JETWAY NF632E Series User Manual

NF632E Series
User Manual
Revision: 6.0
Release date: October 12, 2018
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution and ensure environment protection of mother earth, please recycle.
iii
ENVIRONMENTAL SAFETY INSTRUCTION .......................................................................... iv
USERS NOTICE ....................................................................................................................... v
MANUAL REVISION INFORMATION ...................................................................................... v
ITEM CHECKLIST ..................................................................................................................... v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ............................................................................... 1
1-2 SPECIFICATION ......................................................................................................... 2
1-3 LAYOUT DIAGRAM ................................................................................................... 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING ..................................................................................................... 9
2-2 CONNECTORS AND HEADERS ............................................................................... 14
2-2-1 CONNECTORS ............................................................................................. 14
2-2-2 HEADERS ..................................................................................................... 17
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP ..................................................................................................... 25
3-2 BIOS MENU SCREEN ................................................................................................ 26
3-3 FUNCTION KEYS ....................................................................................................... 26
3-4 GETTING HELP .......................................................................................................... 27
3-5 MEMU BARS .............................................................................................................. 27
3-6 MAIN MENU ................................................................................................................ 28
3-7 ADVANCED MENU .................................................................................................... 29
3-8 CHIPSET MENU ......................................................................................................... 42
3-9 SECURITY MENU ....................................................................................................... 45
3-10 BOOT MENU .............................................................................................................. 46
3-11 SAVE & EXIT MENU .................................................................................................. 47
TABLE OF CONTENT
iv
Environmental Safety Instruction
l Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
l 0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
l Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from the welding spots that connect components and PCB. Computer should go through an adaptive phase before it boots when it is moved from a cold environment to a warmer one to avoid condensation phenomenon. These water drops attached on PCB or the surface of the components can bring about phenomena as minor as computer instability resulted from corrosion and oxidation from components and PCB or as major as short circuit that can burn the components. Suggest starting the computer until the temperature goes up.
l The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher temperature in the inner of the case.
l Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
v
USERS NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE DO ASSURE THIS MANUAL MEETS USERS REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL AS IS WITHOUT WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNERS BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition May 23, 2017
2.0 Second Edition July 19, 2017
3.0 Third Edition October 26, 2017
4.0 Forth Edition December 22, 2017
5.0 Fifth Edition January 5, 2018
6.0 Sixth Edition October 12, 2018
Item Checklist
R
Motherboard
R
Users Manual
R
DVD for motherboard utilities
R
Cable(s)
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
n
Onboard high-performance Intel® Skylake-U series SoC CPU
n
Support 2 * DDR4 2133MHz Dual Channel SO-DIMM, max up to 32GB
n
Support HDMI, Display Port, LVDS, eDP Triple Independent Displays
n
Support 1 * SATAIII (6Gb/s) device
n
Onboard 1* full-size Mini-PCIE/M-SATA share slot device
n
Onboard 1* half-size Mini-PCIE device
n
Support 2 * RJ-45 LAN port
n
Support 6 * internal COM port (COM1 support RS232/422/485)
n
Support USB 3.0 data transport demand
n
Support CPU Over-Temperature protection
n
Support CPU Over-Current/Under Voltage protection
n
Support CPU Smart FAN
n
Compliance with ErP standard
n
Support Watchdog function
n
Support TPM function (optional)
2
1-2 Specification
Spec
De
scription
Design
l
3.5 SBC Form Factor
;
PCB size
: 148
mm
* 102mm
Embedded CPU
l
Integrated with
Intel®
Skylake
-U series CPU;TDP:1
5W
l
*CPU model varies from different IPC options. Please consult your
dealer for more information of onboard CPU.
Memory Slot
l
2*DDR4 SO-DIMM slot
s
upport
2*
DDR
4 2133
MHz SO
-
DIMM up to
32GB
l
Support dual channel function
Expansion Slot
l
1* Full
-
size Mini
-
PCIE/MSATA slot
(MPEST,
share with MSATA slot
)
l
1* Full-size Mini-PCIE slot (MPE)
Storage
l
1*SATAIII 6
G/s port
l
1* Full-size Mini-PCIE/MSATA slot (MPEST, share with MSATA slot)
LAN Chip
l
Integrated
with Intel I211AT
Gigabit
PCI-E
LAN
chip & Intel I219LM
Gigabit LAN PHY chip
l
Support Fast Ethernet LAN function of providing 10/100/1000Mbps
Ethernet data transfer rate
Audio Chip
l
Real
tek ALC662
VD HD
Audio Codec integrated
l
Audio driver and utility included
BIOS
l
AMI
128
MB Flash ROM
Rear I/O
l
1* 9V~
24
V DC
-
in power jack
l
2* USB 2.0 port
l
1* Display port
l
1* HDMI port
l
2* RJ-45 LAN port
l
4* USB 3.0 port
l
1* Audio line-out port
Internal I/O
l
1* 2
-
Pin internal 9V~24V DC
-
in system power connector
l
1* SATA Power-out connector
l
1* CPUFAN connector
l
1* Front panel audio header
3
l
1* 3W amplifier
header
l
1* Front panel header
l
2* 9-pin USB 2.0 header (Expansible to 4* USB 2.0 ports)
l
1* 4-pin USB 2.0 header (Expansible to 1* USB 2.0 port)
l
1* SMBUS header
l
1* PS/2 keyboard & mouse header
l
1* GPIO header
l
1* RS232/422/485 serial port header (COM1)
l
5* RS232 serial port header (COM2/3/4/5/6)
l
1* LAN LED activity header
l
1* 4-Lane eDP header
l
1* 24-bit dual channel LVDS header
l
1* LVDS inverter
* Note: Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher USB speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within platforms. However, legacy operating systems (OS) may not natively recognize XHCI controllers. You might need to pre-install XHCI driver while desiring to install a non-xHCI OS (ex.Windows* 7) on Intel platforms which do not include EHCI controllers. Please contact your representative for more details.
1-3 Layout Diagram
Rear IO Panel Diagram:
USB 3.0 Ports
9V~24V DC-in
Power
Jack
HDMI Po
rt
Display Port
Line-out
Port
USB 2.0 Ports
LAN1
RJ-45 LAN Port
LAN2
RJ-45 LAN Port
4
Motherboard Internal Diagram-Front Side
5
Motherboard Internal Diagram-Back Side
*
Note: CPU is the most important part of the board and very fragile to any possible harm. Make sure
that there is no damage to the CPU during any installation procedures!
*Intel CPU
6
Jumper Positions:
7
Jumper
Jumper
Name
Description
JP1 COM1 Header Pin9 Function Select 4-pin Block JP2 COM2 Header Pin9 Function Select 4-Pin Block JP3 COM3 Header Pin9 Function Select 4-Pin Block JP4 COM4 Header Pin9 Function Select 4-Pin Block JP7 LVDS Header VCC 3.3V/5V/12V Select 4-Pin Block JP8 LVDS INVERTER Backlight 5V/12V Select 4-Pin Block AT_COPEN
Pin (1&2): ATX Mode / AT Mode Select Pin(3&4):Case Open Message Display Function
4-Pin Block
JBAT Pin (1&2): Clear CMOS RAM Function Setting
Pin(3&4): Flash Descriptor Security Override
4-Pin Block
Connectors
Connector
Name
DCIN 9V~24V DC–in System Power Jack ATX2P Internal 9V~24V System DC–in Power Connector USB20 USB 2.0 Port Connector x2 DP_HDMI Top: Display Port Connector
Bottom: HDMI Port Connector LAN1/LAN2 RJ-45 LAN Port Connector x2 USB30/USB31 USB 3.0 Port Connector x 4 LINE_OUT Audio Line-Out Connector SATA SATAIII Connector SATAPWR SATA Power out Connector CPUFAN CPUFAN Connector
8
Headers
Header Name Description
FP_AUDIO Front Panel Audio Header 9-pin Block SPEAK_CON 3W Amplifier Header 4-pin Block JW_FP
Front Panel Header(PWR LED/ HD
D
LED/Power Button /Reset)
9-pin Block
FP_USB20/ FP_USB21
USB 2.0 Header 9-pin Block
FP_USB USB 2.0 Header 4-pin Block SMBUS SMBUS Header 5-pin Block PS2KBMS PS/2 Keyboard & Mouse Header 6-pin Block GPIO GPIO Header 10-pin Block COM1 RS232/422/485 Serial Port Header 9-pin Block COM2/3/4/5/6 RS232 Serial Port Header 9-pin Block LAN_LED LAN Activity LED Header 4-pin Block INVERTER LVDS Inverter Header 8-pin Block LVDS LVDS Header 30-pin Block EDP 4-lane EDP Header 40-pin Block
9
Chapter 2
Hardware Installation
2-1 Jumper Setting
JP1 (4-pin): COM1 Header Pin9 Function Select
JP1→COM1 Header Pin-9
6 4 2 3 1 5 2-4 C
losed
:
Pin9=RING
(Default);
3-4 C
losed
:
Pin9=+5V;
4-6 C
losed
:
Pin9=+12V.
1 3 5
2 4 6 1 3 5 2 4 6
JP2 (4-pin): COM2 Header Pin9 Function Select
JP2→COM2 Header Pin-9
6 4 2
3 1 5
2-4 Closed: Pin9= RING
(Default);
3-4 Closed:
Pin9=+5V;
4-6 Closed: Pin9=+12V.
1 3 5
2 4 6 1 3 5 2 4 6
10
JP3 (4-pin): COM3 Header Pin9 Function Select
JP3→COM3 Header Pin-9
6 4 2
3 1 5
2-4 Closed: Pin9= RING
(Default);
3-4 Closed:
Pin9=+5V;
4-6 Closed: Pin9=+12V.
1 3 5
2 4 6 1 3 5 2 4 6
JP4 (4-pin): COM4 Header Pin9 Function Select
JP4→COM4 Header Pin-9
6 4 2
3 1 5
2-4 Closed: Pin9= RING
(Default);
3-4 Closed:
Pin9=+5V;
4-6 Closed: Pin9=+12V.
1 3 5
2 4 6 1 3 5 2 4 6
11
JP7 (4-pin): LVDS/eDP VCC 3.3V/5V/12V Select
6 4 2
3 1 5 1 3 5 2 4 6 1 3 5 2 4 6
JP7LVDS VCC
2-4 Closed: VCC = 3.3V
3-4 Closed:
VCC = 5V;
4-6 Closed:
VCC = 12V;
JP8 (3-pin): LVDS/eDP INVERTER Backlight 5V/12V Select
6 4 2
3 1 5 1 3 5 2 4 6 1 3 5 2 4 6
JP8LVDS Backlight
2-4 Closed:
VCC = 5V;
3-4 Closed: VCC = 12V;
4-6 Closed:
VCC = DC-in.
*Note: The maximum current carried is 1A.
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