kingston KHX1866C9D3K4-8GX User Manual
DESCRIPTION
Kingston's KHX1866C9D3K4/8GX is a kit of four 256M x 64-bit
(2GB) DDR3-1866 CL9 SDRAM (Synchronous DRAM) 1Rx8
memory modules, based on eight 256M x 8-bit DDR3 FBGA
components per module. Each module kit supports Intel
®
XMP
(Extreme Memory Profiles). Total kit capacity is 8GB. Each
module kit has been tested to run at DDR3-1866 at a low
latency timing of 9-11-9 at 1.65V. For additional supported
timing parameters see the information below. The SPDs are
programmed to JEDEC standard latency DDR3-1333 timing of
9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers
and requires +1.5V. The JEDEC standard electrical and
mechanical specifications are as follows:
Document No. 4806237-001.A00 11/14/11 Page 1
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Power (Operating) 0.795 W* (per module)
UL Rating 94 V - 0
Operating Temperature 0
o
C to 85
o
C
Storage Temperature -55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), single sided component
Memory Module Specifi cations
KHX1866C9D3K4/8GX
8GB (2GB 256M x 64-Bit x 4 pcs.)
DDR3-1866 CL9 240-Pin DIMM Kit
TIMING PARAMETERS:
• JEDEC: DDR3-1333 CL9-9-9 @1.5V
• XMP Profile #1: DDR3-1866 CL9-11-9 @1.65V
• XMP Profile #2: DDR3-1600 CL9-9-9 @1.65V
Continued >>
Document No. 4806237-001.A00 Page 2
continued HyperX
MODULE WITH HEAT SPREADER
MODULE DIMENSIONS
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM
Units: millimeters
30.00
18.80
15.80
11.00
8.00
0.00
133.35
0.00
54.70
TECHNOLOGY
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