Laird BT830 Hardware Integration Manual

Bluetooth v4.0 Dual-Mode UART HCI Module

BT830 – Hardware Integration Guide (HIG)

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Revision

Date

Changes

0.1

26 March 2014

Initial preliminary version

REVISION HISTORY

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CONTENTS

Revision History............................................................................................................................................. 2

Contents ...................................................................................................................................................... 3

1 Scope ..................................................................................................................................................... 4

2 Operational Description .......................................................................................................................... 4

2.1 Features & Benefits ......................................................................................................................... 4

2.2 Application Areas ........................................................................................................................... 4

3 Block Diagram and Descriptions .............................................................................................................. 5

4 Specifications ......................................................................................................................................... 6

5 Pin Definitions ........................................................................................................................................ 7

6 DC Electrical Characteristic ..................................................................................................................... 9

7 RF Characteristics ................................................................................................................................. 10

8 Interface ............................................................................................................................................... 11

8.1 PIO ............................................................................................................................................... 11

8.2 WLAN Coexistence Interface ......................................................................................................... 11

8.3 UART Interface ............................................................................................................................. 12

8.4 PCM Interface .............................................................................................................................. 12

8.5 GCI Interface ................................................................................................................................ 15

8.6 Slots and Sample Formats ............................................................................................................. 15

8.7

PCM Timing Information

8.8 PCM Slave Timing ........................................................................................................................ 18

8.9 PCM Slave Mode Timing Parameters ............................................................................................. 18

8.10 PCM_CLK and PCM_SYNC Generation ......................................................................................... 20

8.11 PCM Configuration ...................................................................................................................... 20

8.12 Digital Audio Interface (I²S) ........................................................................................................... 20

9 Power Supply and Regulation ............................................................................................................... 23

9.1 Voltage Regulator Enable and Reset ............................................................................................. 23

9.2 Power Sequencing ........................................................................................................................ 24

10 Antenna Performance........................................................................................................................... 24

11 Mechanical Dimensions and Land Pattern ............................................................................................. 26

11.1 BT830 Mechanical Drawing .......................................................................................................... 26

12 Implementation Note............................................................................................................................ 27

12.1 PCB Layout on Host PCB............................................................................................................... 27

13 Application Note for Surface Mount Modules ....................................................................................... 28

13.1 Introduction ................................................................................................................................. 28

13.2 Shipping tray ................................................................................................................................ 28

13.3 Reflow Parameters ....................................................................................................................... 29

14 FCC and IC Regulatory ......................................................................................................................... 30

14.1 Documentation Requirements ...................................................................................................... 30

15 European Union Regulatory .................................................................................................................. 32

15.1 EU Declarations of Conformity ...................................................................................................... 33

16 Ordering Information............................................................................................................................ 33

16.1 General Comments ...................................................................................................................... 33

17 Bluetooth SIG Approvals ....................................................................................................................... 34

17.1 Application Note: Subsystem Combinations .................................................................................. 34

17.2 Additional Assistance ................................................................................................................... 35

............................................................................................................... 16

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2.1 Features & Benefits

2.2 Application Areas

 Bluetooth v4.0 - Dual mode (Classic Bluetooth and BLE)
 Compact footprint
 2-wire and 3-wire Wi-Fi coexistence scheme
 High antenna radiation gain and efficiency
 Good interference rejection for multi-com system (GSM/WCDMA)
 Class 1 output – 7 dBm
 UART, GPIO, I2S, and PCM
 Industrial Temperature Range
 Bluetooth Hardware Controller subsystem
 FCC, IC and CE approvals

 Medical devices
 ePOS terminals
 Barcode scanners
 Industrial Cable Replacement
 M2M Connectivity
 Automotive Diagnostic Equipment
 Personal Digital Assistants (PDA)
 Bluetooth HID device (keyboard, mouse,

and joystick)

Figure 1: BT830 module

1 SCOPE

This document describes key hardware aspects of the Laird BT830 Bluetooth HCI module. This document is intended
to assist device manufacturers and related parties with the integration of this module into their host devices. Data in
this document are drawn from a number of sources including data sheets for the CSR8811.

Because the BT830 is currently in development stage, this document is preliminary and the information in this
document is subject to change. Please contact Laird Technologies or visit the Laird website at www.Lairdtech.com to
obtain the most recent version of this document.

2 OPERATIONAL DESCRIPTION

The BT830 series of UART HCI devices are designed to meet the needs of OEMs adding
robust Bluetooth connectivity and using embedded Bluetooth stacks within these products.

Leveraging the market-leading CSR8811 chipset, the BT830 series provides exceptionally
low power consumption with outstanding range. Supporting the latest Bluetooth v4.0
Specification with EDR (Enhanced Data Rate), the Laird BT830 series enables OEMs to
accelerate their development time for leveraging either Classic Bluetooth or Bluetooth Low
Energy (BLE) into their operating system based devices.

With a tiny footprint as small as 8.5 x 13 mm, yet output power at 7 dBm, these modules are ideal for applications
where designers need high performance in minimal size. For maximum flexibility in systems integration, the modules
are designed to support a UART interface plus GPIO and additionally I2S and PCM audio interfaces.

These modules present an HCI interface and have native support for Windows and Linux Bluetooth software stacks.
All BT830 series devices are fully qualified as Bluetooth Hardware Controller Subsystem products. This also allows
designers to integrate their existing pre-approved Bluetooth Host and Profile subsystem stacks to gain a Bluetooth
END product approval for their products.

The BT830 series is engineered to provide excellent RF performance with integrated antenna and additional band pass
filters. It further reduces regulatory and testing requirements for OEMs and ensures a hassle free development cycle.

A fully featured, low-cost developer’s kit is available for prototyping, debug, and integration testing of the BT830
series modules and further reduces risk and time in development cycles.

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CS8811A08
(Main chip)

The BT830 is based on CSR8811A08 dual mode chip. The chip is a single-chip radio with on-chip
LDO regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps.
Dedicated signal and baseband processing is included for full Bluetooth operation. The chip
provides PCM/I2S and UART interfaces. Up to four general purpose I/Os are available for general
use such as Wi-Fi coexistence or general indicators.

Note: The purpose of the SPI interface is to access the module’s inner settings such as selecting

different WLAN CO-EXIST scheme and enabling HID proxy mode. The SPI interface can
also be used to put the module in RF test mode. You cannot use the module over the SPI
interface for normal operation as the main host interface.

Antenna

The antenna is a ceramic monopole chip antenna.

Band Pass
Filter

The band pass filter filters the out-of-band emissions from the transmitter to meet the specific
regulations for type approvals of various countries.

Crystal

The embedded 26 MHz crystal is used for generating the clock for the entire module.

3 BLOCK DIAGRAM AND DESCRIPTIONS

Figure 1: BT830 module block diagram

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CATEGORIES

FEATURE

IMPLEMENTATION

Wireless Specification

Bluetooth®

V4.0 Dual Mode

Frequency

2.402 - 2.480 GHz

Maximum Transmit
Power

Class 1
+7 dBm from antenna

Receive Sensitivity

-89 dBm

Range

Circa 100 meters

Data Rates

Up to 3 Mbps (over the air)

Host Interface
UART

RX, TX, CTS, RTS

GPIO

Four configurable lines
(1.8V/3.3V configurable by VDD_PADS)

Operational Modes

HCI

Host Controller Interface over UART

Coexistence

802.11 (Wi-Fi)

3 wire CSR schemes supported
(Unity-3;Unity-3e, and Unity+)

Supply Voltage

Supply

3.3V +/-10%
Note: See

Implementation Note

for details on different DC

power selections on the BT830.

Power Consumption

Current

Idle Mode ~TBD mA (Master; ACL link; No traffic)
File Transfer ~TBD mA (Master; ACL link; Transmit)

Antenna Option

Internal

Multilayer ceramic antenna with up to 41% efficiency.

Physical

Dimensions

8.5 x 13 x 1.6 mm (BT830 - Module)

Environmental
Operating

-30C to +85C

Storage

-40C to +85C

Miscellaneous
Lead Free

Lead-free and RoHS compliant

Warranty

1 Year

Approvals
Bluetooth®

Hardware Controller Subsystem Approved

FCC / IC / CE

All BT830 series (BT830-SA; BT830-ST)

4 SPECIFICATIONS

Table 1: BT830 specifications

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#

Pin Name

I/O

Supply Domain

Description

1

VDD_PADS

Power supply

(1.7V-3.6V)

Positive supply for digital I/O pads

2

GND

GND

-

Ground

3

UART_RTS

Bidirectional, tristate,
with weak internal

pullup

VDD_PADS
UART data output, active high

4

UART_TX

Bidirectional, tristate,
with weak internal

pullup

VDD_PADS
UART data input, active high

5

UART_CTS

Bidirectional, tristate,
with weak internal

pullup

VDD_PADS
UART clear to send, active low

6

UART_RX

Bidirectional, tristate,
with weak internal

pullup

VDD_PADS
UART request to send, active low

7

GND

GND

-

Ground

8

VREG_EN_RST#

Input with strong
internal pull-down

VDD_PADS

Take high to enable internal
regulators. Also acts as active low
reset. Maximum voltage is VDD_PADS.

9

VREG_IN_HV

Analogue regulator
input

3.3V

Input to internal high-voltage regulator

10

VREG_OUT_HV

Analogue regulator
input/output

1.8V

Output from internal high-voltage
regulator and input to low-voltage
internal regulators.

11

GND

GND

-

Ground

12

GND

GND

-

Ground

13

GND

GND

-

Ground

14

GND

GND

-

Ground

15

GND

GND

-

Ground

16

GND

GND

-

Ground

17

RF

RF signal out (50 ohm) for BT830-ST
version only.

Not connection for BT830-SA.

18

GND

GND

-

Ground

19

PCM_SYNC/
SPI_CS#/

PIO23

Bidirectional, tri-state,
with weak internal
pull-down

VDD_PADS

PCM synchronous data sync SPI chip
select, active low Programmable
input/output line

*See Note 1.

5 PIN DEFINITIONS

Table 2: BT830 pin definitions

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#

Pin Name

I/O

Supply Domain

Description

20

PCM_CLK/ SPI_CLK/
PIO24

Bidirectional, tri-state,
with weak internal
pull-down

VDD_PADS

PCM synchronous data clock
SPI clock
Programmable input/output line
*See Note 1.

21

PCM_IN/ SPI_MOSI/
PIO21

Input, tri-state, with
weak internal pull­down

VDD_PADS

PCM synchronous data input
SPI data input
Programmable input/output line
*See Note 1.

22

PCM_OUT/
SPI_MISO/

PIO22

Output, tri-state, with
weak internal pull­down

VDD_PADS

PCM synchronous data output
SPI data output
Programmable input/output line
*See Note 1.

23

GND

GND

-

Ground

24

PIO0/
32K_CLK_IN

Bidirectional, tri-state,
with weak internal pull­down

VDD_PADS

Programmable input/output line and
32kHz sleep clock input

25

PIO1/
BT_ACTIVE

Bidirectional, tri-state,
with weak internal pull­down

VDD_PADS

Programmable input/output line;
Wi-Fi & BT 3-wire coexistance

26

PIO9/
BT_PRIORITY

Bidirectional, tri-state,
with weak internal pull­down

VDD_PADS

Programmable input/output line;
Wi-Fi & BT 3-wire coexistance

27

PIO4/
WLAN_ACTIVE

Bidirectional, tri-state,
with weak internal pull­down

VDD_PADS

Programmable input/output line;
Wi-Fi & BT 3-wire coexistance

28

SPI_PCM#_SEL

Input with weak
internal pull-down

VDD_PADS

Control line to select SPI or PCM
interface, high = SPI, low = PCM
*See Note 1.

29

GND

GND

-

Ground

30

GND

GND

-

Ground

Note 1: The purpose of the SPI interface is to access the module’s inner settings such as selecting different WLAN

CO-EXIST scheme. The SPI interface can also be used to put the module in RF test mode. You cannot use

the module over the SPI interface for normal operation as the main host interface.

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Rating

Min

Max

Unit

Storage temperature

-40

+85

⁰C

VREG_IN_HV

2.3

4.8 V VREG_OUT_HV

1.7

2.0 V VDD_PADS

-0.4

3.6 V Other terminal voltages

VSS - 0.4V

VDD + 0.4 V

V

Rating

Min

Max

Unit

Operating temperature

-30

+85

⁰C

VREG_IN_HV

2.3

4.8

V

VREG_OUT_HV

1.75

1.95

V

VDD_PADS

1.2

3.6

V

VREG_EN_RST#

VDD_PADS

VDD_PADS

V

Normal Operation

Min

Typ

Max

Unit

Input voltage (VREG_IN_HV)

3.1

3.3

3.6

V

Output voltage (VREG_OUT_HV)

1.75

1.85

1.95

V

Temperature coefficient

-200

-

200

ppm/⁰C

Output noise
(frequency range 100Hz to100kHz)

- - 0.4

mV rms

Settling time (settling time
within 10% of final value)

- - 5

µs

Output current

- - 100

mA

Quiescent current
(excluding load, load <1mA)

30

40

60

µA

Low-power Mode

Quiescent current
(excluding load, load <100µA)

14

18

23

µA

Normal Operation

Min

Typ

Max

Unit

Input Voltage

VIL input logic level low

-0.4 - 0.4

V

VIH input logic level high

0.7 x
VDD

-

VDD +

0.4

V

6 DC ELECTRICAL CHARACTERISTIC

Table 3: Absolute maximum ratings

Table 4: Recommended operating conditions

Table 5: High-voltage Linear Regulator

Table 6: Digital I/O Characteristics

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Normal Operation

Min

Typ

Max

Unit

Output Voltage

VOL output logic level low,
IOL = 4.0 mA

- - 0.4

V

VOH output logic level high,
IOL = 4.0 mA

0.75 x
VDD

- - V
Input and Tristate Currents

Strong pull-up

-150

-40

-10

µA

Strong pull-down

10

40

150

µA

Weak pull-up

-5

-1.0

-0.33

µA

Weak pull-down

0.33

1.0

5.0

µA

CI input capacitance

1.0 - 5.0

pF

Normal Operation

Peak (7 dBm)

AVG

Unit

Idle 4.3

mA

Inquiry 891

µA

File Transfer

73

58

mA

LE Connected (Master)

74 mA

LE Scan (Master)

48 mA

RF Characteristics, VDD = 3.3V @ room
temperature unless otherwise specified

Min Typ.

Max

BT. Spec.

Unit

Maximum RF Transmit Power

7 8

20

dBm

RF power variation over temperature range

1.5 -

dB

RF power variation over supply voltage range

0.2 - dB

RF power variation over BT band

2 - dB

RF power control range

-21 8 - dBm

20 dB band width for modulated carrier

1000

kHz

ACP

F = F

0

± 2MHz

-20

F = F

0

± 3MHz

-40

F = F

0

> 3MHz

-40

Drift rate

10 +/-25

kHz

ΔF

1avg

165

140<175

kHz

ΔF1

max

168

140<175

kHz

ΔF

2avg

/ ΔF

1avg

0.9 >=0.8

Table 7: Current Consumption

7 RF CHARACTERISTICS

Table 8: Receiver Characteristics

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RF Characteristics, VDD = 3.3V @ room temp.

Packet Type

Min

Typ

Max

BT. Spec.

Unit

Sensitivity for 0.1% BER

DH1

-89 -70

dBm

DH3

-89

dBm

DH5

-89

dBm

2-DH5

-92

dBm

3-DH5

-85

dBm

Sensitivity variation over BT band

All

2 dB

Sensitivity variation over temperature range

All

TBD

dB

Table 9: BDR and EDR receiver sensitivity

8 INTERFACE

8.1 PIO

See the Device Terminal Functions section for the list of supplies to the PIOs (Programmable I/O ports).

PIO lines are configured through software to have either weak or strong pull-ups or pull-downs. All PIO lines are
configured as inputs with weak pull-downs at reset and have additional individual bus-keeper configuration.

8.2 WLAN Coexistence Interface

Dedicated hardware is provided to implement a variety of WLAN coexistence schemes. There is support for:

 Channel skipping AFH
 Priority signaling
 Channel signaling
 Host passing of channel instructions

The BT830 supports the WLAN coexistence schemes:

 Unity-3
 Unity-3e
 Unity+

For more information see

BT830 WLAN Coexistence Schemes and LED Indication

.

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8.3 UART Interface

This is a standard UART interface for communicating with other serial devices.

CSR8811 UART interface provides a simple mechanism for communicating with other serial devices using the RS-232
protocol.

The above figure shows the 4 signals that implement the UART function. When BT830 is connected to another digital
device, UART_RX and UART_TX transfer data between the 2 devices. The remaining 2 signals, UART_CTS and
UART_RTS, implement RS232 hardware flow control where both are active low indicators. The default configuration
of UART is 115200 bauds; None parity check; 1 stop bit; 8 bits per byte.

Note: To communicate with the UART at its maximum data rate using a standard PC, an accelerated serial port

adapter card is required for the PC.

8.4 PCM Interface

The audio PCM interface on the BT830 supports:

 Continuous transmission and reception of PCM encoded audio data over Bluetooth.
 Processor overhead reduction through hardware support for continual transmission and reception of PCM

data.

 A bidirectional digital audio interface that routes directly into the baseband layer of the firmware. It does not

pass through the HCI protocol layer.

 Hardware on the BT830 for sending data to and from a SCO connection.
 Up to three SCO connections on the PCM interface at any one time.
 PCM interface master, generating PCM_SYNC and PCM_CLK.
 PCM interface slave, accepting externally generated PCM_SYNC and PCM_CLK.
 Various clock formats including:

- Long Frame Sync

- Short Frame Sync

 GCI timing environments.
 13-bit or 16-bit linear, 8-bit µ-law, or A-law companded sample formats.
 Receives and transmits on any selection of three of the first four slots following PCM_SYNC.

The PCM configuration options are enabled by setting PSKEY_PCM_CONFIG32.

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8.4.1 PCM Interface Master/Slave

When configured as the master of the PCM interface, the BT830 generates PCM_CLK and PCM_SYNC.

Figure 2: PCM Interface Master

Figure 3: PCM Interface Slave

8.4.2

L

ong

Frame Sync

Figure 4: Long Frame Sync (shown with 8-bit Companded Sample)

Long Frame Sync is the name given to a clocking format that controls the transfer of PCM data words or samples. In
Long Frame Sync, the rising edge of PCM_SYNC indicates the start of the PCM word. When the BT830 is configured
as PCM master, generating PCM_SYNC and PCM_CLK, then PCM_SYNC is eight bits long. When the BT830 is
configured as PCM Slave, PCM_SYNC is from one cycle PCM_CLK to half the PCM_SYNC rate.

BT830 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the rising edge. PCM_OUT is
configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on the rising edge.

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8.4.3

S

hort Frame Sync

In Short Frame Sync, the falling edge of PCM_SYNC indicates the start of the PCM word. PCM_SYNC is always one
clock cycle long.

Figure 5: Short Frame Sync (Shown with 16-bit Sample)

As with Long Frame Sync, BT830 samples PCM_IN on the falling edge of PCM_CLK and transmits PCM_OUT on the
rising edge. PCM_OUT is configurable as high impedance on the falling edge of PCM_CLK in the LSB position or on
the rising edge.

8.4.4 Multi-Slot Operation

More than 1 SCO connection over the PCM interface is supported using multiple slots. Up to 3 SCO connections are
carried over any of the first 4 slots.

Figure 6: Multi-slot Operation with 2 Slots and 8-bit Companded Samples

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8.5 GCI Interface

BT830 is compatible with the GCI, a standard synchronous 2B+D ISDN timing interface. The two 64 kbps B channels
are accessed when this mode is configured.

Figure 7: Multi-slot Operation

The start of frame is indicated by the rising edge of PCM_SYNC and runs at 8 kHz.

8.6 Slots and Sample Formats

BT830 receives and transmits on any selection of the first four slots following each sync pulse. Slot durations are
either 8 or 16 clock cycles:

 8 clock cycles for 8-bit sample formats.
 16 clock cycles for 8-bit, 13-bit, or 16-bit sample formats.

BT830 supports:

 13-bit linear, 16-bit linear and 8-bit µ-law or A-law sample formats
 A sample rate of 8 ksps
 Little or big endian bit order
 For 16-bit slots, the three or eight unused bits in each slot are filled with sign extension, padded with zeros or a

programmable 3-bit audio attenuation compatible with some codecs.

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Symbol

Parameter

Min Typ Max Unit

f

mclk

PCM_CLK frequency
4MHz DDS generation. Frequency

selection is programmable.

­128

-

kHz
256

512

48MHz DDS generation. Frequency
selection is programmable.

2.9 - -

kHz

-

PCM_SYNC frequency for SCO connection

- 8 -

kHz

t

mclkh

(a)

PCM_CLK high

4MHz DDS generation

980 - -

ns

t

mclkl

a)

PCM_CLK low

4MHz DDS generation

730 - -

ns

-

PCM_CLK jitter

48MHz DDS generation

- - 21

ns
pk-pk

t

dmclksynch

Delay time from
PCM_CLK high to
PCM_SYNC high

4MHz DDS generation

- - 20

ns

48MHz DDS generation

- - 40.83

ns

t

dmclkpout

Delay time from PCM_CLK high to valid PCM_OUT

- - 20

ns

t

dmclklsyncl

Delay time from
PCM_CLK low to

4MHz DDS generation

- - 20

ns

48MHz DDS generation

- - 40.83

ns

Figure 8: 16-bit Slot Length and Sample Formats

8.7

PCM Timing Information

Table 10: PCM Timing information

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Symbol

Parameter

Min Typ Max Unit

PCM_SYNC low (long
frame sync only)

Symbol

Parameter

Min Typ Max Unit

t

Delay time from
PCM_CLK high to
PCM_SYNC low

4MHz DDS generation

- - 20

ns

48MHz DDS generation

- - 40.83

ns

t

dmclklpoutz

Delay time from PCM_CLK low to PCM_OUT
high impedance

- - 20

ns

t

dmclkhpoutz

Delay time from PCM_CLK high to PCM_OUT
high impedance

- - 20

ns
t Set-up time for PCM_IN valid to PCM_CLK low

20 - -

ns

t

hpinclkl

Hold time for PCM_CLK low to PCM_IN invalid

0 - -

ns

(a) Assumes normal system clock operation. Figures vary during low-power modes, when system clock speeds are reduced.

Table 11: PCM Master Mode Timing Parameters

Figure 9: PCM Master Timing Long Frame Sync

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Symbol

Parameter

Min

Typ

Max

Unit

f

sclk

PCM clock frequency (Slave mode: input)

64 - 2048

kHz

f

sclk

PCM clock frequency (GCI mode)

128 - 4096

kHz

t

sclkl

PCM_CLK low time

200 - -

ns

t

sclkh

PCM_CLK high time

200 - -

ns

Symbol

Parameter

Min

Typ

Max

Unit

t

hsclksynch

Hold time from PCM_CLK low to PCM_SYNC high

2 - -

ns

t

susclksynch

Set-up time for PCM_SYNC high to PCM_CLK low

20 - -

ns

t

dpout

Delay time from PCM_SYNC or PCM_CLK, whichever is later,
to valid PCM_OUT data (long frame sync only)

- - 15

ns

t

dsclkhpout

Delay time from CLK high to PCM_OUT valid data

- - 15

ns

t

dpoutz

Delay time from PCM_SYNC or PCM_CLK low, whichever is
later, to PCM_OUT data line high impedance

- - 20

ns

t

supinsclkl

Set-up time for PCM_IN valid to CLK low

20 - -

ns

t

hpinsclkl

Hold time for PCM_CLK low to PCM_IN invalid

2 - -

ns

Figure 10: PCM Master Timing Short Frame Sync

8.8 PCM Slave Timing

8.9 PCM Slave Mode Timing Parameters

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Figure 11: PCM Slave Timing Long Frame Sync

Figure 12: PCM Slave Timing Short Frame Sync

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PCM Interface

I²S Interface

PCM_OUT

SD_OUT

PCM_IN

SD_IN

PCM_SYNC

WS

PCM_CLK

SCK

8.10 PCM_CLK and PCM_SYNC Generation

BT830 has two methods of generating PCM_CLK and PCM_SYNC in master mode:

 Generating these signals by DDS from BT830internal 4MHz clock. Using this mode limits PCM_CLK to 128, 256

or 512 kHz and PCM_SYNC to 8 kHz.

 Generating these signals by DDS from an internal 48MHz clock, which enables a greater range of frequencies

to be generated with low jitter but consumes more power. To select this second method set bit
48M_PCM_CLK_GEN_EN in PSKEY_PCM_CONFIG32. When in this mode and with long frame sync, the length
of PCM_SYNC is either 8 or 16 cycles of PCM_CLK, determined by LONG_LENGTH_SYNC_EN in
PSKEY_PCM_CONFIG32.

Equation 8.1 describes PCM_CLK frequency when generated from the internal 48MHz clock:

Equation 8.1: PCM_CLK Frequency Generated Using the Internal 48MHz Clock

Set the frequency of PCM_SYNC relative to PCM_CLK using Equation 8.2:

Equation 8.2: PCM_SYNC Frequency Relative to PCM_CLK

CNT_RATE, CNT_LIMIT and SYNC_LIMIT are set using PSKEY_PCM_LOW_JITTER_CONFIG. As an example, to
generate PCM_CLK at 512kHz with PCM_SYNC at 8kHz, set SKEY_PCM_LOW_JITTER_CONFIG to 0x08080177.

8.11 PCM Configuration

Configure the PCM by using PSKEY_PCM_CONFIG32 and PSKEY_PCM_LOW_JITTER_CONFIG (See your PSKey file).
The default for PSKEY_PCM_CONFIG32 is 0x00800000 (for example: first slot following sync is active, 13-bit linear
voice format, long frame sync and interface master generating 256kHz PCM_CLK from 4MHz internal clock with no
tri-state of PCM_OUT).

8.12 Digital Audio Interface (I²S)

The digital audio interface supports the industry standard formats for I²S, left-justified or right-justified. The interface
shares the same pins as the PCM interface, which means each audio bus is mutually exclusive in its usage. Table 12
lists these alternative functions. Figure 11 shows the timing diagram.

Table 12: Alternative Functions of the Digital Audio Bus Interface on the PCM Interface.

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Symbol

Parameter

Min Typ Max Unit

-

SCK Frequency

- - 6.2

MHz

-

WS Frequency

- - 96

kHz t

SCK high time

80 - -

ns t

SCK low time

80 - -

ns

Configure the digital audio interface using PSKEY_DIGITAL_AUDIO_CONFIG, see BlueCore Audio API Specification
and the PS Key file.

Figure 13: PCM Configuration

The internal representation of audio samples within BT830is 16-bit and data on SD_OUT is limited to 16-bit per
channel.

Table 13: Digital Audio Interface Slave Timing

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Symbol

Parameter

Min

Typ

Max

Unit

t WS valid to SCK high set-up time

20 - -

ns

t SCK high to WS invalid hold time

2.5 - -

ns

t SCK low to SD_OUT valid delay time

- - 20

ns t

SD_IN valid to SCK high set-up time

20 - -

ns t

SCK high to SD_IN invalid hold time

2.5 - -

ns

Symbol

Parameter

Min Typ Max Unit

-

SCK Frequency

- - 6.2

MHz

-

WS Frequency

- - 96

kHz

Symbol

Parameter

Min Typ Max Unit

t SCK low to WS valid delay time

- - 39.27

ns t

SCK low to SD_OUT valid delay time

- - 18.44

ns t

SD_IN valid to SCK high set-up time

18.44

- - ns t

SCK high to SD_IN invalid hold time

0 - -

ns

Table 14: I²S Slave Mode Timing

Figure 14: Digital Audio Interface Slave Timing

Table 15: Digital Audio Interface Master Timing

Table 16: I²S Master Mode Timing Parameters, WS and SCK as Outputs

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Figure 15: Digital Audio Interface Master Timing

9 POWER SUPPLY AND REGULATION

See the Example Application Schematic (Error! Reference source not found.) for the regulator configuration. BT830
can be powered by either two sources listed below

 Method #1: Apply 3.3 V on pin-9,High-voltage linear regulator input (VREG_IN_HV), to generate the main 1.8

V out put on pin-10 (VREG_OUT_HV).
A minimum 1.5μF capacitor must be connected to the Pin-10 (VREG_OUT_HV). Low ESR capacitors such as

multilayer ceramic types should be used.

 Method #2: Apply 1.8V on pin-10 High-voltage linear regulator output (VREG_OUT_HV), to generate the

internal voltage for the system. Be sure to left Pin-9 un-connected in this method.

9.1 Voltage Regulator Enable and Reset

A single pin, VREG_EN_RST#, controls both the High-voltage linear regulator enables and the digital reset function.
The VREG_EN_RST# pin remains active controlling the reset function if the HV linear regulator is not used so the pin
must be driven high to take the device out of reset.

The regulator is enabled by taking the VREG_EN_RST# pin above 1V. The regulator can also be controlled by the
software.

The VREG_EN_RST# is also connected internally to the reset function, and is powered from the VDD_PADS supply, so
voltages above VDD_PADS must not be applied to this pin. The VREG_EN_RST# pin is pulled down internally.

The VREG_EN_RST# pin is an active low reset. Assert the reset signal for a period >5 ms to ensure a full reset.

Note: The regulator enables are released as soon as VREG_EN_RST# is low, so the regulators shut down.

Therefore do not take VREG_EN_RST# low for less than 5 ms, as a full reset is not guaranteed.

Other reset sources are:

Power-on reset
Via a software-configured watchdog timer

A warm reset function is also available under software control. After a warm reset the RAM data remains
available.

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Unit in dBi @ 2.44 GHz

XY-plane

XZ-plane

YZ-plane

Efficiency

Peak

Avg.

Peak

Avg.

Peak

Avg.

A1

-3.5

-4.2

3.8

-5.3

3.2

-4.7

41.0%

9.2 Power Sequencing

CSR recommends that all power supplies are powered at the same time. The order of powering the supplies relative
to the I/O supply, VDD_PADS to VREG_IN_HV or VREG_OUT_HV, is not important.

10 ANTENNA PERFORMANCE

Table 17 displays antenna performance for this module.

Table 17: Gain table

Figure 16: Network Analyzer output

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Figure 17: XY plane

XY-plane
Peak

Avg.

-3.5

-4.2

Figure 18: XZ-plane

XZ-plane

Peak

Avg.

3.8

-5.3

Figure 19: YZ-plane

YZ-plane

Peak

Avg.

3.2

-4.7

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11 MECHANICAL DIMENSIONS AND LAND PATTERN

11.1 BT830 Mechanical Drawing

Note: Dimensions are in mm.

Tolerances: .xx ±0.03 mm
.x ±1.3 mm

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12 IMPLEMENTATION NOTE

12.1 PCB Layout on Host PCB

Checklist (for PCB):

 MUST locate the BT830 module close to the edge of PCB.
 Use solid GND plane on inner layer (for best EMC and RF performance).
 Place GND vias close to module GND pads as possible
 Route traces to avoid noise being picked up on VCC supply.
 Antenna Keep-out area:

- Ensure there is no copper in the antenna keep-out area on any layers of the host PCB.

- Keep all mounting hardware and metal clear of the area to allow proper antenna radiation.

- For best antenna performance, place the BT830 module on the edge of the host PCB, preferably in the

corner with the antenna facing the corner.

- A different host PCB thickness dielectric will have small effect on antenna.

Figure 20: Recommend Antenna keep-out area (in White) used on the BT830

12.1.1 Antenna Keep-out and Proximity to Metal or Plastic

Checklist (for metal /plastic enclosure):

 Minimum safe distance for metals without seriously compromising the antenna (tuning) is 40 mm top/bottom

and 30 mm left or right.

 Metal close to the BT830 chip monopole antenna (bottom, top, left, right, any direction) will have degradation

on the antenna performance. The amount of degradation is entirely system dependent which means some
testing by customers is required (in their host application).

 Any metal closer than 20 mm starts to significantly degrade performance (S11, gain, radiation efficiency).
 It is best that the customer tests the range with mock-up (or actual prototype) of the product to assess effects

of enclosure height (and material whether metal or plastic).

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12.1.2 DC power supply options for using BT830 module

 Using DC power 3.3 V

Power the on Pin-9 (VREG_IN_HV) with 3.3 V and pull-high on Pin-8 (VREG_EN_RST#) to turn on the internal
regulator. The BT830 module generates 1.8 V output on Pin-10 (VREG_OUT_HV) which can supply to the other
DC pin of the board.

 Using DC power 1.8 V

Leave the Pin-9 (VREG_IN_HV) no connection, power the Pin-10 (VREG_OUT_HV) with 1.8 V and pull-high on
Pin-8 (VREG_EN_RST#) to turn on the internal regulator.

13 APPLICATION NOTE FOR SURFACE MOUNT MODULES

13.1 Introduction

Laird surface mount modules are designed to conform to all major manufacturing guidelines. This application note is
intended to provide additional guidance beyond the information that is presented in the user manual. This application
note is considered a living document and is updated as new information is presented.

The modules are designed to meet the needs of a number of commercial and industrial applications. They are easy to
manufacture and they conform to current automated manufacturing processes.

13.2 Shipping tray

Modules are shipped in ESD (Electrostatic Discharge) safe trays that can be loaded into most manufacturers pick and
place machines. Layouts of the trays are provided in Figure 21.

Figure 21: Shipping tray layout

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Specification

Value

Unit

Temperature Inc./Dec. Rate (max)

1~3

°C / Sec

Temperature Decrease rate (goal)

2-4

°C / Sec

Soak Temp Increase rate (goal)

.5 - 1

°C / Sec

Flux Soak Period (Min)

70

Sec

Flux Soak Period (Max)

120

Sec

Flux Soak Temp (Min)

150

°C

Flux Soak Temp (max)

190

°C

Time Above Liquidous (max)

70

Sec

Time Above Liquidous (min)

50

Sec

Time In Target Reflow Range (goal)

30

Sec

Time At Absolute Peak (max)

5

Sec

Liquidous Temperature (SAC305)

218

°C

Lower Target Reflow Temperature

240

°C

Upper Target Reflow Temperature

250

°C

Absolute Peak Temperature

260

°C

13.3 Reflow Parameters

Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately
it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during
reflow meet the requirements of the solder paste. Laird’s surface mount modules conform to J-STD-020D1 standards
for reflow temperatures.

Important: During reflow, modules should not be above 260° and not for more than 30 seconds.

Figure 13-22: Recommended Reflow Temperature

Temperatures should not exceed the minimums or maximums presented in Table 18.

Table 18: Recommended Maximum and minimum temperatures

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Model

US/FCC

CANADA/IC

BT830

TBC

TBC

BT830

TBC

TBC

DVK-BT830

TBC

TBC

Item

Part Number

Mfg.

Type

Gain (dBi)

1

AT3216-B2R7HAA

ACX

Ceramic

0.5

IMPORTANT:

In the event that the conditions above cannot be met (for example certain device configurations or
co-location with another transmitter), then the FCC authorization is no longer considered valid and the
FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be
responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC
authorization.

When using Laird’s FCC grant for the BT830, the integrator must include specific information in the

user’s guide for the device into which the BT830 is integrated. The integrator must not provide
information to the end user regarding how to install or remove this RF module in the user’s manual of

the device into which the BT830 is integrated. The following FCC statements must be added in their

entirety and without modification into a prominent place in the user’s guide for the device into which

the BT830 is integrated:

14 FCC AND IC REGULATORY

The BT830 family has been designed to operate with the antenna listed below having a maximum gain of 0.5 dBi. The
required antenna impedance is 50 ohms.

14.1 Documentation Requirements

In order to ensure regulatory compliance, when integrating the BT830 into a host device, it is necessary to meet the
documentation requirements set forth by the applicable regulatory agencies. The following sections (FCC, Industry
Canada, and European Union) outline the information that may be included in the user’s guide and external labels for
the host devices into which the BT830 is integrated.

FCC

Note: You must place “Contains FCC ID: TBC” on the host product in such a location that it can be seen by an

operator at the time of purchase.

User’s Guide Requirements

The BT830 complies with FCC Part 15 Rules for a Modular Approval. To leverage Laird’s grant, the conditions below
must be met for the host device into which the BT830 is integrated:

 The transmitter module is not co-located with any other transmitter or antenna that is capable of simultaneous

operation.

As long as the conditions above are met, further transmitter testing is typically not required. However, the OEM
integrator is still responsible for testing its end-product for any additional compliance requirements required with this
module installed, such as (but not limited to) digital device emissions and PC peripheral requirements.

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IMPORTANT NOTE: To comply with FCC requirements, the BT830 must not be co-located or

operating in conjunction with any other antenna or transmitter.

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:

1. Reorient or relocate the receiving antenna.

2. Increase the separation between the equipment and receiver.

3. Connect the equipment into an outlet on a circuit different from that to which the receiver is

connected.

4. Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for
compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

IMPORTANT NOTE: FCC Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.

Industry Canada

Note: You must place “Contains IC ID: TBC” on the host product in such a location that it can be seen by an

operator at the time of purchase.

RF Radiation Hazard Warning

Using higher gain antennas and types of antennas not certified for use with this product is not allowed. The device
shall not be co-located with another transmitter.

Cet avertissement de sécurité est conforme aux limites d'exposition définies par la norme CNR-102 at relative aux
fréquences radio.

This radio transmitter (Contains IC ID: TBC) has been approved by Industry Canada to operate with the antenna types
listed in table above with the maximum permissible gain and required antenna impedance for each antenna type
indicated. Antenna types not included in this list, having a gain greater than the maximum gain indicated for that
type, are strictly prohibited for use with this device.

Le présent émetteur radio (Contains IC ID: TBC) a été approuvé par Industrie Canada pour fonctionner avec les types
d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type
d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué,
sont strictement interdits pour l'exploitation de l'émetteur.

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Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum
(or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users,
the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not
more than that necessary for successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne
d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire
les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain
de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante.

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en
compromettre le fonctionnement.

15 EUROPEAN UNION REGULATORY

The BT830 has been tested for compliance with relevant standards for the EU market. BT830 module was tested with
a 0.5 dBi chip antenna.

The OEM should consult with a qualified test house before entering their device into an EU member country to make
sure all regulatory requirements have been met for their complete device.

Reference the Declaration of Conformities listed below for a full list of the standards that the modules were tested to.
Test reports are available upon request.

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Manufacturer:

Laird

Product:

BT830-SA / BT830-ST

EU Directive:

RTTE 1995/5/EC

Conformity Assessment:

Annex IV

Article
Number

Requirement

Reference standard(s)

3.1a

Health and Safety

EN60950-1:2006+A11:2009+A1:2010+A12:2011

3.1b

Protection requirements with respect to
electromagnetic compatibility

EN 301 489-1 V1.9.2 (2011-09)
EN 301 489-17 V2.2.1 (2012-09)
Emissions:
EN55022:2006/A1:2007 (Class B)
Immunity:
EN61000-4-2:2009
EN61000-4-3:2006/A1:2008/A2:2010

3.2

Means of the efficient use of the radio
frequency spectrum

EN 300 328 V1.8.1 (2012-06)

Place of Issue:

Laird
Saturn House, Mercury Park
Wooburn Green
HP100HH,
United Kingdom
tel: [phone]
fax: [phone]

Date of Issue:

July 2013

Name of Authorized Person:

Andrew Dobbing, Engineering Manager

Signature:
Part Number

Description

BT830-SA

BTv4.0 Dual Mode UART HCI Module with integrated Antenna

BT830-ST

BTv4.0 Dual Mode UART HCI Module

DVK-BT830

Development Kit for BT830 Module

15.1 EU Declarations of Conformity

15.1.1 BT830

Reference standards used for presumption of conformity:

Declaration:

We, Laird, declare under our sole responsibility that the essential radio test suites have been carried out and that the
above product to which this declaration relates is in conformity with all the applicable essential requirements of
Article 3 of the EU Directive 1999/5/EC, when used for its intended purpose.

16 ORDERING INFORMATION

16.1 General Comments

This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If in
doubt, ask.

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Design Name

Owner

Declaration ID

Link to listing on the SIG website

BT830

Laird

TBC

https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=TBC

Windows 8
(Host Subsystem)

Microsoft
Corporation

B012854

https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=12854

TBC

17 BLUETOOTH SIG APPROVALS

17.1 Application Note: Subsystem Combinations

This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on the
Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to create a
complete Bluetooth End Product solution.

Subsystem listings referenced as an example:

Laird Customer Declaration ID Procedure

This procedure assumes that the member is simply combining two subsystems to create a new design, without any
modification to the existing, qualified subsystems. This is achieved by using the Listing interface on the Bluetooth SIG
website. Figure 23 shows the basic subsystem combination of a controller and host subsystem. The Controller
provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP and any other
specific protocols and profiles existing in the Host subsystem listing. The design may also include a Profile Subsystem.

The controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP and
any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a Profile
Subsystem.

Figure 23: Basic subsystem combination of a controller and host subsystem

The Qualification Process requires each company to registered as a member of the Bluetooth SIG –

http://www.bluetooth.org

The following link provides a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/

BT830 Hardware Integration Guide

Version 0.1 (PRELIMINARY)

Americas: [phone] Option 2
Europe: [phone]
Hong Kong: [phone]
www.lairdtech.com/bluetooth

35

CONN-GUIDE-BT830

(PRELIMINARY)

For each Bluetooth Design it is necessary to purchase a Declaration ID. This can be done before starting the new
qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your
membership status, please refer to the following webpage:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees

For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG
document:

https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486

To start the listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm.

In step 1, select the option, Reference a Qualified Design and enter the Declaration IDs of each subsystem used in the
End Product design. You can then select your pre-paid Declaration ID from the drop down menu or go to the
Purchase Declaration ID page, (please note that unless the Declaration ID is pre-paid or purchased with a credit card,
it will not be possible to proceed until the SIG invoice is paid.

Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document.
Your new Design will be listed on the SIG website and you can print your Certificate and DoC.

For further information please refer to the following training material:

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates

17.2 Additional Assistance

Please contact your local sales representative or our support team for further assistance:

Laird Technologies Connectivity Products Business Unit

Support Centre: http://ews-support.lairdtech.com

Email: [e-mail]

Phone: Americas: [phone] Option 2

Europe: [phone]

Hong Kong: [phone]

Web: http://www.lairdtech.com/bluetooth

BT830 Hardware Integration Guide

Version 0.1 (PRELIMINARY)

Americas: [phone] Option 2
Europe: [phone]
Hong Kong: [phone]
www.lairdtech.com/bluetooth

36

CONN-GUIDE-BT830

(PRELIMINARY)

Copyright © 2014 Laird Technologies, Inc. All rights reserved.

The information contained in this manual and the accompanying software programs are copyrighted and all rights are reserved by Laird
Technologies, Inc. Laird Technologies, Inc. reserves the right to make periodic modifications of this product without obligation to notify any
person or entity of such revision. Copying, duplicating, selling, or otherwise distributing any part of this product or accompanying
documentation/software without the prior consent of an authorized representative of Laird Technologies, Inc. is strictly prohibited.
All brands and product names in this publication are registered trademarks or trademarks of their respective holders.

This material is preliminary Information furnished by Laird Technologies in this specification is believed to be accurate. Devices sold by Laird
Technologies are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Laird Technologies makes
no warranty, express, statutory, and implied or by description, regarding the information set forth herein. Laird Technologies reserves the right
to change specifications at any time and without notice. Laird Technologies’ products are intended for use in normal commercial and
industrial applications. Applications requiring unusual environmental requirements such as military, medical life-support or life-sustaining
equipment are specifically not recommended without additional testing for such application.
Limited Warranty, Disclaimer, Limitation of Liability

Federal Communication Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful interference in a residential installation.

This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instructions, may cause harmful

interference to radio communications. However, there is no guarantee that

interference will not occur in a particular installation. If this equipment does cause

harmful interference to radio or television reception, which can be determined by

turning the equipment off and on, the user is encouraged to try to correct the

interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party

responsible for compliance could void the user's authority to operate this equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) This device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

IMPORTANT NOTE:
FCC Radiation Exposure Statement:

The product comply with the US portable RF exposure limit set forth for an

uncontrolled environment and are safe for intended operation as described in this

manual. The further RF exposure reduction can be achieved if the product can be

kept as far as possible from the user body or set the device to lower output power if

such function is available.

This transmitter must not be co-located or operating in conjunction with any other

antenna or transmitter.

2006/8/16 v1.0

This device is intended only for OEM integrators under the following
conditions:

1) The transmitter module may not be co-located with any other transmitter or

antenna,

As long as 1 condition above is met, further transmitter test will not be required.

However, the OEM integrator is still responsible for testing their end-product for any

additional compliance requirements required with this module installed

IMPORTANT NOTE

In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the FCC authorization is

no longer considered valid and the FCC ID can not be used on the final product. In

these circumstances, the OEM integrator will be responsible for re-evaluating the

end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

The final end product must be labeled in a visible area with the following: “Contains

FCC ID: SQGBT830

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user

regarding how to install or remove this RF module in the user’s manual of the end

product which integrates this module.

The end user manual shall include all required regulatory information/warning as

show in this manual.

2006/8/16 v1.0

Industry Canada statement:

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is

subject to the following two conditions:

(1) this device may not cause interference, and

(2) this device must accept any interference, including interference that may cause

undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes :

(1) l'appareil ne doit pas produire de brouillage, et

(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le

brouillage est susceptible d'en compromettre le fonctionnement.

Radiation Exposure Statement:

The product comply with the Canada portable RF exposure limit set forth for an

uncontrolled environment and are safe for intended operation as described in this manual.

The further RF exposure reduction can be achieved if the product can be kept as far as

possible from the user body or set the device to lower output power if such function is

available.

Déclaration d'exposition aux radiations:

Le produit est conforme aux limites d'exposition pour les appareils portables RF pour les

Etats-Unis et le Canada établies pour un environnement non contrôlé. Le produit est sûr

pour un fonctionnement tel que décrit dans ce manuel. La réduction aux expositions RF

peut être augmentée si l'appareil peut être conservé aussi loin que possible du corps de

l'utilisateur ou que le dispositif est réglé sur la puissance de sortie la plus faible si une telle

fonction est disponible.

2006/8/16 v1.0

This device is intended only for OEM integrators under the following conditions:

1) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 1 condition above are met, further transmitter test will not be required. However,

the OEM integrator is still responsible for testing their end-product for any additional

compliance requirements required with this module installed.

Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions

suivantes:

1) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne.

Tant que les 1 condition ci-dessus sont remplies, des essais supplémentaires sur

l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours

responsable des essais sur son produit final pour toutes exigences de conformité

supplémentaires requis pour ce module installé.

IMPORTANT NOTE:

In the event that these conditions can not be met (for example certain laptop

configurations or co-location with another transmitter), then the Canada authorization is no

longer considered valid and the IC ID can not be used on the final product. In these

circumstances, the OEM integrator will be responsible for re-evaluating the end product

(including the transmitter) and obtaining a separate Canada authorization.

NOTE IMPORTANTE:

Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines

configurations d'ordinateur portable ou de certaines co-localisation avec un autre

émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut

pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé

de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte

au Canada.

End Product Labeling

The final end product must be labeled in a visible area with the following: “Contains IC:

3147A-BT830”.

Plaque signalétique du produit final

Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante:

"Contient des IC: 3147A-BT830".

2006/8/16 v1.0

Manual Information to the End User

The OEM integrator has to be aware not to provide information to the end user regarding

how to install or remove this RF module in the user’s manual of the end product which

integrates this module.

The end user manual shall include all required regulatory information/warning as show in

this manual.

Manuel d'information à l'utilisateur final

L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final

quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur

du produit final qui intègre ce module.

Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises

et avertissements comme indiqué dans ce manuel.

2006/8/16 v1.0

(For transmitters equipped with detachable antennas)

N/A

This radio transmitter (identify the device by certification number, or model number if

Category II) has been approved by Industry Canada to operate with the antenna types

listed below with the maximum permissible gain and required antenna impedance for each

antenna type indicated. Antenna types not included in this list, having a gain greater than

the maximum gain indicated for that type, are strictly prohibited for use with this device.

Le présent émetteur radio (IC:3147A-BT830) a été approuvé par Industrie Canada pour

fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible

maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non

inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont

strictement interdits pour l'exploitation de l'émetteur.

Type Manufacture Gain Connector

Chip

Dipole

PCB Dipole

Dipole

Dipole

ACX (Advanced Ceramic X
Corp.)

0.5dBi

Nearson 2.0 dBi IPEX u.FL

Laird Technologies 2.0 dBi

Laird Technologies 2.0 dBi

Laird Technologies 1.5 dBi

IPEX u.FL

IPEX u.FL

IPEX u.FL

2006/8/16 v1.0