405
405
No-Clean, Rosin-Free Cored W
No-Clean, Rosin-Free Cored W
ire
ire
For Lead-bearing and Lead-free alloys
For Lead-bearing and Lead-free alloys
Product Description
Kester 405 Rosin-Free Low Residue Flux for
cored solder wire was developed to completely
eliminate R-42 sensitizers commonly found in
rosin-based fluxes. Kester 405 has performance
characteristics far exceeding st andard No-Clean
fluxes without any of the sensitizer issues.
Performance Characteristics:
• Nearly colorless translucent residues
• Improves wetting performance
• Excellent solderability and fast wetting to a
variety of surface finishes
• Eliminates the need and expense of cleaning
• Low smoke and odor
• Compatible with leaded and lead-free alloys
• Classified as REL0 per J-STD-004
• Compliant to Bellcore GR-78
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Subst ances) Directive,
2002/95/EC Article 4 for the st ated banned
substances. (Applies only if this core flux is
combined with a lead free alloy)
Reliability Properties
Copper Mirror Corrosion: Low
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test: Low
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Chloride and Bromides: None Detected
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test: Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical): Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Spread Test (typical):
Tested to J-STD-004, IPC-TM-650, Method 2.4.46
Area of Spread mm2(in2)
Flux Core Solder
Cu Ni
285 Mildly Activated Rosin 335 (0.52) 142 (0.22)
245 No-Clean 348 (0.54) 116 (0.18)
405 No-Clean 355 (0.55) 174 (0.27)
Test Parameters
1.0 gram of cored wire solder
63/37 solder alloy
1.0% flux per weight of solder wire
Blank 405
Day 1
1.6 ×1010Ω 7.2 × 109Ω
Day 4
1.2 ×1010Ω 7.5 × 10
9
Ω
Day 7
1.1 ×1010Ω 7.0 × 109Ω