TECHNOLOGY
Memory Module Specification
KHX6400S2ULK2/2G
2GB (1GB 128M x 64-Bit x 2 pcs.)
PC2-6400 CL5 200-Pin SODIMM Kit
DESCRIPTION:
Kingston's KHX6400S2ULK2/2G is a kit of two 128M x 64-bit 1GB (1024MB) CL5 SDRAM
(Synchronous DRAM) memory modules. Each module is based on eight 128M x 8-bit DDR2 FBGA
components. Total kit capacity is 4GB (4096MB). The SPDs are programmed to JEDEC ultra low
latency timing of 4-4-4-12 at 1.8V. Each 200-pin SODIMM uses gold contact fingers and requires
+1.8V. The electrical and mechanical specifications are as follows:
FEATURES:
Power supply : Vdd: 1.8V ± 0.1V, Vddq: 1.8V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 4, 3 (clock)
Burst Length: 4, 8 (Interleave/nibble sequential)
Programmable Burst type (sequential & interleave)
Timing Reference: 4-4-4-12 at +1.8V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
PCB : Height 1.180” (30.00mm), double sided component
PERFORMANCE:
Clock Cycle Time (tCK) CL=4 2.5ns (min.) / 8ns (max.)
Row Cycle Time (tRC) 57.5ns (min.)
Refresh to Active/Refresh Command Time (tRFC) 127.5ns
Row Active Time (tRAS) 45ns (min.) / 70,000ns (max.)
Single Power Supply of +1.8V (+/- .1V)
Power TBD W (operating per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 55o C
Storage Temperature -55o C to +125o C
Document No. 4805073-001.A00
10/16/08
Page 1
MODULE DIMENSIONS:
Kingston Technology
For more information, go to www.kingston.com
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not
operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to
run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to
computer components.
Document No. 4805073-001.A00 Page 2