kingston KHX2133C11D3K4-16GX User Manual

Memory Module Specifi cations

KHX2133C11D3K4/16GX

16GB (4GB 512M x 64-Bit x 4 pcs.)
DDR3-2133 CL11 240-Pin DIMM Kit

SPECIFICATIONS

CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)

Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Power (Operating) 1.410 W* (per module)

UL Rating 94 V - 0
Operating Temperature 0
Storage Temperature -55o C to +100o C

*Power will vary depending on the SDRAM used.

o

C to 85o C

DESCRIPTION

Kingston's KHX2133C11D3K4/16GX is a kit of four 512M x 64­bit (4GB) DDR3-2133 CL11 SDRAM (Synchronous DRAM)
2Rx8 memory modules, based on sixteen 256M x 8-bit DDR3
FBGA components per module. Each module kit supports Intel
XMP (Extreme Memory Profiles). Total kit capacity is 16GB.
Each module kit has been tested to run at DDR3-2133 at a low
latency timing of 11-12-11 at 1.65V. The SPDs are pro­grammed to JEDEC standard latency DDR3-1333 timing of
9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers.
The JEDEC standard electrical and mechanical specifications
are as follows:

XMP TIMING PARAMETERS

• JEDEC: DDR3-1333 CL9-9-9 @1.5V

• XMP Profile #1: D3-2133 CL11-12-11 @1.65V

• XMP Profile #2: D3-1866 CL10-11-10 @1.65V

FEATURES

• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

• VDDQ = 1.5V (1.425V ~ 1.575V)

• 667MHz fCK for 1333Mb/sec/pin

®

• 8 independent internal bank

• Programmable CAS Latency: 9, 8, 7, 6

• Posted CAS

• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)

• 8-bit pre-fetch

• Burst Length: 8 (Interleave without any limit, sequential with

starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]

• Bi-directional Differential Data Strobe

• Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85°C,

3.9us at 85°C < TCASE

< 95°C

• Asynchronous Reset

• PCB : Height 1.18” (30mm) w/ heat spreader,

double sided component

Document No. 4806238-001.A00 11/14/11 Page 1

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continued HyperX

MODULE DIMENSIONS

TECHNOLOGY

30.00

18.80

15.80

11.00

8.00

0.00

Units: millimeters

0.00

133.35

54.70

MODULE WITH HEAT SPREADER

FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

Document No. 4806238-001.A00 Page 2