KEPCO RA 19-4B User Manual

INSTRUCTION MANUAL

RA 19-4B

RACK ADAPTER

HOT SWAP RACK ADAPTER FOR HSF SERIES POWER SUPPLIES

KEPCO INC.

An ISO 9001 Company.

RACK ADAPTER

ORDER NO. REV. NO.

IMPORTANT NOTES:

1) This manual is valid for the following Model and associated serial numbers:

MODEL SERIAL NO. REV. NO.

2) A Change Page may be included at the end of the manual. All applicable changes and
revision number changes are documented with reference to the equipment serial num­bers. Before using this Instruction Manual, check your equipment serial number to identify
your model. If in doubt, contact your nearest Kepco Representative, or the Kepco Docu­mentation Office in New York, [phone], requesting the correct revision for your par­ticular model and serial number.

3) The contents of this manual are protected by copyright. Reproduction of any part can be
made only with the specific written permission of Kepco, Inc.

Data subject to change without notice.

MODEL

RA 19-4B

KEPCO®

©2009, KEPCO, INC
P/N 243-0955R3

KEPCO, INC.  131-38 SANFORD AVENUE  FLUSHING, NY. 11355 U.S.A.  TEL [phone]  FAX [phone]

email: [e-mail]

 World Wide Web: http://www.kepcopower.com

THE POWER SUPPLIER™

TABLE OF CONTENTS

SECTION PAGE

SECTION 1 - INTRODUCTION

1.1 Scope of Manual..................................................................................................................................... 1-1

1.2 General Description ................................................................................................................................ 1-1

1.3 Electrical ................................................................................................................................................. 1-1

1.4 Mechanical.............................................................................................................................................. 1-2

1.5 Accessories ............................................................................................................................................ 1-2

1.6 Options ................................................................................................................................................... 1-2

SECTION 2 - INSTALLATION

2.1 Unpacking and Inspection ...................................................................................................................... 2-1

2.2 Configuring the Rack Adapter................................................................................................................. 2-1

2.3 Rack Adapter Keying Instructions........................................................................................................... 2-1

2.3.1 Disassembly to Gain Access to Interior Components ....................................................................... 2-1

2.3.2 Establishing Key Positions................................................................................................................ 2-2

2.4 Slot Configuration ................................................................................................................................... 2-3

2.4.1 Independent Operation ..................................................................................................................... 2-4

2.4.1.1 Independent Operation - Local Sensing Using Internal DIP switches......................................... 2-5

2.4.1.2 Independent Operation - Local Sensing Using External Wiring .................................................. 2-6

2.4.1.3 Independent Operation - Remote Sensing.................................................................................. 2-7

2.4.2 Parallel Operation ............................................................................................................................. 2-8

2.4.2.1 Parallel DC OUTPUT Connections ............................................................................................. 2-8

2.4.2.2 Parallel Current Share Connections............................................................................................ 2-8

2.4.2.2.1 Parallel Current Share - Internal DIP Switches ......................................................................... 2-9

2.4.2.2.2 Parallel Current Share - External Wiring ................................................................................... 2-10

2.4.2.3 Sense Connections for Parallel Configurations........................................................................... 2-10

2.4.2.3.1 Parallel Configuration Using DIP Switches to Connect Sense Lines in

Parallel and External Wires to Configure Local Sensing ....................................................... 2-11

2.4.2.3.2 Parallel Configurations using External Wires to Connect Sense Lines

in Parallel and External Wires to Configure Local Sensing ................................................... 2-12

2.4.2.3.3 Parallel Configurations using DIP Switches to Connect Sense Lines in

Parallel and External Wires to Configure Remote Sensing ................................................... 2-13

2.4.2.3.4 Parallel Configurations using External Wires to Connect Sense Lines

in Parallel and External Wires to Configure Remote Sensing ............................................... 2-14

2.4.3 Series Operation ............................................................................................................................... 2-15

2.4.4 Alarm Configurations ........................................................................................................................ 2-16

2.4.4.1 N.O. Alarm Line (Close on Failure) ............................................................................................. 2-16

2.4.4.1.1 Close on Failure Using Internal Dip Switches ........................................................................... 2-16

2.4.4.1.2 Close on Failure Using External Wiring at I/O Mating Connector ............................................. 2-18

2.4.4.2 N.C. Alarm Line (Open on Failure).............................................................................................. 2-19

2.4.4.2.1 Open on Failure Using Internal Dip Switches............................................................................ 2-19

2.4.4.2.2 Open on Failure Using External Wiring of I/O Mating Connector.............................................. 2-20

2.5 Terminations ........................................................................................................................................... 2-21

2.6 Cooling.................................................................................................................................................... 2-21

2.7 Installation............................................................................................................................................... 2-21

2.8 Wiring Instructions .................................................................................................................................. 2-21

2.8.1 Safety Grounding .............................................................................................................................. 2-21

2.8.2 Source Power Connections .............................................................................................................. 2-22

2.8.3 Control Signal Connections .............................................................................................................. 2-22

2.8.4 Output Load Connections ................................................................................................................. 2-23

2.8.4.1 Parallel/Redundant Operation..................................................................................................... 2-23

2.8.4.2 Series/Independent Operation .................................................................................................... 2-23

2.8.4.3 Mixed Operation.......................................................................................................................... 2-23

2.9 Installing/Removing HSF Power Supplies .............................................................................................. 2-24

2.10 Shipping.................................................................................................................................................. 2-24

i RA 19-4B 011409

LIST OF FIGURES

FIGURE TITLE PAGE

1-1 RA 19-4B Rack Adapter................................................................................................................................ iii

1-2 RA 19-4B Rack Adapter with HSF Power Supplies Installed...................................................................... 1-1

1-3 RA 19-4B Interconnections, Simplified Diagram ......................................................................................... 1-2

1-4 RA 19-4B Rack Adapter Rear Panel........................................................................................................... 1-3

1-5 Mechanical Outline Drawing, RA 19-4B Rack Adapter............................................................................... 1-4

2-1 Backplate Assembly, Interior View.............................................................................................................. 2-2

2-2 Independent Operation, Local Sensing for PS1 and PS2 using

Internal DIP switches, Simplified Diagram .............................................................................................. 2-5

2-3 ndependent Operation, Local Sensing for PS1 and PS2 using

External Jumpers at I/O Mating Connector, Simplified Diagram ............................................................. 2-6

2-4 Independent Operation, Remote Sensing for PS1 and PS2 using

External Wiring at I/O Mating Connector, Simplified Diagram................................................................. 2-7

2-5 Parallel Outputs Using Internal DIP Switches to Parallel sense

lines and current share, PS1 and PS2 (Typical), Simplified Diagram ..................................................... 2-9

2-6 Typical Parallel Connections Using External Wires for

Local Sensing and DIP switches to parallel sense wires ........................................................................ 2-11

2-7 Typical Parallel Connections using External Wires for Local Sensing

and I/O Mating Connector Jumpers to Parallel sense wires .................................................................... 2-12

2-8 Typical Parallel Connections, Remote Sensing using DIP Switches to Parallel Sense Wires.................... 2-13

2-9 Typical Parallel Connections, Remote Sensing using I/O Mating

Connector Jumpers to Parallel Sense Wires........................................................................................... 2-14

2-10 Series Configuration, Simplified Diagram ................................................................................................... 2-15

2-11 Close on Failure Alarm Configuration Using Internal Dip Switches, Simplified Diagram............................ 2-17

2-12 Close on Failure Alarm Configuration Using External Wiring at I/O Mating

Connector, Simplified Diagram................................................................................................................. 2-18

2-13 Open on Failure Alarm Configuration Using Internal Dip Switches, Simplified Diagram ............................ 2-19

2-14 Open on Failure Alarm Configuration Using External Wiring

at I/O Mating Connector, Simplified Diagram ........................................................................................... 2-20

LIST OF TABLES

TABLE TITLE PAGE

1-1 Compatible HSF Power Supplies ................................................................................................................1-3

1-2 RA 19-4B Accessories ................................................................................................................................1-3

2-1 Equipment Supplied ....................................................................................................................................2-1

2-2 Configuration DIP Switch Functions ...........................................................................................................2-3

RA 19-4B 011409

ii

FIGURE 1-1. RA 19-4B RACK ADAPTER

iii RA 19-4B 011409

1.1 SCOPE OF MANUAL

This manual contains instructions for the installation and operation of the RA 19-4B plug-in rack
adapter (Figure 1-1) used with HSF Series power supplies, manufactured by Kepco, Inc., Flush­ing, New York, U.S.A.

SECTION 1 - INTRODUCTION

1.2 GENERAL DESCRIPTION

FIGURE 1-1.

Kepco Series RA 19-(X)B rack adapters are specifically designed for the installation of Kepco
HSF Series Power Supplies into 19-inch EIA standard equipment racks. The RA 19-4B Model
accommodates up to two 350 Watt (1/3 rack) and four 50W, 100W (1/8 rack) or 150W (1/6
rack) HSF power supplies (Figure 1-2).

NOTE: Model RA 19-5B can accommodate one 350 Watt modules and up to four 50 Watt (1/8

rack), 100 Watt (1/8 rack) or 150 Watt (1/6 rack) modules; contact Kepco Applications
Engineering for assistance with non-standard configurations.

The rack adapter is user-configurable for parallel, series, or independent power supply opera­tion. Forced current sharing and OR’ing diodes for N+1 redundancy are built into the HSF power
supplies. User-configurable keying ensures that only the correct power supply can be installed
in a keyed slot.

FIGURE 1-2. RA 19-4B RACK ADAPTER WITH HSF POWER SUPPLIES INSTALLED

1.3 ELECTRICAL

An internal PCB back plate mounts connectors which interface directly with the power and sig­nal connectors of HSF Series power supplies, permitting hot swappable insertion and extrac­tion. The other side of the back plate assembly, available from the rear, contains the fixed power
and signal connections. Figure 1-3 illustrates the interconnections provided by the RA 19-4B
Rack Adapter. Dual input terminal blocks on the back plate assembly (Figure 1-4) distribute
input power to each of the three powers supplies.

All mechanical and electrical specifications are contained in the mechanical outline drawing:
Figure 1-5

RA 19-4B 011409 1-1

FIGURE 1-3. RA 19-4B INTERCONNECTIONS, SIMPLIFIED DIAGRAM

1.4 MECHANICAL

The rack adapter is equipped with mounting ears for mounting in EIA standard 19-inch racks.
For mounting in non-standard racks, consult Kepco Applications Engineering. The rack adapter
is not configured for slides. Optional blank filler panels (see Table 1-2) are available if the full
complement of power supplies is not utilized.

Mechanical dimensions, material, and finish of the RA 19-4B Rack Adapter is provided in Figure
1-5.

1.5 ACCESSORIES

Accessories for RA 19-4B Rack Adapters are listed in Table 1-2.

1.6 OPTIONS

Table 1-1 below describes the standard model options available with Series RA 19-(X)B rack
adapters. For non-standard options, contact Kepco Applications Engineering for assistance.

1-2 RA 19-4B 011409

FIGURE 1-4. RA 19-4B RACK ADAPTER REAR PANEL

TABLE 1-1. COMPATIBLE HSF POWER SUPPLIES

1/8 Rack Slots 1/6 Rack Slots 1/3 Rack Slots

MODEL

RA 19-3B * *

RA 19-4B

RA 19-5B

RA 19-6B *

RA 19-7B

RA 19-8B

* Contact Kepco Applications Engineering for assistance with non-standard configurations.

To ta l

HSF5-10, HSF12-

4.2, HSF15-3.4,

2

HSF24-2.1, HSF48-1

(max)

HSF5-10, HSF12-

4.2, HSF15-3.4,

4

HSF24-2.1, HSF48-1

(max)

HSF5-10, HSF12-

4.2, HSF15-3.4,

7

HSF24-2.1, HSF48-1

(max)

HSF5-10, HSF12-

4.2, HSF15-3.4,

8

HSF24-2.1, HSF48-1

(max)

Compatible HSF Models

50 Watt 100 Watt 150 Watts 350 Watts

HSF5-20, HSF12-

8.3, HSF15-6.6,
HSF24-4.2, HSF28-

3.5, HSF48-2

HSF5-20, HSF12-

8.3, HSF15-6.6,
HSF24-4.2, HSF28-

3.5, HSF48-2

HSF5-20, HSF12-

8.3, HSF15-6.6,
HSF24-4.2, HSF28-

3.5, HSF48-2

HSF5-20, HSF12-

8.3, HSF15-6.6,
HSF24-4.2, HSF28-

3.5, HSF48-2

To ta l

(max)

(max)

(max)

(max)

Compatible HSF

Models

HSF5-30, HSF12-12,
HSF15-10, HSF24-6,

2

HSF28-5, HSF48-2.82 (max)

HSF5-30, HSF12-12,
HSF15-10, HSF24-6,

4

HSF28-5, HSF48-2.81 (max)

HSF5-30, HSF12-12,

6

HSF15-10, HSF24-6,
HSF28-5, HSF48-2.8

HSF5-30, HSF12-12,
HSF15-10, HSF24-6,

4

HSF28-5, HSF48-2.8

*

Compatible HSF Mod-

To ta l

HSF3.3-70, HSF5-70,
HSF12-30, HSF15-24,

3

HSF24-16, HSF28-13,

(max)

HSF48-7.5

HSF3.3-70, HSF5-70,
HSF12-30, HSF15-24,
HSF24-16, HSF28-13,
HSF48-7.5

HSF3.3-70, HSF5-70,
HSF12-30, HSF15-24,
HSF24-16, HSF28-13,
HSF48-7.5

els

TABLE 1-2. RA 19-4B ACCESSORIES

ACCESSORY PART NUMBER USE

Filler Panel (1/6 Rack) RFP 19-16 Cover one unused 1/6 rack slot.

Filler Panel (1/3 Rack) RFP 19-13 Cover one unused 1/3 rack slot (includes top bracket)

Filler Panel (1/3 Rack) RFP 19-26 Cover two unused 1/6 rack slots

Filler Panel (2/3 Rack) RFP 19-23 Cover two unused 1/3 rack slots (includes top brackets).

Filler Panel (1/24 Rack) RFP 19-124 Cover gap if 1/8 rack unit used in 1/6 rack slot (See NOTE)

NOTE: If mounting holes for filler panel are not visible with 1/8 unit installed, order RFP 19-24

RA 19-4B 011409 1-3

Dimensions are in in ches, [dimensio ns in
brackets are in milli meters].

Tolerance: ± 1/64" (0.4) between
mounting holes; ± 1/32" (0.8) other
dimensions

FIGURE 1-5. MECHANICAL OUTLINE DRAWING, RA 19-4B RACK ADAPTER (SHEET 1 OF 2)

1-4 RA 19-4B 011409

FIGURE 1-5. MECHANICAL OUTLINE DRAWING, RA 19-4B RACK ADAPTER (SHEET 2 OF 2)

RA 19-4B 011409 1-5/(1-6 Blank)

SECTION 2 - INSTALLATION

2.1 UNPACKING AND INSPECTION

This equipment has been thoroughly inspected and tested prior to packing and is ready for
operation. After careful unpacking, inspect for shipping damage before attempting to operate. If
any indication of damage is found, file an immediate claim with the responsible transport ser­vice. See Table 2-1 for a list of equipment supplied.

TABLE 2-1. EQUIPMENT SUPPLIED

ITEM QUANTITY PART NUMBER

Rack Adapter 1 RA 19-4B

I/O Connector (Mating) 2 142-0449

Line cord (115 V a-c, 15A max, North American style plug, 6 ft.) 2 118-0506

Instruction Manual 1 243-0955

Keying pins 4 108-0305

Hood for I/O Connector (Mating) P/N 142-0449 2 108-0204

2.2 CONFIGURING THE RACK ADAPTER

Prior to installation the rack adapter must be configured by the user. Configuration consists of
the following:

• For configurations that use multiple output voltages it is possible to key the rack adapter
to accept only a power supply with corresponding keying (see PAR 2.3).

• Configuring slots for independent, parallel, or series operation. This can be done by
means of internal DIP switches, or externally by wiring the associated I/O mating con­nector and DC OUTPUT terminals (see PAR. 2.4).

2.3 RACK ADAPTER KEYING INSTRUCTIONS

Series RA 19-(X)B rack adapters incorporate a keying mechanism to prevent accidental inser­tion of the incorrect model HSF power supply into any position. The HSF power supplies are
keyed by voltage at the factory. The keying mechanism will prevent engagement of any of the
HSF power supply's connectors with those on the rack adapter's back plate unless the key and
keyway align. The user can configure each power supply position of the rack adapter for the
desired voltage in the desired position (see Figure 2-1). First gain access to the interior compo­nents (PAR.2.3.1), then position the key as required (PAR. 2.3.2).

NOTE: After removing the rear panel, the keying pins can be accessed through the front of the

rack adapter, although it is recommended that the back plate be removed to gain easy
access to interior components.

2.3.1 DISASSEMBLY TO GAIN ACCESS TO INTERIOR COMPONENTS

NOTE: All power supplies must be removed prior to disassembly.

1. Remove four spacers securing the two I/O connectors to the rear panel

RA 19-4B 011409 2-1

2. Remove the four screws (two at the top and two at the bottom) securing the rear panel to the
chassis and separate the rear panel from the chassis (it is not necessary to remove the
ground connection (if present) between the rear panel and the chassis ).

3. Remove seven screws (three at the top and four at the bottom) securing the back plate to the
chassis and remove the back plate to gain access to the interior components (see Figure 2-1)

FIGURE 2-1. BACKPLATE ASSEMBLY, INTERIOR VIEW

2.3.2 ESTABLISHING KEY POSITIONS

To establish the keying of any position, simply insert the key pin from the front and secure with
mounting nut at the back plate using two ¼" nutdrivers or deep sockets. RA 19-4B backplate
assembly keying is identical to the HSF module keying identified in Figure 2-1 and in the HSF
operator's manual. Slots 3 and 4 require two pins to key 3.3V; all other models require only one
pin. DO NOT ALTER THE KEYING AT THE POWER SUPPLY.

2-2 RA 19-4B 011409

2.4 SLOT CONFIGURATION

Configuring slots of the rack adapter for independent, parallel or series operation is accom­plished either internally by means of DIP switches associated with each slot (see Figure 2-1),
or externally by connecting the appropriate pins of the associated I/O mating connector. DIP
switch functions are explained in Table 2-2. Refer to PAR. 2.3.1 to gain access to the DIP
switches.

Slot configuration requires the following selection:

1. Select independent (PAR. 2.4.1), parallel (PAR. 2.4.2), or series (PAR. 2.4.3) operation.

2. Select local or remote sensing; PAR. 2.4.1 (independent), 2.4.2, (parallel) or 2.4.3, (series).

3. Optional: Select close-on-failure or open-on-failure alarm (PAR. 2.4.4).

TABLE 2-2. CONFIGURATION DIP SWITCH FUNCTIONS

DIP

SWITCH

POSITION

FUNCTION DIP SWITCH SET TO ON (CLOSED) DIP SWITCH SET TO OFF (OPEN)

NOTE: BOLD TYPE INDICATES FACTORY SETTINGS.

1, 2

3, 4

6, 7

Required ON for independent operation with
Local Sensing. Position 1 connects V+ to S+,
Position 2 connects V– to S– (see PAR.

Local /
Remote
Sensing

Selection

Connect

Sense

+ and –

in parallel

5

Current

Share

Close on

Failure

Alarm

2.4.1.1).

Required ON for parallel configurations using DIP
switch settings to connect the sense leads in par­allel. Position 3 connects +S to adjacent slot +S,
Position 4 connects –S to adjacent slot –S (see
PAR. 2.4.2.3.1 for local sensing, PAR. 2.4.2.3.3
for remote sensing).

Required ON for parallel operation using forced
current sharing (connects current share lines in
parallel) unless connections are made via external
wires (see PAR. 2.4.2.2.1)

When set to ON, allows a single alarm to provide
failure indication (contact closure between N.O.
pin and COM pin) if any one of many power sup­plies fails (see PAR. 2.4.4.1).

Position 1 and 2 required OFF for:
a) Independent configurations using Remote
Sensing (see PAR. 2.4.1.3).
b) Independent configurations using Local Sens­ing with user supplied connections from V+ to S+
and V– to S– (see PAR. 2.4.1.2).
c) All parallel configurations (sensing must be
established using external wires) (see PAR.

2.4.2.3).
d) All series connections (see PAR. 2.4.3).

Position 3 and 4 required OFF for all configura­tions except parallel configurations using DIP
switch settings to connect the sense leads in
parallel.

Required OFF for
a) independent and series configurations.
b) Parallel configurations with forced current
sharing using external wires to connect current
share lines in parallel.
c. Parallel configurations without forced cur­rent sharing (current balancing).

When set to OFF, individual power supplies
produce closure between I/O connector N.O.
and COM pins upon failure (see PAR. 2.4.4.1).

8

RA 19-4B 011409 2-3

Open on

Failure

Alarm

When set to ON, allows a single alarm to provide
failure indication (contact open between N.C. pin
and COM pin) if any one of many power supplies
fails (see PAR. 2.4.4.2).

When set to OFF, individual power supplies
produce open between I/O connector N.C. and
COM pins upon failure (see PAR. 2.4.4.2).

2.4.1 INDEPENDENT OPERATION

The rack adapter is preconfigured at the factory for independent operation of all slots. DIP
switch positions 3, 4 and 5 associated with each slot must be set to OFF (open) for each power
supply to be operated independently.

NOTE: Either local or remote sensing must be connected for the HSF power supplies to

work properly.

The rack adapter is shipped from the factory with each power supply position configured for
local sensing (see Figure 2-2). Sensing for each slot can be configured independently:

• Local sensing using internal DIP switches

• Local sensing using external jumpers connected to the I/O mating connector or the DC
OUTPUT terminal block.

• Remote sensing

2-4 RA 19-4B 011409

2.4.1.1 INDEPENDENT OPERATION - LOCAL SENSING USING INTERNAL DIP SWITCHES

The rack adapter slots are preconfigured at the factory for local sensing using internal DIP
switches. If a slot has been configured for other than local sensing using DIP switches and it is
necessary to reconfigure it for local sensing, simply set positions 1 and 2 of the DIP switch asso­ciated with that slot to ON (closed). External sensing connections must be removed. When set
to ON (closed) DIP switch position 1 connects (V+) to (S+) and position 2 connects (V–) to (S–).
See Figure 2-1 for DIP switch locations. Figure 2-2 illustrates local sensing of PS1 and PS2 by
setting positions 1 and 2 of internal DIP switches B3 and C4 to ON (closed); positions 3 and 4
must be set to OFF (open). Position 5 (current share) must be set to OFF and positions 6, 7,
and 8 (alarms) can be configured per PAR. 2.4.4.

FIGURE 2-2. INDEPENDENT OPERATION, LOCAL SENSING FOR PS1 AND PS2 USING

INTERNAL DIP SWITCHES, SIMPLIFIED DIAGRAM

RA 19-4B 011409 2-5

2.4.1.2 INDEPENDENT OPERATION - LOCAL SENSING USING EXTERNAL WIRING

To configure a slot for local sensing using external wiring, first set internal DIP switch positions 1
and 2 of the DIP switches associated with that slot to OFF (open).

External local sensing is accomplished by connecting (V+) to (S+) and (V–) to (S–). This can be
done at either the mating I/O connector supplied (see Table 2-1) or the DC OUTPUT terminal
block. See Figure 2-1 for DIP socket locations. Figure 1-3 illustrates I/O connector pin assign­ments. Figure 2-3 illustrates local sensing of PS1 and PS2 using external jumpers connected to
the I/O mating connector.

NOTE: The internal DIP switch settings established at the factory for positions 1 and 2 of the

associated DIP switch MUST be changed to OFF (open) if this option is chosen.

Positions 3 and 4 (connecting sense lines in parallel) and Position 5 (current share) must be set
to OFF. Configure Positions 6, 7, and 8 (alarms) per PAR. 2.4.4.

FIGURE 2-3. INDEPENDENT OPERATION, LOCAL SENSING FOR PS1 AND PS2 USING

EXTERNAL JUMPERS AT I/O MATING CONNECTOR, SIMPLIFIED DIAGRAM

2-6 RA 19-4B 011409

2.4.1.3 INDEPENDENT OPERATION - REMOTE SENSING

Remote sensing is accomplished by connecting +Load to (S+) and –Load to (S–). Figure 2-4
illustrates remote sensing for PS1 and PS2 using wires connected to the I/O mating connector.

NOTE: The internal DIP switch settings established at the factory for positions 1 and 2 of the

associated DIP switch MUST be changed to OFF (open) if this option is chosen.

Positions 3 and 4 (connecting sense lines in parallel) and Position 5 (current share) must be set
to OFF. Configure Positions 6, 7, and 8 (alarms) per PAR. 2.4.4.

FIGURE 2-4. INDEPENDENT OPERATION, REMOTE SENSING FOR PS1 AND PS2 USING

EXTERNAL WIRING AT I/O MATING CONNECTOR, SIMPLIFIED DIAGRAM

RA 19-4B 011409 2-7

2.4.2 PARALLEL OPERATION

Identical HSF power supplies can be connected in parallel to provide redundant operation or
increased output current to a common load. The power leads must be connected in parallel
externally (see PAR. 2.8.4.1). (Configurations using internal parallel busing are also possible;
consult Kepco’s Applications Engineering for details.) Three things must be considered when
configuring the rack adapter for parallel operation:

• DC OUTPUT

• CURRENT SHARE

• SENSE

2.4.2.1 PARALLEL DC OUTPUT CONNECTIONS

The power leads must be connected in parallel externally (see PAR. 2.8.4.1). DC Output V(+)
and V(–) must be connected in parallel at the DC OUTPUT terminal block (see Figures 2-5
through 2-9).

2.4.2.2 PARALLEL CURRENT SHARE CONNECTIONS

The Current Share pins of the HSF power supplies must be connected together for parallel
operation. This can be done either internally using the DIP switches to configure adjacent slots
in parallel (PAR 2.4.2.2.1), or externally by wiring the I/O mating connector for configuring slots
2 and 3 (PAR. 2.4.2.2.2).

2-8 RA 19-4B 011409

2.4.2.2.1 PARALLEL CURRENT SHARE - INTERNAL DIP SWITCHES

To configure adjacent slots, use the internal DIP switches to connect the Current Share bus.
Using internal DIP switches permits only adjacent power supplies be connected in parallel.(i.e.,
PS1 and PS2 FOR HSF 350W units and PS3 and PS4 for HSF 50W, 100W or 150W units.

CAUTION: HSF 50W, 150W or 150W units can not be connected in parallel with 350W
units.

To connect the current share lines locate the applicable DIP switches: C4 for HSF 350W units
and F8 for HSF 50W, 100W or 150W units (see Figure 2-1) and set position 3, 4, 5 to ON
(closed). The example illustrated in Figure 2-5 shows two 350W units (slot 1 and slot 2) con­nected in parallel using internal DIP switches to configure the current share bus, enabled via
position 5 of DIP switch C4 for slots 1/2 or F8 for slots 3/4.

NOTE: If internal DIP switch positions 3, 4 are closed (ON), use only one pair of sense

lines to monitor voltage.

FIGURE 2-5. PARALLEL OUTPUTS USING INTERNAL DIP SWITCHES TO PARALLEL SENSE

LINES AND CURRENT SHARE, PS1 AND PS2 (TYPICAL), SIMPLIFIED DIAGRAM

RA 19-4B 011409 2-9

2.4.2.2.2 PARALLEL CURRENT SHARE - EXTERNAL WIRING

Due to current share bus incompatibility between HSF 350W units and the 50W, 100W and
150W units, using external wiring for parallel current share is not necessary. Parallel current
share bus configuration must be accomplished using the DIP switches (see PAR. 2.4.2.2.1).

2.4.2.3 SENSE CONNECTIONS FOR PARALLEL CONFIGURATIONS

NOTE: HSF power supply sense lines MUST be connected to the respective output terminals;

otherwise the power supplies will not work.

For parallel configurations the sense lines must be connected in parallel. This can be accom­plished either by using the DIP switches (positions 3 and 4 set to ON) or by setting the DIP
switch positions 3 and 4 to OFF and using external wires. When configuring units to work in par­allel, the current share bus (PAR. 2.4.2.2) must also be configured.

For local sensing (at the rack adapter) connect the sense lines in parallel using either the DIP
switches or external jumpers, then connect one +S and one –S from the I/O mating connector to
the DC OUTPUT terminal block using short jumpers.

For remote sensing (at the load) connect the sense lines in parallel using either the DIP
switches or external jumpers to connect the sense lines in parallel, then connect one +S and
one –S from the I/O connector to the load using external wires.

For both local and remote sensing Positions 1 and 2 of each DIP switch in the parallel configura­tion must be set to OFF (open); refer to Figure 2-1 to identify the DIP switch associated with a
corresponding slot.

See the following paragraphs for more details:

• PAR. 2.4.2.3.1: Parallel configurations using DIP switches to connect the sense lines in par­allel and external wires to configure local sensing.

• PAR. 2.4.2.3.2: Parallel configurations using external wires to connect the sense lines in
parallel and external wires to configure local sensing.

• PAR. 2.4.2.3.3: Parallel configurations using DIP switches to connect the sense lines in par­allel and external wires to configure remote sensing.

• PAR. 2.4.2.3.4: Parallel configurations using external wires to connect the sense lines in
parallel and external wires to configure remote sensing.

2-10 RA 19-4B 011409

2.4.2.3.1 PARALLEL CONFIGURATION USING DIP SWITCHES TO CONNECT SENSE LINES IN PARALLEL AND EXTERNAL WIRES TO CONFIGURE LOCAL SENSING

Figure 2-6 is a simplified diagram of a typical parallel configuration using local sensing via exter­nal wires to connect V(+) to S(+), V(–) to S(–) and DIP switch settings to connect the sense
leads in parallel. This configuration requires the following:

1. For each supply in parallel set DIP switch positions 1 and 2 to OFF (open) (see Figure 2-1).

2. For each DIP switch between parallel-connected slots (C4 and F8), set DIP switch positions

3 and 4 to ON (closed) to connect sense leads in parallel (see Figure 2-1).

3. For each DIP switch between parallel-connected slots configure position 5 to connect the

current share bus by referring to PAR. 2.4.2.2.

4. Configure Positions 6, 7, and 8 (alarms) of each DIP switch per PAR. 2.4.4.

5. Connect wire between I/O mating connector pin Sense (+) and corresponding power supply

V(+) terminal at DC OUTPUT terminal block.

6. Connect wire between I/O mating connector pin Sense (–) and corresponding power supply

V(–) terminal at DC OUTPUT terminal block.

FIGURE 2-6. TYPICAL PARALLEL CONNECTIONS USING EXTERNAL WIRES FOR

LOCAL SENSING AND DIP SWITCHES TO PARALLEL SENSE WIRES

RA 19-4B 011409 2-11

2.4.2.3.2 PARALLEL CONFIGURATIONS USING EXTERNAL WIRES TO CONNECT SENSE LINES IN PARALLEL AND EXTERNAL WIRES TO CONFIGURE LOCAL SENSING

Figure 2-7 is a simplified diagram of a typical parallel configuration using local sensing via exter­nal wires to connect V(+) to S(+), V(–) to S(–) and jumpers connected to the I/O mating con­necter to connect the sense leads in parallel. This configuration requires the following:

1. For each supply in parallel set DIP switch positions 1 and 2 to OFF (open) (see Figure 2-1).

2. For each DIP switch between parallel-connected slots (C4 and F8), set DIP switch positions

3 and 4 to OFF (open) (sense leads will be connected in parallel in steps 7 and 8) (see Fig­ure 2-1).

3. For each DIP switch between parallel-connected slots configure position 5 to connect the

current share bus by referring to PAR. 2.4.2.2.

4. Configure Positions 6, 7, and 8 (alarms) of each DIP switch per PAR. 2.4.4.

5. Connect wire between I/O mating connector pin Sense (+) and corresponding power supply

V (+) terminal at DC OUTPUT terminal block.

6. Connect wire between I/O mating connector pin Sense (–) and corresponding power supply

V (–) terminal at DC OUTPUT terminal block.

7. Connect short jumper across I/O mating connector Sense (+) pins.

8. Connect short jumper across I/O mating connector Sense (–) pins.

FIGURE 2-7. TYPICAL PARALLEL CONNECTIONS USING EXTERNAL WIRES FOR LOCAL SENSING

AND I/O MATING CONNECTOR JUMPERS TO PARALLEL SENSE WIRES

2-12 RA 19-4B 011409

2.4.2.3.3 PARALLEL CONFIGURATIONS USING DIP SWITCHES TO CONNECT SENSE LINES IN PARALLEL AND EXTERNAL WIRES TO CONFIGURE REMOTE SENSING

Figure 2-8 is a simplified diagram of a typical parallel configuration using remote sensing via
external wires to connect V(+) to S(+), V(–) to S(–) and DIP switch settings to connect the sense
leads in parallel. This configuration requires the following:

1. For each supply in parallel set DIP switch positions 1 and 2 to OFF (open) (see Figure 2-1).

2. For each DIP switch between parallel-connected slots (C4 and F8), set DIP switch positions

3 and 4 to ON (closed) to connect sense leads in parallel (see Figure 2-1).

3. For each DIP switch between parallel-connected slots configure position 5 to connect the

current share bus by referring to PAR. 2.4.2.2.

4. Configure Positions 6, 7, and 8 (alarms) of each DIP switch per PAR. 2.4.4.

5. Connect wire from I/O mating connector Sense (+) pin to V (+) at the load.

6. Connect wire from I/O mating connector Sense (–) pin to V (–) at the load.

FIGURE 2-8. TYPICAL PARALLEL CONNECTIONS, REMOTE SENSING

USING DIP SWITCHES TO PARALLEL SENSE WIRES

RA 19-4B 011409 2-13

2.4.2.3.4 PARALLEL CONFIGURATIONS USING EXTERNAL WIRES TO CONNECT SENSE LINES IN PARALLEL AND EXTERNAL WIRES TO CONFIGURE REMOTE SENSING

Figure 2-9 is a simplified diagram of a typical parallel configuration using remote sensing via
external wires to connect V(+) to S(+), V(–) to S(–) and jumpers connected to the mating con­necter to connect the sense leads in parallel. This configuration requires the following:

1. For each supply in parallel set DIP switch positions 1 and 2 to OFF (open) (see Figure 2-1).

2. For each DIP switch between parallel-connected slots (C4 and F8), set DIP switch positions

3 and 4 to OFF (open) (sense leads will be connected in parallel in steps 7 and 8) (see Fig­ure 2-1).

3. For each DIP switch between parallel-connected slots, configure position 5 to connect the

current share bus by referring to PAR. 2.4.2.2.

4. Configure Positions 6, 7, and 8 (alarms) of each DIP switch per PAR. 2.4.4.

5. Connect short jumper across I/O mating connector Sense (+) pins.

6. Connect short jumper across I/O mating connector Sense (–) pins.

7. Connect wire from I/O mating connector Sense (+) pin to V (+) at the load.

8. Connect wire from I/O mating connector Sense (–) pin to V (–) at the load.

FIGURE 2-9. TYPICAL PARALLEL CONNECTIONS, REMOTE SENSING USING I/O MATING

CONNECTOR JUMPERS TO PARALLEL SENSE WIRES

2-14 RA 19-4B 011409

2.4.3 SERIES OPERATION

HSF power supplies may be connected in series to obtain higher output voltages, however the
maximum current must not exceed 35 Amperes (the current carrying capacity of the internal
printed circuit board) and is limited to the maximum current of one of the power supplies con­nected in series. The power supply with the lowest rated value of maximum current establishes
the maximum load current allowed. Series configurations can only be accomplished by external
wiring of the I/O mating connector. Blocking diodes are incorporated in the HSF power sup­plies. V+ of one supply must be connected to V– of the next supply at the DC OUTPUT terminal
block.

DIP switches (positions 1 through 5) between series-connected supplies and at both ends of the
series-connected group must be set to OFF (open). Sensing can be either local or remote (PAR.

2.4.1.3). Local sensing requires external wiring (PAR.2.4.1.2). Figure 2-10 illustrates PS4, PS5
and PS6 connected in series.

FIGURE 2-10. SERIES CONFIGURATION, SIMPLIFIED DIAGRAM

RA 19-4B 011409 2-15

2.4.4 ALARM CONFIGURATIONS

The HSF Power Supplies each provide a normally closed (N.C.) and normally open (N.O.) line
referenced to common (COM) for use as an alarm at the users discretion. The N.C. line opens
upon failure, the N.O. line closes upon failure. The RA 19-4B is configured at the factory for
independent operation of these lines. It is possible to configure these alarm lines to allow multi­ple power supplies to provide a failure indication using the N.O. (close on failure) lines, N.C
(open on failure) lines, or both. Each alarm circuit can be configured in two ways: either by inter­nal DIP switches or by external wiring of the I/O mating connector. Use external wiring of the I/O
mating connector if DIP switch specifications noted in the following CAUTION will be exceeded.

CAUTION: The user is responsible for ensuring that the alarm circuit does not exceed

the HSF alarm relay switching specifications: 1A @ 30V d-c or 0.5A @ 125V
a-c. If the alarm circuit is configured using the rear panel DIP switches, the
user is responsible for ensuring that the alarm circuit does not exceed DIP
switch specifications: 100mA, 50V d-c, maximum.

2.4.4.1 N.O. ALARM LINE (CLOSE ON FAILURE)

The N.O. and COM line of each HSF supply provide a closed contact (short circuit) upon failure.
To configure multiple power supplies so that a failure of any supply produces a failure indication,
it is necessary to connect the N.O. lines in parallel and the COM lines in parallel.

2.4.4.1.1 CLOSE ON FAILURE USING INTERNAL DIP SWITCHES

Close on failure for multiple power supplies can be accomplished by setting DIP switch positions
6 and 7 to ON (closed). associated with each adjacent slot included in the alarm circuit. For
example, for PS1 and PS2, set DIP switch 2, positions 6 and 7 to ON (closed). The failure indi­cation (short circuit) will be present across both N.O.1 and COM1, and N.O.2 and COM2. Figure
2-11 is a simplified diagram illustrating a close on failure alarm configuration for four power sup­plies using internal DIP switches.

2-16 RA 19-4B 011409

FIGURE 2-11. CLOSE ON FAILURE ALARM CONFIGURATION USING INTERNAL DIP

SWITCHES, SIMPLIFIED DIAGRAM

RA 19-4B 011409 2-17

2.4.4.1.2 CLOSE ON FAILURE USING EXTERNAL WIRING AT I/O MATING CONNECTOR

Close on failure for multiple power supplies can be accomplished by wiring N.O. and COM in
parallel at the I/O mating connector. DIP switches associated with slots included in the alarm cir­cuit must have positions 6 and 7 set to OFF (open). The failure indication (short circuit) will be
present across any pair of N.O. and COM lines. Figure 2-12 is a simplified diagram illustrating a
close on failure alarm configuration for four power supplies using external wiring at the I/O mat­ing connector.

FIGURE 2-12. CLOSE ON FAILURE ALARM CONFIGURATION USING EXTERNAL WIRING AT I/O MATING

CONNECTOR, SIMPLIFIED DIAGRAM

2-18 RA 19-4B 011409

2.4.4.2 N.C. ALARM LINE (OPEN ON FAILURE)

The N.C and COM line of each HSF supply provide an open contact (open circuit) upon failure.
To configure multiple power supplies so that a failure of any supply produces a failure indication,
it is necessary to connect the N.C. line of one, with the COM line of the next power supply, so
the alarm line is connected in series.

2.4.4.2.1 OPEN ON FAILURE USING INTERNAL DIP SWITCHES

The open on failure alarm for multiple power supplies is accomplished by setting the associated
DIP switch, position 8, to ON (closed) for each slot included in the alarm circuit as indicated in
Figure 2-13. Setting DIP switch position 8 to ON (closed) connects the N.C. line to the COM line
of the adjacent power supply. Figure 2-13 illustrates an open on failure alarm configuration for
four power supplies using internal DIP switch settings.

CAUTION: The user is responsible for ensuring that the alarm circuit does not exceed

DIP switch specifications: 100mA, 50V d-c, maximum.

To configure PS1, PS2 and PS3 as open on failure, set position 8 of DIP switch for slot 2 (C4)
and slot 3 (F8) to ON (closed). The failure indication (open circuit) will be present across N.C.3
and COM 1.

FIGURE 2-13. OPEN ON FAILURE ALARM CONFIGURATION USING INTERNAL DIP

SWITCHES, SIMPLIFIED DIAGRAM

RA 19-4B 011409 2-19

2.4.4.2.2 OPEN ON FAILURE USING EXTERNAL WIRING OF I/O MATING CONNECTOR

Figure 2-14 illustrates an open on failure alarm configuration using external wiring of the I/O
mating connectors for four power supplies. It is necessary to set DIP switch position 8 to OFF
(open) for each slot included in the open on failure alarm circuit.

FIGURE 2-14. OPEN ON FAILURE ALARM CONFIGURATION USING EXTERNAL WIRING

AT I/O MATING CONNECTOR, SIMPLIFIED DIAGRAM

2-20 RA 19-4B 011409

2.5 TERMINATIONS

All input, output and control terminations are located on the rear panel of the rack adapter (see
Figure 1-4).

2.6 COOLING

The HSF power supplies mounted within the rack adapter are maintained within their operating
temperature range by means of convection cooling. ALL OPENINGS AROUND THE RACK
ADAPTER CASE MUST BE KEPT CLEAR OF OBSTRUCTION TO ENSURE PROPER AIR
CIRCULATION. Care must be taken that the ambient temperature, which is the temperature of
the air immediately surrounding the rack adapter, does not rise above the specified limits for the
operating load conditions of the installed HSF power supplies. Kepco recommends providing
additional space above and below the rack adapter where possible when the rack adapter is
fully populated.

2.7 INSTALLATION (Refer to "Mechanical Outline Drawing," Figure 1-5.)

The rack adapter mounts directly to EIA standard 19" racks via the two mounting ears; two
screws are required per mounting ear for proper support.

Provide adequate clearance around case and ensure that the temperature immediately sur­rounding the unit does not exceed the maximum specified ambient temperature for the operat­ing conditions of the installed power supplies.

RACK ADAPTER SHOULD BE MOUNTED BEFORE INSTALLING POWER SUPPLIES.

2.8 WIRING INSTRUCTIONS

Interconnections between an a-c power source and a stabilized power supply, and between the
power supply and its load are as critical as the interface between other types of electronic equip­ment. If optimum performance is expected, certain rules for the interconnection of source,
power supply and load must be observed by the user. These rules are described in detail in the
following paragraphs and in the operating instructions for HSF Series power supplies.

2.8.1 SAFETY GROUNDING

Local, national and international safety rules dictate the grounding of the metal cover and case
of any instrument connected to the a-c power source, when such grounding is an intrinsic part of
the safety aspect of the instrument. The instructions below suggest wiring methods which com­ply with these safety requirements; however, in the event that the specific installation for the
power system involves differences with the recommended wiring, it is the customer's responsi­bility to ensure that all applicable electric codes for safety grounding requirements are met.

CAUTION

RA 19-4B 011409 2-21

2.8.2 SOURCE POWER CONNECTIONS

THE SERIES RA 19-(X)B DOES NOT INCORPORATE ANY SAFETY INTERRUPT DEVICES.
PROTECTION OF INPUT WIRING REQUIRES USER-CONFIGURED SAFETY INTERRUPTS.

When used in conjunction with Kepco HSF series power supplies, these rack adapters can be
operated from single phase 95-264V a-c or 125-370V d-c source power without adjustment or
modification. Source power is applied to two 3-terminal terminal blocks at the rear panel and
distributed as indicated in Figure 1-3. Wires must be sized according to expected current. Wire
size range is 20-10 AWG; torque to 6 lb-in (0.6N•M) maximum. The terminal positions are
labeled L, N, and G. Their functions are as follows:

• Terminal G (Ground) is the safety ground connection for the Series RA 19-(X)B. It is
connected to the Series RA 19-(X)B chassis and to the safety ground terminal of the
input power connector for each of the power supply mounting positions via the PCB
backplane. Terminal G must be connected to safety ground in order to ensure proper
grounding of the HSF power supplies.

• Terminals L (Line Phase) and N (Neutral) are connected to the input power entry con-
nectors. Source power is provided to the power supplies indicated by the label on the
rear panel. The source power connectors are independent of each other, allowing the
user complete flexibility in wiring for common or redundant input power configurations.

CAUTION

The following standard wiring configuration is recommended by Kepco as being compliant with
applicable national and international safety standards. Please consult local electrical codes for
wire current ratings and other specific requirements:

• Connect Terminal G of each Series RA 19-(X)B input power terminal block to safety
ground

• Connect a separate wire pair from each side of the input power to the L/N terminal pair of
the input power terminal block.

• Where 115V a-c source power is used, Kepco recommends the use of the line cords,
P/N 118-0506 supplied (North American style plug, 15A maximum, 6 ft. long).

• Wire size is determined by the maximum rated source current for each HSF power sup­ply and the number of power supplies installed. For lower system power configurations,
smaller wire can be used; contact Kepco Applications Engineering for assistance.

2.8.3 CONTROL SIGNAL CONNECTIONS

Access to the control signal (I/O) connector for each HSF power supply is provided via the 15­pin D-subminiature connectors on the rear panel of the rack adapter (see Figure 1-4). Two mat­ing connectors (Kepco P/N 142-0449) are provided in a plastic bag. Consult PAR. 2.4 and the
HSF operator's manual for instructions on wiring and use of these control lines.

2-22 RA 19-4B 011409

2.8.4 OUTPUT LOAD CONNECTIONS

Load connections to the rack adapters are achieved via two terminal blocks located on the
backplate assembly. Wires must be sized according to expected current. Wire size range is 20­10 AWG; torque to 6 lb-in (0.6N•M) maximum. (Sensing connections are made through the I/O
mating connector, PAR. 2.4.1)

NOTE!

REGARDLESS OF OUTPUT CONFIGURATION, OUTPUT SENSE

LINES MUST BE PROPERLY CONNECTED FOR OPERATION.

2.8.4.1 PARALLEL/REDUNDANT OPERATION

WARNING

Removal of an HSF power supply from a “live” system must be done only by
authorized service personnel after HSF power switch is set to OFF. Danger­ous voltages may be accessible through the open slot after a power supply
is removed.

Identical HSF power supplies can be connected in parallel to provide redundant operation or
increased output current to a common load. Maximum output current for each terminal pair of
the DC OUTPUT terminal blocks is 35 Amperes. Connect (+) to (+) and (–) to (–) at the DC
OUTPUT terminal block (see Figure 2-5).

NOTE: Verify that the sense lines and current share bus are configured per PAR. 2.4.2. An

external bus is required where current exceeds 35 Amperes.

2.8.4.2 SERIES/INDEPENDENT OPERATION

The rack adapter can be used for either independent or series operation of HSF power supplies;
it is factory configured for independent operation using local sensing. To select remote sensing,
refer to PAR. 2.4.1.3.

For series operation, connect (+) and (–) terminals at the DC OUTPUT terminal block of power
supplies to be connected in series (see Figure 2-10). The HSF power supplies are equipped
with blocking diodes which allow series operation without further modification. The RA 19-(X)B
Series rack adapter is designed to safely handle a maximum output voltage of 500 Volts.

2.8.4.3 MIXED OPERATION

The design of the Series RA 19-(X)B rack adapters permits the user to configure HSF power
supplies for almost any combination of independent, series and parallel operation, both within a
single rack adapter and between different RA 19-(X)B rack adapters, within the limits of the HSF
operation envelope and the current and voltage ratings specified in PAR.s 2.8.4.1 and 2.8.4.2.
The user must ensure that the requirements for each configuration stated above are met. If any
questions or problems arise, the user is encouraged to contact the Kepco Applications Engi­neering group for technical assistance.

RA 19-4B 011409 2-23

2.9 INSTALLING/REMOVING HSF POWER SUPPLIES

WARNING

Removal of an HSF power supply from a “live” system must be done only by
authorized service personnel after HSF power switch is set to OFF. Danger­ous voltages may be accessible through the open slot after a power supply
is removed.

Refer to Figure 1-1, for proper slot positions applicable to the RA 19-4B Rack Adapter. Insert
HSF power supply in selected slot until power supply front panel is flush with rack adapter chas­sis and secure with two phillips screws on power supply.

2.10 SHIPPING

The rack adapter may be shipped with power supplies installed only after the HSF power sup-
plies have been securely fastened to the rack adapter (PAR. 2.9). Contact Kepco Applications
Engineering if further assistance is required.

2-24 RA 19-4B 011409

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