Memory Module Specifi cations
KVR16LS11K2/16
16GB (8GB 2Rx8 1G x 64-Bit x 2pcs.) PC3L-12800
CL11 204-Pin SODIMM Kit
DESCRIPTION
This document describes ValueRAM's kit of two 1G x 64-bit
(8GB) DDR3L-1600 CL11 SDRAM (Synchronous DRAM), 2Rx8,
low voltage, memory module, based on sixteen 512M x 8-bit
FBGA components. Totalk kit capacity is 16GB. The SPD is
programmed to JEDEC standard latency DDR3-1600 timing of
11-11-11 at 1.35V or 1.5V. This 204-pin SODIMM uses gold
contact fingers. The electrical and mechanical specifications
are as follows:
FEATURES
• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~1.575V)
Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
• 8-bit pre-fetch
• Bi-directional Differential Data Strobe
SPECIFICATIONS
selcyc 11)DDI(LC
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 35ns (min.)
Maximum Operating Power TBD W*
0 - V 49gnitaR LU
Operating Temperature 0
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM.
o
C to 85o C
• Internal(self) calibration : Internal self calibration through ZQ pin
(RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at
85°C < TCASE < 95°C
• Asynchronous Reset
• PCB: Height1.18” (30mm), double sided component
• RoHS Compliant
Continued >>
Document No. VALUERAM1571-001.A00 12/23/16 Page 1
MODULE DIMENSIONS:
Document No. VALUERAM1571-001.A00 Page 2