JETWAY NC9S-B85 Technical Manual

TECHNICAL MANUAL

Of

Intel B85 Express Chipset

Based Mini-ITX M/B

NO. G03-NC9S-F

Revision: 1.0

Release date: November 21, 2013

Trademark:

* Specifications and Information contained in this documentation are furnished for i nf ormation use only, a nd are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

i

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

ii

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING.....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................13

2-2-1 CONNECTORS .............................................................................................13

2-2-2 HEADERS .....................................................................................................15

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP.....................................................................................................23

3-2 BIOS MENU SCREEN ................................................................................................24

3-3 FUNCTION KEYS .......................................................................................................24

3-4 GETTING HELP ..........................................................................................................25

3-5 MEMU BARS...............................................................................................................25

3-6 MAIN MENU................................................................................................................26

3-7 ADVANCED MENU.....................................................................................................27

3-8 CHIPSET MENU..........................................................................................................34

3-9 BOOT MENU...............................................................................................................39

3-10 SECURITY MENU.......................................................................................................41

3-11 SAVE & EXIT MENU...................................................................................................42

TABLE OF CONTENT

iii

Environmental Safety Instruction

z Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

z 0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

z Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.

z The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.

z Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

iv

USER’S NOTICE

COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AN D WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

1.0 First Edition 2013-11-21

Item Checklist

5

Motherboard

5

DVD for motherboard utilities

5

User’s Manual

5

Cable(s)

5

I/O Back panel shield

1

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

z

Intel® B85 express chipset

z

Support Intel® LGA 1150 Socket Intel® Core™ i3, i5, i7 & Pentium Processors in

LAG1150 Package

z

Support 2 * DDRIII SO-DIMM 1333/1600 MHz up to 16GB and dual channel

function

z

Integrated with Intel® i217-LM Gigabit Ethernet LAN chip

z

Integrated ALC662 6-channel HD Audio Codec

z

Support 3* VGA Video Outputs

z

Support 2* SATAIII 6GB/S ports

z

Support Mini-PCIE slot (Selectable with MSATA)

z

Support PCI Express x16 slot

z

Support USB 3.0 data transport demand

z

Integrated with 24-bit dual channel LVDS

z

Support CPU Smart FAN

z

Supports ACPI S3 Function

z

Compliance with EuP Standard

z

Support Watchdog Timer Technology

2

1-2 Specification

Spec Description

Design z

Mini-ITX form factor; 6 layers ; PCB size: 17.0x17.0cm

Chipset

z

Intel® B85 Express Chipset

CPU Socket

z

Supports Intel® Core™ i7, Core™ i5, Core™ i3 series,

Pentium® processor in LAG1150 Package

* for detailed CPU support information please visit our website

Memory Slot

z

DDRIII SO-DIMM slot x2

z

Support DDRIII 1333/1600 MHz DDRIII SO-DIMM

expandable to 16GB

z

Support dual channel function

Expansion Slot

z

1 pcs of PCI Express x16 slot, support PCI Express 3.0

specification

z

1 pcs of Mini-PCIE slot (Selectable with MSATA)

Storage

z

2* SATAIII 6Gb/s ports

Gigabit LAN Chip

z

Integrated Intel® i217-LM Gigabit Ethernet LAN chip that

support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate

Audio Chip

z

Realtek ALC662 6-channel Audio Codec integrated

z

Audio driver and utility included

BIOS z

64M bit DIP Flash ROM

Multi I/O

Rear Panel I/O:

z

COM port connector x 3

z

VGA port connector x3

z

USB 3.0 port connector x2

z

USB 2.0 port connector x2

z

RJ-45 LAN connector x1

z

Audio connector x3(Line-in, Line-out, MIC)

Internal I/O Connectors& Headers:

z

1 *24-pin main power connector

3

z

1 *4-pin 12V power connector

z

SATAIII connector x2

z

Front panel audio header x1

z

PS/2 KB & MS header x1

z

HDMI_SPDIF out header x1

z

LAN LED header x1

z

Front panel header x1

z

Speaker + PWRLED header x1

z

Serial port header x3

z

USB 2.0 header x2 (support four expansion USB 2.0 ports)

z

TPM header x1

z

GPIO header x1

z

SM BUS header x1

z

LVDS header x1

z

LVDS Inverter x1

z

Fan header x 3

1-3 Layout Diagram

Rear IO Diagram

MIC-IN

VGA Ports (CRT1/2/3)

Line-IN

Line-OUT

USB 3.0 Ports

RJ-45 LAN Port

USB 2.0 Ports

Serial Ports (COM1/2/3)

4

Motherboard Internal Diagram

Main Power connector

ATX 12V

Power Connecto

r

DDRIII SODIMM Slot x 2

（DDRIII 1333/1600）

Serial Port over

VGA Port

Audio Connectors

Intel LGA 1150

CPU Socket

HDMI_SPDIF Header

GPIO

H

eade

r

Intel B85 Chipset

*PCI Express x16 Slot

USB 2.0 Ports

LVDS Heade

r

SATAIII Ports

(

SATA1/2

)

Front Panel

Audio Heade

r

Front Panel Heade

r

Speaker &

Power LED Heade

r

RJ-45 Port over

USB 3.0 Ports

LVDS Inverte

r

Full-size

Mini-PCIE/MSATA

Selectable Slo

t

USB 2.0
Headers

LANLED Heade

r

SYSFAN1 Header

SM BUS Heade

r

PS2 KB &MS Header

Serial Port Headers

Serial Port over

VGA Port

Serial Port over

VGA Port

TPM Heade

r

SYSFAN2 Header

CPUFAN Header

5

Motherboard Jumper Position

JBAT

JP

4

COPEN

JP5J

P12

JP7 J

P13

JP8

JP9

JP

3

JP

6

AT-M

ODE

6

Jumper

Jumper Name Description

JP4 COM1 Port Pin9 Function Select 4-pin Block
JP7 COM2 Port Pin9 Function Select 4-pin Block
JP12 COM4 Header Pin9 Function Select 4-pin Block
JP13 COM6 Header Pin9 Function Select 4-pin Block
JP8 Inverter Back Light 5V/12V Select 3-pin Block
JP9 LVDS PVCC 3.3V/5V/12V Select 4-pin Block
JP5 MMPE Slot 3.3V /3VSB Select 3-pin Block
JBAT CMOS RAM Clear Function Setting 3-pin Block
JP3 Security Measures Function Select 2-pin Block
AT-MODE ATX Mode & AT Mode Select 2-pin Block
COPEN Case Open Message Display Function 2-pin Block

Connectors

Connector Name

ATXPWR Main Power Connector
ATX12V 12V Power Connector
SATA1/2 SATAIII Connector x 2
CRT1_COM1 (Top)/
CRT2_COM2 (Top)/
CRT3_COM3 (Top)

Serial Port Connector x3

CRT1_COM1 (Bottom)/
CRT2_COM2 (Bottom)/
CRT3_COM3 (Bottom)

Video Graphic Attach Connector x3

USB3 USB 2.0 Port Connector x2
UL1(Top) RJ-45 LAN Connector
UL1(Middle & Bottom)

USB 3.0 Port Connector x2

AUDIO Line Out /Line In /MIC Audio Connector

7

Headers

Header Name Description

FP_AUDIO Front Panel Audio Header 9-pin Block
PS2KBMS PS2 KB & MS Header 6-pin Block
SPDIFOUT HDMI_SPDIF Out Header 2-pin Block
LANLED LAN LED Header 2-pin Block
FP

Front Panel Header(PWR LED/ HD
LED/ /Power Button /Reset)

9-pin Block

SPK-LED Power LED+ Speaker Header 7-pin Block
COM4/5/6 Serial Port Headers 9-pin Block
USB1/2 USB 2.0 Port Headers 9-pin Block
TPM TPM Header 19-pin Block
GPIO GPIO Header 10-pin Block
SMBUS SM BUS Header 4-pin Block
LVDS2 LVDS Header 30-pin Block
INVERTER2 LVDS Inverter 8-pin Block
SYSFAN1/SYSFAN2
/CPUFAN

FAN Headers 4-pin Block

8

Chapter 2

Hardware Installation

2-1 Jumper Setting

(1) JP4 (4-pin): COM1 Port Pin9 Function Select

JP4→COM1 Port

4-6 Closed:

RI= 12V ;

642

3-4 Closed:

RI= 5V;

2-4 Closed:

RI=RS232

3

1

5

13

5

24

6

1 3

5

2 4 6

(2) JP7 (4-pin): COM2 Port Pin9 Function Select

JP7→COM 2 Po rt

4-6 Closed:

RI= 12V ;

642

3-4 Closed:

RI= 5V;

2-4 Closed:

RI=RS232

3

1

5

13

5

24

6

1 3

5

2 4 6

9

(3) JP12 (4-pin): COM4 Header Pin9 Function Select

JP12→COM4 Header

4-6 Closed:

RI= 12V ;

642

3-4 Closed:

RI= 5V;

2-4 Closed:

RI=RS232

3

1

5

13

5

24

6

1 3

5

2 4 6

(4) JP13 (4-pin): COM6 Header Pin9 Function Select

JP13→COM6 Header

4-6 Closed:

RI= 12V ;

642

3-4 Closed:

RI= 5V;

2-4 Closed:

RI=RS232

3

1

5

13

5

24

6

1 3

5

2 4 6

10

(5) JP8 (3-pin): INVERTER2 Back Light 5V/12V Select

2-3 Closed: IN VERTER2 Bac k Light 12V Selected .

JP8→INVERTER2

1-2 Cl osed: INVERT ER2 Back Light 5V Selected;

1

1

3

(6) JP9 (4-pin): LVDS PVCC 3.3V/5V/12V Select

JP9→ LVDS2

4-6 Closed: LVDS

PVCC= 12V.

642

3-4 Closed: LVDS

PVCC= 5V;

2-4 Closed: LVDS

PVCC= 3.3V

3

1

5

13

5

24

6

1 3

5

2 4 6