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Memory Module Specifi cations
KVR13S9S8K2/8
8GB (4GB 1Rx8 512M x 64-Bit x 2 pcs.)
PC3-10600 CL9 204-Pin SODIMM Kit
DESCRIPTION
ValueRAM's KVR13S9S8K2/8 is a kit of two 512M x 64-bit
(4GB) DDR3-1333 CL9 SDRAM (Synchronous DRAM), 1Rx8
memory modules, based on eight 512M x 8-bit FBGA components per module. Total kit capacity is 8GB. The SPDs are
programmed to JEDEC standard latency DDR3-1333 timing of
9-9-9 at 1.5V. Each 204-pin SODIMM uses gold contact fingers.
The electrical and mechanical specifications are as follows:
FEATURES
• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power 2.100 W* (per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB: Height 1.18” (30mm), double sided component
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Document No. VALUERAM1286-001.A00 03/12/13 Page 1
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MODULE DIMENSIONS:
(units = millimeters)
Document No. VALUERAM1286-001.A00 Page 2