Kingston KVR1333D3N9K4-32G User Manual

Memory Module Speciﬁ cations

KVR1333D3N9K4/32G

32GB (8GB 1G x 64-Bit x 4 pcs.) PC3-10600 CL9 240-Pin DIMM Kit

DESCRIPTION

ValueRAM's KVR1333D3N9K4/32G is a kit of four 1G x 64-bit (8GB) DDR3-1333 CL9 SDRAM (Synchronous DRAM) 2Rx8, memory modules, based on sixteen 512M x 8-bit FBGA components per module. Total kit capacity is 32GB. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:

FEATURES

• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

• VDDQ = 1.5V (1.425V ~ 1.575V)

• 667MHz fCK for 1333Mb/sec/pin

• 8 independent internal banks

• Programmable CAS latency: 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• 8-bit pre-fetch

SPECIFICATIONS

CL(IDD) Row Cycle Time (tRCmin) Refresh to Active/Refresh

Command Time (tRFCmin) Row Active Time (tRASmin) Maximum Operating Power UL Rating Operating Temperature Storage Temperature

*Power will vary depending on the SDRAM.

(per module)

9 cycles

49.125ns(min.) 260ns(min.)

36ns(min.) TBD W* 94 V - 0

C to +85o C

C to +100o C

-55

• Burst Length: 8 (interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS)

• Bi-directional Differential Data Strobe

• Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE < 95°Cº

• Asynchronous Reset

• PCB: Height 0.740” (18.75mm) or 1.180” (30.00mm)

Important Information: The module defined in this data sheet is one of several configurations available under this part number. While all configurations are compatible, the DRAM combination and/or the module height may vary from what is described here.

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MODULE DIMENSIONS

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