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Memory Module Specifi cations
KVR13LR9S8/4
4GB 1Rx8 512M x 72-Bit PC3L-10600
CL9 Registered w/Parity 240-Pin DIMM
DESCRIPTION
This document describes ValueRAM's 512M x 72-bit (4GB)
DDR3L-1333 CL9 SDRAM (Synchronous DRAM), low voltage,
registered w/parity, 1Rx8 ECC, memory module, based on nine
512M x 8-bit DDR3L-1333 FBGA components. The SPD is
programmed to JEDEC standard latency DDR3-1333 timing of
9-9-9 at 1.35V and 1.5V. This 240-pin DIMM uses gold contact
fingers. The electrical and mechanical specifications are as
follows:
FEATURES
• JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~
1.575V) Power Supply
• VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
SPECIFICATIONS
9)DDI(LC cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power (1.35V) = 2.374 W*
(1.50V) = 2.728 W*
0 - V 49gnitaR LU
Operating Temperature 0
Storage Temperature -55
*Power will vary depending on the SDRAM and
Register/PLL used.
o
C to 85o C
o
C to +100o C
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• On-DIMM thermal sensor (Grade B)
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
Continued >>
Document No. VALUERAM1326-001.B00 10/10/14 Page 1
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MODULE DIMENSIONS:
Document No. VALUERAM1326-001.B00 Page 2