TECHNOLOGY
Memory Module Specification
KHX2000C9D3T1FK3/6GX
6GB (2GB 256M x 64-Bit x 3 pcs.) DDR3-2000MHz
CL9 240-Pin DIMM Kit w/ Fan
DESCRIPTION:
Kingston's KHX2000C9D3T1FK3/6GX is a kit of three 256M x 64-bit 2GB (2048MB) DDR3-2000MHz CL9 SDRAM
(Synchronous DRAM) memory modules, based on sixteen 128M x 8-bit DDR3 FBGA components per module. Each
module kit supports Intel
to run at DDR3-2000MHz at a low latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard
latency DDR3-1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.
The JEDEC standard electrical and mechanical specifications are as follows:
This special kit part number includes Kingston's HyperX high-performance cooling fan assembly (KHX-FAN).
FEATURES:
JEDEC standard 1.5V ± 0.075V Power Supply
VDDQ = 1.5V ± 0.075V
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 5,6,7,8,9,10
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4
which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
Asynchronous Reset
PCB : Height 2.401” (61.00mm) w/ heatsink, double sided component
®
XMP (Extreme Memory Profiles). Total kit capacity is 6GB. Each module kit has been tested
Keyed
Keyed
Keyed
PERFORMANCE:
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin) 110ns
Row Active Time (tRASmin) 36ns (min.)
Power 1.800 W (operating per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
Document No. 4805278-001.A00
07/27/09
Page 1
MODULE DIMENSIONS:
TECHNO L O GY
Kingston
30.00
18.80
15.80
11.00
8.00
0.00
Units: millimeters
0.00
w/ heatsink assembly
133.35
54.70
61mm
2.401
Document No. 4805278-001.A00 Page 2
Kingston
KHX-FAN
HyperX Cooling Fan Assembly
DESCRIPTION:
This document describes Kingston's HyperX memory module cooling fan assembly. If you are
looking to maximize the performance potential of your HyperX memory... this is it. With twin fans
focusing air directly onto your HyperX modules, your modules will run cooler, even in the most
demanding environments. The mechanical and electrical specifications are as follows:
PERFORMANCE:
Rated Voltage 12 VDC
Operational Voltage 8 - 13.5 VDC
Input Current 0.09 amp
Input Power 1.08 watt
RPM 3000 ± 10%
Speed Control Type
Signal Output Frequency Generator (FG)
Max. Air Flow 0.43 m3/min
At Zero Static Pressure 15.02 CFM
Max. Air Pressure 2.31 mm-H2O
At Zero Flow 0.09 inch-H2O
Accoustical Noise 25 (28 max.) dB-A
HyperX Cooling Fan Assembly
Document No. 4805278-001.A00 Page 3