MASK ALIGNER MA6
Standard Operation Procedure
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Nano Fabrication Unit
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Turn On/Off instructions
Turn On
1. Switch On the cooling delay controlץ
2a. Turn On power supply
2b. Press “CP” button.
2b. Press “Start”.
3. Turn on switch on the Controller unit.
In case of turn on error hit “Off” button and after 2 min delay
repeat “ON” => “CP” => “Start”
Turn Off
Turn off the tool in the following sequence:
Controller => Power supply unit => Cooling delay control.
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First Mask Print Mode
The first mask print of a wafer is done without alignment. This
software sequence is started by the EXPOSURE key.
Starting from the initial state of the machine these steps have to be
performed:
1. Adjust Parameters
a. Press EDIT PARAMETER key to edit the parameter.
b. Change exposure time to the desired value
c. Press EDIT PARAMETER key again.
2. Load Mask
a. Press CHANGE MASK key
b. Place the mask onto the mask holder. Toggle the mask
vacuum on by pressing the ENTER key.
c. Flip the mask holder 180° back and move it into the
machine. Lock the mask holder slide by pressing
CHANGE MASK key again.
3. Load Wafer
a. The machine instructs: "pull slide and load substrate onto
chuck". Pull out the transport slide completely. Insert the
proper chuck and place the wafer against the prealignment pins. Confirm with ENTER key. Now the wafer
is hold by vacuum.
b. The machine instructs: "move slide into machine and
confirm with ENTER". Move slide in and press ENTER
key.
c. Wedge error compensation (WEC) starts automatically
after the last action is completed. The wafer is adjusted
parallel to the mask.
4. Exposure
a. After WEC the wafer moves automatically in exposure
position.
b. Press EXPOSE key.
5. Unload wafer
6. Unload Mask
a. Hit the CHANGE MASK key and the mask holder will be
released. Pull the mask holder out, flip it by 180° and
store it on the tray to your left. Hit ENTER to switch the
mask vacuum off.
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Top Side Alignment
In this mode the wafer is aligned to the mask using the top side
alignment microscope (TSA).
1. Adjust Parameters
a. Make secure that no mask is loaded before select mask
loading manual.
b. Deactivate BSA MICROSCOPE key (LED off).
c. Press EDIT PARAMETER key to edit the parameter
exposure time, alignment gap and WEC type. Change all
necessary value and confirm by pressing EDIT
PARAMETER key again
2. Load Mask
a. Press CHANGE MASK key
b. Place the mask onto the mask holder. Toggle the mask
vacuum on by pressing ENTER key.
c. Flip the mask holder 180° back and move it into the
machine. Lock the mask holder slide by pressing
CHANGE MASK key again.
3. Load Wafer
a. The machine instructs: “pull slide and load substrate onto
chuck”. Pull out the transport slide completely. Insert the
proper chuck and place the wafer against the prealignment pins. Confirm with ENTER key. Now the wafer
is hold by vacuum.
b. The machine instructs: “move slide into machine and
confirm with ENTER”. Move slide in and press ENTER
key.
c. Wedge error compensation (WEC) starts automatically
after the last action is completed. The wafer is adjusted
parallel to the mask.
4. Microscope Alignment
a. Verify BSA MICROSCOPE key off.
b. Set SPITFIELD switch to the required position.
c. Adjust illumination with the aperture located at the
left/right microscope front.
d. Focus on the mask plane.
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e. Set STG/TSA/BSA button to dark to activate microscope
motors.
f. Adjust microscope to the mask alignment marks. Move
the left/right objective to the left/right mask alignment
mark by the X-Y-JOYSTICK (joystick on the right).
5. Wafer Alignment
a. Focus on the wafer plane.
b. Change STG/TSA/BSA button to illuminated.
c. Use joysticks to align the wafer alignment marks central
symmetrical to the mask alignment marks.
6. Exposure
a. Press Exposure key.
7. Unload wafer
8. Unload Mask
a. Hit the CHANGE MASK key and the mask holder will be
released. Pull the mask holder out, flip it by 180° and
store it on the tray to your left.
b. Hit ENTER to switch the mask vacuum off.
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Bottom Side Alignment
The wafer is aligned to the mask using the bottom side alignment
microscope (BSA).
1. Adjust Parameters
a. Make secure that no mask is loaded before select mask
loading manual.
b. Deactivate BSA MICROSCOPE key (LED off).
c. Press EDIT PARAMETER key to edit the parameter
exposure time, alignment gap and WEC type. Change all
necessary value and confirm by pressing EDIT
PARAMETER key again.
2. Load Mask
a. Press CHANGE MASK key
b. Place the mask onto the mask holder.
c. Toggle the mask vacuum on by pressing
ENTER key.
d. Flip the mask holder 180° back and move it into the
machine. Lock the mask holder slide by pressing
CHANGE MASK key again.
3. Load Wafer Chuck for BSA
a. Insert a proper chuck without wafer onto the transport
slide.
b. Move the BSA-chuck placed onto the transport slide into
the machine. Don't press a key.
4. Microscope Alignment
a. Turn the SPLITFIELD switch to middle position and toggle
BSA MICROSCOPE key on (LED on). This key enables
the microscope manipulators accordingly.
b. Turn the ILLUMINATION switch to BSA/IR and adjust the
light intensity by the potentiometers labeled BSA/IR
microscope illumination left/right.
c. Make secure the TOP/BOTTOM key LED is on and adjust
the fine focus separately with the TOP SUBSTRATE
LEFT/RIGHT regulators.
d. Select one of keys LEFT, BOTH, RIGHT to move the
left/right objective with the ARROW keys. If necessary
use fast speed (FAST key LED on).
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e. GRAB IMAGE key (option). First keystroke grabs the
mask image. The objectives move to the wafer focus
plane (TOP/BOTTOM key LED off). The motor control of
the microscope manipulator is disabled. Second
keystroke GRAB IMAGE key deletes stored image and
enables the manipulator again.
5. Load Wafer
a. After grab image the machine informs you: "ready for
load... BSA image stored". Press LOAD key to start this
procedure. Load wafer onto chuck and push slide into the
machine as prompted on the display.
b. Press ENTER key.
c. WEC starts automatically. After WEC the wafer will move
to the alignment gap.
6. Wafer Alignment
a. Adjust the left/right objective image with the BOTTOM
SUBSTRATE LEFT/RIGHT regulators. Correct
illumination if necessary.
b. Use joysticks for STG-X-Y-Θ-MOVEMENT. Align the
wafer alignment marks central symmetrical to the mask
alignment marks.
7. Exposure
a. Hit EXPOSURE key.
b. After finishing the wafer chuck moves down for unload the
exposed wafer.
8. Unload Mask
a. Hit the CHANGE MASK key and the mask holder will be
released. Pull the mask holder out, flip it by 180° and
store it on the tray to your left.
b. Hit ENTER to switch the mask vacuum off.
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