JETWAY NF697 Series User Manual
NF697 Series
User Manual
NO. G03-NF697-F
Revision: 3.0
Release date: December 15, 2017
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
ENVIRONMENTAL SAFETY INSTRUCTION ....................................................................... iii
USER’S NOTICE.................................................................................................................. iv
MANUAL REVISION INFORMATION................................................................................... iv
ITEM CHECKLIST................................................................................................................ iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ............................................................................ 1
1-2 SPECIFICATION .................................................................................................... 2
1-3 PRODUCT DIAGRAM ............................................................................................ 4
CHAPTER 2 HARDWARE INSTALLATION
2-1 LOCATION OF INTERNAL JUMPER AND CONNECTOR...................................... 5
2-2 INTERNAL JUMPER AND CONNECTOR SETTING .............................................. 6
2-2-1 CONNECTORS ......................................................................................... 10
2-2-2 HEADERS................................................................................................. 12
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................. 18
3-2 BIOS MENU SCREEN............................................................................................ 19
3-3 FUNCTION KEYS................................................................................................... 19
3-4 GETTING HELP...................................................................................................... 20
3-5 MEMU BARS.......................................................................................................... 20
3-6 MAIN MENU ........................................................................................................... 21
3-7 ADVANCED MENU ................................................................................................ 22
3-8 CHIPSET MENU..................................................................................................... 34
3-9 SECURITY MENU .................................................................................................. 37
3-10 BOOT MENU.......................................................................................................... 38
3-11 SAVE & EXIT MENU .............................................................................................. 39
TABLE OF CONTENT
iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition June 14, 2017
2.0 Second Edition August 14, 2017
3.0 Third Edition December 15, 2017
Item Checklist
Motherboard
DVD for motherboard utilities
User’s Manual
Cable(s)
I/O Back panel shield
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel® LGA1151 Skylake/Kabylake Processor (TDP 65W)
Intel® Q170 Express Chipset
Support DDR4-2133, 2 * SO-DIMM slot, up to 32GB memory
Realtek ALC662VD Audio
2 * Intel Giga LAN
Support 4 * SATA III (6Gb/s), support RAID 0, 1, 5, 10
Support 2 * DP/HDMI/LVDS, triple displays
2 * External COM and 4 * internal COM
4 * External USB3.0 & 2 * Internal USB1.1/2.0
1 * mini-PCIe slot & 1 * PCIe x4 side-slot
1 * SIM Card Holder
9 ~ 24V DC IN power
Support Watchdog Timer Technology
1* TPM (onboard option)
2
1-2 Specification
Spec Description
Design
Mini-ITX ; PCB size: 17.0x17.0cm
Chipset
Intel Q170 Express Chipset
CPU Socket
Intel® LGA1151 Skylake/Kabylake Processor (TDP 65W)
* for detailed CPU support information please visit our website
Memory Slot
2* DDR4 SO-DIMM slot
Support DDR4 2133MHz SO-DIMM up to 32GB
Support dual channel function
Expansion Slot
1* Full-size Mini-PCIe slot
1* PCIe x4 side-slot (4 * PCIe x1 combo signals)
1* SIM Card Holder
Storage
4* SATAIII 6G/s ports with support for RAID 0/1/5/10 mode
Gigabit LAN Chip
Integrated with 2* Intel Gigabit PCIe LAN chip
Support Fast Ethernet LAN function of providing 10/100/1000Mb
ps
Ethernet data transfer rate
BIOS
128M AMI Flash ROM
Rear I/O
1* HDMI
2* DisplayPort
2* RJ-45 port
4* USB3.0
1* Audio (Line-in, Line-out, MIC)
2* Serial port (COM1/2: RS232/422/485)
1* DC-input
Internal I/O
2* USB2.0
1* PS/2
1* LVDS,
1* Inverter
4* Serial port
3
4* SATAIII (6.0Gb/s)
1* full size Mini PCIe
1* GPIO header
1* Chassis Intrusion
1* Audio header
1* SMBIS/I2C
4
1-3 Product Diagram
For NF697 Series:
DC Input
Connector
Display
Port1
(Top)
Display
Port2
(Bottom)
HDMI
(To
p)
COM1
(Bottom)
COM2
(Top)
RJ-45 LAN1
(Middle)
(Bottom)
USB3.0
(Middle)
(Bottom)
USB3.0
(Top)
RJ-45 LAN2
Line-IN
Line-OUT
MIC-IN
Connector
Audio
Header
USB 2.0
Header
COM Port
Headers
SIM Card Holder
Mini PCIe
DDR4
SODIMM
Slots
PCIE1: Sideway
PCI Express x4 Slot
Intel Q170 Chipset
LGA 1151
CPU Socket
SATAIII
Ports
Inverter
2
LVDS2
5
Chapter 2
Hardware Installation
2-1 Location of Internal Jumper and Connector
DC Input
Connector
Display
Port1
(Top)
Display
Port2
(Bottom)
HDMI
(Top)
COM1
(Bottom)
COM2
(Top)
RJ-45 LAN1
(Middle)
(Bottom)
USB3.0
(Middle)
(Bottom)
USB3.0
(Top)
RJ-45 LAN2
Line-IN
Line-OUT
MIC-IN
Connector
FP_USB1
COM Port
Headers
SIM Card Holder
Mini PCIe
DDR4
SODIMM
Slots
PCIE1: Sideway
PCI Express x4 Slot
Intel Q170 Chipset
LGA 1151
CPU Socket
SATAIII
Ports
JBAT_OPEN
AT_MODE
JPMPE
JP
LCD
JPBKLT
JP
COM2
ATX
Power
C
onnector
SYSFAN
Header
CPU
FAN Header
SATAPW
SPEAK PWRLED
SMBUS
Inverter
2 LVDS2
COM3
COM4
COM5
COM6
GPIO_CON
JW_FP
SPDIF
LAN_LED
FP_AUDIO
6
2-2 Internal Jumper and Connector Setting
(1) JBAT_OPEN (6-pin): Clear CMOS, TXE Override, and Chassis Intrusion
Select
1-2 Closed:
Clea r CMO S;
3-4 Closed:
TXE Disable;
4-6 Clo sed:
Chassis Intrusion
Header
.
6
4
2
3
1
5
6
4
2
3
1
5
6
4
2
3
1
5
(2) AT_MODE (3-pin): AT/ATX Mode Select
2-3 C
losed
:
AT Mode
.
1-2 Closed: ATX Mode(Default)
；
Pin1
Pin1
*ATX Mode Selected: Press power button to power on after power input ready;
AT Mode Selected: Directly power on as power input ready.
7
(3) GPIO_CON (10-pin): GPIO Header
9
GPIO
_
8
0
GND
GPIO_82
GPIO_84
GPIO_86
GPIO_81
GPIO_83
2
Pin 1
10
VCC
GPIO_85
GPIO_87
(4) JW_FP (9-pin): Front Panel Header
GND
HDD LED
-
GND
RSSET-
PWR
SW
-
VCC
PWR LED+
PW R LED-
HDD L ED+
Pin 1
2
9
10
8
(5) JPMPE (3-pin): Mini PCI-E (MPE) Slot VCC 3.3V/3.3 VSB Select
2-3 Closed：MINI PCI-E VCC= 3.3VSB.
1-2 Closed：MINI PCI-E VCC= 3.3V;
1 3
1
3
(6) INVERTER2 (8-pin): INVERTER Back Light Select
Pin 1
LCD_ BKL T_EN
LCD_BKLT_PWM
BKLT_PWR
BKLT_PWR
GND
GND
BRTNSS_UP
BRTNSS_DN
9
(7) JPLCD(4-pin): LVDS VCC 3.3V/5V/12V Select
4-6 Closed:
VCC= 12V.
3-4 Closed:
VCC= 5V;
2-4 Closed:
VCC=3.3V(Default);
5
2
1
4
3
6
5
2
1
4
3
6
5
2
1
4
3
6
(8) JPBKLT (3-pin): LCD Back Light PWR Select
2-3 Close: 12V.
1-2 Close: 5V (Default);
1 3
1
3
(9) JPCOM2 (4-pin): COM 2 Port RI Select
5-6 C
losed
:
12V.
6 4 2
3-4 Closed:
5V;
2-4 Closed:
RI=RS232;
3 1 5
6
4 2
3 1 5
6
4 2
3 1 5
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