Kingston KSM32RS4-16HDR User Manual

Memory Module Speciﬁcations

KSM32RS4/16HDR

16GB 1Rx4 2G x 72-Bit PC4-3200 CL22 Registered w/Parity 288-Pin DIMM

DESCRIPTION		SPECIFICATIONS
Kingston's KSM32RS4/16HDR is a 2G x 72-bit (16GB)
			CL(IDD)		22cycles
DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/			Row Cycle Time (tRCmin)		45.75ns(min.)
parity, 1Rx4, ECC, memory module, based on eighteen 2G x
			Refresh to Active/Refresh		350ns(min.)
4-bit FBGA components. The SPD is programmed to JEDEC
			Command Time (tRFCmin)
standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each
			Row Active Time (tRASmin)		32ns(min.)
288-pin DIMM uses gold contact fingers. The electrical and
			Maximum Operating Power		*
mechanical specifications are as follows:
			UL Rating		94 V - 0

			Operating Temperature		0o C to +85o C
FEATURES			Storage Temperature		-55o C to +100o C
			*See IDD Specifications (page 2)
• Power Supply: VDD = 1.2V

•	VDDQ = 1.2V		Module Assembly
•	VPP = 2.5V
				DRAM: HYNIX (D-DIE)

• VDDSPD = 2.41V to 2.75V

RCD: Rambus

•Functionality and operations comply with the DDR4 SDRAM datasheet

•16 internal banks

•Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available

•Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600

•Bi-Directional Differential Data Strobe

•8 bit pre-fetch

•Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)

•Supports ECC error correction and detection

•On-Die Termination (ODT)

•Temperature sensor with integrated SPD

•This product is in compliance with the RoHS directive.

•Per DRAM Addressability is supported

•Internal Vref DQ level generation is available

•Write CRC is supported at all speed grades

•CA parity (Command/Address Parity) mode is supported

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Document No. 4809351A 03/10/20 Page 1

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IDD Specifications

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