JETWAY NF9N Technical Manual
Technical Manu al
Of
Intel Bay Trail Series CPU
Based Mini-ITX M/B
NO.G03-NF9N-F
Revision: 2.0
Release date: Octob er 1, 2019
Trademark:
* Specifications and Information contained in t his docu ment ation ar e furnish ed for i nfo r mation u se only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Prote cti on Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protect ion of mother earth, please recyc l e.
ii
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION ........................................................................... iv
USER’S NOTICE ....................................................................................................................... v
MANUAL REVISION INFORMATION ....................................................................................... v
ITEM CHECKLIST ..................................................................................................................... v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ................................................................................ 1
1-2 SPECIFICATION ......................................................................................................... 2
1-3 LAYOUT DIAGRAM .................................................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING ..................................................................................................... 8
2-2 CONNECTORS AND HEADERS ................................................................................ 12
2-2-1 CONNECTORS ............................................................................................. 12
2-2-2 HEADERS ..................................................................................................... 15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP ..................................................................................................... 24
3-2 BIOS MENU SCREEN ................................................................................................ 25
3-3 FUNCTION KEYS ....................................................................................................... 25
3-4 GETTING HELP .......................................................................................................... 26
3-5 MEMU BARS ............................................................................................................... 26
3-6 MAIN MENU ................................................................................................................ 27
3-7 ADVANCED MENU ..................................................................................................... 28
3-8 CHIPSET MENU .......................................................................................................... 38
3-9 SECURITY MENU ....................................................................................................... 41
3-10 BOOT MENU ............................................................................................................... 42
3-11 SAVE & EXIT MENU ................................................................................................... 43
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is th e suitabl e tem perat ure. (The fig ure c omes from the r eques t
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor a s computer instabi lity resulted fr om corrosio n and oxi dation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DES CRIBED IN I T MAY BE REPRO DUCED, TR ANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION RE QU IRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition October 1, 2019
Item Checklist
Motherboard
Cable(s)
v
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Bay Trail Series Processor, with low power consumption never
denies high performance
Support 2 * DDR3L SO-DIMM 1066/1333 MHz up to 8GB
Support Mini-PCIE connector
Support m-SATA connector
Support 2 * SATAII device
Integrated with 1 * 24-bit dual channel LVDS header
Support HDMI & VGA display output
Support USB 3.0 data transport demand
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
2
Spec
Description
Design
6 layers; PCB size: 17x 17 cm
Integrated with Intel® Bay Trail-D/M/I series CPU
2 * DDR3L SODIMM Slot for un-buffered dual channel DDR3L
Dual channel function supp or ted
1* Full-size Mini-PCIE slot (MPE)
1* PCIE x1 slot (PCI-E)
Integrated with Intel I211AT PCI-E Gigabit LAN chip
10/100/1000Mbps Ethernet dat a tra nsfer rate
2* SATAI I port (SATA1/2)
1* Full-size mSATA slot (MSATA: shares with SATA2)
AMI 64MB Flash ROM
1* DC 12V power-in connector
Audio Line Out port x1
1* 20-pin ATX type internal main power connector
1* Front panel audio header
1-2 Specification
Embedded CPU
Memory Slot
Expansion Slot
LAN Chip
Storage
BIOS
Rear I/O
Internal I/O
1066/1333 MHz SDRAM, expandable to 8GB in total
Support Fast Ethernet LAN func ti on of prov i di ng
1* PS/2 keyboard & 1* PS/2 mouse port
1* VGA port
1* COM1 port
1* HDMI port
1* RJ-45 LAN port
3* USB 2.0 port
1* USB 3.0 port
1* 2-pin DC 12V internal power connector
1* SATA Power connector
1* CPU FAN connector & 2* SYSFAN connector
3
1* SPDIF Out header
1*Jetway daughter board expansion slot header (CN1/CN2)
Line-Out Port
USB 2.0 Port
RJ-45 LAN Port
USB 3.0 Port
12V DC-in
Power Connector
USB 2.0 Ports
VGA Port
COM1 Port
HDMI Port
PS/2
Keyboard Port
PS/2
Mouse Port
1* SPEAK_CON header
1* CDIN header & 1* Line In header
1* Front panel header
1* Power LED & speaker header
2* USB 2.0 header (Expansible to 4* USB 2.0 ports)
1* Serial port header
1* Parallel port header
1* GPIO_CON hea der
1* SMBUS header
1* LAN LED activity header
1* LVDS header
1* LVDS inverter header
1-3 Layout Diagram
Rear IO Panel Diagram:
4
Internal ATX Type
Power connector
Intel CPU
PCI Express x1 Slot
CPUFAN Header
Front Panel
Audio Header
Front Panel Header
LVDS Inverter
Serial Port H eader
GPIO Header
SATA Hard Disk
Power-Out Connector
Speaker
Connector
USB 2.0 Headers
LVDS Header
SATAII Ports
SYSFAN2 Header
SYSFAN1 Header
LAN_LED Header
*DDR3L SODIMM Slot
(SODIMM1/2)
Parallel Port Header
SMBUS Header
Power LED Header
Full-size
Mini-PCIE Slot (MPE)
PS/2 Mouse Port
M-SATA Slot
COM1 Port over
VGA Port
USB 2.0 Port
HDMI Port
Line-Out Port
RJ-45 LAN Port
Over USB 2.0 Ports
12V DC-In
Power connector
USB 3.0 Port
Line-In
CDIN
Daughter Board
Header(CN1/CN2)
Internal 12V
HDMI_SPDIF Out
Header
Motherboard Internal Diagram
Over
PS/2 Keyboard Port
Power connector
Header
Header
& Speaker Header
Note: 1. Priority should be given to SODIMM1 slot when installing only one compatible memory
modules. 2. The module should be DDR3L 1.35V SODIMM and not exceeding 8GB total capacity. 3.
MSATA slot shares function with SATA2 port; i.e. only one can function at a time.
5
JP1
JP3
JBAT
JP2
AT-MODE & COPEN
JP5
Jumper Position:
6
Jumper
Name
Description
JBAT
Pin 1-2: CMOS RAM Clear Function Setting
Pin 3-4: Clear ME RTC Function Setting
4-Pin Block
AT_COPEN
Pin 1-2: ATX Mode & AT Mode Select
Pin 3-4: Case Open Message Display Function
4-Pin Block
JP2
LVDS PVCC 5V/3.3V /12V Select
4-Pin Block
JP3
INVERTER Back Light 5V/12V Select
3-Pin Block
JP1
COM1 Port Pin9 Function Select
4-Pin Block
JP5
COM2 Header Pin9 Function Sel ec t
4-Pin Block
Connector
Name
DCIN
DC 12V Power–in Power Connector
ATXPWRIN
20-Pin Internal Main Power Connector
ATX2P
2-Pin Internal DC 12V Power–in Connector
SATAPW
SATA Power out Connector
SATA1/SATA2
SATAII Port Connector X2
CPUFAN/SYSFAN1/SYSFAN2
FAN Connector X3
KBMS (Top)
PS/2 Mouse Port Connector
KBMS ( Bottom)
PS/2 Keyboard Port Connector
VGA_COM1 (Top)
Serial Port Connector
VGA_COM1 (Bottom)
VGA Port Connector
LAN2_USB20 (Top)
RJ-45 LAN Port Connector
LAN2_USB20 (Bottom)
USB 2.0 Port Connector X2
HDMI
HDMI Port Connector
USB30
USB 3.0 Port Connector
USB20
USB 2.0 Port Connector
AUDIO
Audio Line Out Port Connector
Jumper
Connectors
7
Header
Name
Description
FP_AUDIO
Front Panel Audio Header
9-pin Block
SPDIF
SPDIF Out Header
2-pin Block
SPEAK_CON
Speaker Header
4-pin Block
CD_IN
CD Audio In Header
4-pin Block
LINE_IN
Line In Header
4-pin Block
JW_FP
Front Panel Header(PWR LED/
9-pin Block
SPK-LED
Power LED & Speaker Header
7-pin Block
FP_USB1/FP_USB2
USB 2.0 Header X2
9-pin Block
LPT
Parallel Port Header
25-pin Block
COM2
Serial Port Header
9-pin Block
GPIO_CON
GPIO Header
10-pin Block
SMBUS
SMBUS Header
4-pin Block
LAN_LED
LAN Activity LED Header
2-pin Block
LVDS
LVDS Header
30-pin Block
INVERTER
LVDS Inverter Header
8-pin Block
CN1/CN2
Jetway Daughter Board Header
35-pin Block
Headers
HDD LED/Power Button /Reset)
8
2-3 Close：Clear CMOS.
JBAT(Pin1&2)→Clear CMOS
1-2 Open: Normal；
1 1 2
2
3-4Close：Clear ME_RTC.
JBAT(Pin3&4)→Clear ME_RTC
3-4 Open: Normal；
3 3 4
4
Chapter 2
Hardware Installation
2-1 Jumper Setting
Pin 1 & 2 of JBAT (4-pin): Clear CMOS Setting
Pin 3 & 4 of JBAT (4-pin): Clear ME_RTC Function Setting
9
AT_COPEN(Pin 1&2)→AT Mode Select
1-2 Close: AT Mode Selected.
1-2 Open: ATX Mode Selected;
Pin 1
2
2
4
4
3
Pin 1
3
AT_COPEN (Pin 3&4)→Case Open Function Select
3-4 Close: Case Open Function Selected (One Touch).
3-4 Open: Normal;
Pin 1
2
2
4
4
3
Pin 1
3
Pin 1 & 2 of AT_COPEN (4-pin): AT Mode Function Select
*ATX Mode Selected: Press power button to power on after power input ready;
AT Mode Selected: Directly power on as power input ready.
Pin 3 & 4 of AT_COPEN (4-pin): Case Open Message Display Function Select
Pin 3-4 Close: When Case open function pin short to GND, the Case open function
was detected. When Used, needs to enter BIOS and enable ‘Case Open Detect’
10
JP2→LVDS PVCC
4-6 Closed: LVDS
PVCC= 12V.
6 4 2
3-4 Closed: LVDS
PVCC= 5V;
2-4 Closed: LVDS
PVCC= 3.3V;
3
1
5
1
3
5
2
4
6
1
3
5
2
4
6
2-3 Closed: INVERTER Back Light 12V Selected.
JP3→INVERTER Back Light VCC
1-2 Closed: INVERTER Back Light 5V Selected;
1
3
1
3
function. In this cas e if your case is removed, next ti me when you restar t your computer,
a message will be displayed on screen to inform you of this.
JP2 (4-pin): LVDS PVCC 3.3V/5V/12V Select
JP3 (3-pin): INVERTER Back Light VCC 5V/12V Select
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