MASK ALIGNER MA6
Standard Operation Procedure
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Nano Fabrication Unit
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Turn On/Off instructions
Turn On
1. Switch On the cooling delay controlץ
2a. Turn On power supply
2b. Press “CP” button.
2b. Press “Start”.
3. Turn on switch on the Controller unit.
In case of turn on error hit “Off” button and after 2 min delay
repeat “ON” => “CP” => “Start”
Turn Off
Turn off the tool in the following sequence:
Controller => Power supply unit => Cooling delay control.
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First Mask Print Mode
The first mask print of a wafer is done without alignment. This
software sequence is started by the EXPOSURE key.
Starting from the initial state of the machine these steps have to be
performed:
1. Adjust Parameters
a. Press EDIT PARAMETER key to edit the parameter.
b. Change exposure time to the desired value
c. Press EDIT PARAMETER key again.
2. Load Mask
a. Press CHANGE MASK key
b. Place the mask onto the mask holder. Toggle the mask
vacuum on by pressing the ENTER key.
c. Flip the mask holder 180° back and move it into the
machine. Lock the mask holder slide by pressing
CHANGE MASK key again.
3. Load Wafer
a. The machine instructs: "pull slide and load substrate onto
chuck". Pull out the transport slide completely. Insert the
proper chuck and place the wafer against the prealignment pins. Confirm with ENTER key. Now the wafer
is hold by vacuum.
b. The machine instructs: "move slide into machine and
confirm with ENTER". Move slide in and press ENTER
key.
c. Wedge error compensation (WEC) starts automatically
after the last action is completed. The wafer is adjusted
parallel to the mask.
4. Exposure
a. After WEC the wafer moves automatically in exposure
position.
b. Press EXPOSE key.
5. Unload wafer
6. Unload Mask
a. Hit the CHANGE MASK key and the mask holder will be
released. Pull the mask holder out, flip it by 180° and
store it on the tray to your left. Hit ENTER to switch the
mask vacuum off.
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