Memory Module Specification
T E C H N O L O G Y
KHX2000C9D3T1FK3/6GX
6GB (2GB 256M x 64-Bit x 3 pcs.) DDR3-2000MHz CL9 240-Pin DIMM Kit w/ Fan
DESCRIPTION:
Kingston's KHX2000C9D3T1FK3/6GX is a kit of three 256M x 64-bit 2GB (2048MB) DDR3-2000MHz CL9 SDRAM (Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Total kit capacity is 6GB. Each module kit has been tested to run at DDR3-2000MHz at a low latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:
This special kit part number includes Kingston's HyperX high-performance cooling fan assembly (KHX-FAN).
FEATURES:
JEDEC standard 1.5V ± 0.075V Power Supply VDDQ = 1.5V ± 0.075V 667MHz fCK for 1333Mb/sec/pin
8 independent internal bank Programmable CAS Latency: 5,6,7,8,9,10
Posted CAS Programmable Additive Latency: 0, CL - 2, or CL - 1 clock Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%) On Die Termination using ODT pin
Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C Asynchronous Reset
PCB : Height 2.401” (61.00mm) w/ heatsink, double sided component
PERFORMANCE:
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CL(IDD) |
9 cycles |
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Row Cycle Time (tRCmin) |
49.5ns (min.) |
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Refresh to Active/Refresh Command Time (tRFCmin) |
110ns |
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Row Active Time (tRASmin) |
36ns (min.) |
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Power |
1.800 W (operating per module) |
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UL Rating |
94 V - 0 |
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Operating Temperature |
0o C to 85o C |
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Storage Temperature |
-55o C to +100o C |
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Document No. 4805278-001.A00 |
07/27/09 |
Page 1 |
Kingston
MODULE DIMENSIONS:
T E C H N O L O G Y
30.00 |
Units: millimeters |
133.35 |
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18.80
15.80
11.00
8.00
0.00
0.00 |
54.70 |
w/ heatsink assembly
61mm |
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2 |
.401 |
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Document No. 4805278-001.A00 |
Page 2 |
Kingston
KHX-FAN
HyperX Cooling Fan Assembly
DESCRIPTION:
This document describes Kingston's HyperX memory module cooling fan assembly. If you are looking to maximize the performance potential of your HyperX memory... this is it. With twin fans focusing air directly onto your HyperX modules, your modules will run cooler, even in the most demanding environments. The mechanical and electrical specifications are as follows:
PERFORMANCE:
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Rated Voltage |
12 VDC |
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Operational Voltage |
8 - 13.5 VDC |
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Input Current |
0.09 amp |
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Input Power |
1.08 watt |
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RPM |
3000 ± 10% |
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Speed Control Type |
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Signal Output |
Frequency Generator (FG) |
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Max. Air Flow |
0.43 m3/min |
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At Zero Static Pressure |
15.02 CFM |
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Max. Air Pressure |
2.31 mm-H2O |
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At Zero Flow |
0.09 inch-H2O |
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Accoustical Noise |
25 (28 max.) dB-A |
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HyperX Cooling Fan Assembly
Document No. 4805278-001.A00 |
Page 3 |