Kingston KHX2333C9D3T1FK3-3GX User Manual

TECHNOLOGY

Memory Module Specification

KHX2333C9D3T1FK3/3GX

3GB (1GB 128M x 64-Bit x 3 pcs.) DDR3-2333MHz

CL9 240-Pin DIMM Kit w/ Fan

DESCRIPTION:

Kingston's KHX2333C9D3T1FK3/3GX is a kit of three 128M x 64-bit (1GB) DDR3-2333MHz CL9 SDRAM (Synchro­nous DRAM) memory modules, based on eight 128M x 8-bit DDR3 FBGA components per module. Each module kit
supports Intel
DDR3-2333MHz at a low latency timing of 9-11-9-27 at 1.65V. See more detailed XMP Profile information at the
bottom of the page. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V.
Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical
specifications are as follows:

This special kit part number includes Kingston's HyperX high-performance cooling fan assembly (KHX-FAN).

FEATURES:

®

XMP (Extreme Memory Profiles). Total kit capacity is 3GB. Each module kit has been tested to run at

JEDEC standard 1.5V ± 0.075V Power Supply
VDDQ = 1.5V ± 0.075V
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 6,7,8,9

d

e

y

e

K

d

e

y

e

K

d

e

y

e

K

Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4
which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
Asynchronous Reset

PCB : Height 2.401” (61.00mm) w/ heatsink, single sided component

PERFORMANCE:

CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin) 110ns
Row Active Time (tRASmin) 36ns (min.)
Power 1.080 W (operating per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C

XMP Supported Profiles:

Profile #1: DDR3-2333 CL9-11-9 @ 1.65V (Intel 6-Core CPU)
Profile #2 DDR3-2000 CL9-10-9 @ 1.65V (Intel 4-Core CPU)

Document No. 4805704-001.A00

07/22/10

Page 1

MODULE DIMENSIONS:

TECHNO L O GY

Kingston

30.00

18.80

15.80

11.00

8.00

0.00

Units: millimeters

0.00

w/ heatsink assembly

133.35

54.70

61mm

2.401

Document No. 4805704-001.A00 Page 2

Kingston

KHX-FAN

HyperX Cooling Fan Assembly

DESCRIPTION:

This document describes Kingston's HyperX memory module cooling fan assembly. If you are
looking to maximize the performance potential of your HyperX memory... this is it. With twin fans
focusing air directly onto your HyperX modules, your modules will run cooler, even in the most
demanding environments. The mechanical and electrical specifications are as follows:

PERFORMANCE:

Rated Voltage 12 VDC
Operational Voltage 8 - 13.5 VDC
Input Current 0.09 amp
Input Power 1.08 watt
RPM 3000 ± 10%
Speed Control Type
Signal Output Frequency Generator (FG)
Max. Air Flow 0.43 m3/min

At Zero Static Pressure 15.02 CFM
Max. Air Pressure 2.31 mm-H2O
At Zero Flow 0.09 inch-H2O
Accoustical Noise 25 (28 max.) dB-A

HyperX Cooling Fan Assembly

Document No. 4805704-001.A00 Page 3