Memory Module Specifi cations
KHX1600C9D3P1K2/8G
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1600MHz CL9 240-Pin DIMM Kit
Supports Kingston HyperX Plug and Play (PnP)
SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 48.125ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 33.75ns (min.)
Power (Operating) TBD* (per module)
UL Rating 94 V - 0
Operating Temperature 0
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.
o
C to 85o C
DESCRIPTION
Kingston's KHX1600C9D3P1K2/8G is a kit of two 512M x 64-bit
(4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8
memory modules, based on sixteen 256M x 8-bit DDR3 FBGA
components per module. Total kit capacity is 8GB. Each
module kit has been tested to run at JEDEC DDR3-1600 at a
low latency timing of 9-9-9 at 1.5V. Additional timing parameters are shown in the PnP Timing Parameters section. Each
240-pin DIMM uses gold contact fingers and requires +1.5V.
The electrical and mechanical specifications are as follows:
Note: PnP implementation is only possible in configurations that
include a BIOS that supports the PnP function. Your maximum
speed will be determined by your BIOS.
PnP JEDEC TIMING PARAMETERS:
• DDR3-1600 CL9-9-9 @1.5V
• DDR3-1333 CL8-8-8 @1.5V
• DDR3-1066 CL6-6-6 @1.5V
FEATURES
• JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 800MHz fCK for 1600Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 11, 10, 9, 8, 7, 6, 5
• Posted CAS
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• Programmable CAS Write Latency(CWL) = 8 (DDR3-1600)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component
Continued >>
Document No. 4806050-001.B00 04/21/11 Page 1
continued HyperX
MODULE DIMENSIONS
TECHNOLOGY
30.00
18.80
15.80
11.00
8.00
0.00
Units: millimeters
0.00
133.35
54.70
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
Document No. 4806050-001.B00 Page 2