JVC pd35b50b schematic
SERVICE MANUAL
PDP COLOUR TELEVISION
PD-35B50BJ, PD-35B50BU PD-42B50BJ, PD-42B50BU
BASIC C
FP2
HASSIS
1 PRECAUTION
2 SPECIFIC SERVICE INSTRUCTIONS
3 DISASSEMBLY
4 ADJUSTMENT
5 TROUBLESHOOTING
......................................................................................................................................................... 1-4
..................................................................................................................................................... 1-16
...................................................................................................................................................... 1-33
........................................................................................................................................... 1-48
COPYRIGHT © 2004 Victor Company of Japan, Limited
TABLE OF CONTENTS
...................................................................................................................... 1-8
No.YA098
2004/6
SPECIFICATION
Contents
Items
Dimensions (W x H x D)
Mass 38.3kg 30.4kg
TV RF System CCIR B / G, I, D / K, L
Colour System RF PAL / SECAM
Stereo System A2 (B / G, D / K), NICAM (B / G, I, D / K, L)
Teletext System FLOF (Fastext), TOP, WST (World Standard System)
Receiving Frequency VHF 47MHz ~ 470MHz
Intermediate Frequency VIF 38.9MHz (B / G, I, D / K, L)
Colour Sub Carrier Frequency
Power Input AC110V ~ AC240V, 50Hz
Power Consumption Operate : 303W, Stand by: 3.0W Operate : 244W, Stand by : 3.0W
Plasma Display Panel (PDP) QLE0028-001 QLE0021-002
Screen Size Visible size : 107.5cm (Diagonel) / Visible size : 91.0cm (Diagonel) /
Display Pixels
Speaker 6.6cm round x4
Audio Power Output 10W + 10W (Oblique cone)
Aerial Input Teminal 75Ω unbalanced, coaxial
External EXT-1 (Input/Output) 21 pin Euro connector (SCART socket)
terminal
EXT-2 (Input/Output) 21 pin Euro connector (SCART socket)
EXT-3 (Input) 21 pin Euro connector (SCART socket)
EXT-4 (Input) COMPONENT VIDEO RCA pin jack x 3
1125i / 750p Y : 1V(p-p), Sync
525i / 525p / 625i / 625p
AUDIO 500mV (rms), High impedance, RCA pin jack x 2
EXT-5 (Input) S-VIDEO Mini-DIN 4 pin x 1
VIDEO 1V(p-p), Positive (Negative sync provided), 75Ω, RCA pin jack x 1
AUDIO 500mV (rms), Low impedance, RCA pin jack x 2
AUDIO OUTPUT (Fixed) 500mV (rms), Low impedance, RCA pin jack x 2
Subwoofur OUTPUT 500mV (rms), Low impedance, RCA pin jack x 1
CENTRE CH INPUT 500mV (rms), Low impedance, RCA pin jack x 1
PC (RGB) INPUT D-sub 15pin x 1
Headphone 3.5mm Stereo mini jack x 1
Remote Control Unit RM-C1811H (AA/R6 TYPE battery x 2)
Design & specifications are subject to change without notice.
1-2 (No.YA098)
104.5cm x 72.9cm x 11.0cm 90.7cm x 63.4cm x 11.7cm
EXT PAL / SECAM / NTSC3.58 / NTSC4.43
UHF 470MHz ~ 862MHz
CATV 116MHz ~ 172MHz, 220MHz ~ 469MHz
SIF
33.4MHz (5.5MHz: B / G) / 32.9MHz (6.0MHz: I) / 32.4MHz (6.5MHz: D / K) /
40.45MHz (6.5MHz :L)
PAL : 4.43MHz
SECAM : 4.40MHz / 4.25MHz
NTSC : 3.58MHz / 4.43MHz
42V wide aspect (16:9) 35V wide aspect (16:9)
93.3 cm x 53.3 cm (H x V) 78.6 cm x 44.2 cm (H x V)
H: 852 pixels / V: 480 pixels H: 853 pixels / V: 480 pixels
[W-VGA] [W-VGA]
• Video input, S-video (Y / C) input, Audio L / R inputs and RGB inputs
are available.
•
TV broadcast outputs (Video and Audio L / R) are available.
•
Video input, S-video (Y / C) input, Audio L / R inputs and RGB inputs
are available.
•
Video and Audio L / R outputs are available.
•
T-V LINK functions are available.
•
Video input and Audio L / R inputs are available.
Pb/Pr : ±0.35V(p-p), 75
Y : 1V(p-p), Positive (Negative sync prorided), 75
Cb/Cr :
Y : 1V(p-p), Positive (Negative sync provided), 75
C : 0.286V(p-p) (Burst signal), 75
R/G/B : 0.7V (p-p), 75
HD / VD : 1V (p-p) ~ 5V (p-p), High impedance
Available signal
VGA : 640 pixels x 480 pixels (Horizontal : 31.5kHz / Vertical : 60Hz)
PD-42B50BJ PD-35B50BJ
PD-42B50BU PD-35B50BU
0.7
V(p-p), 75
±0.35V(p-p) terminal x3
Ω
Ω
Ω
, 75
Ω
Ω
Ω
Ω
21-pin Euro connector (SCART) : EXT-1/EXT-2/EXT-3
PinNo. Signal designation Matching value EXT-1 EXT-2 EXT-3
AUDIO R output
1
500mV(rms) (Nominal),
Used (TV OUT)
Used (LINE OUT)
Not used
Low impedance
2
AUDIO R input
500mV(rms) (Nominal),
Used
Used
Used
High impedance
3
AUDIO L output
500mV(rms) (Nominal),
Used (TV OUT)
Used (LINE OUT)
Not used
Low impedance
4
5
6
AUDIO GND
GND (B)
AUDIO L input
500mV(rms) (Nominal),
Used
Used
Used
Used
Used
Used
Used
Used
Used
High impedance
7
8
9
10
B input
FUNCTION SW
(SLOW SW)
GND (G)
SCL / T-V LINK
700mV(
B-W
), 75Ω
Low : 0V-3V, High : 8V-12V,
High impedance
Used
Used
Used
Not used
Used
Used
Used
Used
Not used
Used
Used
Not used
(SCL2/TV-LINK)
11
12
13
14
15
G input
SDA
GND (R)
GND (YS)
R / C input
700mV(
B-W
R : 700mV(
), 75Ω
B-W
), 75Ω
Used
Not used
Used
Used
Used (C1/R)
Used
Used(SDA2)
Used
Not used
Used (C2/R)
Not used
Not used
Used
Not used
Not used
C : 300mV(p-p), 75Ω
16
17
18
19
Ys input
(FAST SW)
GND (VIDEO output)
GND (VIDEO input)
VIDEO output
Low : 0V-0.4V
High : 1V-3V, 75Ω
1V(p-p) (Negative going sync),
Used
Used
Used
Used (TV OUT)
Used
Used
Used
Used (LINE OUT)
Not used
Used
Used
Not used
75Ω
20
VIDEO / Y input
1V(p-p) (Negative going sync),
Used
Used
Used
75Ω
21
COMMON GND
Used
Used
Used
(P-P= Peak to Peak, B-W= Blanking to white peak)
[Pin assignment]
20 18 16 14 12 10 8 6 4 2
21 19 17 15 13 11 9 7 5 3 1
(No.YA098) 1-3
D
SECTION 1
PRECAUTION
1.1 SAFETY PRECAUTIONS [EXCEPT FOR UK]
(1) The design of this product contains special hardware,
many circuits and components specially for safety
purposes. For continued protection, no changes should
be made to the original design unless authorized in writing
by the manufacturer. Replacement parts must be identical
to those used in the original circuits. Service should be
performed by qualified personnel only.
(2) Alterations of the design or circuitry of the products should
not be made. Any design alterations or additions will void
the manufacturer's warranty and will further relieve the
manufacturer of responsibility for personal injury or
property damage resulting therefrom.
(3) Many electrical and mechanical parts in the products have
special safety-related characteristics. These
characteristics are often not evident from visual inspection
nor can the protection afforded by them necessarily be
obtained by using replacement components rated for
higher voltage, wattage, etc. Replacement parts which
have these special safety characteristics are identified in
the parts list of Service manual. Electrical components
having such features are identified by shading on the
schematics and by () on the parts list in Service
manual. The use of a substitute replacement which does
not have the same safety characteristics as the
recommended replacement part shown in the parts list
of Service manual may cause shock, fire, or other hazards.
(4) Don't short between the LIVE side ground and ISOLATED
(NEUTRAL) side ground or EARTH side ground when
repairing.
Some model's power circuit is partly different in the GND.
The difference of the GND is shown by the LIVE : (
GND, the ISOLATED (NEUTRAL) : (
EARTH : (
) side GND. Don't short between the LIVE
) side GND and
side GND and ISOLATED (NEUTRAL) side GND or EARTH
side GND and never measure the LIVE side GND and
ISOLATED (NEUTRAL) side GND or EARTH side GND at
the same time with a measuring apparatus (oscilloscope
etc.).If above note will not be kept, a fuse or any parts will
be broken.
(5) If any repair has been made to the chassis, it is
recommended that the PDP POWER SUPPLY setting
should be checked or adjusted.
(6) The high voltage applied to the PDP must conform with
that specified in Service manual. Excessive high voltage
can cause an increase in arcing and possible component
damage, therefore operation under excessive high voltage
conditions should be kept to a minimum, or should be
prevented. If severe arcing occurs, remove the AC power
immediately and determine the cause by visual inspection
(incorrect installation, cracked or melted high voltage
harness, poor soldering, etc.). To maintain the proper
components in the circuitry including the PDP must be
the exact replacements or alternatives approved by the
manufacturer of the complete product.
(7) Do not check high voltage by drawing an arc. Use a high
voltage meter or a high voltage probe with a VTVM.
Discharge the picture tube before attempting meter
connection, by connecting a clip lead to the ground frame
and connecting the other end of the lead through a 10kΩ
2W resistor to the anode button.
) side
(8) When service is required, observe the original lead dress.
Extra precaution should be given to assure correct lead
dress in the high voltage circuit area. Where a short circuit
has occurred, those components that indicate evidence
of overheating should be replaced. Always use the
manufacturer's replacement components.
(9) Isolation Check
(Safety for Electrical Shock Hazard)
After re-assembling the product, always perform an
isolation check on the exposed metal parts of the cabinet
(antenna terminals, video/audio input and output
terminals, Control knobs, metal cabinet, screw heads,
earphone jack, control shafts, etc.) to be sure the product
is safe to operate without danger of electrical shock.
a) Dielectric Strength Test
The isolation between the AC primary circuit and all metal
parts exposed to the user, particularly any exposed metal
part having a return path to the chassis should withstand
a voltage of 3000V AC (r.m.s.) for a period of one second.
(. . . . Withstand a voltage of 1100V AC (r.m.s.) to an
appliance rated up to 120V, and 3000V AC (r.m.s.) to an
appliance rated 200V or more, for a period of one second.)
This method of test requires a test equipment not generally
found in the service trade.
b) Leakage Current Check
Plug the AC line cord directly into the AC outlet (do not use
a line isolation transformer during this check.). Using a
"Leakage Current Tester", measure the leakage current
from each exposed metal part of the cabinet, particularly
any exposed metal part having a return path to the chassis,
to a known good earth ground (water pipe, etc.). Any
leakage current must not exceed 0.5mA AC (r.m.s.).
However, in tropical area, this must not exceed 0.2mA AC
(r.m.s.).
Alternative Check Method
Plug the AC line cord directly into the AC outlet (do not
use a line isolation transformer during this check.).
Use an AC voltmeter having 1000 ohms per volt or
more sensitivity in the following manner. Connect a
1500Ω 10W resistor paralleled by a 0.15µF AC-type
capacitor between an exposed metal part and a known
good earth ground (water pipe, etc.). Measure the AC
voltage across the resistor with the AC voltmeter. Move
the resistor connection to each exposed metal part,
particularly any exposed metal part having a return path
to the chassis, and measure the AC voltage across
the resistor. Now, reverse the plug in the AC outlet and
repeat each measurement. Any voltage measured
must not exceed 0.75V AC (r.m.s.). This corresponds
to 0.5mA AC (r.m.s.).
However, in tropical area, this must not exceed 0.3V AC
(r.m.s.). This corresponds to 0.2mA AC (r.m.s.).
AC VOLTMETER
(HAVING 1000Ω/V,
OR MORE SENSITIVITY)
0.15µF AC-TYPE
PLACE THIS PROBE
1500Ω 10W
GOOD EARTH GROUND
ON EACH EXPOSE
ME TA L PA RT
1-4 (No.YA098)
1. 2 SAFETY PRECAUTIONS [FOR UK]
(1) The design of this product contains special hardware and many circuits and components specially designed for safety
purposes. For continued protection, no changes should be made to the original design unless authorized in writing by the
manufacturer. Replacement parts must be identical to those used in the original circuits. Service should be performed by
qualified personnel only.
(2) Alterations of the design or circuitry of the product should not be made. Any design alterations or additions will void the
manufacturer's warranty and may result in personal injury or property damage resulting therefrom.
(3) Many electrical and mechanical parts in the product have special safety-related characteristics. These characteristics are
often not evident from visual inspection nor can the protection afforded by them necessary be obtained by using replacement
components rated for higher voltage, wattage, etc. Replacement parts which have these special safety characteristics are
identified in the Parts List of Service Manual. Electrical components having such features are identified by shading on the
schematics and by ( ) on the Parts List in the Service Manual. The use of a substitute replacement which does not have the
same safety characteristics as the recommended replacement part shown in the Parts List of Service Manual may cause
shock, fire, or other hazards.
(4) The leads in the products are routed and dressed with ties, clamps, tubings, barriers and the like to be separated from live
parts, high temperature parts, moving parts and / or sharp edges for the prevention of electric shock and fire hazard. When
service is required, the original lead routing and dress should be observed, and it should be confirmed that they have been
returned to normal, after re-assembling.
WARNING
(1) The equipment has been designed and manufactured to meet international safety standards.
(2) It is the legal responsibility of the repairer to ensure that these safety standards are maintained.
(3) Repairs must be made in accordance with the relevant safety standards.
(4) It is essential that safety critical components are replaced by approved parts.
(5) If mains voltage selector is provided, check setting for local voltage.
(No.YA098) 1-5
1.3 INSTALLATION
1.3.1 HEAT DISSIPATION
If the heat dissipation vent behind this unit is blocked, cooling
efficiency may deteriorate and temperature inside the unit will
rise. The temperature sensor that protects the unit will be
activated when internal temperature exceeds the predetermined level and power will be turned off automatically.
Therefore, please make sure pay attention not to block the heat
dissipation vent as well as the ventilation outlet behind the unit
and ensure that there is room for ventilation around it.
SPACE REQUIRED FOR INSTALLATION
1.3.2 INSTALLATION REQUIREMENTS
Ensure that the minimal distance is maintained, as specified
below, between the unit with and the surrounding walls, as well
as the floor etc.
Install the unit on stable flooring or stands.
Take precautionary measures to prevent the unit from tipping in
order to protect against accidents and earthquakes.
150 mm or
150 mm
more
200 mm or
200 mm
more
50 mm
50 mm or more
1.3.3 FALL TIP PREVENTION MEASURES
Take precautionary measures to prevent the unit from falling or
tipping to protect against emergencies such as earthquakes as
well as accidents.
Fasten the supplied hook for tip fall prevention using the screws,
also supplied, behind the display unit, and use them together
with durable cords (to be purchased separately) to secure the
unit to a robust part such as the wall surface or pillars.
150 mm
or more
150 mm
200 mm
200 mm
or more
50 mm
50 mm or more
1-6 (No.YA098)
The supplied hook for tipfall prevention
1. 4 PRECAUTIONS REGARDING PDP
1.4.1 PRECAUTIONS DURING NOTES FOR TRANSPORTATION
When transporting the unit, pressure exerted on the internal
PDP (Plasma Display Panel) due to improper handling (such
as tossing and dropping) may cause damages even when the
unit is carefully packed. To prevent accidents from occurring
during transportation, pay careful attention prior to delivery such
as through explaining the handling instructions to transporters.
Ensure that the following requirements are met during
transportation, as the PDP of this unit is made of glass and
therefore fragile:
(1) Avoid vibrations and impacts
The unit may be broken if it is toppled sideways even
when properly packed. Ensure that the unit is carried by at
least 2 persons and pay careful attention not to exert any
vibration or impact on it.
(2) Do not place equipment horizontally
Ensure that it is placed upright and not horizontally during
transportation and storage as the PDP is very vulnerable
to lateral impacts and may break easily under such
circumstances.
During transportation, ensure that the unit is loaded along
the traveling direction of travel of the vehicle, and avoid
stacking them on one another.
For storage, ensure that they are stacked in 2 layers or
less even when placed upright.
1.4.2 RESIDUAL IMAGE / BURN-IN ON SCREEN
Like CRTs, “burn-in” may occur when a same image is
continuously displayed over an extended period of time.
As this may also shorten the life span of the PDP. Therefore, turn
off the display when not in use, scroll the screen, make use
of screen-savers, or allow even distribution on the display by
inverting the brightness, switching to complementary colors or
inserting animated images at periodic intervals.
As burn-in is more likely to occur with high brightness and contrast
settings, try to use neutral gradations or medium tone colors.
Burn-in does not occur in the case of animated images.
When switching to another image after continuous display of
the previous image, residual images may become prominent,
as luminance in a part of the display is higher than the other
parts.
This is not a defect but is because due to the discharge surface
of the lighted portion has become being relatively activated and
its luminance higher than the unlighted parts.
1.4.4 OPTICAL FILER (PANEL FILTER)
Avoid placing the unit under direct sunlight over a prolonged
period of time. This may cause the optical filter to deteriorate in
quality and color.
Clean the filter surface by wiping it softly lightly with outing flannels
a soft and lightly fuzz cloth (such as flannel).
Do not use solvents such as benzine or thinner to wipe the filter
surface. This may cause the filter to deteriorate in quality or the
coating on the surface to come off.
As the filter surface is fragile., do not scratch or hit it with hard
materials.
1.4.5 NOTES PRECAUTIONS FOR REPLACEMENT OF
EXTERIOR PARTS
Take note of the following when replacing exterior parts (back
REAR COVER, FRONT PANEL, optical filter)
• Do not exert pressure on the front of the PDP (glass surface).
• Pay careful attention not to scratch or stain the front of the PDP
(surface) with hands.
• When replacing exterior parts, the front of the PDP should be
placed facing downward. Place a mat, etc. underneath to avoid
causing scratches to the front surface. However, never use
materials that are too soft (such as blanket cloth). If
replacement is made with the PDP surface facing downward
and in contact with the blanket, pressure may be exerted on
the PDP, thus causing damages to it.
1.4.3 INFRARED RAYS
Near Near-infrared rays (800nm to 1000nm) are emitted from
the front of the panel, and this may give rise to malfunctions in
infrared remote controls or communication systems placed near
it. In this case, avoid direct infrared rays (and reflected rays in
some cases) from the screen by either changing the direction of
the unit or other infrared systems or securing a longer keeping
a distance from the screen.
(No.YA098) 1-7
SECTION 2
SPECIFIC SERVICE INSTRUCTIONS
2.1 FEATURES
2.1.1 HIGH-DEFINITION IMAGE TECHNOLOGY (DIST)
• DIST (Digital Image Scaling Technology)
Employs an interpolation method that doubles the scanning
lines to realize 480-line flickerfree picture making it especially
suitable for reproducing high-resolution pictures even on largescreen displays.
2.1.2 MAIN FUNCTION
•
DIGITAL VNR
The DIGITAL VNR function cuts down the amount of noise in
original picture. There are three function settings of AUTO,MIN
and MAX.
• Super DigiPure
This function uses the latest technology to give viewer a natural
looking picture.
It consist of DigiPure and picture motion compensation function.
•
MOVIE THEATRE
This function displays a cinema film picture more smoothly
and naturally on the screen.
•
COLOUR MANAGEMENT
This function ensures dull colours are compensated to produce
natural hues.
• Sleep Timer
Setting for situations such as falling asleep while watching TV,
and for prevention against forgetting to turn off the TV. The
power supply of the TV will be cut off automatically when the
time exceeds the set up timing (maximum 2 hours).
• 3D SOUND function
This function makes the speaker sounds like in a wider
ambience.
• Teletext function
The teletext broadcast can be viewed and the teletext pages
can be stored in memory.
• T-V LINK function
This function make a VCR could automatically download the
data or image from the TV, and turn on the TV to view the image
when it playing.
2.1.3 ASPECT CONTROL
The screen size can be changed according to the picture aspect
ratio.
• ZOOM function
Desired screen size (AUTO/REGULAR / PANORAMIC / 14:9
ZOOM / 16:9 ZOOM / 16:9 ZOOM SUBTITLE / FULL) can be
selected.
2.1.4 MULTI-SCREEN FUNCTION
• Twin-pictures function
With the function, two pictures can be displayed at the Twin
pictures mode.
• Multi-picture function
With this function, one of multi-picture (12 pictures) can be
displayed at the same time.
• Freeze function
The images that are currently seen can be viewed on the memo
screen (still picture).
It is convenient for taking down notes like application address
and recipe of cooking program etc, while enjoying the current
program.
2. 2 MAIN DIFFERENCE LIST
Item
TABLE TOP STAND
WALL BRACKET NO YES
1-8 (No.YA098)
PD-42B50BJ PD-42B50BU
PD-35B50BJ PD-35B50BU
YES NO
2. 3 TECHNICAL INFORMATION
2.3.1 PDP STRUCTURE AND CHARACTERISTIC
This unit uses the flat type panel PDP (Plasma Display Panel), instead of the conventional CRT (Cathode Ray Tube),
as a display unit.
2.3.1.1 PIXEL (CELL) ARRAY
PDP is constructed by sealing the xenon, which emits neon and ultraviolet rays for discharging purpose, in between the electrodes
lay on the front glass substrate and rear glass substrate.
One pixel is composed of 3 RGB cells, with cell pitch of 0.365mm (1 pixel 1.095mm) [42V MODEL] / 0.307 mm (1 plxel 0.921 mm)
[35V MODEL] horizontally and 1.110mm [42V MODEL] / 0.921 mm [35V MODEL] vertically.
The cell is arrayed in each RGB color as shown in Fig. 1. One pixel is formed by interlacing each RGB color cell.
One cell size is 0.365mm [42V MODEL] / 0.307 mm [35V MODEL] horizontally and 1.110mm [42V MODEL] / 0.921 mm [35V MODEL]
vertically.
Direction
Vertically
No.1
Pixel line
No.2
Pixel line
No.479
Pixel line
No.480
Pixel line
42V MODEL
35V MODEL
Horizontally
No.1
Pixel
sequence
No.2
Pixel
sequence
B G R B G R
(R) (B) (R)(G) (G) (B) (R) (B) (R) (B)
BG
(R) (B) (R)(G) (G)
B
(R) (B) (R) (B) (R) (B) (R) (B)
B
(R) (B) (R) (B) (R) (B) (R) (B)
(Horizontally) Pixel pitch
RBGR
(B) (R) (B) (R) (B)
G RBG R
(G) (G)
GRBGR
(G) (G)
1 pixel
(1 dot)
1.095mm
0.921 mm 0.307 mm
B(R) Cell
G(G)
Cell
R(B) Cell
35V MODEL
42V MODEL
No.851 No.852
No.852
Pixel
sequence
B GRBG R
(G) (G)
BGRBGR
(G) (G)
G RBG R
B
(G) (G)
GRBGR
B
(G) (G)
0.365mm
(Horizontally) Cell pitch
No.853
Pixel
sequence
42V MODEL
35V MODEL
1.110 mm 42V MODEL
0.921 mm 35V MODEL
(Vertically)
Pixel pitch
(Cell pitch)
42V MODEL
35V MODEL
Fig.1
2.3.1.2 PIXEL DEFECTS
Though PDP is made by means of ultra precise technology, there are cases whereby not all pixels (cell) will function properly. In
some cases, there may be defective pixels that do not light at all or the ones that always light on.
There are 3 types of Pixel defects, [Bright Dot Defects], [Dark Dot Defects] and [Flicker Dot Defects], as defined respectively in the
following:
(1) Bright Dot Defects
Bright dot defect is a pixel cell that lights though it should not light.
The presence of bright dot defects can be confirmed by inputting a full black signal (pattern).
(2) Dark Dot Defects
Dark dot defect is a pixel cell that does not light, though it should light.
The presence of dark dot defects can be confirmed by inputting a 100% full white signal (pattern).
(3) Flicker Dot Defects
Flicker dot defect is a pixel cell that blinks though it should light or not light.
The presence of flicher dot defects can be confirmed by inputting a full black signal (pattern).
(No.YA098) 1-9
2.3.2 MAIN CPU [IC7501] PIN FUNCTION
Pin No. Terminal name Port name I/O Remark
1 TCK TCK I Test purpose
2 TMS TMS I Test purpose
3 TDI TDI I Test purpose
4 TDO TDO O Test purpose
5 NC P2.8 O Not used
6 OSDB0 P2.9 O Bule for OSD
7 OSDB1 P2.10 O Bule for OSD
8 OSDB2 P2.11 O Bule for OSD
9 OSDB3 P2.12 O Bule for OSD
10 OSDB4 P2.13 O Bule for OSD
11 TV-LINK P2.14 I TV-LINK communication
12 RX_BUSY(Sirial) P2.15 O Communication for chassis CPU (Request)
13 VSS33 VSS33 - GND
14 VDD33 VDD33 I 3.3V
15 TV_LINK_OUT P4.5/CS3 O TV-LINK communication
16 A20 P4.4/A20 O Memory (Program ROM) address
17 A19 P4.3/A19 O Memory (Program ROM) address
18 A18 P4.2/A18 O Memory (Program ROM) address
19 A17 P4.1/A17 O Memory (Program ROM) address
20 VSS25 VSS25 - GND
21 VDD25 VDD25 I 2.5V
22 A16 P4.0/A16 O Memory (Program ROM) address
23 A8 A8 O Memory (Program ROM) address
24 A7 A7 O Memory (Program ROM) address
25 A9 A9 O Memory (Program ROM) address
26 A6 A6 O Memory (Program ROM) address
27 A5 A5 O Memory (Program ROM) address
28 A10 A10 O Memory (Program ROM) address
29 A11 A11 O Memory (Program ROM) address
30 A12 A12 O Memory (Program ROM) address
31 VSS33 VSS33 - GND
32 VDD33 VDD33 I 3.3V
33 A4 A4 O Memory (Program ROM) address
34 A3 A3 O Memory (Program ROM) address
35 A2 A2 O Memory (Program ROM) address
36 A1 A1 O Memory (Program ROM) address
37 A0 A0 O Memory (Program ROM) address
38 A13 A13 O Memory (Program ROM) address
39 A14/RAS A14/RAS O Memory (Program ROM) address
40 A15/CAS A15/CAS O Memory (Program ROM) address
41 VSS33 VSS33 - GND
42 VDD33 VDD33 I 3.3V
43 MEMCLK MEMCLK O Clock for memory
44 CSSDRAM CSSDRAM O Chip select for memory
45 CLKEN CLKEN O Clock enable for memory
46 CSROM CSROM O Chip select for memory
47 RD RD O Read for memory
48 UDQM UDQM O Control IN / OUT buffer of memory
49 LDQM LDQM O Control IN / OUT buffer of memory
50 WR WR O Write for memory
51 D15 D15 I/O Data (Program ROM)
52 VSS33 VSS33 - GND
53 VDD33 VDD33 I 3.3V
54 D7 D7 I/O Data (Program ROM)
55 D0 D0 I/O Data (Program ROM)
56 D14 D14 I/O Data (Program ROM)
57 D8 D8 I/O Data (Program ROM)
58 D6 D6 I/O Data (Program ROM)
59 D1 D1 I/O Data (Program ROM)
60 VSS33 VSS33 - GND
61 VDD33 VDD33 I 3.3V
62 D13 D13 I/O Data (Program ROM)
63 D9 D9 I/O Data (Program ROM)
64 D5 D5 I/O Data (Program ROM)
65 D2 D2 I/O Data (Program ROM)
1-10 (No.YA098)
Pin No. Terminal name Port name I/O Remark
66 D12 D12 I/O Data (Program ROM)
67 D10 D10 I/O Data (Program ROM)
68 VSS33 VSS33 - GND
69 VDD33 VDD33 I 3.3V
70 D 4 D4 I/O Data (Program ROM)
71 D 3 D3 I/O Data (Program ROM)
72 D11 D11 I/O Data (Program ROM)
73 RSTIN RSTIN I Reset
74 POWER P3.0 O Sleep state release for chassis CPU [Relese : L]
75 ID_TV_POWER(IDTV) P3.1 O Not used
76 REMOCON P3.2 I Remote control
77 PIX CLOCK P3.3 I Clock for OSD
78 OSDR0 P3.4 O Red for OSD
79 OSDR1 P3.5 O Red for OSD
80 OSDR2 P3.6 O Red for OSD
81 OSDR3 P3.7 O Red for OSD
82 MRST(Sirial) P3.8 I/O Communication for chassis CPU (Serial data)
83 MTSR(Sirial) P3.9 I/O Communication for chassis CPU (Serial data)
84 VSS33 VSS33 - GND
85 VDD33 VDD33 I 3.3V
86 VSS25 VSS25 - GND
87 VDD25 VDD25 I 2.5V
88 MICON TX TXD0 I/O Communication for adjustment (Serial data)
89 MICON RX RXD0 I/O Communication for adjustment (Serial data)
90 OSDR4 P3.12 O Red for OSD
91 CLK(Sirial) P3.13 O Communication for chassis CPU (Clock)
92 OSDG0 P3.15 O Green for OSD
93 OSDG1 P5.14 O Green for OSD
94 OSDG2 P5.15 O Green for OSD
95 OSDG3 TRIG_IN O Green for OSD
96 OSDG4 TRIG_OUT O Green for OSD
97 OSDG5 P6.2 O Green for OSD
98 SCL3A P6.3 I/O I2C bus clock (for main memory)
99 SDA3A P6.4 I/O I2C bus Data (for main memory)
100 TEXT / OTHER P6.5 O Teletext signal select [Analog RGB : H Digital RGB : L]
101 IRQ(IDTV) P6.6 O Not used
102 V_PULSE VSYNC I Vertical sync
103 H_PULSE HSYNC I Horizontal sync
104 (COR/RSTOUT) COR/RSTOUT O Not used
105 Ys BLANK/CORBLA O Ys for OSD / Teletext
106 VDD33 VDD33 I 3.3V
107 VSS33 VSS33 - GND
108 XTAL1 XTAL1 I 6MHz for system clock
109 XTAL2 XTAL2 O 6MHz for system clock
110 VSSA VSSA - GN D
111 VDDA VDDA I 2.5V
112 R R O R for OSD / Teletext
113 G G O G for OSD / Teletext
114 B B O B for OSD / Teletext
115 VSSA VSSA - GN D
116 VDDA VDDA I 2.5V
117 CVBS CVBS2 I Video for Teletext
118 VSSA VSSA - GN D
119 VDDA VDDA I 2.5V
120 GND CVBS1B I GND
121 CVBS CVBS1A I Video for Teletext
122 VSSA VSSA - GND
12 3 VDDA VDDA I 2.5V
124 F_KEY_1 P5.0 I Key scan data 1 [ON : H]
125 F_KEY_2 P5.1 I Key scan data 2 [ON : H]
126 POWER_KEY P5.2 I Main power ON / OFF control [ON : L]
127 NC P5.3 I Not used
12 8 (TMODE) TMODE I Test purpose
(No.YA098) 1-11
2.3.3 CHASSIS CPU [IC7001] PIN FUNCTION
Pin No. Terminal name Port name I/O Remark
1 NC P60 O Not used
2 P_MU P61 O Viveo mute [Mute : H]
3 FUNC_LED P62 O Not used
4 A_MU P63 O Audio out mute [Mute : H]
5 M_MU P50 O Monitor out mute [Mute : H]
6 PC_SW P51 O PC input switch [ON : H]
7 DIMMER_LED P52 O Power LED brightness control [Low brightness : L]
8 NC P53 O Not used
9 NC P54 O Not used
10 NC P55 O Not used
11 POW_LED P56 O Power LED control [ON : H]
12 NC P57 O Not used
13 SBT2 SBT2 I Communication for main CPU (Clock)
14 SBI2 SBI2 I/O Communication for main CPU (Serial data)
15 SBO2 SBO2 I/O Communication for main CPU (Serial data)
16 REQ P23 O Communication for main CPU (Request)
17 3.3V VDD I 3.3V
18 NC PB0 O Not used
19 GND VSS - GND
20 3.3V XI I 3.3V
21 NC XO O Not used
22 3.3V VDD I 3.3V
23 OSCI OSCI I 16MHz for system clock
24 OSCO OSCO O 16MHz for system clock
25 3.3V (MODE) I 3.3v
26 NC P24 O Not used
27 A92_RST P25 O 3D YC separator reset [Reset : L]
28 NC P26 O Not used
29 LIP_RST P27 O Lip sync reset [Reset : H]
30 NC KI0 O Not used
31 NC KI1 I Not used
32 NC KI2 O Not used
33 MDR_CON P33 I Not used
34 3.3V AVDD I 3.3V
35 NC P34 O Not used
36 DsyncSW2 P35 O Not used
37 NC P36 O Not used
38 NC P37 O Not used
39 HOTPLUG P40 I Not used
40 MECA_SW P41 I Power switch input [ON : L]
41 MAIN_POW P42 O Main power control [ON : L]
42 MSP_RESET P43 O Multi sound processor reset [Reset : H]
43 0V Vref- I GND
44 NC AN4 I Not used
45 AFT1 AN5 I Tuner AFT detection [Detection : H]
46 NC AN6 I Not used
47 NC AN7 I Not used
48 NC P80 O Not used
49 NC P81 O Not used
50 N C TM0IO I Not used
51 N C SBI3 O Not used
52 N C SBO3 I Not used
53 NC P85 O Not used
54 3.3V Vref+ I 3.3V
55 PDP_TX SBI4 O PDP communication for sub CPU
56 PDP_RX SBO4 I PDP communication for sub CPU
57 SDA0 P90 I/O I2C bus data (for chassis memory)
58 SCL0 P91 I/O I2C bus clock (for chassis memory)
59 SDA_DVI P92 I/O Not used
60 SCL_DVI P92 I/O Not used
61 GND AVSS - GND
62 NC AN0 I Not used
63 AGC AN1 I AGC voltage level detection [Detection : H]
64 YS1 AN2 I YS1 detection [Detection : H]
65 YS2 AN3 I YS2 detection [Detection : H]
1-12 (No.YA098)
Pin No. Terminal name Port name I/O Remark
66 3.3V VDD I 3.3V
67 NC P70 O Not used
68 NC P71 O Not used
69 NC P72 O Not used
70 NC P73 O Not used
71 NC SBI1 O Not used
72 NC SBO1 O Not used
73 SBD5 * I/O For flash writing
74 SBT5 * I For flash writing
75 3.3V NMI I 3.3V
76 NC IRQ0 I Not used
77 REMOCON IRQ1 I Remote control
78 V_SYNC IRQ2 I Vertical sync
79 WAKEUP_SHM IRQ3 I Sleep state release for chassis CPU [Relese : L]
80 POWERGOOD IRQ4 I Power error detection [Detection : H]
81 REC_LED PA5 O Stand-by power LED control [Stand-by :H]
82 RST RST I Chassis CPU reset [Reset : L]
83 3.3V VDD I 3.3V
84 SCL3A P00 I/O I
85 SDA3A P01 I/O I
86 SCL3B P02 I/O I
2
C bus clock (for 3D separator, colour management / OSD
composition / RGB A-D convert, U / V frontend, sound delay)
2
C bus data (for 3D separator, colour management / OSD
composition / RGB A-D convert, U / V frontend, sound delay)
2
C bus clock (for multi sound process, video / audio select,
colour demod. / sync sep. / RGB SW, 3 line comb filter,
component video / audio select, sync sep. / SW / detect)
2
87 SDA3B P03 I/O I
C bus data (for multi sound process, video / audio select,
colour demod. / sync sep. / RGB SW, component video / audio
select, sync sep. / SW / detect)
88 NC P04 O Not used
89 NC P05 O Not used
90 NC P06 O Not used
91 DVI_RST P07 O Not used
92 GND VSS - GND
93 SCL5055 P10 I/O I2C bus clock (for DIST)
94 NC P11 O Not used
95 SDA5055 P12 I/O I2C bus data (for DIST)
96 NC P13 O Not used
97 NC P14 O Not used
98 15K/OTH P15 O Y signal select for 3D YC separator [525i : H other : L]
99 DsyncSW1 P16 O Not used
100 JCC5057_BUSY P17 I Busy for Colour management / OSD composition [Busy : H]
(No.YA098) 1-13
2.3.4 SUB CPU [IC807] PIN FUNCTION [PD-42B50BJ, PD-42B50BU]
Pin No. Terminal name Port name I/O Remark
1 SYSTEM0 PB6/AN6 I PDP size select [1.75V : 42V VGA 3.25V : 35V VGA]
2 SYSTEM3 PB7/AN7 I PDP maker select [0V : SAMSUNG 3.25V : NEC]
3 AVCC AVCC I 5.0V
4 X2 X2 - Not used
5X1 X1 -GND
6 VCL VCL - GND
7 RES RES I Reset [Reset : L]
8 TEST TEST I GND
9 VSS VSS - G ND
10 OSC2 OSC2 O 16MHz for system clock
11 OSC1 OSC1 I 16MHz for system clock
12 VCC VCC I 5.0V
13 PW_LOB P50/WKP0 O Power control [ON : L]
14 PANEL_PW_ON P51/WKP1 O Panel power control [ON : L]
15 TALK_RST P34 O Not used
16 CODEC_RST P35 O Not used
17 I2C_STOP P36 O I2C bus stop control [Stop : L]
18 NC P37 O Not used
19 NC P52/WKP2 O Not used
20 NC P53/WKP3 O Not used
21 NC P54/WKP4 O Not used
22 NC P55/WKP5/ADTRG O Not used
23 SDA1 P10/TMOW I/O I2C bus data (for sub memory)
24 FAN P11/PWM O Not used
25 SCL1 P12 O I2C bus clock (for sub memory)
26 SDA0 P56/SDA I/O
27 SCL0 P57/SCL O
28 SDA2 P74/TMRIV I/O I2C bus data (for PDP communication)
29 SCL2 P75/TMCIV O I2C bus clock (for PDP communication)
30 N C P76/TMOV O Not used
31 SDA3 P24 I/O Not used
32 SCL3 P63/FTIOD0 O Not used
33 NC P62/FTIOC0 O Not used
34 NC P61/FTIOB0 O Not used
35 NMI NMI I Port for writing on board control [Writing : L]
36 A_MU P60/FTIOA0 O Audio mute [Mute : H]
37 (HD) P64/FTIOA1 I Not used
38 ON_TIMMER P65/FTIOB1 O Not used
39 REMO P66/FTIOC1 I Not used
40 POWERLED P67/FTIOD1 O Not used
41 P85 P85 I Emulator connection / Port for writing on board [Writing : H]
42 P86 P86 I Emulator connection
43 P87 P87 I Emulator connection
44 SCK3 P20/SCK3 O Port for writing on board
45 RXD P21/RXD I Port for writing on board
46 TXD P22/TXD O Port for writing on board
47 AC_DET P23 I AC power frequency detection [Detection : H]
48 NC P70/SCK3_2 O Not used
49 RXD2 P71/RXD_2 I Communication for main CPU (Serial data)
50 TXD2 P72/TXD_2 O Communication for main CPU (Serial data)
51 NC P14/IRQ0 O Not used
52 MECA_SW P15/IRQ1/TMIB1 I Not used
53 VD P16/IRQ2 I Vertical sync
54 REC_DET P17/IRQ3/TRGV I Not used
55 I2C_READY P33 I
56 FAN_LOCK P32 I Not used
57 SYSTEM2 P31 I Not used
58 SYSTEM 1 P30 I Not used
59 THEM_DET PB3/AN3 I Temp. sensor detection [Detection : H]
60 (AMP_PRO2) PB2/AN2 - GND
61 AMP_PRO1 PB1/AN1 I Temp. protector detection for Audio out [Detection : L]
62 EE_CDS PB0/AN0 I Not used
63 KEY_IN1 PB4/AN4 I Not used
64 KEY_IN2 PB5/AN5 I Not used
I2C bus data (for BBE / SURROUND / AUDIO CONTROL, TEMP. SENSOR)
I2C bus clock (for BBE / SURROUND / AUDIO CONTROL, TEMP. SENSOR)
PDP I2C communication select (Prohibition : L Permission : H)
1-14 (No.YA098)
2.3.5 SUB CPU [IC807] PIN FUNCTION [PD-35B50BJ, PD-35B50BU]
Pin No. Terminal name Port name I/O Remark
1 SYSTEM0 PB6/AN6 I PDP size select [1.75V : 42V VGA 3.25V : 35V VGA]
2 SYSTEM3 PB7/AN7 I PDP maker select [0V : SAMSUNG 3.25V : NEC]
3 AVCC AVCC I 5.0V
4 X2 X2 - Not used
5 X1 X1 - GND
6 VCL VCL - GND
7 RES RES I Reset [Reset : L]
8 TEST TEST I GND
9 VSS VSS - GND
10 OSC2 OSC2 O 16MHz for system clock
11 OSC1 OSC1 I 16MHz for system clock
12 VCC VCC I 5.0V
13 PW_LOB P50/WKP0 O Power control [ON : L]
14 PANEL_PW_ON P51/WKP1 O Panel power control [ON : L]
15 TALK_RST P34 O Not used
16 CODEC_RST P35 O Not used
17 I2C_STOP P36 O I2C bus stop control [Stop : L]
18 NC P37 O Not used
19 PSCK P52/WKP2 O Not used
20 PLE P53/WKP3 O PDP communication for DVI / LVDS format conversion
21 CLE P54/WKP4 O Not used
22 PSSC P55/WKP5/ADTRG O Not used
23 SDA1 P10/TMOW I/O I2C bus data (for sub memory)
24 FAN P11/PWM O Not used
25 SCL1 P12 O I2C bus clock (for sub memory)
26 SDA0 P56/SDA I/O
27 SCL0 P57/SCL O
28 SDATA P74/TMRIV I/O I2C bus data (for PDP communication)
29 SCK P75/TMCIV O I2C bus clock (for PDP communication)
30 LE P76/TMOV O PDP communication control for DVI / LVDS format conversion
31 SDA3 P24 I/O Not used
32 SCL3 P63/FTIOD0 O Not used
33 NC P62/FTIOC0 O Not used
34 NC P61/FTIOB0 O Not used
35 NMI NMI I Port for writing on board control [Writing : L]
36 A_MU P60/FTIOA0 O Audio mute [Mute : H]
37 (HD) P64/FTIOA1 I Not used
38 ON_TIMMER P65/FTIOB1 O Not used
39 REMO P66/FTIOC1 I Not used
40 POWERLED P67/FTIOD1 O Not used
41 P85 P85 I Emulator connection / Port for writing on board [Writing : H]
42 P86 P86 I Emulator connection
43 P87 P87 I Emulator connection
44 SCK3 P20/SCK3 O Port for writing on board
45 RXD P21/RXD I Port for writing on board
46 TXD P22/TXD O Port for writing on board
47 ALARM P2 3 I AC power frequency detection [Detection : H]
48 NC P70/SCK3_2 O Not used
49 RXD2 P71/RXD_2 I Communication for main CPU (Serial data)
50 TXD2 P72/TXD_2 O Communication for main CPU (Serial data)
51 N C P14/IRQ0 O Not used
52 MECA_SW P15/IRQ1/TMIB1 I Not used
53 VD P16/IRQ2 I Vertical sync
54 REC_DET P17/IRQ3/TRGV I Not used
55 PSS P33 I PDP communication for DVI / LVDS format conversion
56 FAN_LOCK P32 I Not used
57 SYSTEM2 P31 I Not used
58 SYSTEM 1 P30 I Not used
59 THEM_DET PB3/AN3 I Temp. sensor detection [Detection : H]
60 (AMP_PRO2) PB2/AN2 - GND
61 AMP_PRO1 PB1/AN1 I Temp. protector detection for Audio out [Detection : L]
62 EE_CDS PB0/AN0 I Not used
63 KEY_IN1 PB4/AN4 I Not used
64 KEY_IN2 PB5/AN5 I Not used
I2C bus data (for BBE / SURROUND / AUDIO CONTROL, TEMP. SENSOR)
I2C bus clock (for BBE / SURROUND / AUDIO CONTROL, TEMP. SENSOR)
(No.YA098) 1-15
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