Memory Module Specifi cations
KHX6400S2LLK2/2G
2GB (1GB 128M x 64-Bit x 2 pcs.)
PC2-6400 CL5 200-Pin SODIMM Kit
SPECIFICATIONS
Clock Cycle Time (tCK) 2.5ns (min.) / 8ns (max.)
Row Cycle Time (tRCmin) 57.5ns (min.)
Refresh to Active/Refresh 127.5ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 45ns (min.) / 70,000 (max.)
Single Power Supply of +1.8V (+/- .1V)
Power (Operating) TBD* (per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 55o C
o
Storage Temperature -55
C to +125o C
DESCRIPTION
Kingston's KHX6400S2LLK2/2G is a kit of two 128M x 64-bit
(1GB) CL5 low latency SDRAM (Synchronous DRAM) 1Rx8
memory modules. Each module is based on eight 128M x 8-bit
DDR2 FBGA components. Total kit capacity is 2GB. The SPDs
are programmed to JEDEC low latency timing of 5-5-5-18 at
1.8V. Each 200-pin SODIMM uses gold contact fingers and
requires +1.8V. The electrical and mechanical specifications
are as follows:
*Power will vary depending on the SDRAM used.
FEATURES
• Power supply : Vdd: 1.8V ± 0.1V, Vddq: 1.8V ± 0.1V
• Double-data-rate architecture; two data transfers per
clock cycle
• Bidirectional data strobe(DQS)
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• Programmable Read latency 5, 4, 3 (clock)
• Burst Length: 4, 8 (Interleave/nibble sequential)
• Programmable Burst type (sequential & interleave)
• Timing Reference: 5-5-5-18 at +1.8V
• Edge aligned data output, center aligned data input
• Auto & Self refresh, 7.8us refresh interval (8K/64ms
refresh)
• Serial presence detect with EEPROM
• PCB : Height 1.180” (30.00mm), double sided
component
Continued >>
Document No. 4805075-001.B00 06/30/11 Page 1
continued HyperX
MODULE DIMENSIONS
(units = millimeters)
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
Document No. 4805075-001.B00 Page 2