Bluetooth v4.0 Dual-Mode USB HCI Module
Hardware Integration Guide (HIG)
Version 0.2
BT800 Series
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BT800 Hardware Integration Guide
Version 0.2
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Europe: +44-1628-858-940
Hong Kong: +852-2923-0610
www.lairdtech.com/bluetooth
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CONN-GUIDE-BT800_v0_2
Revision
Date
Changes
Version 0.1
7/8/2013
Preliminary
Version 0.2
10/07/13
Initial – KP only
REVISION HISTORY
BT800 Hardware Integration Guide
Version 0.2
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CONN-GUIDE-BT800_v0_2
CONTENTS
Revision History .......................................................................................................................... 2
Contents ..................................................................................................................................... 3
1 Scope .................................................................................................................................... 5
2 Operational Description ......................................................................................................... 5
Features & Benefits ............................................................................................................................ 5 2.1
Application Areas .............................................................................................................................. 5 2.2
3 Module picture ...................................................................................................................... 6
4 Block Diagram and Descriptions ............................................................................................ 7
Main Chip: CSR8510A10 ................................................................................................................... 7 4.1
Antenna ............................................................................................................................................... 7 4.2
Band Pass Filter ................................................................................................................................... 7 4.3
EEPROM ............................................................................................................................................... 7 4.4
Crystal .................................................................................................................................................. 7 4.5
5 Specifications ........................................................................................................................ 8
6 Pin definitions ....................................................................................................................... 9
7 DC Electrical Characteristic .................................................................................................. 11
8 RF Characteristics ................................................................................................................ 13
9 Interface .............................................................................................................................. 14
PIO (Programmable I/O Ports) ...................................................................................................... 14 9.1
WLAN Coexistence Interface ........................................................................................................ 14 9.2
USB Interface .................................................................................................................................... 14 9.3
PCM Interface .................................................................................................................................. 15 9.4
GCI Interface .................................................................................................................................... 17 9.5
Slots and Sample Formats .............................................................................................................. 17 9.6
PCM Timing Information
PCM Slave Timing ............................................................................................................................ 20 9.8
PCM Slave Mode Timing Parameters .......................................................................................... 20 9.9
PCM_CLK and PCM_SYNC Generation ...................................................................................... 22 9.10
PCM Configuration .......................................................................................................................... 22 9.11
Digital Audio Interface (I²S) ............................................................................................................ 22 9.12
10 Power Control and Regulation ............................................................................................. 25
USB Linear Regulator ....................................................................................................................... 25 10.1
High-voltage Linear Regulator ...................................................................................................... 25 10.2
Low-voltage VDD_DIG Linear Regulator ..................................................................................... 26 10.3
Low-voltage VDD_RADIO Linear Regulator ................................................................................ 26 10.4
Low-voltage VDD_AUX Linear Regulator .................................................................................... 26 10.5
Voltage Regulator Enable and Reset .......................................................................................... 26 10.6
Power Sequencing .......................................................................................................................... 26 10.7
11 Antenna performance .......................................................................................................... 27
12 Mechanical Dimensions and Land Pattern ............................................................................ 29
13 Implementation note ........................................................................................................... 30
PCB Layout on Host PCB ................................................................................................................ 30
13.1
14 Application Note for Surface Mount Modules ....................................................................... 32
Introduction ...................................................................................................................................... 32 14.1
Shipping tray ..................................................................................................................................... 32 14.2
Reflow Parameters .......................................................................................................................... 32 14.3
15 FCC and IC Regulatory ......................................................................................................... 34
Documentation Requirements ..................................................................................................... 34 15.1
................................................................................................................... 18 9.7
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CONN-GUIDE-BT800_v0_2
16 European Union Regulatory ................................................................................................. 38
17 EU Declarations of Conformity ............................................................................................. 38
BT800 / BT810 / BT820 ....................................................................................................................... 38 17.1
18 Ordering Information........................................................................................................... 39
General Comments ........................................................................................................................ 39 18.1
19 Bluetooth SIG Approvals ...................................................................................................... 40
TBC 40
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CONN-GUIDE-BT800_v0_2
Features & Benefits
2.1
Application Areas
2.2
Bluetooth v4.0 - Dual mode
- Classic Bluetooth and Bluetooth Low Energy
Compact footprint
2-wire and 3-wire Wi-Fi coexistence scheme
High antenna radiation gain and efficiency
Good interference rejection for multi-com system
(GSM/WCDMA)
Class 1 output – 8 dBm
USB, GPIO, I2S, and PCM
Industrial Temperature Range
Medical devices
ePOS terminals
Barcode scanners
Industrial Cable Replacement
M2M Connectivity
Automotive Diagnostic Equipment
Personal Digital Assistants (PDA)
Bluetooth HID device (keyboard,
mouse, and joystick)
1 SCOPE
This document describes key hardware aspects of the Laird BT800 Bluetooth HCI/HID module. This
document is intended to assist device manufacturers and related parties with the integration of this
module into their host devices. Data in this document are drawn from a number of sources including
data sheets for the CSR CSR8510.
Because the BT800 is currently in development stage, this document is preliminary and the information
in this document is subject to change. Please contact Laird Technologies or visit the Laird website at
www.Lairdtech.com to obtain the most recent version of this document.
2 OPERATIONAL DESCRIPTION
The BT800 series of USB HCI devices are designed to meet the needs of OEMs adding robust Bluetooth
connectivity and using embedded Bluetooth stacks within these products.
Leveraging the market-leading CSR 8510 chipset, the BT800 series provides exceptionally low power
consumption with outstanding range. Supporting the latest Bluetooth v4.0 Specification with EDR
(Enhanced Data Rate), the Laird BT800 series enables OEMs to accelerate their development time for
leveraging either Classic Bluetooth or Bluetooth Low Energy (BLE) into their operating system based
devices.
With a tiny footprint as small as 8.5 x 13 mm, yet output power at 8 dBm, these modules are ideal for
applications where designers need high performance in minimal size. For maximum flexibility in systems
integration, the modules are designed to support a full speed USB interface plus GPIO and additionally
I2S and PCM audio interfaces.
These modules present an HCI interface and have native support for Windows and Linux Bluetooth
software stacks. All BT800 series devices are fully qualified as Bluetooth Controller Subsystem products.
This also allows designers to integrate their existing pre-approved Bluetooth Host and Profile subsystem
stacks to gain a Bluetooth END product approval for their products.
The BT800 series is engineered to provide excellent RF performance with integrated antenna and
additional band pass filters. It further reduces regulatory and testing requirements for OEMs and ensures
a hassle free development cycle. As an additional benefit of the BT8000 series, Laird has implemented
CSR’s HID (Human Interface Device) Proxy Mode enabling out of the box HID connectivity for pointing
devices and / or keyboard functionality, requiring zero host device software or configuration.
A fully featured, low-cost developer’s kit is available for prototyping, debug and integration testing of
the BT800 series modules and further reduces risk and time in development cycles.
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CONN-GUIDE-BT800_v0_2
64 k EEPROM support for HID Proxy mode
Bluetooth Controller subsystem
FCC, IC, CE, and MIC approvals
3 MODULE PICTURE
TBA
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CONN-GUIDE-BT800_v0_2
4 BLOCK DIAGRAM AND DESCRIPTIONS
Figure 1: BT800 module block diagram
Main Chip: CSR8510A10 4.1
BT800 is based on CSR8510A10 dual mode chip. The chip is a single-chip radio with on chip LDO
regulators and baseband IC for Bluetooth 2.4 GHz systems including EDR to 3 Mbps. Dedicated signal
and baseband processing is included for full Bluetooth operation. The chip provides SPI/PCM and USB
interfaces. Up to 4 general purpose I/Os are available for general usage, such as Wi-Fi coexistence or
general indicators.
Antenna 4.2
Antenna is a ceramic monopole chip antenna.
Band Pass Filter 4.3
The band pass filter filters the out of band emissions from the transmitter to meet the specific regulations
for type approvals of various countries.
EEPROM 4.4
There are 64 k bits EEPROM embedded on the BT800 module which can be used to store customizable
parameters, such as maximum TX power, PCM configuration, USB product ID, USB vendor ID and USB
product description. With that, the BT800 module can support HID/HCI Proxy Mode.
Crystal 4.5
The embedded 26 MHz crystal is used for generating the clock for the entire module.
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CONN-GUIDE-BT800_v0_2
CATEGORIES
FEATURE
IMPLEMENTATION
Wireless
Specification
Bluetooth®
V4.0 Dual Mode
Frequency
2.402 - 2.480 GHz
Max Transmit
Power
Class 1
+8dBm from antenna
Receive Sensitivity
-89dBm
Range
Circa 100 meters
Data Rates
Up to 3 Mbps (over the air)
Host Interface
USB
Full Speed USB 2.0
GPIO
4 configurable lines
(1.8V/3.3V configurable by VDD_PADS)
Operational
Modes
HCI
Host Controller Interface over USB
HID Proxy Mode
Human Interface Device
EEPROM
2-wire
64K bits
Coexistence
802.11 (Wi-Fi)
3 wire CSR schemes supported
(Unity-3;Unity-3e and Unity+)
Supply Voltage
Supply
5V +/-10% (Note:1)
Power
Consumption
Current
Idle (sleep) < TBC mA
Connectable & Discoverable < TBC mA
Antenna Option
Internal
Multilayer ceramic antenna with up to 41% efficiency.
Physical
Dimensions
8.5 x 13 x 1.6 mm (BT800 - Module)
9.3 x 13.05 x 2.3mm (BT810 – Module BG)
16 x 43 x 11 (BT820 – USB Dongle)
Environmental
Operating
-40C to +85C
Storage
-40C to +85C
Miscellaneous
Lead Free
Lead-free and RoHS compliant
Warranty
1 Year
Approvals
Bluetooth®
Controller Subsystem Approved
FCC / IC / CE /
MIC
All BT800 series
5 SPECIFICATIONS
Note: Different DC power selections on BT800 are detailed in “
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#
Pin Name
I/O
Supply
Domain
Description
1
SPI_PCM#_SEL
Input with
weak
internal
pull-down
VDD_PADS
High switches SPI/PCM lines to
SPI,
Low
switches SPI/PCM lines to
PCM/PIO
2
VDD_HOST
Power supply
(3.1V-3.6V)
USB system positive supply
3
GND
GND
-
Ground
4
USB+
Bidirectional
VDD_HOST
USB data plus with selectable
internal 1.5kΩ pull-up resistor
5
USB-
Bidirectional
VDD_HOST
6 GND
GND
-
Ground
7
VREG_IN_USB
Power supply
Analogue
regulator
input
Input to USB regulator. Connect to
external
USB bus supply, e.g. USB_VBUS
8
VREG_EN_RST#
Input with strong
internal pull-down
VDD_PADS
Take high to enable internal
regulators. Also acts as active low
reset. Maximum voltage is
VDD_PADS.
Note: USB regulator is always
enabled and not controlled by
this pin
9
VREG_IN_HV
Analogue regulator
input / output
3.3V
Input to internal high-voltage
regulator to 1.8V regulator, 3.3V
output from USB regulator.
10
VREG_OUT_HV
Analogue regulator
input / output
1.8V
Output from internal high-voltage
to 1.8V regulator. Input to second
stage internal regulators.
11
GND
GND
-
Ground
12
GND
GND
-
Ground
13
GND
GND
-
Ground
14
GND
GND
-
Ground
15
GND
GND
-
Ground
16
GND
GND
-
Ground
Implementation note.”
6 PIN DEFINITIONS
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#
Pin Name
I/O
Supply
Domain
Description
17
N/C
-
-
This pin is reserved for future used.
No connection.
18
GND
GND
-
Ground
19
PCM_SYNC/
SPI_CS#/
PIO23
Bidirectional,
tri-state, with weak
internal pull-down
VDD_PADS
PCM synchronous data sync SPI
chip select, active low
Programmable input/output line
20
PCM_CLK/
SPI_CLK/
PIO24
Bidirectional,
tri-state, with weak
internal pull-down
VDD_PADS
PCM synchronous data clock
SPI clock
Programmable input/output line
21
PCM_IN/
SPI_MOSI/
PIO21
Input, tri-state, with
weak internal pulldown
VDD_PADS
PCM synchronous data input
SPI data input
Programmable input/output line
22
PCM_OUT/
SPI_MISO/
PIO22
Output, tri-state, with
weak internal pulldown
VDD_PADS
PCM synchronous data output
SPI data output
Programmable input/output line
23
PIO0/
WLAN_ACTIVE
Bidirectional,
tri-state, with weak
internal pull- down
VDD_PADS
Programmable input/output line
24
GND
GND
-
Ground
25
PIO1/
BT_PIRORITY
Bidirectional,
tri-state, with weak
internal pull- down
VDD_PADS
Programmable input/output line
26
PIO2/
BT_ACTIVE
Bidirectional,
tri-state, with weak
internal pull- down
VDD_PADS
Programmable input/output line
27
VDD_PADS
Power supply
(1.7V-3.6V)
Positive supply for digital I/O pads
28
PIO5
Bidirectional,
tri-state, with weak
internal pull- down
VDD_PADS
Programmable input/output line
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Rating
Min
Max
Unit
Storage temperature
-40
+85
⁰C
VREG_IN_USB
-0.2
5.75
V
VREG_IN_HV
-0.2
4.9 V VDD_HOST
-0.2
3.7 V VDD_PADS
-0.2
3.7 V Other terminal voltages
VSS - 0.4V
VDD + 0.4 V
V
Rating
Min
Max
Unit
Operating temperature
-40
+85
⁰C
VREG_IN_USB
4.5
5.5 V VREG_IN_HV
3.1
3.6 V VDD_HOST
3.1
3.6 V VDD_PADS
1.7
3.6
V
Rating
Min
Typ
Max
Unit
Input voltage (VREG_IN_USB)
4.5
5.0
5.5 V Output voltage (VREG_IN_HV)
3.2
3.3
3.4 V Output current
- - 150
mA
Normal Operation
Min
Typ
Max
Unit
Input voltage (VREG_IN_HV)
3.1
3.3
3.6 V Output voltage (VREG_OUT_HV)
1.75
1.85
1.95
V
Temperature coefficient
-200
-
200
ppm/⁰C
Output noise (frequency range 100Hz
to100kHz)
- - 0.4
mV rms
Settling time (settling ti within 10% of
finalvalue)
- - 5
µs
Output current
- - 100
mA
Quiescent current (excluding load, Iload
<1mA)
30
40
60
µA
Low-power Mode
Quiescent current
14
18
23
µA
7 DC ELECTRICAL CHARACTERISTIC
Table 1: Absolute maximum ratings
Table 2: Recommended operating conditions
Table 3: USB Linear Regulator
Table 4: High-voltage Linear Regulator
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CONN-GUIDE-BT800_v0_2
(excluding load, Iload <100µA)
Normal Operation
Min
Typ
Max
Unit
Input Voltage
VIL input logic level low
-0.4 - 0.4
V
VIH input logic level high
0.7 x
VDD
-
VDD +
0.4 V Output Voltage
VOL output logic level low, IOL =
4.0mA
- - 0.4
V
VOH output logic level high, IOL =
4.0mA
0.75 x
VDD
- - V
Input and Tristate Currents
Strong pull-up
-150
-40
-10
µA
Strong pull-down
10
40
150
µA
Weak pull-up
-5
-1.0
-0.33
µA
Weak pull-down
0.33
1.0
5.0
µA
CI input capacitance
1.0 - 5.0
pF
Normal Operation
Peak (8 dBm)
AVG
Unit
Idle
5 mA
USB Suspend
200
µA
Inguiry
73
51
mA
File Transfer
73
58
mA
LE Connected (Master)
74 mA
LE Scan (Master)
48 mA
Table 5: Digital I/O Characteristics
Table 6: Current Consumption
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