JETWAY NF9QU-Q87 Technical Manual

TECHNICAL MANUAL

Of

Intel Q87 Express Chipset

Based Mini-ITX M/B

NO. G03-NF9QU-F

Revision: 1.0

Release date: October 14, 2014

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

i

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

ii

ENVIRONMENTAL SAFETY INSTRUCTION ....................................................................... iii

USER’S NOTICE.................................................................................................................. iv

MANUAL REVISION INFORMATION................................................................................... iv

ITEM CHECKLIST................................................................................................................ iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD ............................................................................ 1

1-2 SPECIFICATION .................................................................................................... 2

1-3 LAYOUT DIAGRAM ............................................................................................... 3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING................................................................................................. 8

2-2 CONNECTORS AND HEADERS ............................................................................ 12

2-2-1 CONNECTORS ......................................................................................... 12

2-2-2 HEADERS................................................................................................. 14

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP................................................................................................. 20

3-2 BIOS MENU SCREEN............................................................................................ 21

3-3 FUNCTION KEYS................................................................................................... 21

3-4 GETTING HELP...................................................................................................... 22

3-5 MEMU BARS.......................................................................................................... 22

3-6 MAIN MENU ........................................................................................................... 23

3-7 ADVANCED MENU ................................................................................................ 24

3-8 CHIPSET MENU..................................................................................................... 33

3-9 BOOT MENU.......................................................................................................... 36

3-10 SECURITY MENU .................................................................................................. 38

3-11 SAVE & EXIT MENU .............................................................................................. 39

TABLE OF CONTENT

iii

Environmental Safety Instruction

 Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

 Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.

 The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.

 Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

iv

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition 2014-10-14

Item Checklist



Motherboard



DVD for motherboard utilities



User’s Manual



Cable

(s)



I/O Back panel shield

1

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

 Intel® Q87 express chipset

 Support Intel® LGA 1150 Socket Intel® Core™ i3, i5, i7 & Pentium Processors in

LAG1150 Package

 Support 2 * DDRIII SO-DIMM 1333/1600 MHz up to 16GB and dual channel

function

 Integrated with Intel® i211AT and Intel® i217-LM Gigabit Ethernet LAN chip

 Integrated ALC662 HD audio codec

 Support HDMI , DVI-D and VGA video outputs

 Support 4* SATAIII 6GB/S ports with RAID 0,1,5,10 function

 Support 1*full-size Mini-PCIE slot (Selectable with MSATA)

 Support 1*half-size Mini-PCIE slot

 Support PCI Express x4 slot

 Support USB 3.0 data transport demand

 Support CPU Smart FAN

 Supports ACPI S3 Function

 Compliance with EuP Standard

 Support TPM function

 Support Watchdog Timer Technology

2

1-2 Specification

Spec Description

Design

 Mini-ITX form factor; 6 layers ; PCB size: 17.0x17.0cm

Chipset

 Intel® Q87 Express Chipset

CPU Socket

 Supports Intel® Core™ i7, Core™ i5, Core™ i3 series,

Pentium® processor in LAG1150 Package

* for detailed CPU support information please visit our website

Memory Slot

 DDRIII SO-DIMM slot x2
 Support DDRIII 1333/1600 MHz DDRIII SO-DIMM

expandable to 16GB

 Support dual channel function

Expansion Slot

 1* PCI Express x 4 slot
 1 * full-size Mini-PCIE slot (Selectable with MSATA)
 1 * half-size Mini-PCIE slot

Storage

 4 * SATAIII 6Gb/s ports support RAID 0, 1, 5, 10 function

Dual LAN Chip

 Integrated Intel® i211AT and i217-LM Gigabit Ethernet LAN

chip that support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate

Audio Chip

 Realtek ALC662 Audio Codec integrated
 Audio driver and utility included

BIOS

 64M bit Flash ROM

Multi I/O

Rear Panel I/O:

 1* 9V~24V DC power in jack
 1* HDMI port connector
 1* VGA port connector
 1* DVI-D port connector
 2* COM port connector
 4* USB 3.0 port connector
 2* RJ-45 LAN connector
 1* Audio Line-out connector
 1* Audio MIC connector

3

Internal I/O Connectors& Headers:

 1 *4-pin 9V~24V internal power connector
 4* SATAIII connector
 1* 4-pin SATA hard disk power connector

 1* Front panel audio header
 1* HDMI_SPDIF out header
 2* LAN port activity indicator LED header
 2* Serial port header
 1* GPIO header
 1* PS/2 KB & MS header
 1* SM BUS header



2* USB 2.0 header (support four expansion USB 2.0 ports)

 1* USB 3.0 header (support two expansion USB 3.0 ports)
 1* Speaker header + PWRLED header
 1* Front panel header
 1* CPU fan header
 2* System fan header

1-3 Layout Diagram

Rear IO Diagram

MIC-IN

Line-OUT

RJ-45 LAN Ports

DVI-DPort

USB 3.0 Ports

VGA Port

HDMI Port

9V~24V

DC Power-in

Connector

Serial Port

(COM1)

Serial Port

(COM2)

4

Motherboard Internal Diagram

USB 2.0 Headers

9V～24V Internal

Power Connector

DDRIII SODIMM Slot x 2

（DDRIII 1333/1600）

Audio Connectors

Intel LGA 1150

CPU Socket

HDMI_SPDIF Header

GPIO Header

Intel Q87 Chipset

*PCI Express x4 Slot (PCIE1)

CPUFAN Header

RJ-45 Port over

USB 3.0 Ports

SATAIII Ports

Front Panel

Audio Header

Front Panel Header

SYSFAN1Header

Speaker &

Power LED Header

RJ-45 Port over

USB 3.0 Ports

Serial Ports

USB 3.0 Header

LAN2LED Header

SYSFAN2 Header

SM BUS

Header

PS2

KB &MS Heade

r

9V~24V DC

Power-in

Connector

HDMI Port

VGA Port over

DVI-D Port

Full-size Mini-PCIE

/ M-SATA Connector

Half-size Mini-PCIE

Connector

Serial Port Headers

(COM3/4)

LAN1LED Header

Hard Disk

Power Connector

5

Motherboard Jumper Position

JBAT

JP2

COPEN

JP5

JP7

JP1

AT-MODE

JP4

6

Jumper

Jumper Name Description

JP1 COM1 Port Pin9 Function Select 4-pin Block
JP2 COM2 Port Pin9 Function Select 4-pin Block
JP5 MPE Slot VCC3.3V /3VSB Select 3-pin Block
JP7 MMPE Slot VCC3.3V /3VSB Select 3-pin Block
JBAT CMOS RAM Clear Function Setting 3-pin Block
JP4 Security Measure Function Select 2-pin Block
AT-MODE ATX Mode & AT Mode Select 2-pin Block
COPEN Case Open Message Display Function 2-pin Block

Connectors

Connector Name

DCIN 9V~24V Main Power Connector
DCPWRIN 9V~24V Internal Power Connector
PWROUT SATA Hard Disk Power Connector
SATA1/2/3/4 SATAIII Connector x 4
HDMI High-Definition Multimedia Interface
DVI DVI-D Port Connector
VGA VGA Port Connector
USB1 USB 3.0 Port Connector x2
COM2-COM1( Bottom ) COM1:Serial Port Connector
COM2-COM1 (Top) COM2:Serial Port Connector
UL1(Middle & Bottom)

/UL2(Middle & Bottom)

USB 3.0 Port Connector x4

UL1(Top) / UL2(Top) RJ-45 LAN Connector x2
AUDIO( Bottom ) Audio MIC Audio Connector
AUDIO(Top) Audio Line out Audio Connector

7

Headers

Header Name Description

FP_AUDIO Front Panel Audio Header 9-pin Block
SPDIFOUT HDMI_SPDIF Out Header 2-pin Block
LAN1LED/LAN2LED LAN LED Header 2-pin Block
COM3/COM4 Serial Port Header x2 9-pin Block
GPIO GPIO Header 10-pin Block
PS2KBMS PS2 KB & MS Header 6-pin Block
SMBUS SM BUS Header 4-pin Block
USB2/USB3 USB 2.0 Port Header x2 9-pin block
USB1 USB 3.0 Port Header 19-pin block
SPK-LED Power LED+ Speaker Header 7-pin Block
FP

Front Panel Header(PWR LED/
HD LED/ /Power Button /Reset)

9-pin Block

SYSFAN1/SYSFAN2
/CPU FAN

FAN Header x3 4-pin Block

8

Chapter 2

Hardware Installation

2-1 Jumper Setting

(1) JP1 (4-pin): COM1 Port Pin9 Function Select

JP1→COM1 Port

4-6 Closed:

RI= 12V.

6 4 2

3-4 Closed:

RI= 5V;

2-4 Closed:

RI=RS232;

3

1

5

1

3

5

2 4

6

1 3

5

2 4

6

(2) JP2 (4-pin): COM4 Header Pin9 Function Select

JP2→COM4 Port

4-6 Closed:

RI= 12V.

5
3
1

3-4 Closed:

RI= 5V;

2-4 Closed:

RI=RS232;

4
2

6

2

1

3

5

4

6

1

3

5

2

4

6

9

(3) JP5 (3-pin): MPE Slot VCC3.3V/ 3VSB Select

2-3 Closed: MPE Slot VCC= 3VSB.

JP5→MPE Slot(Half-size Mini-PCIE Slot)

1-2 Closed: MPE Slot VCC= 3.3V;

1

3

1

(4) JP7 (3-pin): MMPE Slot VCC3.3V/ 3VSB Select

2-3 Closed: MMPE Slot VCC= 3VSB.

JP7→MMPE Slot(Full-size Mini-PCIE/MSATA Slot)

1-2 Closed: MMPE Slot VCC= 3.3V;

1

3

1