kingston KHX1600C9S3K2-8GX User Manual
Memory Module Specifi cations
KHX1600C9S3K2/8GX
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600 CL9 204-Pin SODIMM Kit
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Power (Operating) 1.410* (per module)
UL Rating 94 V - 0
Operating Temperature 0
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
o
C to 85o C
DESCRIPTION
Kingston's KHX1600C9S3K2/8GX is a kit of two 512M x 64-bit
(4GB) DDR3-1600MHz CL9 SDRAM (Synchronous DRAM)
2Rx8 memory modules, based on sixteen 256M x 8-bit DDR3
FBGA components per module. Each module kit supports Intel
XMP (Extreme Memory Profiles). Total kit capacity is 4GB.
Each module pair has been tested to run at DDR3-1600MHz at
a low latency timing of 9-9-9-27 at 1.5V. The SPDs are programmed to JEDEC standard latency DDR3-1333MHz timing of
9-9-9 at 1.5V. Each 204-pin SODIMM uses gold contact fingers
and requires +1.5V. The JEDEC standard electrical and
mechanical specifications are as follows:
XMP TIMING PARAMETERS:
•
JEDEC: DDR3-1333 CL9-9-9 @1.5V
• XMP Profile #1: DDR3-1333 CL7-7-7-20 @1.5V
• XMP Profile #2: DDR3-1600 CL9-9-9-27 @1.5V
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
®
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
Continued >>
Document No. 4805876-001.B00 09/30/11 Page 1
continued HyperX
MODULE DIMENSIONS
(units = millimeters)
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
Document No. 4805876-001.B00 Page 2
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