Kingston KHX2333C9D3T1K3-3GX User Manual

Memory Module Specification

T E C H N O L O G Y

KHX2333C9D3T1K3/3GX

3GB (1GB 128M x 64-Bit x 3 pcs.) DDR3-2333MHz CL9 240-Pin DIMM Kit

DESCRIPTION:

Kingston's KHX2333C9D3T1K3/3GX is a kit of three 128M x 64-bit (1GB) DDR3-2333MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on eight 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 3GB. Each module kit has been tested to run at DDR3-2333MHz at a low latency timing of 9-11-9-27 at 1.65V. See more detailed XMP Profile information at the bottom of the page. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

FEATURES:

JEDEC standard 1.5V ± 0.075V Power Supply VDDQ = 1.5V ± 0.075V 667MHz fCK for 1333Mb/sec/pin 8 independent internal bank Programmable CAS Latency: 6,7,8,9

Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7(DDR3-1333)

8-bit pre-fetch

Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]

Bi-directional Differential Data Strobe

Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) On Die Termination using ODT pin

Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C Asynchronous Reset

PCB : Height 2.401” (61.00mm) w/ heatsink, single sided component

PERFORMANCE:

 

CL(IDD)

9 cycles

 

 

Row Cycle Time (tRCmin)

49.5ns (min.)

 

 

Refresh to Active/Refresh Command Time (tRFCmin)

110ns

 

 

Row Active Time (tRASmin)

36ns (min.)

 

 

Power

1.080 W (operating per module)

 

 

UL Rating

94 V - 0

 

 

Operating Temperature

0o C to 85o C

 

 

Storage Temperature

-55o C to +100o C

 

XMP Supported Profiles:

Profile #1: DDR3-2333 CL9-11-9 @ 1.65V (Intel 6-Core CPU)

Profile #2 DDR3-2000 CL9-10-9 @ 1.65V (Intel 4-Core CPU)

Document No. 4805703-001.A00

07/22/10

Page 1

Kingston KHX2333C9D3T1K3-3GX User Manual

Kingston

MODULE DIMENSIONS:

T E C H N O L O G Y

30.00

Units: millimeters

133.35

 

 

 

18.80

15.80

11.00

8.00

0.00

0.00

54.70

w/ heatsink assembly

61mm

2

.401

 

Document No. 4805703-001.A00

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