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Memory Module Specifi cations
KHX2133C10D3W1K2/4GX
4GB (2GB 256M x 64-Bit x 2 pcs.)
DDR3-2133 CL10 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Power (Operating) 0.795 W* (per module)
UL Rating 94 V - 0
Operating Temperature 0
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
o
C to 85o C
DESCRIPTION
Kingston's KHX2133C10D3W1K2/4GX is a kit of two 256M x
64-bit (2GB) DDR3-2133 CL10 SDRAM (Synchronous DRAM),
water cooled, 1Rx8 memory modules, based on eight
256M x 8-bit DDR3 FBGA components per module. Each
module kit supports Intel® XMP (Extreme Memory Profiles).
Total kit capacity is 4GB. Each module kit has been tested to
run at DDR3-2133 at a low latency timing of 10-11-10 at 1.65V.
The SPDs are programmed to JEDEC standard latency DDR31333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold
contact fingers. The JEDEC standard electrical and mechanical
specifications are as follows:
XMP TIMING PARAMETERS
• JEDEC: DDR3-1333 CL9-9-9 @1.5V
• XMP Profile #1: D3-1866 CL9-11-10 @1.65V
• XMP Profile #2: D3-2133 CL10-11-10 @1.65V
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
• Asynchronous Reset
• PCB : Height 1.88” (48.00mm) w/ heatsink, single sided
component
Continued >>
Document No. 4806197-001.A00 09/27/11 Page 1
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continued HyperX
MODULE DIMENSIONS
TECHNOLOGY
30.00
18.80
15.80
11.00
8.00
0.00
Units: millimeters
0.00
54.70
133.35
MODULE WITH HEAT SPREADER
8.70mm
0.342
48.00mm
1.88
COOLING TUBE DIMENSIONS
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
Document No. 4806197-001.A00 Page 2