Memory Module Specifi cations
KVR1333D3E9SK3/12GI
12GB (4GB 2Rx8 512M x 72-Bit x 3 pcs.)
PC3-10600 CL9 240-Pin ECC DIMM Kit
DESCRIPTION
ValueRAM's KVR1333D3E9SK3/12GI is a kit of three 512M x
72-bit (4GB) DDR3-1333 CL9 SDRAM (Synchronous DRAM),
®
2Rx8, Intel
based on eighteen 256M x 8-bit FBGA components per module.
Total kit capacity is 12GB. The SPDs are programmed to
JEDEC standard latency DDR3-1333 timing of 9-9-9. Each 240pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:
Compatibility Tested, ECC memory modules,
FEATURES
• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Power (Operating) 2.223 W* (per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• On-DIMM Thermal Sensor (Grade B)
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB Height: 1.18” (30mm), double sided component
Continued >>
Document No. VALUERAM0989-001.A00 06/17/11 Page 1
MODULE DIMENSIONS:
TECHNOLOGY
30.00
18.80
15.80
11.00
8.00
0.00
Units: millimeters
0.00
133.35
54.70
Document No. VALUERAM0989-001.A00 Page 2