Bluetooth v4.0 Dual-Mode UART HCI Module
BT830 – Hardware Integration Guide (HIG)
Version 0.1 - PRELIMINARY
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
2
CONN-GUIDE-BT830
(PRELIMINARY)
Revision
Date
Changes
0.1
26 March 2014
Initial preliminary version
REVISION HISTORY
BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
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CONN-GUIDE-BT830
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CONTENTS
Revision History............................................................................................................................................. 2
Contents ...................................................................................................................................................... 3
1 Scope ..................................................................................................................................................... 4
2 Operational Description .......................................................................................................................... 4
2.1 Features & Benefits ......................................................................................................................... 4
2.2 Application Areas ........................................................................................................................... 4
3 Block Diagram and Descriptions .............................................................................................................. 5
4 Specifications ......................................................................................................................................... 6
5 Pin Definitions ........................................................................................................................................ 7
6 DC Electrical Characteristic ..................................................................................................................... 9
7 RF Characteristics ................................................................................................................................. 10
8 Interface ............................................................................................................................................... 11
8.1 PIO ............................................................................................................................................... 11
8.2 WLAN Coexistence Interface ......................................................................................................... 11
8.3 UART Interface ............................................................................................................................. 12
8.4 PCM Interface .............................................................................................................................. 12
8.5 GCI Interface ................................................................................................................................ 15
8.6 Slots and Sample Formats ............................................................................................................. 15
8.7
PCM Timing Information
8.8 PCM Slave Timing ........................................................................................................................ 18
8.9 PCM Slave Mode Timing Parameters ............................................................................................. 18
8.10 PCM_CLK and PCM_SYNC Generation ......................................................................................... 20
8.11 PCM Configuration ...................................................................................................................... 20
8.12 Digital Audio Interface (I²S) ........................................................................................................... 20
9 Power Supply and Regulation ............................................................................................................... 23
9.1 Voltage Regulator Enable and Reset ............................................................................................. 23
9.2 Power Sequencing ........................................................................................................................ 24
10 Antenna Performance........................................................................................................................... 24
11 Mechanical Dimensions and Land Pattern ............................................................................................. 26
11.1 BT830 Mechanical Drawing .......................................................................................................... 26
12 Implementation Note............................................................................................................................ 27
12.1 PCB Layout on Host PCB............................................................................................................... 27
13 Application Note for Surface Mount Modules ....................................................................................... 28
13.1 Introduction ................................................................................................................................. 28
13.2 Shipping tray ................................................................................................................................ 28
13.3 Reflow Parameters ....................................................................................................................... 29
14 FCC and IC Regulatory ......................................................................................................................... 30
14.1 Documentation Requirements ...................................................................................................... 30
15 European Union Regulatory .................................................................................................................. 32
15.1 EU Declarations of Conformity ...................................................................................................... 33
16 Ordering Information............................................................................................................................ 33
16.1 General Comments ...................................................................................................................... 33
17 Bluetooth SIG Approvals ....................................................................................................................... 34
17.1 Application Note: Subsystem Combinations .................................................................................. 34
17.2 Additional Assistance ................................................................................................................... 35
............................................................................................................... 16
BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
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Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
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2.1 Features & Benefits
2.2 Application Areas
Bluetooth v4.0 - Dual mode (Classic Bluetooth and BLE)
Compact footprint
2-wire and 3-wire Wi-Fi coexistence scheme
High antenna radiation gain and efficiency
Good interference rejection for multi-com system (GSM/WCDMA)
Class 1 output – 7 dBm
UART, GPIO, I2S, and PCM
Industrial Temperature Range
Bluetooth Hardware Controller subsystem
FCC, IC and CE approvals
Medical devices
ePOS terminals
Barcode scanners
Industrial Cable Replacement
M2M Connectivity
Automotive Diagnostic Equipment
Personal Digital Assistants (PDA)
Bluetooth HID device (keyboard, mouse,
and joystick)
Figure 1: BT830 module
1 SCOPE
This document describes key hardware aspects of the Laird BT830 Bluetooth HCI module. This document is intended
to assist device manufacturers and related parties with the integration of this module into their host devices. Data in
this document are drawn from a number of sources including data sheets for the CSR8811.
Because the BT830 is currently in development stage, this document is preliminary and the information in this
document is subject to change. Please contact Laird Technologies or visit the Laird website at www.Lairdtech.com to
obtain the most recent version of this document.
2 OPERATIONAL DESCRIPTION
The BT830 series of UART HCI devices are designed to meet the needs of OEMs adding
robust Bluetooth connectivity and using embedded Bluetooth stacks within these products.
Leveraging the market-leading CSR8811 chipset, the BT830 series provides exceptionally
low power consumption with outstanding range. Supporting the latest Bluetooth v4.0
Specification with EDR (Enhanced Data Rate), the Laird BT830 series enables OEMs to
accelerate their development time for leveraging either Classic Bluetooth or Bluetooth Low
Energy (BLE) into their operating system based devices.
With a tiny footprint as small as 8.5 x 13 mm, yet output power at 7 dBm, these modules are ideal for applications
where designers need high performance in minimal size. For maximum flexibility in systems integration, the modules
are designed to support a UART interface plus GPIO and additionally I2S and PCM audio interfaces.
These modules present an HCI interface and have native support for Windows and Linux Bluetooth software stacks.
All BT830 series devices are fully qualified as Bluetooth Hardware Controller Subsystem products. This also allows
designers to integrate their existing pre-approved Bluetooth Host and Profile subsystem stacks to gain a Bluetooth
END product approval for their products.
The BT830 series is engineered to provide excellent RF performance with integrated antenna and additional band pass
filters. It further reduces regulatory and testing requirements for OEMs and ensures a hassle free development cycle.
A fully featured, low-cost developer’s kit is available for prototyping, debug, and integration testing of the BT830
series modules and further reduces risk and time in development cycles.
BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
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CONN-GUIDE-BT830
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CS8811A08
(Main chip)
The BT830 is based on CSR8811A08 dual mode chip. The chip is a single-chip radio with on-chip
LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides PCM/I2S and UART interfaces. Up to four general purpose I/Os are available for general
use such as Wi-Fi coexistence or general indicators.
Note: The purpose of the SPI interface is to access the module’s inner settings such as selecting
different WLAN CO-EXIST scheme and enabling HID proxy mode. The SPI interface can
also be used to put the module in RF test mode. You cannot use the module over the SPI
interface for normal operation as the main host interface.
Antenna
The antenna is a ceramic monopole chip antenna.
Band Pass
Filter
The band pass filter filters the out-of-band emissions from the transmitter to meet the specific
regulations for type approvals of various countries.
Crystal
The embedded 26 MHz crystal is used for generating the clock for the entire module.
3 BLOCK DIAGRAM AND DESCRIPTIONS
Figure 1: BT830 module block diagram
BT830 Hardware Integration Guide
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CATEGORIES
FEATURE
IMPLEMENTATION
Wireless Specification
Bluetooth®
V4.0 Dual Mode
Frequency
2.402 - 2.480 GHz
Maximum Transmit
Power
Class 1
+7 dBm from antenna
Receive Sensitivity
-89 dBm
Range
Circa 100 meters
Data Rates
Up to 3 Mbps (over the air)
Host Interface
UART
RX, TX, CTS, RTS
GPIO
Four configurable lines
(1.8V/3.3V configurable by VDD_PADS)
Operational Modes
HCI
Host Controller Interface over UART
Coexistence
802.11 (Wi-Fi)
3 wire CSR schemes supported
(Unity-3;Unity-3e, and Unity+)
Supply Voltage
Supply
3.3V +/-10%
Note: See
Implementation Note
for details on different DC
power selections on the BT830.
Power Consumption
Current
Idle Mode ~TBD mA (Master; ACL link; No traffic)
File Transfer ~TBD mA (Master; ACL link; Transmit)
Antenna Option
Internal
Multilayer ceramic antenna with up to 41% efficiency.
Physical
Dimensions
8.5 x 13 x 1.6 mm (BT830 - Module)
Environmental
Operating
-30C to +85C
Storage
-40C to +85C
Miscellaneous
Lead Free
Lead-free and RoHS compliant
Warranty
1 Year
Approvals
Bluetooth®
Hardware Controller Subsystem Approved
FCC / IC / CE
All BT830 series (BT830-SA; BT830-ST)
4 SPECIFICATIONS
Table 1: BT830 specifications
BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
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#
Pin Name
I/O
Supply Domain
Description
1
VDD_PADS
Power supply
(1.7V-3.6V)
Positive supply for digital I/O pads
2
GND
GND
-
Ground
3
UART_RTS
Bidirectional, tristate,
with weak internal
pullup
VDD_PADS
UART data output, active high
4
UART_TX
Bidirectional, tristate,
with weak internal
pullup
VDD_PADS
UART data input, active high
5
UART_CTS
Bidirectional, tristate,
with weak internal
pullup
VDD_PADS
UART clear to send, active low
6
UART_RX
Bidirectional, tristate,
with weak internal
pullup
VDD_PADS
UART request to send, active low
7
GND
GND
-
Ground
8
VREG_EN_RST#
Input with strong
internal pull-down
VDD_PADS
Take high to enable internal
regulators. Also acts as active low
reset. Maximum voltage is VDD_PADS.
9
VREG_IN_HV
Analogue regulator
input
3.3V
Input to internal high-voltage regulator
10
VREG_OUT_HV
Analogue regulator
input/output
1.8V
Output from internal high-voltage
regulator and input to low-voltage
internal regulators.
11
GND
GND
-
Ground
12
GND
GND
-
Ground
13
GND
GND
-
Ground
14
GND
GND
-
Ground
15
GND
GND
-
Ground
16
GND
GND
-
Ground
17
RF
RF signal out (50 ohm) for BT830-ST
version only.
Not connection for BT830-SA.
18
GND
GND
-
Ground
19
PCM_SYNC/
SPI_CS#/
PIO23
Bidirectional, tri-state,
with weak internal
pull-down
VDD_PADS
PCM synchronous data sync SPI chip
select, active low Programmable
input/output line
*See Note 1.
5 PIN DEFINITIONS
Table 2: BT830 pin definitions
BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
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#
Pin Name
I/O
Supply Domain
Description
20
PCM_CLK/ SPI_CLK/
PIO24
Bidirectional, tri-state,
with weak internal
pull-down
VDD_PADS
PCM synchronous data clock
SPI clock
Programmable input/output line
*See Note 1.
21
PCM_IN/ SPI_MOSI/
PIO21
Input, tri-state, with
weak internal pulldown
VDD_PADS
PCM synchronous data input
SPI data input
Programmable input/output line
*See Note 1.
22
PCM_OUT/
SPI_MISO/
PIO22
Output, tri-state, with
weak internal pulldown
VDD_PADS
PCM synchronous data output
SPI data output
Programmable input/output line
*See Note 1.
23
GND
GND
-
Ground
24
PIO0/
32K_CLK_IN
Bidirectional, tri-state,
with weak internal pulldown
VDD_PADS
Programmable input/output line and
32kHz sleep clock input
25
PIO1/
BT_ACTIVE
Bidirectional, tri-state,
with weak internal pulldown
VDD_PADS
Programmable input/output line;
Wi-Fi & BT 3-wire coexistance
26
PIO9/
BT_PRIORITY
Bidirectional, tri-state,
with weak internal pulldown
VDD_PADS
Programmable input/output line;
Wi-Fi & BT 3-wire coexistance
27
PIO4/
WLAN_ACTIVE
Bidirectional, tri-state,
with weak internal pulldown
VDD_PADS
Programmable input/output line;
Wi-Fi & BT 3-wire coexistance
28
SPI_PCM#_SEL
Input with weak
internal pull-down
VDD_PADS
Control line to select SPI or PCM
interface, high = SPI, low = PCM
*See Note 1.
29
GND
GND
-
Ground
30
GND
GND
-
Ground
Note 1: The purpose of the SPI interface is to access the module’s inner settings such as selecting different WLAN
CO-EXIST scheme. The SPI interface can also be used to put the module in RF test mode. You cannot use
the module over the SPI interface for normal operation as the main host interface.
BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
Americas: +1-800-492-2320 Option 2
Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
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Rating
Min
Max
Unit
Storage temperature
-40
+85
⁰C
VREG_IN_HV
2.3
4.8 V VREG_OUT_HV
1.7
2.0 V VDD_PADS
-0.4
3.6 V Other terminal voltages
VSS - 0.4V
VDD + 0.4 V
V
Rating
Min
Max
Unit
Operating temperature
-30
+85
⁰C
VREG_IN_HV
2.3
4.8
V
VREG_OUT_HV
1.75
1.95
V
VDD_PADS
1.2
3.6
V
VREG_EN_RST#
VDD_PADS
VDD_PADS
V
Normal Operation
Min
Typ
Max
Unit
Input voltage (VREG_IN_HV)
3.1
3.3
3.6
V
Output voltage (VREG_OUT_HV)
1.75
1.85
1.95
V
Temperature coefficient
-200
-
200
ppm/⁰C
Output noise
(frequency range 100Hz to100kHz)
- - 0.4
mV rms
Settling time (settling time
within 10% of final value)
- - 5
µs
Output current
- - 100
mA
Quiescent current
(excluding load, load <1mA)
30
40
60
µA
Low-power Mode
Quiescent current
(excluding load, load <100µA)
14
18
23
µA
Normal Operation
Min
Typ
Max
Unit
Input Voltage
VIL input logic level low
-0.4 - 0.4
V
VIH input logic level high
0.7 x
VDD
-
VDD +
0.4
V
6 DC ELECTRICAL CHARACTERISTIC
Table 3: Absolute maximum ratings
Table 4: Recommended operating conditions
Table 5: High-voltage Linear Regulator
Table 6: Digital I/O Characteristics
BT830 Hardware Integration Guide
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Normal Operation
Min
Typ
Max
Unit
Output Voltage
VOL output logic level low,
IOL = 4.0 mA
- - 0.4
V
VOH output logic level high,
IOL = 4.0 mA
0.75 x
VDD
- - V
Input and Tristate Currents
Strong pull-up
-150
-40
-10
µA
Strong pull-down
10
40
150
µA
Weak pull-up
-5
-1.0
-0.33
µA
Weak pull-down
0.33
1.0
5.0
µA
CI input capacitance
1.0 - 5.0
pF
Normal Operation
Peak (7 dBm)
AVG
Unit
Idle 4.3
mA
Inquiry 891
µA
File Transfer
73
58
mA
LE Connected (Master)
74 mA
LE Scan (Master)
48 mA
RF Characteristics, VDD = 3.3V @ room
temperature unless otherwise specified
Min Typ.
Max
BT. Spec.
Unit
Maximum RF Transmit Power
7 8
20
dBm
RF power variation over temperature range
1.5 -
dB
RF power variation over supply voltage range
0.2 - dB
RF power variation over BT band
2 - dB
RF power control range
-21 8 - dBm
20 dB band width for modulated carrier
1000
kHz
ACP
F = F
0
± 2MHz
-20
F = F
0
± 3MHz
-40
F = F
0
> 3MHz
-40
Drift rate
10 +/-25
kHz
ΔF
1avg
165
140<175
kHz
ΔF1
max
168
140<175
kHz
ΔF
2avg
/ ΔF
1avg
0.9 >=0.8
Table 7: Current Consumption
7 RF CHARACTERISTICS
Table 8: Receiver Characteristics
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RF Characteristics, VDD = 3.3V @ room temp.
Packet Type
Min
Typ
Max
BT. Spec.
Unit
Sensitivity for 0.1% BER
DH1
-89 -70
dBm
DH3
-89
dBm
DH5
-89
dBm
2-DH5
-92
dBm
3-DH5
-85
dBm
Sensitivity variation over BT band
All
2 dB
Sensitivity variation over temperature range
All
TBD
dB
Table 9: BDR and EDR receiver sensitivity
8 INTERFACE
8.1 PIO
See the Device Terminal Functions section for the list of supplies to the PIOs (Programmable I/O ports).
PIO lines are configured through software to have either weak or strong pull-ups or pull-downs. All PIO lines are
configured as inputs with weak pull-downs at reset and have additional individual bus-keeper configuration.
8.2 WLAN Coexistence Interface
Dedicated hardware is provided to implement a variety of WLAN coexistence schemes. There is support for:
Channel skipping AFH
Priority signaling
Channel signaling
Host passing of channel instructions
The BT830 supports the WLAN coexistence schemes:
Unity-3
Unity-3e
Unity+
For more information see
BT830 WLAN Coexistence Schemes and LED Indication
.
BT830 Hardware Integration Guide
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8.3 UART Interface
This is a standard UART interface for communicating with other serial devices.
CSR8811 UART interface provides a simple mechanism for communicating with other serial devices using the RS-232
protocol.
The above figure shows the 4 signals that implement the UART function. When BT830 is connected to another digital
device, UART_RX and UART_TX transfer data between the 2 devices. The remaining 2 signals, UART_CTS and
UART_RTS, implement RS232 hardware flow control where both are active low indicators. The default configuration
of UART is 115200 bauds; None parity check; 1 stop bit; 8 bits per byte.
Note: To communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port
adapter card is required for the PC.
8.4 PCM Interface
The audio PCM interface on the BT830 supports:
Continuous transmission and reception of PCM encoded audio data over Bluetooth.
Processor overhead reduction through hardware support for continual transmission and reception of PCM
data.
A bidirectional digital audio interface that routes directly into the baseband layer of the firmware. It does not
pass through the HCI protocol layer.
Hardware on the BT830 for sending data to and from a SCO connection.
Up to three SCO connections on the PCM interface at any one time.
PCM interface master, generating PCM_SYNC and PCM_CLK.
PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.
Various clock formats including:
- Long Frame Sync
- Short Frame Sync
GCI timing environments.
13-bit or 16-bit linear, 8-bit µ-law, or A-law companded sample formats.
Receives and transmits on any selection of three of the first four slots following PCM_SYNC.
The PCM configuration options are enabled by setting PSKEY_PCM_CONFIG32.
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8.4.1 PCM Interface Master/Slave
When configured as the master of the PCM interface, the BT830 generates PCM_CLK and PCM_SYNC.
Figure 2: PCM Interface Master
Figure 3: PCM Interface Slave
8.4.2
L
ong
Frame Sync
Figure 4: Long Frame Sync (shown with 8-bit Companded Sample)
Long Frame Sync is the name given to a clocking format that controls the transfer of PCM data words or samples. In
Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When the BT830 is configured
as PCM master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is eight bits long. When the BT830 is
configured as PCM Slave, PCM_SYNC is from one cycle PCM_CLK to half the PCM_SYNC rate.
BT830 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT is
configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.
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