JETWAY NF36-2600, NF36-2800, NF36-2550 Technical Manual
Technical Manual
Of
Intel Cedar Trail Series CPU
& NM10 Chipset
Based
3.5’’ SBC
NO.G03-NF36-F
Revision: 5.0
Release date: May 31, 2013
Trademark:
* Specifications and Information contained in this docume ntation ar e furnishe d for inf ormation us e only , and ar e
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
iii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv
USER’S NOTICE .......................................................................................................................v
MANUAL REVISION INFORMATION.......................................................................................v
ITEM CHECKLIST.....................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING.....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................14
2-2-1 CONNECTORS .............................................................................................14
2-2-2 HEADERS .....................................................................................................15
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP.....................................................................................................24
3-2 BIOS MENU SCREEN ................................................................................................25
3-3 FUNCTION KEYS .......................................................................................................25
3-4 GETTING HELP ..........................................................................................................26
3-5 MANU BAR .................................................................................................................27
3-6 MAIN MENU................................................................................................................27
3-7 ADVANCED MENU.....................................................................................................29
3-8 CHIPSET MENU..........................................................................................................35
3-9 BOOT MENU...............................................................................................................38
3-10 SECURITY MENU.......................................................................................................39
3-11 SAVE & EXIT MENU...................................................................................................40
TABLE OF CONTENT
iv
Environmental Safety Instruction
z Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
z Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
z The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
z Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
5.0 Fifth Edition May 31, 2012
Item Checklist
5
Motherboard
5
User’s Manual
5
CD for motherboard utilities
5
DVI-VGA Converter
5
Cable(s)
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel® Cedar Trail Processor + NM10 Chipset, with low power
consumption never denies high performance
Support SODIMM DDRIII 800Single Channel, up to 2GB(for
NF36-2600
Series)
Support SODIMM DDRIII 800/1066 Single Channel, up to 4GB (for
NF36-2800
& NF36-2550
Series)
Support 1 * SATAII Device
Support CFast card Slot and Mini PCIE slot
Onboard dual Realtek RTL 8111E Gigabit Ethernet LAN chip
Integrated with 2-CH Realtek ALC662 HD Audio CODEC
Integrated with 1 * 18-bit / 24-bit Single Channel LVDS header & 1 * 24-bit Dual
Channel LVDS header
Support DVI-I Output
Support USB 2.0 data transport demands.
Support RS232/422/485 function
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
2
1-2 Specification
Spec Description
Model
NF36-2600 / NF36-2800 / NF36-2550
Design
z
3.5”SBC 6 layers; PCB size: 14.8x 10.2 cm
Chipset
z
Intel®NM10 Express chipset
Embedded CPU
z
Intel® Cedar Trail M-N2600 / 1.6GHz (for NF36-2600 series)
z
Intel® Cedar Trail M-N2800 /1.86GHz(for NF36-2800 series)
z
Intel® Cedar Trail D-D2550/ 1.86GHz(for NF36-2550 series)
Memory Slot
z
1 * DDRIII SODIMM Slot for un-buffered Single Channel DDRIII
800 MHz SDRAM, expandable to 2GB(for NF36-2600 series)
z
1 * DDRIII SODIMM Slot for un-buffered Single Channel DDRIII
800-1066 MHz SDRAM, expandable to 4GB(for NF36-2800 &
NF36-2550 series)
Notice:
*Support Small Outline DIMMs Raw Cards RC-B(1Rx8), and RC-F (2Rx8). Does
not support RC-A (2Rx16), RC-C (1Rx16), RC-D (2Rx16 dual die), and
RC-E(2Rx16)
Expansion Slots
z
CFast card slot x1
z
Mini-PCI E slot x1
Dual LAN
z
Integrated with dual Realtek RTL8111E PCI-E Gigabit LAN chip.
z
Support Fast Ethernet LAN function of providing 10/100/1000Mbps
Ethernet data transfer rate
HD Audio
z
Realtek ALC662-GR 2-channel HD Audio Codec integrated
z
Audio driver and utility included
BIOS
z
AMI 16MB Flash ROM
Rear I/O
z
DC12V power-in connector x1
z
USB 2.0 port x 4
z
DVI-I port x1
z
RJ-45 LAN port x2
3
z
Audio Line out connector x1
Internal I/O
z
9-pin USB 2.0 header x1 (Expansible to 2* USB 2.0 ports)
z
4pin USB 2.0 header x1 (Expansible to 1*USB 2.0 port)
z
Front panel audio header x1
z
SPDIF _out header x1
z
CIR header x1
z
SM_BUS header x1
z
Front panel header x1
z
SATAII port & SATA Power connector x1
z
Serial port header x4 & TX-RX COM header x1
z
LVDS connector x2 & LVDS inverter x2
z
GPIO header x1
z
CPU FAN header x1
1-3 Layout Diagram
Rear IO Panel Diagram:
DC12V
Power-in
Connector
USB 2.0 Ports
DVI-I Port
USB 2.0 Ports
RJ-45 LAN Ports
Line-Out
Connector
4
Internal Diagram:
Serial port Headers
(COM4/COM3/COM2/COM1)
USB 2.0 Heade
r
Front Panel
Audio Heade
r
SATA II Port
SATA DIS
K
Power Connecto
r
GPIO Header
LVDS1 Heade
r
LVDS2 Header
CPUFAN1 Heade
r
Front Panel Heade
r
SODIMM Slot
Reset Button
Mini PCIE slot
Power Switch Button
DC 12V Power-in
Connector
USB 2.0 Ports
DVI-I Port
RJ-45 LAN Port
RJ-45 LAN Port
USB 2.0 Ports
Audio Line-out
USB 2.0 Header
SPDIF Out
Header
CFast Card Slot
CIR Header
INVERTER2
INVERTER1
TX-RX COM Header
SM_BUS Header
5
Jumper Position:
JP4JP2J
P3
J
BAT1
COPEN1
JP1J
P5
J
COMP4
J
COMP3
J
COMP2
J
COMP1
6
Jumper
Jumper Name Description
JBAT1 CMOS RAM Clear Function Setting 3-Pin Block
JP1 LVDS1 VCC 5V/3.3V Select 3-Pin Block
JP2 INVERTER1 VCC 12V/5V Select 3-Pin Block
JP3 LVDS2 VCC 5V/3.3V Select 3-Pin Block
JP4 INVERTER2 VCC 12V/5V Select 3-Pin Block
JCOMP1 COM1 Header Pin9 Function Select 6-Pin Block
JCOMP2 COM2 Header Pin9 Function Select 6-Pin Block
JCOMP3 COM3 Header Pin9 Function Select 6-Pin Block
JCOMP4 COM4 Header Pin9 Function Select 6-Pin Block
JP5 COM4 RS232/485/422 Function Select 6-Pin Block
COPEN Case Open Message Display Function 2-Pin Block
Connectors
Connector Name Description
J1 DC Power Connector 1-phone Jack
USB1/USB2 USB Port Connectors 4-pin Connectors
DVI1 DVI Port Connector 24-pin Connector
LAN1/LAN2 RJ-45 LAN Connector 8-pin Connector
FLINE_OUT1 Line Out Connector 1-phone Jack
SATA1 SATAII Connector 7-pin Connector
PWOUT1 SATA Power Out Connector 4-pin Connector
7
Headers
Header Name Description
AUDIO1 Front panel audio header 9-pin block
SPDIF SPDIF out header 2-pin block
USB3 USB header 9-pin block
USB4 USB header 4-pin block
COM1/COM2/
COM3/COM4
Serial port headers 9-pin block
TX-RXCOM1 RS422/485 header 4-pin block
GPIO1 GPIO header 10-pin block
JW_FP1
Front Panel header (PWR LED/ HD
LED/ /Power Button /Reset)
8-pin Block
CPUFAN1 CPU FAN header 3-pin Block
CIR CIR header 4-pin block
SM_BUS SM_BUS header 4-pin block
INVERTER1
/INVERTER2
LVDS Inverter header 8-pin Block
LVDS1 24-bit LVDS header 30-pin Block
LVDS2 18-bit /24-bit LVDS header 30-pin Block
8
Chapter 2
Hardware Installation
2-1 Jumper Setting
(1) JBAT1 (3-pin): Clear CMOS
2-3 closed : Clear CMOS
JBAT1
13
1-2 closed: Normal;
13
(2) JP1 (3-pin): LVDS1 VCC 5V/3.3V Function Setting
2-3 closed : LVDS1 VCC 3.3V
JP1
1-2 closed: LVDS1 VCC 5V(default);
9
(3) JP2 (3-pin): INVERTER1 VCC 12V/5V Select
JP2
1-2 closed：Inverter1 VCC=12V (default); 2-3 closed：Inverter1 VCC=5V
(4) JP3 (3-pin): LVDS2 VCC 5V/3.3V Function Setting
JP3
1-2 closed: LVDS2 VCC 5V(default);
2-3 closed : LV DS2 VCC 3.3V
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