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Memory Module Specifi cations
KVR21S15S8/8
8GB 1Rx8 1G x 64-Bit PC4-2133
CL15 260-Pin SODIMM
DESCRIPTION
This document describes ValueRAM's 1G x 64-bit (8GB)
DDR4-2133 CL15 SDRAM (Synchronous DRAM), 1Rx8, non-ECC,
memory module, based on eight 1G x 8-bit FBGA components. The
SPD is programmed to JEDEC standard latency DDR4-2133 timing
of 15-15-15 at 1.2V. This 260-pin DIMM uses gold contact fingers.
The electrical and mechanical specifications are as follows:
FEATURES
• Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
*Power will vary depending on the SDRAM used.
15 cycles
46.5ns(min.)
350ns(min.)
33ns(min.)
TBD W*
94 V - 0
o
C to +85o C
0
o
C to +100o C
-55
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• PCB: Height 1.18” (30.00mm)
• RoHS Compliant and Halogen-Free
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Document No. VALUERAM1500-001.A00 03/03/16 Page 1
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continued HyperX
MODULE DIMENSIONS
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All measurements are in millimeters.
3.7 Max
1.20
Side
Document No. VALUERAM1500-001.A00 Page 2