Kingston KVR24S17D8-16 User Manual

Memory Module Specifi cations
KVR24S17D8/16
16GB 2Rx8 2G x 64-Bit PC4-2400 CL17 260-Pin SODIMM
DESCRIPTION
FEATURES
• Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
SPECIFICATIONS
CL(IDD) Row Cycle Time (tRCmin) Refresh to Active/Refresh
Command Time (tRFCmin) Row Active Time (tRASmin) Maximum Operating Power UL Rating Operating Temperature Storage Temperature
*Power will vary depending on the SDRAM used.
17 cycles
45.75ns(min.) 350ns(min.)
32ns(min.) TBD W* 94 V - 0
o
C to +85o C
0
o
C to +100o C
-55
• Dual-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free
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Continued >>
Document No. VALUERAM1580-001.A00 08/30/16 Page 1
continued HyperX
MODULE DIMENSIONS
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All measurements are in millimeters.
3.7 Max
1.20
Side
Document No. VALUERAM1580-001.A00 Page 2
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