kingston KVR1333D3D8R9S-4G User Manual

Memory Module Speciﬁ cations

KVR1333D3D8R9S/4G

4GB 2Rx8 512M x 72-Bit PC3-10600 CL9 Registered w/Parity 240-Pin DIMM

DESCRIPTION

This document describes ValueRAM's 512M x 72-bit (4GB) DDR3-1333 CL9 SDRAM (Synchronous DRAM), registered w/ parity, 2Rx8, ECC memory module, based on eighteen 256M x 8-bit DDR3-1333 FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.This 240-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows:

FEATURES

• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply

• VDDQ = 1.5V (1.425V ~ 1.575V)

• 667MHz fCK for 1333Mb/sec/pin

• 8 independent internal bank

• Programmable CAS Latency: 9, 8, 7, 6

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)

• 8-bit pre-fetch

SPECIFICATIONS

CL(IDD) 9 cycles Row Cycle Time (tRCmin) 49.5ns (min.) Refresh to Active/Refresh 160ns (min.)

Command Time (tRFCmin) Row Active Time (tRASmin) 36ns (min.) Power (Operating) 2.812 W*

UL Rating 94 V - 0 Operating Temperature 0o C to 85o C Storage Temperature -55o C to +100o C

*Power will vary depending on the SDRAM and Register/PLL used.

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• On-DIMM thermal sensor (Grade B)

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE

< 95°C

• Asynchronous Reset

• PCB : Height 1.180” (30.00mm), double sided component

Continued >>

Document No. VALUERAM0869-001.B00 09/08/11 Page 1

MODULE DIMENSIONS:

(units = millimeters)

Document No. VALUERAM0869-001.A00 Page 2