filter filters the out-of-band emissions from the transmitter to meet the

specific regulations for type approvals of various countries.

EEPROM There are 512 k bits EEPROM embedded on the BT85x which can be used to store

parameters, such as BD_ADDR, USB enumeration information, maximum TX power, PCM

configuration, USB product ID, USB vendor ID, and USB product description. With that, the

BT850 module can support UHE/HCI Proxy mode.

Crystal The embedded 40 MHz crystal is used for generating the clock for the entire module.

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4 S

PECIFICATIONS

Table 1: BT850 specifications

Categories Feature Implementation

Wireless

Specification

Bluetooth® V4.2 Dual Mode – BR / EDR / LE

Frequency 2.402 - 2.480 GHz

Maximum Transmit

Power

Class 1

+8 dBm from antenna

Receive Sensitivity -94 dBm

Range Circa 100 meters

Data Rates Up to 3 Mbps (over-the-air)

Host Interface USB Full speed USB 2.0

GPIO 3.3V for all general purpose I/Os

Operational Modes

HCI Host Controller Interface over USB

UHE USB HID Emulation

EEPROM 2-wire 512 K bits

Coexistence 802.11 (Wi-Fi) 2-Wire Cypress Global Coexistence Interface (GCI)

Supply Voltage Supply 3.3V +/-10%

Power

Consumption

Current

Idle Mode ~8 mA

File Transfer ~43 mA

Antenna Options Internal

External

Multilayer ceramic antenna

Trace Pad

Physical Dimensions

8.5 x 13 x 1.6 mm (BT850-Sx - modules)

16 x 43 x 11 (BT851 – USB dongle)

Environmental Operating -30° C to +85° C

Storage -40° C to +85° C

Miscellaneous

Lead Free Lead-free and RoHS-compliant

Warranty 1-Year warranty

Approvals Bluetooth® Controller Subsystem Approved

FCC/IC/CE/RCM/Giteki

All BT85x series

5 P

IN DEFINITIONS

Table 2: BT850 pin definitions

Pin No. Pin Name I/O Supply Domain

Description If Unused

1 NC NC

2 NC

3 GND GND Ground GND

4 USB_D+ Bidirectional

3V3 USB data plus N/A

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Pin No. Pin Name I/O Supply Domain

Description If Unused

5 USB_D- Bidirectional

3V3 USB data negative N/A

6 GND GND Ground GND

7 NC NC

8 RESET Input 3v3

Active-low reset

input

N/A

9 3v3 Input 3v3

Module main DC

power supply,

Input to internal 1.2V

and 2.5V LDO

N/A

10 NC NC

11 GND GND Ground GND

12 GND GND Ground GND

13 GND GND Ground GND

14 GND GND Ground GND

15 GND GND Ground GND

16 GND GND Ground GND

17 RF

BT850-ST RF signal

output (50Ω)
BT850-SA No

connection

18 GND GND Ground GND

19

I2S_WS/PCM_SYNC Bidirectional

3V3 PCM sync/I2S word

select

NC

20 I2S_CLK/PCM_CLK Bidirectional

3V3 PCM/I2S clock NC

21 I2S_DI/PCM_IN Bidirectional

3V3 PCM/I2S data input NC

22 I2S_OUT/PCM_OUT Bidirectional

3V3 PCM/I2S data output

NC

23 NC NC

24 GND GND Ground GND

25

BT_SECI_IN Input 3V3 Coexistence data

input

NC

26

BT_SECI_OUT Output 3V3 Coexistence data

output

NC

27 NC NC

28

GPIO_5 Bidirectional

3V3 Programmable

input/output line

NC

Pin Definition Note:

b

For to meet the pin alignment of BT800, there are several pins which must be put to NC status

(No Connection).

The GPIO_5 controlled by the default firmware for the status of BT850 indications.

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6 DC E

LECTRICAL CHARACTERISTICS

Table 3: Recommended operating conditions

Rating Min Max Unit

Storage temperature -40 +150

⁰

C

Operating Temperature -30 +85 ⁰C

3V3 Input 3.0 3.6 V

Table 4: Digital I/O characteristics

Normal Operation Min Typ. Max Unit

VIL Input Low Voltage (VDDO = 3.3V) - - 0.8 V

VIH Input High Voltage (VDDO = 3.3V) 2.0 - - V

VOL Output Low Voltage - - 0.4 V

VOH Output High Voltage 3V3-0.4 - - V

IIL Input Low Current - - 1.0 µA

IIH Input High Current - - 1.0 µA

IOL Output Low Current

(VDDO = 3.3V, VOL = 0.4V)

- - 2.0 mA

IOH Output Low Current

(VDDO = 3.3V, VOH = 2.9V)

- - 2.0 mA

CIN Input Capacitance - - 0.4 pF

Table 5: Current consumption

Normal Operation Peak (8 dBm)

AVG Unit

Idle - 8 mA

Inquiry 23 22 mA

File Transfer 43 26 mA

LE Connected (Master) 26 - mA

LE Scan (Master) 26 - mA

LE File Transfer 27 26 mA

7 RF C

HARACTERISTICS

Table 6: BDR/EDR/LE transmitter characteristics (Input = 3V3 @ 25

℃℃℃℃

)

Parameter Min Typ. Max BT. Spec. Unit

GFSK Maximum RF Transmit Power 6 8 10 20 dBm

EDR Maximum RF Transmit Power 2 4 6 20 dBm

RF power variation over temperature range - 2.0 - - dB

RF power variation over BT band - 2 - - dB

RF power control step 2 4 8 - dB

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Parameter Min Typ. Max BT. Spec. Unit

Initial Carrier Frequency Tolerance - 10 -

±

75 kHz

20 dB Bandwidth - 920 - 1000 kHz

In-Band Spurious

Emissions

1.0 MHz < |M-N| < 1.5 MHz - - -39 -26 dBc

1.5 MHz < |M-N| < 2.5 MHz - - -39 -20 dBm

|M-N| ≧ 2.5 MHz - - -47 -40 dBm

Drift rate - 10 - +/-25 kHz

∆

F

1Avg

- 152 - 140<>175

kHz

∆

F

2Max

100 - - 99.9 %

∆

F

2Avg

/

∆F

1Avg

- 1.0 - ≧ 0.8

LE ∆F

1Avg

- 245 - 225<>275

kHz

LE ∆F

2Max

100 - - 99.9 %

LE ∆F

2Avg

/ ∆F

1Avg

- 1.0 -

≧

0.8

Table 7: BDR/EDR/LE receiver sensitivity (Input = 3V3 @ 25

℃℃℃℃

)

Parameter Conditions Min Typ. Max BT. Spec. Unit

Sensitivity

GFSK, 0.1% BER, 1Mbps -90 -70 dBm

π/4-DQPSK, 0.01% BER, 2Mbps -94 -70 dBm

8-DPSK, 0.01% BER, 3Mbps -87 -70 dBm

GFSK, 30.8% PER, 1Mbps -94 -70 dBm

Sensitivity variation All Modulations (Over BT band) 2 dB

8 I

NTERFACE

8.1. Global Coexistence Interface

The BT850-Sx supports the proprietary Cypress Global Coexistence Interface (GCI) which is a two-wire interface.

The following key features are associated with the interface:

 Enhanced coexistence data can be exchanged over GCI_SECI_IN and GCI_SECI_OUT a two-wire interface,

one serial input (GCI_SECI_IN), and one serial output (GCI_SECI_OUT). The both pins are controlled by the
configuration file that is stored in EEPROM from the host.

 It supports generic UART communication between WLAN and Bluetooth devices.
 To conserve power, it is disabled when inactive.
 It supports automatic resynchronization upon waking from sleep mode.
 It supports a baud rate of up to 4 Mbps.

Error! Reference source not found. shows the 2-wire BT coexistence interface assignments.

Table 8: BT GCI two-wire coexistence

Coexistence Signal Name Signal Assignment Pin Number

BT_SECI_IN GPIO_6 B6

BT_SECI_OUT GPIO_7 C6

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8.2. USB Interface

BT85x has a full-speed (12 Mbps) USB interface for communicating with other compatible digital devices. The
USB interface on the BT85x acts as a USB peripheral, responding to requests from a master host controller.

BT85x supports the Universal Serial Bus Specification (USB v2.0 Specification) and USB Battery Charging
Specification, available from http://www.usb.org. For more information on how to integrate the USB interface
on BT85xd, see Figure 15 located in the following section: USB Dongle Design Example Using BT850.

The following USB interface features are supported:

 USB Protocol, revision 2.0, full-speed compliant with LPM support (up to 12 Mbps)
 Bluetooth HCI
 HID, DFU, UHE (proprietary method to emulate an HID device at system boot)
 Integrated detach resistor
 USB termination when interface is not in use
 Internal modules, certification, and non-specification compliant operation

8.3. PCM Interface

The BT850-Sx supports two independent PCM interfaces that share the pins with I2S interfaces. The PCM
interface on the BT850-Sx can connect to linear PCM Codec devices in master or slave mode. In master mode,
the BT850-Sx generates the PCM_CLK and PCM_SYNC signals; in slave mode, these signals are provided by
another master on the PCM interface and are inputs to the BT850-Sx.

The configuration of the PCM interface may be adjusted by the host through the use of vendor-specific HCI
commands.

8.3.1. Slot Mapping

The BT850-Sx supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM interface.
These three channels are time-multiplexed onto the single PCM interface by using a time-slotting scheme where
the 8 kHz or 16 kHz audio sample interval is divided into as many as 16 slots. The number of slots is dependent
on the selected interface rate of 128 kHz, 512 kHz, or 1024 kHz. The corresponding number of slots for these
interface rate is 1, 2, 4, 8, and 16, respectively. Transmit and receive PCM data from an SCO channel is always
mapped to the same slot. The PCM data output driver tristates its output on unused slots to allow other devices
to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the
PCM clock during the last bit of the slot.

8.3.2. Frame Synchronization

The BT850-Sx supports both short- and long-frame synchronization in both master and slave modes. In short­frame synchronization mode, the frame synchronization signals an active-high pulse at the audio frame rate that
is a single-bit period in width and is synchronized to the rising edge of the bit clock. The PCM slave looks for a
high on the falling edge of the bit clock and expects the first bit of the first slot to start at the next rising edge of
the clock.

Figure 2 and Table 9 shows PCM Timing Diagram and Specifications for the master mode of short-frame.

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Figure 2: PCM timing diagram (Short-Frame Sync, Master Mode)

Table 9: PCM Interface timing specifications (Short-Frame Sync, Master Mode)

Ref No.

Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency - - 12 MHz

2 PCM bit clock LOW 41 - - ns

3 PCM bit clock HIGH 41 - - ns

4 PCM_SYNC setup 0 - 25 ns

5 PCM_OUT delay 0 - 25 ns

6 PCM_IN setup 8 - - ns

7 PCM_IN hold 8 - - ns

8

Delay from rising edge of PCM_BCLK during last bit

period to PCM_OUT becoming high impedance

0 - 25 ns

Figure 3 and Table 10 shows PCM Timing Diagram and Specifications for the slave mode of short-frame.

Figure 3: PCM timing diagram (Short-Frame Sync, Slave Mode)

Table 10: PCM Interface timing specifications (Short-Frame Sync, Slave Mode)

Ref No.

Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency - - 12 MHz

2 PCM bit clock LOW 41 - - ns

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Ref No.

Characteristics Minimum Typical Maximum Unit

3 PCM bit clock HIGH 41 - - ns

4 PCM_SYNC setup 8 - - ns

5 PCM_SYNC_hold 8 - - ns

6 PCM_OUT delay 0 - 25 ns

7 PCM_IN setup 8 - - ns

8 PCM_IN hold 8 - - ns

9

Delay from rising edge of PCM_BCLK during last bit

period to PCM_OUT becoming high impedance

0 - 25 ns

In long-frame synchronization mode, the frame synchronization signal is again an active-high pulse at the audio
frame rate; however, the duration is three bit periods and the pulse starts coincident with the first bit of the first
slot.

Figure 4 and Table 11 shows PCM Timing Diagram and Specifications for the master mode of long-frame.

Figure 4: PCM timing diagram (Long-Frame Sync, Master Mode)

Table 11: PCM Interface timing specifications (Long-Frame Sync, Master Mode)

Ref No.

Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency - - 12 MHz

2 PCM bit clock LOW 41 - - ns

3 PCM bit clock HIGH 41 - - ns

4 PCM_SYNC delay 0 - 25 ns

5 PCM_OUT delay 0 - 25 ns

6 PCM_IN setup 8 - - ns

7 PCM_IN hold 8 - - ns

8

Delay from rising edge of PCM_BCLK during last bit

period to PCM_OUT becoming high impedance

0 - 25 ns

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Figure 5 and Table 12 shows PCM Timing Diagram and Specifications for the slave mode of long-frame.

Figure 5: PCM timing diagram (Long-Frame Sync, Slave Mode)

Table 12: PCM Interface timing specifications (Long-Frame Sync, Slave Mode)

Ref No.

Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency - - 12 MHz

2 PCM bit clock LOW 41 - - ns

3 PCM bit clock HIGH 41 - - ns

4 PCM_SYNC setup 8 - - ns

5 PCM_SYNC_hold 8 - - ns

6 PCM_OUT delay 0 - 25 ns

7 PCM_IN setup 8 - - ns

8 PCM_IN hold 8 - - ns

9

Delay from rising edge of PCM_BCLK during last bit

period to PCM_OUT becoming high impedance

0 - 25 ns

8.3.3.

Data Formatting

The BT85-Sx0 may be configured to generate and accept several different data formats. For conventional
narrowband speech mode, the BT850 uses 13 of the 16 bits in each PCM frame. The location and order of these
13 bits can be configured to support various data formats on the PCM interface. The remaining three bits are
ignored on the input and may be filled with 0s, 1s, a sign bit, or a programmed value on the output. The default
format is 13-bit 2’s complement data, left justified, and clocked MSB first.

8.3.4. Wideband Speech Support

When the host encodes Wideband Speech (WBS) packets in transparent mode, the encoded packets are
transferred over the PCM bus for an eSCO voice connection. In this mode, the PCM bus is typically configured in
master mode for a 4-kHz sync rate with 16-bit samples, resulting in a 64 Kbps bit rate. The BT850-Sx also
supports slave transparent mode using a proprietary rate-matching scheme. In SBC-code mode, linear 16-bit
data at 16 kHz (256 Kbps rate) is transferred over the PCM bus.

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8.3.5. Multiplexed Bluetooth Over PCM

Bluetooth supports multiple audio streams within the Bluetooth channel and both 16 kHz and 8 kHz streams can
be multiplexed. This mode of operation is only supported when the Bluetooth host is the master. Figure 6 shows
the operation of the multiplexed transport with three simultaneous SCO connections. To accommodate
additional SCO channels, the transport clock speed is increased. To change between modes of operation, the
transport must be halted and restarted in the new configuration.

Figure 6: Functional multiples data diagram

8.3.6. Burst PCM Mode

In this mode of operation, the PCM bus runs at a significantly higher rate of operation to allow the host to duty
cycle its operation and save current. In this mode of operation, the PCM bus can operate at a rate of up to 24
MHz. This mode of operation is initiated with an HCI command from the host.

Figure 7 and Table 13 shows PCM Burst mode timing diagram and specifications for the receive-only mode of

short-frame sync.

Figure 7: PCM burst mode timing (Receive Only, Short Frame Sync)

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Table 13: PCM burst mode specifications (Receive Only, Short-Frame Sync)

Ref No.

Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency - - 24 MHz

2 PCM bit clock LOW 20.8 - - ns

3 PCM bit clock HIGH 20.8 - - ns

4 PCM_SYNC setup 8 - - ns

5 PCM_SYNC_hold 8 - - ns

6 PCM_IN setup 8 - - ns

7 PCM_IN hold 8 - - ns

Figure 8 and Table 14 shows PCM Burst mode timing diagram and specifications for the receive-only mode of

long-frame sync.

Figure 8: PCM burst mode timing (Receive Only, Long Frame Sync)

Table 14: PCM burst mode specifications (Receive Only, Long-Frame Sync)

Ref No.

Characteristics Minimum Typical Maximum Unit

1 PCM bit clock frequency - - 24 MHz

2 PCM bit clock LOW 20.8 - - ns

3 PCM bit clock HIGH 20.8 - - ns

4 PCM_SYNC setup 8 - - ns

5 PCM_SYNC_hold 8 - - ns

6 PCM_IN setup 8 - - ns

7 PCM_IN hold 8 - - ns

8.4. I2S Interface

The BT850-Sx supports two independent I2S digital audio ports. The I2S interface supports both master and slave
modes. The I2S signals are:

 I2S clock: I2S SCK
 I2S Word Select: I2S WS
 I2S Data Out: I2S SDO
 I2S Data In: I2S SDI

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I2S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays as an
output. The channel word length is 16 bits and the data is justified so that the MSB of the left-channel data is
aligned with the MSB of the I2S bus, per the I2S specification. The MSB of each data word is transmitted one bit
clock cycle after the I2S WS transition, synchronous with the falling edge of bit clock. Left-channel data is
transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS is high. Data bits sent by the
BT850 are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver on the rising
edge of I2S_SSCK.

The clock rate in master mode is either of the following:

48 kHz x 32 bits per frame = 1.536 MHz

48 kHz x 50 bits per frame = 2.400 MHz

The master clock is generated from the input reference clock using a N/M clock divider.

In the slave mode, any clock rate is supported to a maximum of 3.072 MHz.

8.4.1. I2S Timing

Timing values specified in Table 15 are relative to high and low threshold levels.

Table 15: Timing for I2S transmitters and receivers

Transmitter Receiver Notes

Lower Limit Upper Limit Lower Limit Upper Limit

Min Max Min Max Min Max Min Max

Clock Period T Ttr - - - Tr - - -

Master Mode: Clock generated by transmitter or receiver

HIGH tHC 0.35T

tr

- - - 0.35T

tr

- - -

LOW tLC 0.35T

tr

- - - 0.35T

tr

- - -

Master Mode: Clock generated by transmitter or receiver

HIGH tHC - 0.35T

tr

- - - 0.35T

tr

- -

LOW tLC - 0.35T

tr

- - - 0.35T

tr

- -

Rise time tRC - - 0.15T

tr

- - - - -

Transmitter

Delay t

dtr

- - - 0.8T - - - -

Hold time t

htr

0 - - - - - - -

Receiver

Setup time tsr - - - - - 0.2Tr - -

Hold time thr - - - - - 0 - -

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The time periods specified in Figure 9 and Figure 10 are defined by the transmitter speed. The receiver
specifications must match transmitter performance.

Figure 9: I2S transmitter timing

Figure 10: I2S receiver timing

8.5. BSC (Cypress Serial Control) Master Interface

BT850-Sx includes a Cypress Serial Control (BSC) master interface. The BSC interface supports low-speed and fast
mode devices and is compatible with I2C slave devices. Multiple I2C master devices and flexible wait state
insertion by the master interface or slave devices are not supported. The BT850-Sx provides 400 kHz, full speed
clock support.

The BSC interface is programmed by the CPU to generate the following BSC transfer types on the bus:

 Read-only
 Write-only
 Combined read/write
 Combined write-read

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NVRAM may contain configuration information about the customer application, including the following:

 Fractional-N information
 BD_ADDR
 UART baud rate
 USB enumeration information
 SDP service record
 File system information used for code, code patches, or data

Figure 11 and Table 16 define the timing requirements for the BSC interface.

Figure 11: BSC interface timing diagram

Table 16: BSC interface timing specifications

Ref No.

Characteristics Minimum Maximum Unit

1 Clock frequency -

100
400
800

1000

kHz

2 START condition setup time 650 - ns

3 START condition hold time 280 - ns

4 Clock low time 650 - ns

5 Clock high time 280 - ns

6 Data input hold time 0 - ns

7 Data input setup time 100 - ns

8 STOP condition setup time 280 - ns

9 Output valid from clock - 400 ns

10 Bus free time 650 - ns

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9 A

NTENNA PERFORMANCE

Table 17, Figure 12, and Figure 13 shows the antenna gain and performance.

Table 17: Antenna gain

Unit in dBi @ 2440 MHz XY-plane XZ-plane YZ-plane

Efficiency

AT3216-B2R7HAA

Peak Avg. Peak Avg. Peak Avg.

1.7 -2.9 2.3 -2.3 0.2 -5.4 55%

Figure 12: Antenna return loss

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Figure 13: Antenna patterns

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10 M

ECHANICAL DIMENSIONS AND LAND PATTERN

10.1. BT850-Sx Mechanical Drawing

Note: Dimensions are in millimeters

Tolerances: .xx ±0.03 mm
.x ±1.3 mm

BT850 PCB Edge

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11 I

MPLEMENTATION NOTE

11.1. PCB Layout on Host PCB

Checklist (for PCB):

 M

UST

locate the BT850 module close to the edge of PCB.

 Use solid GND plane on inner layer (for best EMC and RF performance).
 Place GND vias close to module GND pads as possible
 Route traces to avoid noise being picked up on VCC supply.
 Antenna Keep-out area:

– Ensure there is no copper in the antenna keep-out area on any layers of the host PCB.
– Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.
– For best antenna performance, place the BT850 module on the edge of the host PCB, preferably in the

corner with the antenna facing the corner.

– A different host PCB thickness dielectric will have small effect on antenna.

Figure 14: Recommend antenna keep-out area (in blue) used on the BT850

11.1.1. Antenna Keep-out and Proximity to Metal or Plastic

Checklist (for metal/plastic enclosure):

 Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm

top/bottom and 30 mm left or right.

 Metal close to the BT850 chip monopole antenna (bottom, top, left, right, any direction) will have

degradation on the antenna performance. The amount of degradation is entirely system-dependent which
means some testing by customers is required (in their host application).

 Any metal closer than 20 mm starts to significantly degrade performance (S11, gain, radiation efficiency).
 It is best that the customer tests the range with mock-up (or actual prototype) of the product to assess

effects of enclosure height (and material, whether metal or plastic).

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11.1.2. USB Dongle Design Example Using BT850-SA

Figure 15: USB dongle design schematic

Figure 16: BT851 USB dongle, containing embedded BT850-SA

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12 A

PPLICATION NOTE FOR SURFACE MOUNT MODULES

12.1. Introduction

Laird surface mount modules are designed to conform to all major manufacturing guidelines. This application
note is intended to provide additional guidance beyond the information that is presented in the user manual.
This application note is considered a living document and is updated as new information is presented.

The modules are designed to meet the needs of a number of commercial and industrial applications. They are
easy to manufacture and they conform to current automated manufacturing processes.

12.2. Shipping

12.2.1. Tray Package

Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturer’s pick
and place machines. Layouts of the trays are provided in Figure 17.

Figure 17: Shipping tray layout

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12.2.2. Tape and Reel Package Information

Note: Ordering information for Tape and Reel packaging is an addition of T/R to the end of the full

module part number. For example, BT850-Sx becomes BT850-Sx-T/R.

Figure 18: Reel specifications

Figure 19: Tape specifications

There are 2500 BT850-Sx modules taped in a reel (and packaged in a pizza box) and five boxes per carton
(12,500 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Figure 20.

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1.1.1.1 Packaging Process

Figure 20: Packaging process

12.3. Reflow Parameters

Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB.
Ultimately it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven
temperatures during reflow meet the requirements of the solder paste. Laird’s surface mount modules conform
to J-STD-020D1 standards for reflow temperatures.

Important: During reflow, modules should not be above 260° and not for more than 30 seconds.

Figure 21: Recommended reflow temperature

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Temperatures should not exceed the minimums or maximums presented in Table 18.

Table 18: Recommended maximum and minimum temperatures

Specification

Value

Unit

Temperature Inc./Dec. Rate (max)

1~3 °C / Sec

Temperature Decrease rate (goal)

2-4 °C / Sec

Soak Temp Increase rate (goal)

.5 - 1 °C / Sec

Flux Soak Period (Min)

70 Sec

Flux Soak Period (Max)

120 Sec

Flux Soak Temp (Min)

150 °C

Flux Soak Temp (max)

190 °C

Time Above Liquidous (max)

70 Sec

Time Above Liquidous (min)

50 Sec

Time In Target Reflow Range (goal)

30 Sec

Time At Absolute Peak (max)

5 Sec

Liquidous Temperature (SAC305)

218 °C

Lower Target Reflow Temperature

240 °C

Upper Target Reflow Temperature

250 °C

Absolute Peak Temperature

260 °C

13 J

APAN

(MIC) R

EGULATORY

The BT85x is approved for use in the Japanese market. The part numbers listed below hold WW type
certification. Refer to ARIB-STD-T66 for further guidance on OEM’s responsibilities.

Model Product Name Description Certificate No.

BT850 -SA

BT850-SC

BT851

BT v4.2 Dual Mode USB HCI Module Mounted with chipset antenna

13.1. Antenna Information

The BT850-Sx was tested with antennas listed below. The OEM can choose a different manufacturers antenna
but must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved
for use.

Item Part Number Mfg. Type Gain (dBi)

1 AT3216-B2R7HAA ACX Ceramic 0.5

2 001-0030 mFlexPIFA LAIRD PIFA 2

3 001-0014 FlexPIFA LAIRD PIFA 2

4 0600-00040 LAIRD Dipole 2

5 NanoBlue MAF94045 LAIRD PCB Dipole 2

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14 FCC R

EGULATORY

Model US/FCC CANADA/IC

BT850-SA SQGBT850

BT850-ST SQGBT850

BT851 SQGBT850

DVK-BT850-SA

DVK-BT850-ST

The BT85x family has been designed to operate with the antenna listed below having a maximum gain of 0.5 dBi.
The required antenna impedance is 50 ohms.

Item Part Number Mfg. Type Gain (dBi)

1 AT3216-B2R7HAA ACX Ceramic 0.5

2 001-0030 mFlexPIFA LAIRD PIFA 2

3 001-0014 FlexPIFA LAIRD PIFA 2

4 0600-00040 LAIRD Dipole 2

5 NanoBlue MAF94045 LAIRD PCB Dipole 2

14.1. Documentation Requirements

To ensure regulatory compliance, when integrating the BT850-Sx into a host device, it is necessary to meet the
documentation requirements set forth by the applicable regulatory agencies. The following sections (FCC,
Industry Canada, and European Union) outline the information that may be included in the user’s guide and
external labels for the host devices into which the BT850 is integrated.

IMPORTANT:

If the conditions above cannot

be met (for example certain device configurations or co

-

location with

another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot
be used on the final product. In these circumstances, the OEM integrator will be responsible for re­evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

When using Laird’s FCC grant for the BT850, the integrator must include specific information in the
user’s guide for the device into which the BT850 is integrated. The integrator must not provide
information to the end user regarding how to install or remove this RF module in the user’s manual of
the device into which the BT850 is integrated. The following FCC statements must be added in their
entirety and without modification into a prominent place in the user’s guide for the device into which
the BT850 is integrated:

IMPORTANT NOTE: To comply with FCC requirements, the BT850 must not be co-located or

operating in conjunction with any other antenna or transmitter.

This device is intended only for OEM integrators under the following conditions:

 The transmitter module may not be co-located with any other transmitter or antenna,

If the condition above is met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements

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required with this module installed

Important Note:

If these conditions cannot be met (for example, certain laptop configurations or co-location with
another transmitter), then the FCC authorization is no longer considered valid and the FCC ID
cannot be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate
FCC authorization.

End Product Labeling

The final end product must be labeled in a visible area with the following: Contains FCC ID: SQGBT850.

Manual Information to the End User

The OEM integrator must be aware to not provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one of the following measures:

 Reorient or relocate the receiving antenna.
 Increase the separation between the equipment and receiver.
 Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

 Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

IMPORTANT NOTE: FCC Radiation Exposure Statement:

This equipment complies with the US portable RF exposure limit set forth for an uncontrolled
environment and are safe for intended operation as described in this manual. The further RF exposure
reduction can be achieved if the product can be kept as far as possible from the user body or set the
device to lower output power if such function is available.

This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.

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15 I

NDUSTRY CANADA REGULATORY

This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two
conditions:

1. This device may not cause interference; and

2. This device must accept any interference, including interference that may cause undesired operation of

the device.

Le présent appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts
de licence. L’exploitation est autorisée aux deux conditions suivantes:

1. l’appareil ne doit pas produire de brouillage;

2. l’utilisateur de l’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage
est susceptible d’en compromettre le fonctionnement.

Radiation Exposure Statement:

The product complies with the Canada portable RF exposure limit set forth for an uncontrolled environment and
are safe for intended operation as described in this manual. The further RF exposure reduction can be achieved
if the product can be kept as far as possible from the user body or set the device to lower output power if such
function is available.

Déclaration d'exposition aux radiations:

Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les Etats-Unis et le Canada
établies pour un environnement non contrôlé. Le produit est sûr pour un fonctionnement tel que décrit dans ce
manuel. La réduction aux expositions RF peut être augmentée si l'appareil peut être conservé aussi loin que
possible du corps de l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle
fonction est disponible.

This device is intended only for OEM integrators under the following conditions:

 The transmitter module may not be co-located with any other transmitter or antenna.

If the condition above is met, further transmitter test will not be required. However, the OEM integrator is still
responsible for testing their end-product for any additional compliance requirements required with this module
installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes:

 Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes
exigences de conformité supplémentaires requis pour ce module installé.

I

MPORTANT NOTE

:

If these conditions cannot be met (for example, certain laptop configurations or co-location with another
transmitter), then the Canada authorization is no longer considered valid and the IC ID cannot be used on the
final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product
(including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

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Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est
plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances,
l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une
autorisation distincte au Canada.

End Product Labeling

The final end product must be labeled in a visible area with the following: “Contains IC: 3147A-BT850”.

Plaque signalétique du produit final

Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 3147A­BT850".

Manual Information to the End User

The OEM integrator must be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module.

The end user manual shall include all required regulatory information/warning as show in this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon
d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements
comme indiqué dans ce manuel.

This radio transmitter (IC: 3147A-BT850) has been approved by Industry Canada to operate with the antenna
types listed below with the maximum permissible gain indicated. Antenna types not included in this list, having a
gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Le présent émetteur radio (IC: 3147A-BT850) a été approuvé par Industrie Canada pour fonctionner avec les
types d'antenne énumérés ci-dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans
cette liste, et dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur.

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16 E

UROPEAN UNION REGULATORY

The BT85x has been tested for compliance with relevant standards for the EU market. BT850 module was tested
with a 0.5 dBi chip antenna.

The OEM should consult with a qualified test house before entering their device into an EU member country to
make sure all regulatory requirements have been met for their complete device.

Reference the Declaration of Conformities listed below for a full list of the standards that the modules were
tested to. Test reports are available upon request.

16.1. EU Declarations of Conformity

Manufacturer: Laird

Products:

BT850-SA, BT850-ST, BT851

Product
Description

BT850-SA,
BT850-ST

BTv4.2 Dual Mode USB HCI Module

BT851 BTv4.2 Dual Mode USB Dongle

EU Directives:

2014/53/EU – Radio Equipment Directive (RED)

Reference standards used for presumption of conformity:

Article Number

Requirement Reference standard(s)

3.1a

Low voltage equipment safety

EN 60950-1:2006 +A11:2009 +A1:2010 +A12:2011

+A2:2013

RF Exposure

EN 62311:2008

EN 62479:2010

3.1b

Protection requirements with

respect to electromagnetic

compatibility

EN 301 489-1 v2.2.0 (2017-03)

EN 301 489-17 v3.2.0 (2017-03)

3.2

Means of the efficient use of

the radio frequency spectrum

EN 300 328 v2.1.1 (2016-11)

Declaration:

We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and
that the above product to which this declaration relates is in conformity with all the applicable essential
requirements of Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose.

Place of Issue:

Laird

W66N220 Commerce Court, Cedarburg, WI 53012 USA

tel: [phone] fax: [phone]

Date of Issue: TBD

Name of Authorized Person: Thomas T Smith, Director of EMC Compliance

Signature of Authorized Person:

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17 O

RDERING INFORMATION

Part Number Description

BT850-SA BTv4.2 Dual Mode USB HCI Module – Integrated Antenna

BT851 BTv4.2 Dual Mode USB Dongle

BT850-ST BTv4.2 Dual Mode USB HCI Module –External Antenna

DVK-BT850-SA Development Kit for BT850-SA Module

DVK-BT850-ST Development Kit for BT850-ST Module

17.1. General Comments

This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If
in doubt, ask.

18 B

LUETOOTH

SIG A

PPROVALS

18.1. Application Note: Subsystem Combinations

This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on
the Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to
create a complete Bluetooth End Product solution.

Subsystem listings referenced as an example:

Design Name

Owner

Declaration

ID

Link to listing on the SIG website

BT850-SA Laird D037603 https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=37603

Windows 8

(Host

Subsystem)

Microsoft

Corporation

B012854

https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=12854

Laird Customer Declaration ID Procedure

This procedure assumes that the member is simply combining two subsystems to create a new design, without
any modification to the existing, qualified subsystems. This is achieved by using the Listing interface on the
Bluetooth SIG website. Error! Reference source not found. shows the basic subsystem combination of a
controller and host subsystem. The Controller provides the RF/BB/LM and HCI layers, with the Host providing
L2CAP, SDP, GAP, RFCOMM/SPP and any other specific protocols and profiles existing in the Host subsystem
listing. The design may also include a Profile Subsystem.

The controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP
and any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a
Profile Subsystem.

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Figure 22: Basic subsystem combination of a controller and host subsystem

The Qualification Process requires each company to registered as a member of the Bluetooth SIG –

http://www.bluetooth.org

The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/

For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new
qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on
your membership status, please refer to the following webpage:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees

For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG
document:

https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486

To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm.

In step 1, select the option, Reference a Qualified Design and enter the Declaration IDs of each subsystem used
in the End Product design. You can then select your pre-paid Declaration ID from the drop down menu or go to
the Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a
credit card, it will not be possible to proceed until the SIG invoice is paid.

Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help
document. Your new Design will be listed on the SIG website and you can print your Certificate and DoC.

For further information please refer to the following training material:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates

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Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth

35

© Copyright 2017 Laird. All Rights Reserved

Americas: [phone]

Europe: [phone]

Hong Kong: [phone]

19 A

DDITIONAL ASSISTANCE

Please contact your local sales representative or our support team for further assistance:

Laird Technologies Connectivity Products Business Unit
Support Centre:

http://ews-support.lairdtech.com

Email:

[e-mail]

Phone: Americas: [phone]
Europe: [phone]
Hong Kong: [phone]

Web:

http://www.lairdtech.com/bluetooth

© Copyright 2017 Laird. All Rights Reserved. Patent pending. Any information furnished by Laird and its agents is believed to be accurate and
reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird materials or products rests
with the end user since Laird and its agents cannot be aware of all potential uses. Laird makes no warranties as to non-infringement nor as to
the fitness, merchantability, or sustainability of any Laird materials or products for any specific or general uses. Laird, Laird Technologies, Inc., or
any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird products are sold pursuant to the
Laird Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. When used as a tradename
herein,

Laird

means Laird PLC or one or more subsidiaries of Laird PLC. Laird™, Laird Technologies™, corresponding logos, and other marks are
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Laird or any third party intellectual property right.