PRELIMINARY SPEC
3.5x2.8 mm SMD CHIP LED LAMP
Part Number: KA-3529SYS-L
Super Bright Yellow
Features
zSINGLE COLOR.
zSUITABLE FOR ALL SMT ASSEMBLY AND SOLDER
PROCESS.
zAVAILABLE ON TAPE AND REEL.
zIDEAL FOR BACKLIGHTING.
zWHITE SMD PACKAGE, SILICONE RESIN.
zLOW THERMAL RESISTANCE.
zPACKAGE: 1500PCS / REEL.
zMOISTURE SENSITIVITY LEVEL : LEVEL 4.
zRoHS COMPLIANT.
Package Dimensions
Description
The source color devices are made with AlInGaP Light
Emitting Diode.
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Specifications are subject to change without notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAH9301 REV NO: V.2 DATE: DEC/07/2007 PAGE: 1 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might leads to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or
damage the internal circuitry.
4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter
of the nozzle should be as large as possible.
5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
SPEC NO: DSAH9301 REV NO: V.2 DATE: DEC/07/2007 PAGE: 2 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971
Selection Guide
V
Part No.
Dice Lens Type
Iv (mcd) [2]
@ 150mA
Φv (mlm) [2]
@ 150mA
Min. Typ. Min. Typ.
KA-3529SYS-L Super Bright Yellow (AlInGaP) WATER CLEAR 1600 3000 3000 6000
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
2. Luminous intensity / luminous flux: +/-15%.
iewing
Angle [1]
2θ1/2
120°
Electrical / Optical Characteristics at TA=25°C
Symbol Parameter Device Typ. Max. Units Test Conditions
λpeak Peak Wavelength Super Bright Yellow 590 nm I
λD [1] Dominant Wavelength Super Bright Yellow 590 nm I
Δλ1/2 Spectral Line Half-width Super Bright Yellow 20 nm I
C Capacitance Super Bright Yellow 20 pF V
V
F [2] Forward Voltage Super Bright Yellow 2.8 3.2 V IF=150mA
R Reverse Current Super Bright Yellow 10 uA VR=5V
I
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
F=150mA
F=150mA
F=150mA
F=0V;f=1MHz
Absolute Maximum Ratings at TA=25°C
Parameter Super Bright Yellow Units
Power dissipation 480 mW
DC Forward Current 150 mA
Peak Forward Current [1] 200 mA
Reverse Voltage 5 V
Operating Temperature -40°C To +85°C
Storage Temperature -40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAH9301 REV NO: V.2 DATE: DEC/07/2007 PAGE: 3 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971
Super Bright Yellow KA-3529SYS-L
SPEC NO: DSAH9301 REV NO: V.2 DATE: DEC/07/2007 PAGE: 4 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971
KA-3529SYS-L
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Tape Specifications
(Units : mm)
SPEC NO: DSAH9301 REV NO: V.2 DATE: DEC/07/2007 PAGE: 5 OF 5
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: R.CHEN ERP: 1201002971
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